JPH01171027U - - Google Patents
Info
- Publication number
- JPH01171027U JPH01171027U JP1988068286U JP6828688U JPH01171027U JP H01171027 U JPH01171027 U JP H01171027U JP 1988068286 U JP1988068286 U JP 1988068286U JP 6828688 U JP6828688 U JP 6828688U JP H01171027 U JPH01171027 U JP H01171027U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thickness change
- notch
- wafer boat
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図は本考案の治具の一例の傾視図である。
図中の符号：１……円筒体、２……円弧状の切
欠き部、５３……直線状切欠き部、４……厚肉層
、５……肉厚変化層、６……薄肉層。
欠き部、５３……直線状切欠き部、４……厚肉層
、５……肉厚変化層、６……薄肉層。
Claims (1)
- 【実用新案登録請求の範囲】 １ 筒状体の一部を円弧状及び直線状に切り欠い
てウエーハボート保持部を形成し、その切欠き基
部近傍を厚肉層に形成して成るウエーハボート搬
送用治具において、該厚肉層と切欠き端部の薄肉
層との間に緩やかで滑らかな肉厚変化層を形成し
て成る改善された実用的強度を有する上記治具。 ２ 上記肉厚変化層が、１／１２〜１／８０の傾
斜割合である請求項１記載のウエーハボード搬送
用治具。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988068286U JPH01171027U (ja) | 1988-05-24 | 1988-05-24 | |
| KR1019880008741A KR910007105B1 (ko) | 1988-05-24 | 1988-07-14 | 웨이퍼보드 반송용치구(治具) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988068286U JPH01171027U (ja) | 1988-05-24 | 1988-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171027U true JPH01171027U (ja) | 1989-12-04 |
Family
ID=31293612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988068286U Pending JPH01171027U (ja) | 1988-05-24 | 1988-05-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH01171027U (ja) |
| KR (1) | KR910007105B1 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120319A (ja) * | 1984-07-09 | 1986-01-29 | Toshiba Ceramics Co Ltd | 石英ガラス製ウエハボ−ト搬送治具 |
-
1988
- 1988-05-24 JP JP1988068286U patent/JPH01171027U/ja active Pending
- 1988-07-14 KR KR1019880008741A patent/KR910007105B1/ko not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120319A (ja) * | 1984-07-09 | 1986-01-29 | Toshiba Ceramics Co Ltd | 石英ガラス製ウエハボ−ト搬送治具 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR890017792A (ko) | 1989-12-18 |
| KR910007105B1 (ko) | 1991-09-18 |