JPH01173967U - - Google Patents

Info

Publication number
JPH01173967U
JPH01173967U JP1988068983U JP6898388U JPH01173967U JP H01173967 U JPH01173967 U JP H01173967U JP 1988068983 U JP1988068983 U JP 1988068983U JP 6898388 U JP6898388 U JP 6898388U JP H01173967 U JPH01173967 U JP H01173967U
Authority
JP
Japan
Prior art keywords
protrusion
semiconductor
semiconductor device
utility
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988068983U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988068983U priority Critical patent/JPH01173967U/ja
Publication of JPH01173967U publication Critical patent/JPH01173967U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
の断面側面図、第２図は従来の半導体装置の断面
側面図である。 図において、１はパツケージ本体、２は金属製
リード、３ははんだ、４は配線層、５は配線基板
、６は突起、７は配線基板に設けられた穴を示す
。なお、図中、同一符号は同一、又は相当部分を
示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属製リードをもつ半導体パツケージ表面に少
    なくとも１個の非金属性突起を設け、この突起が
    半導体実装基板に設けられた穴に嵌合することを
    特徴とする半導体装置。
JP1988068983U 1988-05-25 1988-05-25 Pending JPH01173967U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988068983U JPH01173967U (ja) 1988-05-25 1988-05-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988068983U JPH01173967U (ja) 1988-05-25 1988-05-25

Publications (1)

Publication Number Publication Date
JPH01173967U true JPH01173967U (ja) 1989-12-11

Family

ID=31294275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988068983U Pending JPH01173967U (ja) 1988-05-25 1988-05-25

Country Status (1)

Country Link
JP (1) JPH01173967U (ja)

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