JPS646085U - - Google Patents
Info
- Publication number
- JPS646085U JPS646085U JP1987101095U JP10109587U JPS646085U JP S646085 U JPS646085 U JP S646085U JP 1987101095 U JP1987101095 U JP 1987101095U JP 10109587 U JP10109587 U JP 10109587U JP S646085 U JPS646085 U JP S646085U
- Authority
- JP
- Japan
- Prior art keywords
- cooling fin
- metal case
- expansion
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案の一実施例を示す正面図、第
２図及び第３図は従来の電子機器の冷却フインを
示す正面図及び側面図である。
図において、１は金属性ケース、２はプリント
基板、３は冷却フイン、４は拡張用冷却フイン、
５は絶縁形半導体素子、６はサポート、７は取付
ネジ、８は熱伝導性シート、９は長穴である。図
中同一符号は同一又は相当部分を示す。
FIG. 1 is a front view showing an embodiment of this invention, and FIGS. 2 and 3 are front and side views showing conventional cooling fins for electronic equipment. In the figure, 1 is a metal case, 2 is a printed circuit board, 3 is a cooling fin, 4 is an expansion cooling fin,
5 is an insulated semiconductor element, 6 is a support, 7 is a mounting screw, 8 is a thermally conductive sheet, and 9 is a long hole. The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
をプリント基板上に取付け、且つ放熱する冷却フ
インと、金属ケースと冷却フインを熱的に接続し
且つ放熱する拡張用冷却フインを備え、上記冷却
フインに接続する拡張用フインの取付に長穴を用
い、拡張用冷却フインが金属ケースに密着して接
続できるよう取付位置を調整することを特徴とす
る電子機器の冷却フイン。 A metal case that houses a printed circuit board, a cooling fin that mounts a semiconductor on the printed circuit board and radiates heat, and an expansion cooling fin that thermally connects the metal case and the cooling fin and radiates heat, and is connected to the cooling fin. A cooling fin for electronic equipment, characterized in that a long hole is used for mounting the expansion cooling fin, and the mounting position is adjusted so that the expansion cooling fin can be closely connected to a metal case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101095U JPS646085U (en) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101095U JPS646085U (en) | 1987-07-01 | 1987-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646085U true JPS646085U (en) | 1989-01-13 |
Family
ID=31329771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987101095U Pending JPS646085U (en) | 1987-07-01 | 1987-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646085U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003206918B2 (en) * | 2002-02-26 | 2007-12-06 | Ciba Specialty Chemicals Holding Inc. | Ink compositions containing lanthanide complexes |
| US7618555B2 (en) | 2006-04-06 | 2009-11-17 | Orient Chemical Industries, Ltd. | Ink composition containing red luminous material |
| US7736620B2 (en) | 2004-08-10 | 2010-06-15 | National University Corporation Kyushu Institute Of Technology | Europium-diketone chelate compound and fluorescent material using the same |
-
1987
- 1987-07-01 JP JP1987101095U patent/JPS646085U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003206918B2 (en) * | 2002-02-26 | 2007-12-06 | Ciba Specialty Chemicals Holding Inc. | Ink compositions containing lanthanide complexes |
| US7736620B2 (en) | 2004-08-10 | 2010-06-15 | National University Corporation Kyushu Institute Of Technology | Europium-diketone chelate compound and fluorescent material using the same |
| US7618555B2 (en) | 2006-04-06 | 2009-11-17 | Orient Chemical Industries, Ltd. | Ink composition containing red luminous material |
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