JPH01168004A - Manufacture of resistance network element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing resistive network elements.

BACKGROUND OF THE INVENTION In recent years, with the ever-increasing demand for electronic devices to be lighter, thinner, and smaller, modular resistor network elements have come into widespread use in order to increase the wiring density of circuit boards.

A conventional method of manufacturing a resistor network element (for example, Japanese Patent Application Laid-open No. 183934/1983) will be described.

First, an electrode pattern is formed by screen printing an Ag-based paste on a fired 96 alumina substrate, and the electrode pattern is fired in air at 8'50°C for 1 hour.

Thereafter, a plurality of resistance patterns are formed by screen printing the RuO2-based glaze resistance paste, and the resultant is baked in air at 860° C. for 1 hour. Next, a glass pattern is formed by screen printing a glass paste based on lead borosilicate, and is fired in air at 600° C. for 1 hour. After that, trimming is performed using a laser to correct the resistance value. Next, after dividing along the dividing grooves, it is inserted into a lead frame. Thereafter, after applying flux, a solder dip is performed to fix the lead frame and the electrode pattern layer with the solder system. Next, the flux is washed away, and the epoxy paint is cured with heat to mold the product, leaving only a portion of the lead frame. Next, stamp and print. and.

Finally, resistance value selection is performed to complete the resistance network element.

Problems to be Solved by the Invention However, in this process, it was necessary to prepare a large number of printing masks depending on the variation in the size of the ceramic substrate. In addition, because the electrode patterns, multiple resistance patterns, and glass patterns are printed and fired individually,
There were problems in that the number of firings was large and the process was complicated.

The present invention solves these problems and aims to simplify the process.

Means to solve problems A method of manufacturing a resistive network element according to the present invention is as follows.

After forming a conductive pattern and a plurality of resistance patterns partially overlapping the conductive pattern on an unfired ceramic green sheet, the ceramic green sheets are simultaneously fired at a temperature of 800'C to 100'C.

Effect: As a result, it is possible to unify the printing mask and reduce the number of firings by batch firing, thereby realizing simplification of the process.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a process diagram showing Example 1 of the method for manufacturing a resistive network element of the present invention, FIG. 2 is a top view of the product in each step of FIG. 1, and FIG. FIG. 4 is a process diagram showing Example 2 of the manufacturing method, and FIG.
FIG. 6 is a top view of the product at each step in the figure, and FIG. 6 shows a manufacturing process diagram of a conventional resistance network element.

A method of manufacturing the resistive network element of Example 1 configured as described above will be described with reference to FIGS. 1 and 2.

First of all, 120. A binder base was added to the powder with a / glass ratio of s o / s o to make a slurry, and the second
As shown in Figure a, an unfired ceramic green sheet 1 is formed. Next, a conductor pattern 2 is formed thereon by screen printing an Ag-based conductor paste as shown in FIG. Next, a plurality of resistor patterns 3 are formed as shown in FIG. 2C by screen printing the RuO2-based glaze resistor paste. Next, as shown in Fig. 2d, a thin plate-like blade is pressed against the unfired ceramic green sheet (t = o, 6 m) with a thickness of 60 mm.
A V-groove 6 is formed for division with a depth of about 100%. Then, in air at 800°C to 1000'C for 2 hours (peak 20
Fire according to the profile (minutes). Next, as shown in FIG. 2e, laser trimming is performed to correct the resistance value.

Furthermore, as shown in FIG. 2f, the film is divided along the V-groove 6 for division, and inserted into the lead frame 7. Thereafter, as shown in FIG. 2g, flux 8 is applied and solder dip is performed to fix the lead frame and the electrode pattern layer with solder portions 9. Next, the flux 8 is washed away, a part of the lead frame of the product is left, and the epoxy paint 10 is thermally cured to cover the mold as shown in the second diagram. Next, as shown in FIG. 2, a stamp 11 is applied and printed. Finally, resistance value selection is performed to complete the resistance network element.

The resistance network element according to Example 1 has a resistance value in the range of 10Ω to 1MΩ and a resistance value variation of 3δ of ±1.
0% or less, temperature coefficient of resistance TCR is ±1ooPPM
/°C, excellent performance was obtained.

If the co-firing temperature is less than 800°C, problems will occur such as the product's bending strength and electrode adhesive strength becoming weaker.
Moreover, if the temperature is higher than 1000° C., a problem arises in that resistance performance deteriorates due to oversintering.

Next, Example 2 will be explained using FIGS. 3 and 4.

First, a binder was added to powder with a Mu1203/glass ratio of 50/60 to form a slurry.

Unfired ceramic green sheet 1 as shown in Figure 4a
Form into. Next, a conductor pattern 2 is formed thereon by screen printing a 5G conductor paste as shown in FIG. Next, a plurality of resistor patterns 3 are formed as shown in FIG. 4C by screen printing the RuO2-based glaze resistor paste. On top of that, a fourth layer is added by screen printing a glass ceramic paste.
A glass pattern 4 is formed as shown in Figure d. Next, the fourth
As shown in FIG. 0, a V-groove 6 for division with a depth of about 60% of this thickness is formed in an unfired ceramic green sheet (t=0.6 mm) by pressing a thin blade. Thereafter, it is fired in air at 800° C. to 100° C. according to a profile of 2 hours (peak 20 minutes). Then the fourth
Laser trimming is performed to correct the resistance value as shown in Figure f. Furthermore, it is divided along the V groove 6 for division, and the fourth
Insert it into the lead frame 7 as shown in Figure g. then the fourth
After attaching flux 8 as shown in the figure, a solder dip is performed to fix the lead frame and the electrode pattern layer with solder portions 9. Next, the flux is washed away, and the epoxy paint 1o is thermally cured, leaving a part of the lead frame of the product, and then the mold is packaged as shown in FIG. 4i. Next, as shown in FIG. 4j, a stamp 11 is made and printed.

Then, resistance value selection is performed later to complete the resistor network element.

The resistance network element according to Example 1 has a resistance value in the range of 10Ω to 1MΩ and a resistance value variation of ±10 at 3δ.
% or less, and the temperature coefficient of resistance TCR is ±100PPM/
An excellent performance of 'C was obtained.

If the co-firing temperature is less than 80°C, there will be problems such as the bending strength of the product and the adhesive strength of the electrode becoming weak.
Furthermore, if the temperature is higher than 100° C., a problem arises in that resistance performance deteriorates due to oversintering.

Although a glass pattern was not formed in Example 1,
Printing and firing may be performed after simultaneous firing. Also, the electrode is 5g
In addition, noble metal conductors such as Pt and P(1) can be used.In addition, the green sheet is made of Mu (bo3/glass ratio is so/so, but any insulating ceramic material can be used. In addition, in the embodiment, a SIP type (Single-in-one) is used in which a plurality of lead terminals that are electrically connected to the picture electrode of each resistive element protrude in a line from the exterior body.
Although the resistor network element called "-Package" has been described, it can also be used for a leadless type chip resistor network element.

Effects of the Invention As is clear from the above description, the present invention is capable of forming a conductor pattern and a plurality of resistance patterns partially overlapping the conductor pattern on an unfired ceramic green sheet, and then heating the sheet at a temperature of 800°C to 1000°C. Because they are configured to fire at the same time at different temperatures.

Excellent effects such as unification of masks and reduction of steps due to batch firing can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing Example 1 of the method for manufacturing a resistive network element of the present invention, FIG. 2 is a top view of the product in each step of FIG. 1, and FIG. 3 is a manufacturing process of the resistive network element of the present invention. A process diagram showing Example 2 of the method, FIG. 4 is a top view of the product in each step of FIG. 3. 1... Unfired ceramic green sheet, 2
...Conductor pattern, 3...Resistance pattern p-
7, 4...Glass pattern, 6...v
groove. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2! Figure 3 Figure 4

Claims (3)

[Claims] (1) A resistor characterized by forming a conductor pattern and a plurality of resistance patterns partially overlapping the conductor pattern on an unfired ceramic green sheet, and then firing them simultaneously at a temperature of 800°C to 1000°C. A method for manufacturing a network element. (2) After forming a plurality of resistance patterns, forming a glass pattern covering at least the resistance patterns,
The method for manufacturing a resistive network element according to claim 1, characterized in that the firing is carried out simultaneously at a temperature of 1000°C to 1000°C. (3) Claim 1 characterized in that the conductor pattern is made of an Ag or Ag-Pd based noble metal conductor, the resistance pattern is made of a RuO_2 based glazed resistor, and the firing atmosphere is air. A method for manufacturing a resistive network element according to section 1.