JPH01181525A - Spray device - Google Patents

Abstract

PURPOSE:To supply treatment liquid onto the surface of a wafer uniformly by performing reciprocating motion of a nozzle in horizontal direction on a wafer. CONSTITUTION:While a wafer 3 is revolved, a nozzle 4 which supplies treatment liquid from upward to the wafer 3 is allowed to perform reciprocating motion in horizontal direction on the wafer 3. By blowing off treatment liquid from this nozzle 4 to the wafer which moves below, the treatment liquid can be sprayed over the surface of the wafer uniformly. It allows a uniform treatment on the entire surface of wafer without producing any difference in treatment speed to realize stabilized quality of the product.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention is applicable to the manufacturing process of semiconductor integrated circuits, color filters, photomasks, etc., in which, for example, a developer, etching solution, MM, etc. are applied to the surface of a silicon or glass wafer. The present invention relates to an improvement in a spray device that performs surface treatment by supplying a treatment liquid suitable for a process from above to the wafer through a nozzle.

<Prior art and the problems it attempts to solve> The surface treatment of a wafer using a conventional spray device is shown in Figure 3 (
This will be explained using the explanatory diagram a). When a chuck 1 on which a plurality of wafers 3 are concentrically fixed by suction is rotated about a rotation shaft 2, the wafers move under the nozzle 4. At this time, the surface treatment of a plurality of wafers is performed at once by spraying a processing liquid depending on the process, such as a developing liquid, an etching liquid, or a stripping liquid, onto the wafers moving below from the nozzle.

At this time, the processing liquid sprayed from the nozzle tip is not uniformly sprayed onto the wafer surface, as shown in Figure 3 (C).
As shown in , there is unevenness in A%B within the wafer. The reason for this is that since each wafer revolves around the rotation axis of the chuck, the centrifugal force causes the processing liquid sprayed on the wafer surface to move outward.

If wafer processing (developing, etching, peeling, etc.) is performed under such conditions, differences in processing speed will occur due to unevenness in the processing liquid sprayed within the wafer, and a particularly fine pattern format is required. This has been an inconvenience for such products.

The present invention solves these problems in the prior art and provides a spray device that can uniformly supply a processing liquid to the wafer surface.

<Means for Solving the Problems> In other words, the present invention includes a chuck that suctions and fixes a plurality of wafers concentrically, and a process liquid that is supplied from above toward the wafers while the wafers are being rotated. The spray device has a nozzle, and the spray device is characterized in that the nozzle reciprocates in the horizontal direction above the wafer.

The present invention will be explained below based on the drawings.

FIG. 1 is an explanatory view of the spray apparatus of the present invention. When a chuck, on which a plurality of wafers are fixed by suction in a concentric manner, is rotated about a rotation axis, the wafers move under a nozzle. At this time, by spraying the treatment liquid from the nozzle onto the wafers moving below, surface treatment of a plurality of wafers is performed at once.

At this time, in order to uniformly spray the processing liquid onto the wafer surface, the present apparatus is equipped with a reciprocating mechanism that moves the nozzle back and forth horizontally over the wafer.

An example of a nozzle reciprocating mechanism will be explained based on FIG. 2. FIG. 2(a) is an explanatory view from below of a mechanism with a nozzle attached to its tip, and FIG. 2(b) is an explanatory view from the side. According to FIG. 2(a), a rack 8 is provided near the center of a rod-shaped nozzle support part 5 to which a nozzle is fixed at the tip, and a rack 8 is provided at two predetermined end points of the support part. A photo sensor 6 is attached.

The photosensor is connected so as to exert a control effect on the drive circuit of the motor 9 shown in FIG. 2(b).

A pinion gear 7 at the tip of the motor meshes with the rack provided on the support part, and the nozzle reciprocates in the horizontal direction by normal and reverse rotation of the motor.

FIG. 2(C) is an explanatory side view showing a state in which the cover 10 is covered with the nozzle support portion 5, and is an explanatory view seen from the side.
0 is provided with holes 11 at two locations at a wider interval than the photosensor 6. In Fig. 3 (C), the motor is rotating in the direction shown, and the support part to which the nozzle is attached also moves in the direction of the arrow, but in Fig. 2 (B)
When the state shown in Fig. 2 is reached, the left photosensor provided in the support reaches the position of the left hole provided in the cover, the photosensor senses the hole, and the rotation of the motor is reversed. As the motor reverses, the nozzle support also begins to move in the opposite direction, and when the state shown in Figure 2 (e) is reached, the photosensor on the right side of the nozzle support detects the hole on the right side of the cover, and the motor is reversed again. By repeating zero or more movements of moving the nozzle support in the opposite direction, the nozzle reciprocates in the horizontal direction. It supplies liquid.

<Effects of the Invention> According to the spray device of the present invention, since the processing liquid is uniformly sprayed over the surface of the wafer, there is no inconvenience of difference in processing speed as in the conventional case, and the entire surface of the wafer can be sprayed in different ways. This has made it possible to perform a variety of treatments, resulting in stable quality.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a spray device of the present invention, FIG. 2 is an explanatory diagram showing a reciprocating mechanism of a nozzle, and FIG. 3 is an explanatory diagram showing a conventional spray device. 1. Chuck 6. Photo sensor 2, rotation axis 7. Pinion gear 3, wafer
8. Rack 4, nozzle 9. Motor 5, nozzle support part 10. Cover 11, hole Patent application: Toppan Printing Co., Ltd. Representative: Kazuo Suzuki Figure 1 Figure 2 (a) Figure 2 (I) Figure 2 (C) -

Claims (1)

[Claims] 1) In a spray device having a chuck that suctions and fixes a plurality of wafers concentrically, and a nozzle that supplies a processing liquid from above to the wafers while the wafers are orbiting, the nozzle is located above the wafers. A spray device characterized by horizontal reciprocating motion.