JPH01171027U - - Google Patents

Info

Publication number
JPH01171027U
JPH01171027U JP1988068286U JP6828688U JPH01171027U JP H01171027 U JPH01171027 U JP H01171027U JP 1988068286 U JP1988068286 U JP 1988068286U JP 6828688 U JP6828688 U JP 6828688U JP H01171027 U JPH01171027 U JP H01171027U
Authority
JP
Japan
Prior art keywords
layer
thickness change
notch
wafer boat
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988068286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988068286U priority Critical patent/JPH01171027U/ja
Priority to KR1019880008741A priority patent/KR910007105B1/en
Publication of JPH01171027U publication Critical patent/JPH01171027U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218Conveying cassettes, containers or carriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の治具の一例の傾視図である。 図中の符号:1……円筒体、2……円弧状の切
欠き部、53……直線状切欠き部、4……厚肉層
、5……肉厚変化層、6……薄肉層。
FIG. 1 is a perspective view of an example of the jig of the present invention. Codes in the diagram: 1...Cylindrical body, 2...Circular notch, 53...Linear notch, 4...Thick layer, 5...Variable thickness layer, 6...Thin layer .

Claims (1)

【実用新案登録請求の範囲】 1 筒状体の一部を円弧状及び直線状に切り欠い
てウエーハボート保持部を形成し、その切欠き基
部近傍を厚肉層に形成して成るウエーハボート搬
送用治具において、該厚肉層と切欠き端部の薄肉
層との間に緩やかで滑らかな肉厚変化層を形成し
て成る改善された実用的強度を有する上記治具。 2 上記肉厚変化層が、1/12〜1/80の傾
斜割合である請求項1記載のウエーハボード搬送
用治具。
[Claims for Utility Model Registration] 1. A wafer boat conveyor in which a wafer boat holding portion is formed by cutting out a part of a cylindrical body in an arc shape and a straight line, and a thick layer is formed near the base of the notch. The above-mentioned jig has improved practical strength, wherein a gradual and smooth thickness change layer is formed between the thick layer and the thin layer at the notch end. 2. The wafer board transport jig according to claim 1, wherein the thickness change layer has a slope ratio of 1/12 to 1/80.
JP1988068286U 1988-05-24 1988-05-24 Pending JPH01171027U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988068286U JPH01171027U (en) 1988-05-24 1988-05-24
KR1019880008741A KR910007105B1 (en) 1988-05-24 1988-07-14 Wafer Board Transfer Tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988068286U JPH01171027U (en) 1988-05-24 1988-05-24

Publications (1)

Publication Number Publication Date
JPH01171027U true JPH01171027U (en) 1989-12-04

Family

ID=31293612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988068286U Pending JPH01171027U (en) 1988-05-24 1988-05-24

Country Status (2)

Country Link
JP (1) JPH01171027U (en)
KR (1) KR910007105B1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120319A (en) * 1984-07-09 1986-01-29 Toshiba Ceramics Co Ltd Wafer boat transporting jig made of crystal glass

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6120319A (en) * 1984-07-09 1986-01-29 Toshiba Ceramics Co Ltd Wafer boat transporting jig made of crystal glass

Also Published As

Publication number Publication date
KR910007105B1 (en) 1991-09-18
KR890017792A (en) 1989-12-18

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