JPH01173939U - - Google Patents

Info

Publication number
JPH01173939U
JPH01173939U JP1988070584U JP7058488U JPH01173939U JP H01173939 U JPH01173939 U JP H01173939U JP 1988070584 U JP1988070584 U JP 1988070584U JP 7058488 U JP7058488 U JP 7058488U JP H01173939 U JPH01173939 U JP H01173939U
Authority
JP
Japan
Prior art keywords
bonding
wire
bonding tool
point
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988070584U
Other languages
English (en)
Japanese (ja)
Other versions
JPH058679Y2 (th
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988070584U priority Critical patent/JPH058679Y2/ja
Publication of JPH01173939U publication Critical patent/JPH01173939U/ja
Application granted granted Critical
Publication of JPH058679Y2 publication Critical patent/JPH058679Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1988070584U 1988-05-28 1988-05-28 Expired - Lifetime JPH058679Y2 (th)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988070584U JPH058679Y2 (th) 1988-05-28 1988-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988070584U JPH058679Y2 (th) 1988-05-28 1988-05-28

Publications (2)

Publication Number Publication Date
JPH01173939U true JPH01173939U (th) 1989-12-11
JPH058679Y2 JPH058679Y2 (th) 1993-03-04

Family

ID=31295818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988070584U Expired - Lifetime JPH058679Y2 (th) 1988-05-28 1988-05-28

Country Status (1)

Country Link
JP (1) JPH058679Y2 (th)

Also Published As

Publication number Publication date
JPH058679Y2 (th) 1993-03-04

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