JPH01174992U - - Google Patents
Info
- Publication number
- JPH01174992U JPH01174992U JP7183788U JP7183788U JPH01174992U JP H01174992 U JPH01174992 U JP H01174992U JP 7183788 U JP7183788 U JP 7183788U JP 7183788 U JP7183788 U JP 7183788U JP H01174992 U JPH01174992 U JP H01174992U
- Authority
- JP
- Japan
- Prior art keywords
- mounting plate
- metal
- electronic device
- radiator
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は従来構造の側面構造図、第２図は本考
案の液体冷却構造の側面構造図であり、１は電子
部品、２は絶縁板、３は第１の放熱器、４は熱伝
導シート、５は金属取付板、６は第２の放熱器、
７，８は取付けビス、９は第２の絶縁板である。
Figure 1 is a side view of the conventional structure, and Figure 2 is a side view of the liquid cooling structure of the present invention, where 1 is an electronic component, 2 is an insulating plate, 3 is a first heat sink, and 4 is a heat conductor. a sheet, 5 a metal mounting plate, 6 a second radiator,
7 and 8 are mounting screws, and 9 is a second insulating plate.
Claims (1)
第１の放熱器と、液体冷却機構から成る第２の放
熱器の間に接地状態にある金属取付板を配設し、
かつ、第１の放熱器と前記金属取付板間に第２の
絶縁板を介在せしめて、一体に結合したことを特
徴とする電子機器の冷却構造。 (2) 金属取付板が電子機器の金属ケースに接続
されている実用新案登録請求の範囲第(1)項の電
子機器の冷却構造。[Claims for Utility Model Registration] (1) A metal in a grounded state between a first radiator on which electronic components are mounted via a first insulating plate and a second radiator comprising a liquid cooling mechanism. Arrange the mounting plate,
A cooling structure for an electronic device, characterized in that a second insulating plate is interposed between the first heat radiator and the metal mounting plate so that the first heat radiator and the metal mounting plate are integrally coupled. (2) A cooling structure for an electronic device according to claim (1) of the utility model registration, in which a metal mounting plate is connected to a metal case of the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7183788U JPH01174992U (en) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7183788U JPH01174992U (en) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174992U true JPH01174992U (en) | 1989-12-13 |
Family
ID=31297026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7183788U Pending JPH01174992U (en) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174992U (en) |
-
1988
- 1988-05-31 JP JP7183788U patent/JPH01174992U/ja active Pending
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