JPH01178983U - - Google Patents

Info

Publication number
JPH01178983U
JPH01178983U JP7567788U JP7567788U JPH01178983U JP H01178983 U JPH01178983 U JP H01178983U JP 7567788 U JP7567788 U JP 7567788U JP 7567788 U JP7567788 U JP 7567788U JP H01178983 U JPH01178983 U JP H01178983U
Authority
JP
Japan
Prior art keywords
film
card
laminate
sealed
card according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7567788U
Other languages
Japanese (ja)
Other versions
JPH0742761Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7567788U priority Critical patent/JPH0742761Y2/en
Publication of JPH01178983U publication Critical patent/JPH01178983U/ja
Application granted granted Critical
Publication of JPH0742761Y2 publication Critical patent/JPH0742761Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に用いるフイルム積層体の製造
工程を示す解明図、第2図は本考案の一実施例の
断面を示す説明図、第3図は前記実施例の平面図
、第4図は本考案の別の実施例の断面を示す説明
図である。 1……フイルム積層体、2,3……透明フイル
ム、4……表面処理(隠蔽処理)、5……粘着層
、8……カード基材、10……カードの被シール
面、11……ヒートシール域、12……切取線。
Fig. 1 is an explanatory view showing the manufacturing process of the film laminate used in the present invention, Fig. 2 is an explanatory view showing a cross section of an embodiment of the invention, Fig. 3 is a plan view of the embodiment, and Fig. 4. FIG. 2 is an explanatory diagram showing a cross section of another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Film laminate, 2, 3... Transparent film, 4... Surface treatment (concealing treatment), 5... Adhesive layer, 8... Card base material, 10... Card surface to be sealed, 11... Heat seal area, 12...cutting line.

Claims (1)

【実用新案登録請求の範囲】 (1) 少なくとも一方の側に被シール面を有する
カード基材と、 エチレンを主成分とする重合体からなる一対の
透明な熱可塑性樹脂のフイルムをそれらの熱成形
工程の直後に互いに剥離可能に圧着させて形成し
たフイルム積層体とを備え、 前記積層体の一方のフイルムの下面が感圧性接
着剤層を介して前記カード基材の被シール面に接
着され、他方のフイルムの上面には前記被シール
面に対して充分な隠蔽性を与える表面処理が施さ
れ、かつ前記積層体の周縁部には前記一対のフイ
ルムを互いに固着させるためのヒートシールが形
成されていることを特徴とする被覆シール付カー
ド。 (2) 前記重合体がエチレンと酢酸ビニルとから
なる請求項1記載のカード。 (3) 前記重合体が実質的にエチレンのみからな
る請求項1記載のカード。 (4) 前記フイルムに隠蔽性を与える表面処理が
フイルム面に対して全面もしくは部分的に印刷を
施すことからなる前記請求項1記載のカード。 (5) 前記フイルム積層体の表面処理されたフイ
ルム面および前記カード基材の各一方の面に往復
はがきの往信用および復信用の宛先欄差出が夫々
形成されている請求項1記載のカード。
[Claims for Utility Model Registration] (1) A card base material having a surface to be sealed on at least one side, and a pair of transparent thermoplastic resin films made of a polymer mainly composed of ethylene, and thermoforming them. and a film laminate formed by pressing and bonding them to each other so that they can be peeled off immediately after the process, the lower surface of one of the films of the laminate being adhered to the sealed surface of the card base material via a pressure-sensitive adhesive layer, The upper surface of the other film is subjected to a surface treatment that provides sufficient concealment for the surface to be sealed, and a heat seal is formed on the peripheral edge of the laminate for fixing the pair of films to each other. A card with a covered seal. (2) The card according to claim 1, wherein the polymer comprises ethylene and vinyl acetate. (3) The card according to claim 1, wherein the polymer consists essentially of ethylene. (4) The card according to claim 1, wherein the surface treatment for imparting concealment properties to the film comprises printing on the entire or partial surface of the film. (5) The card according to claim 1, wherein address fields for outbound and return postcards are formed on each of the surface-treated film surface of the film laminate and one surface of the card base material.
JP7567788U 1988-06-07 1988-06-07 Card with cover sticker Expired - Lifetime JPH0742761Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7567788U JPH0742761Y2 (en) 1988-06-07 1988-06-07 Card with cover sticker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7567788U JPH0742761Y2 (en) 1988-06-07 1988-06-07 Card with cover sticker

Publications (2)

Publication Number Publication Date
JPH01178983U true JPH01178983U (en) 1989-12-21
JPH0742761Y2 JPH0742761Y2 (en) 1995-10-04

Family

ID=31300735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7567788U Expired - Lifetime JPH0742761Y2 (en) 1988-06-07 1988-06-07 Card with cover sticker

Country Status (1)

Country Link
JP (1) JPH0742761Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5145615B2 (en) 2001-04-06 2013-02-20 ミツミ電機株式会社 Semiconductor device

Also Published As

Publication number Publication date
JPH0742761Y2 (en) 1995-10-04

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