JPH0337308B2 - - Google Patents

Info

Publication number
JPH0337308B2
JPH0337308B2 JP60181692A JP18169285A JPH0337308B2 JP H0337308 B2 JPH0337308 B2 JP H0337308B2 JP 60181692 A JP60181692 A JP 60181692A JP 18169285 A JP18169285 A JP 18169285A JP H0337308 B2 JPH0337308 B2 JP H0337308B2
Authority
JP
Japan
Prior art keywords
thermal expansion
coefficient
glass
substrate
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60181692A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243155A (ja
Inventor
Satoru Ogiwara
Tomoji Ooishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60181692A priority Critical patent/JPS6243155A/ja
Priority to US06/890,533 priority patent/US4729010A/en
Priority to EP86305894A priority patent/EP0211618B1/en
Priority to DE8686305894T priority patent/DE3672709D1/de
Publication of JPS6243155A publication Critical patent/JPS6243155A/ja
Publication of JPH0337308B2 publication Critical patent/JPH0337308B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP60181692A 1985-08-05 1985-08-21 集積回路パッケ−ジ Granted JPS6243155A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60181692A JPS6243155A (ja) 1985-08-21 1985-08-21 集積回路パッケ−ジ
US06/890,533 US4729010A (en) 1985-08-05 1986-07-30 Integrated circuit package with low-thermal expansion lead pieces
EP86305894A EP0211618B1 (en) 1985-08-05 1986-07-31 Integrated circuit package
DE8686305894T DE3672709D1 (de) 1985-08-05 1986-07-31 Integrierte schaltungspackung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60181692A JPS6243155A (ja) 1985-08-21 1985-08-21 集積回路パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS6243155A JPS6243155A (ja) 1987-02-25
JPH0337308B2 true JPH0337308B2 (cs) 1991-06-05

Family

ID=16105199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60181692A Granted JPS6243155A (ja) 1985-08-05 1985-08-21 集積回路パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6243155A (cs)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251166A (ja) * 1989-03-24 1990-10-08 Matsushita Electric Works Ltd 表面実装用半導体パッケージ
JP2736451B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736452B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736456B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736455B2 (ja) * 1989-11-27 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736464B2 (ja) * 1989-11-30 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ
JP2736459B2 (ja) * 1989-11-30 1998-04-02 京セラ株式会社 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JPS6243155A (ja) 1987-02-25

Similar Documents

Publication Publication Date Title
US4670771A (en) Rectifier module
EP0211618B1 (en) Integrated circuit package
JPH0455339B2 (cs)
JP2003142739A (ja) 熱電装置
JPH0337308B2 (cs)
JPH0117258B2 (cs)
JPH0118583B2 (cs)
JPH11163002A (ja) 半導体素子実装基板
JPS5831755B2 (ja) 電気絶縁用基体
JP2005285885A (ja) 半導体装置
JP2000252392A (ja) 半導体素子搭載配線基板およびその実装構造
JP2572092Y2 (ja) 半導体素子パッケージ
JPS61256746A (ja) 半導体装置
JPS638621B2 (cs)
JP3222348B2 (ja) セラミックパッケージの製造方法
JPH0794623A (ja) 回路基板
JP2551228B2 (ja) 半導体装置
JP2003188295A (ja) 半導体素子収納パッケージ用放熱板及び光通信モジュールパッケージ用放熱板
JPH0525182B2 (cs)
JP2931481B2 (ja) 半導体素子収納用パッケージ
JPS63215057A (ja) 半導体装置の製造方法
JPH0464243A (ja) 半導体装置
JPS6140046A (ja) 半導体素子搭載用パツケ−ジ
JPS61142748A (ja) 半導体装置
JP2001127200A (ja) 半導体素子収納用パッケージの実装構造