JPH0117258B2 - - Google Patents

Info

Publication number
JPH0117258B2
JPH0117258B2 JP58007306A JP730683A JPH0117258B2 JP H0117258 B2 JPH0117258 B2 JP H0117258B2 JP 58007306 A JP58007306 A JP 58007306A JP 730683 A JP730683 A JP 730683A JP H0117258 B2 JPH0117258 B2 JP H0117258B2
Authority
JP
Japan
Prior art keywords
cap
thermal expansion
silicon carbide
substrate
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58007306A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59134852A (ja
Inventor
Satoru Ogiwara
Hironori Kodama
Katsuhiro Sonobe
Hiroaki Doi
Fumyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58007306A priority Critical patent/JPS59134852A/ja
Priority to GB08401603A priority patent/GB2135513B/en
Priority to DE19843401984 priority patent/DE3401984A1/de
Publication of JPS59134852A publication Critical patent/JPS59134852A/ja
Publication of JPH0117258B2 publication Critical patent/JPH0117258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/63—Seals characterised by their shape or disposition, e.g. between cap and walls of a container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58007306A 1983-01-21 1983-01-21 集積回路パツケ−ジ Granted JPS59134852A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58007306A JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ
GB08401603A GB2135513B (en) 1983-01-21 1984-01-20 Packaged integrated circuit device
DE19843401984 DE3401984A1 (de) 1983-01-21 1984-01-20 Verkapselte integrierte schaltung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58007306A JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS59134852A JPS59134852A (ja) 1984-08-02
JPH0117258B2 true JPH0117258B2 (cs) 1989-03-29

Family

ID=11662323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58007306A Granted JPS59134852A (ja) 1983-01-21 1983-01-21 集積回路パツケ−ジ

Country Status (3)

Country Link
JP (1) JPS59134852A (cs)
DE (1) DE3401984A1 (cs)
GB (1) GB2135513B (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3603912A1 (de) * 1985-02-09 1986-08-14 Alps Electric Co., Ltd., Tokio/Tokyo Elektronischer netzwerk-baustein und verfahren zur herstellung desselben
US4729010A (en) * 1985-08-05 1988-03-01 Hitachi, Ltd. Integrated circuit package with low-thermal expansion lead pieces
JPS6247153A (ja) * 1985-08-27 1987-02-28 Ibiden Co Ltd 半導体装置
GB2197540B (en) * 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JP2572823B2 (ja) * 1988-09-22 1997-01-16 日本碍子株式会社 セラミック接合体
JPH03194952A (ja) * 1989-12-22 1991-08-26 Nec Corp セラミックパッケージ
JPH04322452A (ja) * 1991-04-23 1992-11-12 Mitsubishi Electric Corp 半導体装置、半導体素子収納容器および半導体装置の製造方法
JP6829153B2 (ja) * 2017-06-07 2021-02-10 京セラ株式会社 セラミック板、半導体装置および半導体モジュール

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
JPS4954418A (cs) * 1972-09-27 1974-05-27
JPS52116074A (en) * 1976-03-26 1977-09-29 Hitachi Ltd Electronic part
JPS5389664A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Package structure of semiconductor device
US4161743A (en) * 1977-03-28 1979-07-17 Tokyo Shibaura Electric Co., Ltd. Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat
JPS55143042A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Semiconductor device
DE3064598D1 (en) * 1979-11-05 1983-09-22 Hitachi Ltd Electrically insulating substrate and a method of making such a substrate

Also Published As

Publication number Publication date
GB8401603D0 (en) 1984-02-22
DE3401984A1 (de) 1984-07-26
JPS59134852A (ja) 1984-08-02
GB2135513A (en) 1984-08-30
GB2135513B (en) 1987-08-19

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