JPH01178657A - Wall structure - Google Patents
Wall structureInfo
- Publication number
- JPH01178657A JPH01178657A JP272388A JP272388A JPH01178657A JP H01178657 A JPH01178657 A JP H01178657A JP 272388 A JP272388 A JP 272388A JP 272388 A JP272388 A JP 272388A JP H01178657 A JPH01178657 A JP H01178657A
- Authority
- JP
- Japan
- Prior art keywords
- putty
- adhesive
- wall
- wall structure
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 73
- 239000000853 adhesive Substances 0.000 claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 239000003429 antifungal agent Substances 0.000 claims description 11
- 229940121375 antifungal agent Drugs 0.000 claims description 11
- 239000000654 additive Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 14
- 238000010276 construction Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 12
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 239000002023 wood Substances 0.000 abstract description 4
- 229920003023 plastic Polymers 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 2
- 239000005977 Ethylene Substances 0.000 abstract 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000011505 plaster Substances 0.000 abstract 1
- 239000010440 gypsum Substances 0.000 description 16
- 229910052602 gypsum Inorganic materials 0.000 description 16
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000011120 plywood Substances 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- OSDLLIBGSJNGJE-UHFFFAOYSA-N 4-chloro-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Cl OSDLLIBGSJNGJE-UHFFFAOYSA-N 0.000 description 4
- 229920002472 Starch Polymers 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000004480 active ingredient Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000855 fungicidal effect Effects 0.000 description 3
- 239000000417 fungicide Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- 239000008107 starch Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 230000000843 anti-fungal effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 2
- SVPKNMBRVBMTLB-UHFFFAOYSA-N 2,3-dichloronaphthalene-1,4-dione Chemical compound C1=CC=C2C(=O)C(Cl)=C(Cl)C(=O)C2=C1 SVPKNMBRVBMTLB-UHFFFAOYSA-N 0.000 description 1
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- UPTVJAJPBGIRLZ-UHFFFAOYSA-N 2-(trichloromethylsulfanyl)-3a,4,5,7a-tetrahydroisoindole-1,3-dione Chemical compound C1CC=CC2C(=O)N(SC(Cl)(Cl)Cl)C(=O)C21 UPTVJAJPBGIRLZ-UHFFFAOYSA-N 0.000 description 1
- CFKMVGJGLGKFKI-UHFFFAOYSA-N 4-chloro-m-cresol Chemical compound CC1=CC(O)=CC=C1Cl CFKMVGJGLGKFKI-UHFFFAOYSA-N 0.000 description 1
- 229920001817 Agar Polymers 0.000 description 1
- 241000223600 Alternaria Species 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 241001515917 Chaetomium globosum Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 206010011878 Deafness Diseases 0.000 description 1
- 240000003183 Manihot esculenta Species 0.000 description 1
- 235000016735 Manihot esculenta subsp esculenta Nutrition 0.000 description 1
- 241000223251 Myrothecium Species 0.000 description 1
- 241000228153 Penicillium citrinum Species 0.000 description 1
- 244000061456 Solanum tuberosum Species 0.000 description 1
- 235000002595 Solanum tuberosum Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000008272 agar Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 238000009435 building construction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- NJVOZLGKTAPUTQ-UHFFFAOYSA-M fentin chloride Chemical compound C=1C=CC=CC=1[Sn](C=1C=CC=CC=1)(Cl)C1=CC=CC=C1 NJVOZLGKTAPUTQ-UHFFFAOYSA-M 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 235000012015 potatoes Nutrition 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 235000010344 sodium nitrate Nutrition 0.000 description 1
- 239000004317 sodium nitrate Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229940100445 wheat starch Drugs 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- QGDIJZMKEQCRBX-UHFFFAOYSA-N zinc;ethene Chemical group [Zn+2].[CH-]=C.[CH-]=C QGDIJZMKEQCRBX-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Building Environments (AREA)
- Finishing Walls (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、壁構造に関し、特に住宅などの建築物の壁
構造のうち、室内側の内装仕上げ構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wall structure, and particularly to an interior finishing structure for an indoor side of a wall structure of a building such as a house.
上記のような、住宅などの内装仕上げ構造としては、通
常、氷相やコンクリ−1〜等の基礎構造材の上に、石膏
ボードや合板等の下地材が設けられ、さらにその上に塩
化ビニルクロス等の表装材が貼着された構造になってい
る。As for the interior finishing structure of houses, etc., as mentioned above, a base material such as gypsum board or plywood is usually provided on a basic structure material such as ice layer or concrete, and then vinyl chloride is added on top of the base material such as gypsum board or plywood. It has a structure in which a covering material such as cloth is pasted.
近年住宅の気密化に伴って、上記壁構造の内装面や壁構
造の内部に、結露が発生し易い環境になってきている。In recent years, as houses have become more airtight, the environment has become such that condensation is likely to occur on the interior surfaces of the wall structures and inside the wall structures.
そのため、住宅の完成後に内装面や壁構造の内部でカビ
が発生して、内装面を汚したり、居住者の健康を害する
等のトラブルが著しく増加している。As a result, problems such as mold growing on the interior surfaces and inside the wall structure of a house after it is completed, staining the interior surfaces and harming the health of the residents are increasing significantly.
上記問題の解決のため、前記表装材となる壁紙を石膏ボ
ード等に貼着する接着剤に、防カビ剤を添加する技術(
特公昭58−49673号公報参照)や、石膏ボードの
表面に防カビ剤を含有した塗料を塗布する技術(特公昭
57−59229号公報参照)等が開発されている。In order to solve the above-mentioned problem, a technology is used to add a fungicide to the adhesive used to attach the wallpaper, which serves as the covering material, to plasterboard, etc.
(see Japanese Patent Publication No. 58-49673) and a technique of applying a paint containing an antifungal agent to the surface of a gypsum board (see Japanese Patent Publication No. 57-59229).
石膏ボードや合板等の下地材は、予め一定面積のパネル
状に形成されたものを、壁の基礎構造材の上に、順次貼
り付けて施工したり、あるいは木材等を枠状に組み立て
、その表面に石膏ボード等の下地材を貼り付けた、外壁
パネルや間仕切りパネル等の、いわゆる壁パネルとして
施工される。Base materials such as gypsum board and plywood can be constructed by forming panels of a certain area in advance and pasting them one after another on top of the basic structural materials of the wall, or by assembling wood etc. into a frame shape and constructing it. It is constructed as a so-called wall panel, such as an exterior wall panel or a partition panel, with a base material such as gypsum board attached to the surface.
そのため、施工後に隣接する石膏ボード等の間には、ど
うしても若干の隙間があき、この隙間は通常、焼石膏等
からなるパテで埋めている。Therefore, after construction, there is inevitably a slight gap between adjacent gypsum boards, etc., and this gap is usually filled with putty made of calcined gypsum or the like.
そうすると、このパテの部分がカビの増殖地となり、こ
こで発生または増殖したカビが表装材側に侵入する問題
か生じる。また、壁構造の内部で発生したカビも、石膏
ホード等の隙間からパテの部分を通過して、表装材側に
侵入し易くなってしまう。In this case, this putty area becomes a breeding ground for mold, and the problem arises that the mold generated or grown here may invade the facing material. In addition, mold that has grown inside the wall structure is likely to pass through the putty through gaps in the plasterboard and enter the facing material.
前記した先行技術のうち、石膏ボー1等に防カビ塗料を
塗布したりどけのちのでは、壁構造の内部やパテの部分
で発生し増殖したカビは、自由に表装材側に侵入するこ
とができ、この部分におい′ζは全く防カビ効果が発揮
できない。また、表装材の貼着用接着剤に防カビ剤を添
加したものは、表装材側へのカビの侵入を防く効果は、
ある程度発揮できるが、パテの部分等で増殖されたカし
か大量に増えれば、表装材へのカビの侵入を完全に防く
ことは困難である。Among the above-mentioned prior art techniques, when an anti-mold paint is applied to a gypsum board or after it is removed, mold that grows and grows inside the wall structure or the putty part can freely invade the facing material. In this area, ′ζ has no antifungal effect at all. Additionally, the adhesive used to attach the facing material to which an anti-mold agent is added is effective in preventing mold from entering the facing material.
Although this can be achieved to some extent, it is difficult to completely prevent mold from invading the facing material if only a large amount of mold grows in the putty.
そこで、ごの発明は、上記した石膏ホード等の下地材の
隙間を寒くパテの部分におけるカビの発生を6イ[実に
防止することによって、内装面全体の防カビ効果を向上
させることかできる壁構造を提供することを、目的とし
ている。Therefore, the invention was developed to create a wall that can improve the mold-proofing effect of the entire interior surface by cooling the gaps between the base material such as the above-mentioned gypsum board and actually preventing the growth of mold in the putty area. The purpose is to provide structure.
この発明は、上記目的を達成するために、壁下地材同士
の隙間が表面からパテで塞がれ、その下地材の上に接着
剤を介して表装材が貼着されてなる壁構造において、パ
テおよび接着剤として防カビ剤が添加されたものを用い
る。In order to achieve the above object, the present invention provides a wall structure in which gaps between wall base materials are closed from the surface with putty, and a facing material is pasted on top of the base materials via an adhesive. Use putty and adhesive to which an antifungal agent has been added.
このように、パテおよび接着剤として、防カビ剤が添加
されたものを用いることによって、接着剤の部分だけで
なく、パテの部分においても防カビ効果を発揮できるこ
とになる。In this way, by using putty and adhesive to which an antifungal agent has been added, the antifungal effect can be exerted not only in the adhesive area but also in the putty area.
つぎに、この発明を、実施例を示す図面を参照しながら
、以下に説明する。Next, the present invention will be described below with reference to drawings showing embodiments.
まず第3図には、壁構造を構成するために使用する外壁
または間仕切りパネルPの1単位を示しており、このよ
うな壁パネルPを、第4図に示すように、順次つないで
施工することによって、壁構造を構成する。壁パネルP
の基本構造としては、枠状に組み立てられた木材等の基
礎構造材1の両面に、石膏ホード等の下地材2が貼り付
は一体化されたものである。このような壁パネル■)を
建て込み施工した後、下地材2の間に生じる隙間を内装
側からパテで埋め、さらにその上に、接着剤で塩化ヒニ
ルクロス等の表装材を貼着することによって、壁構造が
構成される。First, Fig. 3 shows one unit of an exterior wall or partition panel P used to construct a wall structure, and such wall panels P are connected in sequence and constructed as shown in Fig. 4. This constitutes the wall structure. wall panel P
The basic structure is that a base material 2 such as gypsum board is attached to both sides of a basic structure material 1 such as wood assembled into a frame shape. After constructing such a wall panel (■), fill the gap between the base materials 2 with putty from the interior side, and then apply a facing material such as vinyl chloride cloth with adhesive on top of it. , the wall structure is constructed.
上記のような壁構造の詳細な構造を、第1図および第2
図に示しており、壁パネルPは、予め石膏ボード20の
両面に紙21が貼着された下地材2が、木材等からなる
基礎構造材1の両面に貼着されたものである。そして、
各壁パネルPの端面同士の間には隙間Cがおいており、
この隙間Cに内装側の下地材2の表面から、可塑性のパ
テ3が塗り込まれ、隙間Cを塞いでいる。このパテ3は
、従来のパテと同様に、焼石膏や炭酸力ルシュウム等を
主材料とするものであるが、これらの材料に加え、パラ
クロロメタキシレノール等の防カビ剤および、エチレン
−酢酸ビニル樹脂が添加されている。The detailed structure of the wall structure as described above is shown in Figures 1 and 2.
As shown in the figure, the wall panel P has a base material 2 with paper 21 pasted on both sides of a gypsum board 20 in advance and pasted on both sides of a basic structure material 1 made of wood or the like. and,
There is a gap C between the end faces of each wall panel P,
A plastic putty 3 is applied to this gap C from the surface of the base material 2 on the interior side to close the gap C. Like conventional putty, this putty 3 is mainly made of calcined gypsum, rhusium carbonate, etc., but in addition to these materials, it also contains a fungicide such as parachlorometaxylenol, and ethylene-vinyl acetate. Added resin.
防カビ剤としては、通常の建築施工に使用されている各
種の薬剤が使用でき、例えば、2−(4−チアゾリル)
−ヘンズイミダゾール、メチル2−ヘンズイミダゾール
カーハメイト、メチル1−ブチルカルバモイル−2−ヘ
ンスイミタソールカーハメイト、4−クロロ−3,5−
キシレノール(パラクロロメタキシレノール)、4−ク
ロロ−3−クレゾール、シンクジメチルシチオカーハメ
ー1−、テトラメチルチウラムジスルフィド、ジンクエ
チレンビスジチオカーハメイト、2,3−ジクロロ−1
,4−ナフトキノン、2,4,5.6−チトラクロロイ
ソフタロニトリル、N−(トリクロロメチルチオ)−テ
トラハイドロフタルイミド、ジメチルラウリルヘンシル
アンモニウムクロリド、トリフェニルチンクロライド、
N ’ −(ジンクロロフルオロメチルチオ)−N、N
−ジメチル−N′−フェニルスルファミド等が挙げられ
る。なお、防カビ剤としては、特に昇華性のものが、後
述する表装材等への浸透性か高く、防カヒ効果に優れて
いる。As the antifungal agent, various agents used in ordinary construction can be used, such as 2-(4-thiazolyl).
-Henzimidazole, Methyl 2-Henzimidazole Carhamate, Methyl 1-Butylcarbamoyl-2-Henzimitazole Carhamate, 4-Chloro-3,5-
Xylenol (parachlorometaxylenol), 4-chloro-3-cresol, zinc dimethylcythiocarhame 1-, tetramethylthiuram disulfide, zinc ethylene bisdithiocarhamate, 2,3-dichloro-1
, 4-naphthoquinone, 2,4,5.6-titrachloroisophthalonitrile, N-(trichloromethylthio)-tetrahydrophthalimide, dimethyllaurylhensyl ammonium chloride, triphenyltin chloride,
N'-(dinechlorofluoromethylthio)-N,N
-dimethyl-N'-phenylsulfamide and the like. In addition, as a fungicidal agent, in particular, a sublimable one has a high permeability to a surface material, etc., which will be described later, and is excellent in anti-mildew effect.
パテ3に添加されたエチレン−酢酸ビニル+jJ li
t?は、後述する塩ヒフロス等の表装材に対ずろ接着性
を高め、施工後に表装材か剥がれたり浮き−にがるのを
防止するための接着強化剤として有効である。また、パ
テ3の表面に粉ふきか発生ずるのを防止するためにも、
上記エチレン−酢酸ビニル樹脂等の合成樹脂を添加する
のが有効である。Ethylene-vinyl acetate added to putty 3 + jJ li
T? is effective as an adhesive reinforcing agent for increasing the adhesion to facing materials such as salt hyfloss, which will be described later, and for preventing the facing materials from peeling off or floating after installation. Also, in order to prevent dust from forming on the surface of the putty 3,
It is effective to add a synthetic resin such as the above-mentioned ethylene-vinyl acetate resin.
このようにして、下地材2の隙間かパテ3で塞がれた後
、下地材2の表面に接着剤4が塗布され、この接着剤に
よって、塩ビクロス等の表装材5が貼着される。After the gaps in the base material 2 are filled with the putty 3 in this way, an adhesive 4 is applied to the surface of the base material 2, and a facing material 5 such as PVC cloth is pasted with this adhesive. .
表装材5は、塩ビクロスのほか、通常の内装施工に使用
されている、各種の合成樹脂シート、紙材、布地などか
らなる表装材が、自由に使用できる。接着剤4としては
、上記表装材5と下地4A2とを、強力に接着できるも
のであれば、通常の各種接着剤が使用できる。そして、
この接着剤4にも、前記パテ3と同様の防カビ剤および
エチレン−酢酸ビニル樹脂が添加されている。As the covering material 5, in addition to vinyl chloride cloth, covering materials made of various synthetic resin sheets, paper materials, fabrics, etc., which are commonly used in interior construction, can be freely used. As the adhesive 4, any of various ordinary adhesives can be used as long as it can strongly bond the facing material 5 and the base 4A2. and,
This adhesive 4 also contains the same antifungal agent and ethylene-vinyl acetate resin as the putty 3.
なお、エチレン−酢酸ビニル樹脂は、表装材5か塩ヒフ
ロス等の場合に、下地剤2との接着性を高める接着強化
剤として有効であるが、表装材5の利質によっては、エ
チレン−酢酸ビニルIff 脂以外の接着強化剤を配合
する場合もある。接着剤4かデンプンを主成分とするも
のの場合、地下デンプン(じゃかいも、タピオカ等から
なるもの)よりも変性小麦デンプンを使用したほうが、
耐水接着性および耐老化性が高い。また、接着剤に含有
される硝酸すI・リウムか少ないほど、施工萌に誤って
表装材5の表面に接着剤4が付着した場合に生しる、紫
外線による変色汚↑6が少ない。In addition, ethylene-vinyl acetate resin is effective as an adhesive strengthening agent that increases the adhesion with the base material 2 in the case of the facing material 5 or salt Hyfloss, but depending on the quality of the facing material 5, ethylene-vinyl acetate resin Adhesive strengthening agents other than vinyl Iff fats may be added. In the case of adhesives 4 or those whose main ingredient is starch, it is better to use modified wheat starch than underground starch (such as those made from potatoes, tapioca, etc.).
High water resistant adhesion and aging resistance. Furthermore, the less the amount of sodium nitrate contained in the adhesive, the less the discoloration stain ↑6 caused by ultraviolet rays, which occurs when the adhesive 4 accidentally adheres to the surface of the facing material 5 during construction.
以上に説明した壁構造は、来月等の基礎構造材1の両面
に石膏ボードからなる下地材2か貼着された壁パネルP
を用いる構造であるが、それ以外にも、多数の下地材2
の上に表装材5が貼着される構造のものであれば、通常
の建築施工に採用されている、各種の壁構造にも適用で
きるものである。例えば、壁パネルPを用いず、予め施
工された板壁やコンクリート壁等からなる基礎構造材1
に対して、現場施工で順次下地材2を貼着していく構造
のものでもよい。The wall structure explained above consists of a wall panel P with base material 2 made of gypsum board affixed to both sides of foundation structure material 1.
However, in addition to that, many base materials 2
As long as it has a structure on which the facing material 5 is adhered, it can be applied to various wall structures used in ordinary building construction. For example, the basic structure material 1 consists of a board wall, concrete wall, etc. constructed in advance without using the wall panel P.
Alternatively, a structure may be used in which the base material 2 is sequentially pasted during on-site construction.
下地材2は、石膏ボードのほか、合板その他、通常の建
築用下地材が使用でき、前記した実施例のように、石膏
ボード20の両面に紙21が貼着されたものは、この紙
21自体にもカビ発生防止の効果があるので好ましい。As the base material 2, in addition to gypsum board, plywood and other ordinary construction base materials can be used.As in the above embodiment, when paper 21 is pasted on both sides of the gypsum board 20, this paper 21 It is preferable because it itself has the effect of preventing mold growth.
なお、表装材5を貼着しない外装側の下地材2は、石膏
ボート20の外面側に、適宜の外装材が貼着されたもの
を使用すれば、施工上便利である。Note that it is convenient for construction if the base material 2 on the exterior side to which the facing material 5 is not attached is one in which a suitable exterior material is attached to the outer surface of the gypsum boat 20.
以上に説明した、壁構造の防カヒ作用を説明すると、パ
テ3および接着剤4に添加した防カビ剤が、建築施工後
に徐々に表装材5および下地材2の内部へと浸透してい
き、カビの発生および増殖を防止することができるので
ある。このとき、防カビ剤が昇華性の高いものであると
、表装材4や壁構造の内部まで、充分に浸透していき、
良好な防カビ効果を発揮することができろ。To explain the fungicidal effect of the wall structure explained above, the antifungal agent added to the putty 3 and adhesive 4 gradually penetrates into the interior of the facing material 5 and the base material 2 after construction is completed. It is possible to prevent the occurrence and growth of mold. At this time, if the antifungal agent has a high sublimation property, it will sufficiently penetrate into the interior of the facing material 4 and wall structure.
It can exhibit good anti-mildew effect.
つぎに、この発明の壁構造に使用する、パテ3および接
着剤4の配合例、およびその性能試験の結果について、
従来品と比較しながら、以下に説明する。Next, regarding the formulation examples of putty 3 and adhesive 4 used in the wall structure of this invention, and the results of their performance tests,
This will be explained below while comparing it with conventional products.
まず、パテおよび接着剤の配合例は、次表のとおりであ
る。First, examples of the combination of putty and adhesive are shown in the table below.
上記配合表において、防カビ剤の成分名は、以下の薬剤
を表している。In the above formulation table, the component names of the antifungal agent represent the following drugs.
PCMX:パラクロロメタキシレノール(有効成分10
0%)
TBZ:ザイアヘンダゾール
(有効成分50%)
有機千ソソ:テトロクロロ
イソフタコニ1−リル
(有効成分100%)
なお、上記配合からなるパテは粉末状態であり、この粉
末パテを、粉末パテ100:水50〜40の割合で錬り
合わせたものを試験に用いた。また、接着剤としては、
接着剤100:水70の混合比で混合したものを使用し
た。接着剤の塗布量は200g/mとした。PCMX: parachloromethaxylenol (active ingredient 10
0%) TBZ: Zyahendazole (active ingredient 50%) Organic chloride: Tetrochloroisophtaconyl-1-lyl (active ingredient 100%) The putty made of the above formulation is in a powder state, and this powder putty is A mixture of 100 parts of powdered putty and 50 to 40 parts of water was used in the test. In addition, as an adhesive,
A mixture of 100 parts adhesive and 70 parts water was used. The amount of adhesive applied was 200 g/m.
上記したパテおよび接着剤の性能試験の結果を次表に示
す。The results of the performance tests of the putty and adhesive described above are shown in the table below.
上記性能試験において、各試験項目のうち、添え字を付
記した項目については、以下の条件で試験を行った。In the above performance test, among the test items, the items with subscripts were tested under the following conditions.
■・・・JIS−A6922 (壁紙施工用でん粉系接
着剤)に準拠した。■ Conforms to JIS-A6922 (starch-based adhesive for wallpaper construction).
■・・・住宅都市整備公団特別共通仕様書に準拠した。■...Conforms to the Housing and Urban Development Corporation special common specifications.
初期接着(付着)強度:表装拐として塩ヒフロスを合板
またはパテに接着し、10目間室内乾燥した後接着強度
を測定した。Initial adhesion (adhesion) strength: Salt Hyfloss was adhered to plywood or putty as a surface coating, and after drying indoors for 10 times, the adhesion strength was measured.
耐久接着(付着)強度:上記同様、塩ビクロスを合板ま
たはパテに接着し、10日間室内乾燥した後、下記の環
境条件を所定ザイクル繰り返し、さらに10日間室内乾
燥した後、接着強度を測定した。Durable adhesion (adhesion) strength: As above, PVC cloth was adhered to plywood or putty, and after drying indoors for 10 days, the following environmental conditions were repeated for a predetermined cycle, and after drying indoors for another 10 days, adhesive strength was measured.
表■ ■・・・JIS−22911に準拠して実施した。Table ■ ■...Conducted in accordance with JIS-22911.
試験用のカビ:
アルペルギルス ニケル FERM S−1ペニシリウ
ム シトリナム FERM S−5ケトミウム グロボ
スム FERM 5−11ミロテシウム ヘルカリア
FERM 5−13アルテルナリア シトり
培 地:
硝酸アンモニウム 3.0g
りん酸−カリウム 1.0g
硫酸マグネシウム 0.5 g
塩化カリウム 0.25 g硫酸第一鉄
0.002 g寒天 25.0
g牢青聾慧水 1
000 ml培養温度=28 °C
培養期間:40 日
結果の表示:
3−試料又は試験片の接種した部分に
菌糸の発育が認められない。Molds for testing: Alpergillus nickel FERM S-1 Penicillium citrinum FERM S-5 Chaetomium Globosum FERM 5-11 Myrothecium Hercaria
FERM 5-13 Alternaria Shitori medium: Ammonium nitrate 3.0g Potassium phosphate 1.0g Magnesium sulfate 0.5g Potassium chloride 0.25g Ferrous sulfate
0.002 g agar 25.0
g prison blue deaf water 1
000 ml Culture temperature = 28 °C Culture period: 40 days Display of results: 3- No mycelial growth is observed in the inoculated part of the sample or test piece.
2−試料又は試験片の接種した部分に 認められる菌糸の発育部分の面積 は、全面積の1/3をこえない。2- On the inoculated part of the sample or test piece Area of observed mycelial growth does not exceed 1/3 of the total area.
1−試料又は試験片の接種した部分に 認められる菌糸の発育部分の面積 は、全面積の1/3をこえる。1- On the inoculated part of the sample or test piece Area of observed mycelial growth exceeds 1/3 of the total area.
■・・・失火化学の壁紙貼り用パテ試験方法に準拠した
。■...Compliant with Misfire Chemical's putty test method for pasting wallpaper.
以上の結果から、前記配合例のパテおよび接着剤は、防
カビ効果に優れているとともに、接着強度等の使用性能
も高いことが実証された。したがって、前記したこの発
明の壁構造に使用したときに充分な効果か発揮できるこ
とが判明した。From the above results, it was demonstrated that the putty and adhesive of the above-mentioned formulation example have excellent anti-mildew effects and also have high performance in use such as adhesive strength. Therefore, it has been found that sufficient effects can be exhibited when used in the wall structure of the present invention described above.
以上のような、この発明の壁構造は、下地材に表装材を
接着するための接着剤、および下地材同士の隙間を寒く
パテに、防カビ剤を添加していることによって、内装面
の全面にわたって、良好な防カビ効果を発揮することが
可能になった。The wall structure of the present invention as described above uses an adhesive for bonding the facing material to the base material, a cold putty for the gaps between the base materials, and an anti-mold agent added to the interior surface. It has become possible to exhibit a good anti-mold effect over the entire surface.
すなわち、防カビ剤を接着剤に添加しているだけでは、
接着剤の存在しないパテの部分でカビが発生したり増殖
して、表装斗旧J、lI に侵入する欠点があるが、こ
の発明のように、パテにも防カビ剤を添加しておけば、
表装材の裏面全体に、防カヒ効果を持たせることができ
、カヒが表装材側に侵入するのを、完全に遮断すること
ができる。In other words, simply adding antifungal agents to adhesives
There is a drawback that mold grows and grows in the parts of the putty where there is no adhesive and invades the surface of the putty, but if an anti-mold agent is added to the putty as in this invention, this can be prevented. ,
The entire back surface of the facing material can be given a stain-proofing effect, and the invasion of stains into the facing material side can be completely blocked.
特に、カビが発生したり増ti& シ易く、また壁内部
のカビが進出してくる通路となる、下地材端部の隙間を
、防カビ剤を添加したパテで塞(ので、従来に比べて、
防カビ効果は格段に向上する。In particular, the gaps at the edges of the base material, where mold can easily grow and grow, and where mold can enter inside the wall, can be filled with putty containing an anti-mold agent. ,
The anti-mold effect is greatly improved.
しかも、この発明の壁構造を施工するQこは、予め防カ
ビ剤を添加したパテを準備しておくだけで、現場での作
業は、特別な部材や工程を全く要さず、従来と同様に施
工でき、手間かかからす、施工時間や施工コストが増え
ることもない。What's more, in order to construct the wall structure of this invention, all you have to do is prepare the putty with anti-fungal agent in advance, and the work on site is the same as before, without requiring any special materials or processes. It can be constructed quickly and does not require much time or effort, and does not increase construction time or construction costs.
第1図はこの発明にかかる壁構造の一部切欠斜視図、第
2図は下地材同士の隙間部分の拡大断面図、第3図は壁
構造を構成する壁パネルの平面図、第4図は壁パネルを
施工した状態の端面図である。
2・・・下地材 3・・・パテ 4・・・接着剤 5・
・・表装材 C・・・隙間
代理人 弁理士 松 本 武 彦
手U辞甫正書(自発
昭和63年 2月25日
2、発明の名称
壁構造
3、補正をする者
事イ牛との関係 特許出願人
性 所 大阪府豊中市新千里西町1丁目1
番12号名 称 (467)ナショナル住宅産業
株式会社代表者 代表取締投函 尾 稔(ほか
2名)4、代理人
な し
6、補正の対象
明細書および代理権を証明する書面
7、補正の内容
■ 明細書の特許請求の範囲欄の全文を下記のとおりに
訂正する。
一記一
「土 壁下地材同士の隙間が表面からパテで塞がれ、そ
の下地材の上に接着剤を介して表装材が貼着されてなる
壁構造において、パテおよび接着剤が防カビ剤を添加さ
れたものからなることを特徴とする壁構造。」
■ 代理権を証明する書面を別紙のとおりに補正する。Fig. 1 is a partially cutaway perspective view of the wall structure according to the present invention, Fig. 2 is an enlarged sectional view of the gap between the base materials, Fig. 3 is a plan view of the wall panel constituting the wall structure, and Fig. 4. is an end view of the wall panel after it has been installed. 2... Base material 3... Putty 4... Adhesive 5.
... Surface material C ... Gap agent Patent attorney Takeshi Matsumoto Related Patent Applicant Location 1-1 Shinsenri Nishimachi, Toyonaka City, Osaka Prefecture
No. 12 Name (467) National Housing Industry Co., Ltd. Representative Representative Posted by Minoru O (and 2 others) 4. No agent 6. Specification subject to amendment and document proving authority of agency 7. Contents of amendment ■ The entire text of the claims column of the specification should be corrected as follows. In a wall structure where the gaps between wall base materials are filled with putty from the surface, and a facing material is pasted on top of the base material with an adhesive, the putty and adhesive prevent mold. A wall structure characterized by being made of a material to which an agent has been added.'' ■ Amend the document certifying the power of attorney as shown in the attached document.
Claims (1)
の下地材の上に接着剤を介して表装材が貼着されてなる
壁構造において、パテおよび接着剤が防カビ剤を添加さ
れたものからなることを特徴とする壁構造。(1) In a wall structure in which the gaps between wall base materials are filled with putty from the surface, and a facing material is pasted on top of the base material with an adhesive, the putty and adhesive may be coated with an antifungal agent. Wall structure characterized by consisting of additives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63002723A JP2507506B2 (en) | 1988-01-09 | 1988-01-09 | Wall structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63002723A JP2507506B2 (en) | 1988-01-09 | 1988-01-09 | Wall structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01178657A true JPH01178657A (en) | 1989-07-14 |
| JP2507506B2 JP2507506B2 (en) | 1996-06-12 |
Family
ID=11537231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63002723A Expired - Fee Related JP2507506B2 (en) | 1988-01-09 | 1988-01-09 | Wall structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2507506B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001152116A (en) * | 1999-12-01 | 2001-06-05 | Yayoi Chemical Industry Co Ltd | Aqueous adhesive |
| KR20020017238A (en) * | 2000-08-29 | 2002-03-07 | 연윤흠 | A execution methode of wallboard for construction |
| CN114482328A (en) * | 2022-02-21 | 2022-05-13 | 上海金茂建筑装饰有限公司 | Anti-mildew treatment construction method for wall engineering |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS514336A (en) * | 1974-07-02 | 1976-01-14 | Toyoda Automatic Loom Works | Oopunendoseibokino jojinsochiniokeru fujunkyozatsubutsuno jokyohohooyobisochi |
| JPS5120217A (en) * | 1974-08-10 | 1976-02-18 | Hokko Chem Ind Co | Kabirui ni yoru retsuka o boshisuru hoho |
| JPS57180669A (en) * | 1981-04-30 | 1982-11-06 | Osaka Soda Co Ltd | Mildewproofing method |
| JPS5849673A (en) * | 1981-09-16 | 1983-03-23 | 日本特殊陶業株式会社 | Manufacture of glaze substrate |
| JPS62243665A (en) * | 1986-04-16 | 1987-10-24 | Hagiwara Giken:Kk | Joint material composition with antifungal and antibacterial properties |
-
1988
- 1988-01-09 JP JP63002723A patent/JP2507506B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS514336A (en) * | 1974-07-02 | 1976-01-14 | Toyoda Automatic Loom Works | Oopunendoseibokino jojinsochiniokeru fujunkyozatsubutsuno jokyohohooyobisochi |
| JPS5120217A (en) * | 1974-08-10 | 1976-02-18 | Hokko Chem Ind Co | Kabirui ni yoru retsuka o boshisuru hoho |
| JPS57180669A (en) * | 1981-04-30 | 1982-11-06 | Osaka Soda Co Ltd | Mildewproofing method |
| JPS5849673A (en) * | 1981-09-16 | 1983-03-23 | 日本特殊陶業株式会社 | Manufacture of glaze substrate |
| JPS62243665A (en) * | 1986-04-16 | 1987-10-24 | Hagiwara Giken:Kk | Joint material composition with antifungal and antibacterial properties |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001152116A (en) * | 1999-12-01 | 2001-06-05 | Yayoi Chemical Industry Co Ltd | Aqueous adhesive |
| KR20020017238A (en) * | 2000-08-29 | 2002-03-07 | 연윤흠 | A execution methode of wallboard for construction |
| CN114482328A (en) * | 2022-02-21 | 2022-05-13 | 上海金茂建筑装饰有限公司 | Anti-mildew treatment construction method for wall engineering |
| CN114482328B (en) * | 2022-02-21 | 2024-03-01 | 上海金茂建筑装饰有限公司 | Wall engineering mildew-proof treatment construction method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2507506B2 (en) | 1996-06-12 |
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