JPH01185641A - Photosensitive body - Google Patents
Photosensitive bodyInfo
- Publication number
- JPH01185641A JPH01185641A JP905888A JP905888A JPH01185641A JP H01185641 A JPH01185641 A JP H01185641A JP 905888 A JP905888 A JP 905888A JP 905888 A JP905888 A JP 905888A JP H01185641 A JPH01185641 A JP H01185641A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- infra
- photoreceptor
- wave number
- carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010521 absorption reaction Methods 0.000 claims abstract description 12
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 4
- 108091008695 photoreceptors Proteins 0.000 claims description 30
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 14
- 230000000903 blocking effect Effects 0.000 abstract description 8
- 229910052799 carbon Inorganic materials 0.000 abstract description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 abstract description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 abstract description 4
- 230000036211 photosensitivity Effects 0.000 abstract description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract description 2
- 150000001721 carbon Chemical group 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 238000002407 reforming Methods 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 230000003252 repetitive effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 48
- 239000007789 gas Substances 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000000354 decomposition reaction Methods 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 230000000737 periodic effect Effects 0.000 description 6
- 238000000862 absorption spectrum Methods 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004014 SiF4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910017875 a-SiN Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 108010011222 cyclo(Arg-Pro) Proteins 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 108020003175 receptors Proteins 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical class [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Photoreceptors In Electrophotography (AREA)
Abstract
Description
【発明の詳細な説明】
イ、産業上の利用分野
本発明は感光体、例えば電子写真感光体に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a photoreceptor, such as an electrophotographic photoreceptor.
口、従来技術
従来、電子写真感光体として、アモルファスシリコン(
a−3i)を母体として用いた電子写真感光体が近年に
なって提案されている。Conventional technology Conventionally, amorphous silicon (
Electrophotographic photoreceptors using a-3i) as a matrix have been proposed in recent years.
このようなa−Siはいわゆるダングリングボンドを有
しているため、この欠陥を水素原子で補償して暗抵抗を
大としかつ光導電性も向上させたアモルファス水素シリ
コン(a−3i : H)が捷案されている。Since such a-Si has so-called dangling bonds, amorphous hydrogen silicon (a-3i: H), which compensates for these defects with hydrogen atoms, increases dark resistance and improves photoconductivity. is being devised.
しかしながら、a−Si:Hを表面とする感光体は、長
期に亘って大気や湿気に曝されることによる影響、コロ
ナ放電で生成される化学種の影響等の如き表面の化学的
安定性に関して、これまで十分な検討がなされていない
。例えば1力月以上放置したものは湿気の影響を受け、
受容電位が著しく低下することが分かっている。一方、
アモルファス水素化炭化シリコン(以下、a−3iC:
Hと称する。)について、その製法や存在が“Ph11
.Mag、Vol、35 ’″ (1978)等に記載
されておリ、その特性として、耐熱性や表面硬度が高い
こと、a−3i:)(と比較して高い暗所抵抗率(10
2〜10 Ω−cm)を有すること、炭素量により光
学的エネルギーギヤツブが1.6〜2.8eVの範囲に
亘って変化すること等が知られている。但し、炭素の含
有によりバンドギャップが拡がるために長波長感度が不
良となるという欠点がある。However, photoreceptors with a-Si:H surfaces are susceptible to surface chemical stability, such as the effects of long-term exposure to the atmosphere and moisture, and the effects of chemical species generated by corona discharge. , has not been sufficiently investigated so far. For example, items that have been left for more than a month will be affected by moisture.
It is known that the receptor potential is significantly reduced. on the other hand,
Amorphous hydrogenated silicon carbide (hereinafter referred to as a-3iC:
It is called H. ), its manufacturing method and existence are “Ph11
.. Mag, Vol. 35'' (1978), etc., and its characteristics include high heat resistance and surface hardness, and high dark resistivity (10
2 to 10 Ω-cm), and that the optical energy gear varies over a range of 1.6 to 2.8 eV depending on the amount of carbon. However, there is a drawback that the long wavelength sensitivity becomes poor due to the widening of the band gap due to the inclusion of carbon.
こうしたa−3iC:Hとa−3i;Hとを組合せた電
子写真感光体は例えば特開昭57−115559号公報
において提案されている。これによれば、a−3i:)
(からなる電荷発生層上にa−5ic:8層を表面改質
層として形成している。An electrophotographic photoreceptor combining such a-3iC:H and a-3i;H has been proposed, for example, in Japanese Patent Application Laid-Open No. 115559/1983. According to this, a-3i:)
(A-5IC:8 layer is formed as a surface modification layer on the charge generation layer consisting of (A-5IC:8 layer).
しかしながら、上記の公知の感光体について本発明者が
検討を加えたところ、表面改質層を設けても、未だ期待
した程には効果がなく、特に繰り返し使用時の耐スクラ
ッチ性に問題があることが判明した。However, when the present inventor investigated the above-mentioned known photoreceptor, it was found that even if a surface modification layer is provided, it is still not as effective as expected, and there are problems in particular with respect to scratch resistance during repeated use. It has been found.
像を得ることのできる感光体を提供することにある。The object of the present invention is to provide a photoreceptor capable of obtaining an image.
二9発明の構成及びその作用効果
即ち、本発明は、炭素原子及び酸素原子のうち少なくと
も炭素原子を含有するアモルファス水素化及び/又はハ
ロゲン化シリコンからなる表面改質層を有し、この表面
改質層について測定した赤外吸収曲線の波数1200〜
1300c「1での積分面積(S)が、
S=f”’a (ω)dω≦10,000 (c「2)
で表され、ωは赤外波数(am−” ) 、dは表面改
質層の膜厚(cm) 、I (ω)は透過光強度、I
Oは入射光強度である。〕
で示される範囲にある感光体に係るものである。29 Structure and effect of the invention, that is, the present invention has a surface modified layer made of amorphous hydrogenated and/or halogenated silicon containing at least carbon atoms and oxygen atoms, The wave number of the infrared absorption curve measured for the quality layer is 1200~
The integral area (S) at 1300c'1 is S=f'''a (ω)dω≦10,000 (c'2)
where ω is the infrared wave number (am-”), d is the thickness of the surface modified layer (cm), I (ω) is the transmitted light intensity, and I
O is the incident light intensity. ] This relates to a photoreceptor within the range shown below.
本発明によれば、表面改質層は炭素原子及び酸素原子の
少なくとも炭素原子を含有しているだけでな(、この表
面改質層の赤外吸収面積を上記したS≦10,000
(cm−2)に特定すルコトニヨッテ、はじめて満足す
べき耐スクラッチ性が得られ、白スジ発生等による画質
の劣化がなく、耐刷性が優れたものとなるのである。According to the present invention, the surface modified layer only contains at least carbon atoms and oxygen atoms (and the infrared absorption area of this surface modified layer is set to S≦10,000 as described above).
(cm-2), satisfactory scratch resistance can be obtained for the first time, there is no deterioration in image quality due to the occurrence of white streaks, and the printing durability is excellent.
ホ、実施例 以下、本発明を実施例について詳細に説明する。E, Example Hereinafter, the present invention will be described in detail with reference to examples.
第1図は、本実施例によるa−3i系電子写真感光体3
9を示すものである。この感光体39はA1等のドラム
状導電性支持基板41上に、必要に応じて設けられるa
−3i系の電荷ブロッキング層44と、a−3i:Hか
らなる光導電性層s 1c(o):u)からなる表面改
質層45とが積層された構造からなっている。電荷ブロ
ッキング層44は、a−3i :H,a−3iC:H又
はa −S i N :Hからなっていてよく、また周
期表第111A族又は第VA族元素がドープされていて
よい。また、光導電性層43にも同様の不純物がドープ
されていてよい。光導電性層43は、暗所抵抗率ρDと
光照射時の抵抗率ρ1 との比が電子写真感光体として
十分大きく光感度(特に可視及び赤外領域の光に対する
もの)が良好である。なお、上記の層45−43間には
a−3iC等の中間層を設けてもよい。FIG. 1 shows an a-3i electrophotographic photoreceptor 3 according to this embodiment.
9. This photoreceptor 39 is provided on a drum-shaped conductive support substrate 41 such as A1, if necessary.
It has a structure in which a -3i-based charge blocking layer 44 and a surface modification layer 45 made of a-3i:H photoconductive layer s1c(o):u) are laminated. The charge blocking layer 44 may be composed of a-3i:H, a-3iC:H or a-SiN:H, and may be doped with elements of group 111A or VA of the periodic table. Further, the photoconductive layer 43 may also be doped with similar impurities. The photoconductive layer 43 has a ratio of resistivity ρD in the dark to resistivity ρ1 during light irradiation that is sufficiently large as an electrophotographic photoreceptor, and has good photosensitivity (particularly to light in the visible and infrared regions). Note that an intermediate layer such as a-3iC may be provided between the layers 45-43.
ここで注目すべきことは、表面改質層45がC10の少
なくともCを含有するa−3iC:11又はa−3t
(Co) :J(からなっているだけでなく、その
C及びHの含有による5i−CH3に起因する赤外波数
1240CII−’近傍の赤外吸収面積(上記したS)
を101000cJl−2以下、望ましくは6.000
cra−2以下、更に望ましくは3.000 cu−
2以下と特定範囲に設定していることである。What should be noted here is that the surface modified layer 45 contains a-3iC:11 or a-3t containing at least C10.
(Co): J
below 101,000 cJl-2, preferably 6,000
cra-2 or less, more preferably 3.000 cu-
It is set within a specific range of 2 or less.
このように表面改質l1i45の5i−CH3に起因す
る波数近傍での赤外吸収面積を特定範囲に限定したこと
によって、表面改質層45の機械的強度、特に耐スクラ
ッチ性が著しく向上することがはじめて判明したのであ
る。By limiting the infrared absorption area in the vicinity of the wave number due to 5i-CH3 of the surface-modified l1i45 to a specific range, the mechanical strength, especially the scratch resistance, of the surface-modified layer 45 is significantly improved. was discovered for the first time.
表面改質層45の組成については、
10a t+a%≦(C)又は(C+O)≦100at
+s%(但し、(S i ) + (C) =100
atm%又は(S i) + (C) + (0) =
100atm%)とするのが望ましく、
40at+m%≦〔c〕又は(C+0) ≦70atm
%とするのが更に望ましい(ここで、atm%は原子表
面改質層45の帯電能を向上させるには、後述ツクロー
放電法において例えば(B2Hs)/(S i H4)
=10″3〜10’容量ppm 、望ましくは1叶i
〜102容量ppmの周期表第1[IA族元素、或いは
(PHa)/ (S iH+)=10′3〜104容量
ppm、望ましくはl叶1〜102容量ppmの周期表
第VA族元素をドープするのがよい。Regarding the composition of the surface modified layer 45, 10a t+a%≦(C) or (C+O)≦100at
+s% (However, (S i ) + (C) = 100
atm% or (S i) + (C) + (0) =
100atm%) is desirable, and 40at+m%≦[c] or (C+0)≦70atm
% (here, atm % is, for example, (B2Hs)/(S i H4) in order to improve the charging ability of the atomic surface-modified layer 45 in the later-described black discharge method.
= 10''3~10'capacity ppm, preferably 1 leaf i
~102 ppm by volume of elements of group IA of the periodic table, or doped with elements of group VA of the periodic table of (PHa)/(SiH+) = 10 to 104 ppm by volume, preferably 1 to 102 ppm by volume. It is better to do so.
また、表面改質層45の膜厚は200〜30,000人
とすることが望ましく、1.000−10.000人と
するのが更に望ましい。膜厚が大−きすぎると、残留電
位V、が高くなりすぎかつ光感度の低下も生じ、a−3
t系感光体としての良好な特性を失い易い。Further, the thickness of the surface modified layer 45 is desirably 200 to 30,000 thick, more preferably 1,000 to 10,000 thick. If the film thickness is too large, the residual potential V becomes too high and the photosensitivity decreases, resulting in a-3
It is easy to lose the good characteristics as a t-type photoreceptor.
また、膜厚が小さすぎると、トンネル効果にょって電荷
が表面上に帯電されなくなるため、暗減衰の増大や光感
度の低下が生じてしまう。Furthermore, if the film thickness is too small, charges will not be charged on the surface due to the tunnel effect, resulting in increased dark decay and decreased photosensitivity.
感光層としての光導電性層43はa−3i:Hからなっ
ていてよ(、その組成としては、11を5〜40a L
m%とするのがよく、トIに代えて或いは併用してハロ
ゲンを含有するときにはハロゲン5〜40a ta+%
、或いはHとハロゲンとの含有量は5〜40a ts+
%とするのがよい。この光導電性層43は帯電能向上の
ために不純物、特に周期表第1[IA族又はVA族元素
をドープするとよい。例えば、後述のグロー放電時に、
(BHe)/ (S iH+)〜10−3〜100(好
ましくは10−2〜10)容iippm、(PH3)/
(S 1H4)=10″3〜100(好ましくは10
−2〜10)容量ppmとしてよい。The photoconductive layer 43 as a photosensitive layer is composed of a-3i:H (its composition is 11 in 5-40aL).
m%, and when containing halogen in place of or in combination with I, halogen 5 to 40a ta+%
, or the content of H and halogen is 5 to 40a ts+
It is better to set it as %. This photoconductive layer 43 is preferably doped with an impurity, particularly an element from group IA or VA of the periodic table, in order to improve charging performance. For example, during glow discharge described below,
(BHe)/(S iH+) ~ 10-3 ~ 100 (preferably 10-2 ~ 10) volume ippm, (PH3)/
(S 1H4)=10″3~100 (preferably 10
-2 to 10) Capacity ppm may be used.
また、この層43の厚みは5〜100μm1好ましくは
10〜30μmとするのがよい。光導電性層43の厚み
が小さすぎると十分な帯電電位が得られず、また大きす
ぎると残留電位が上昇し、実用上不十分である。Further, the thickness of this layer 43 is preferably 5 to 100 μm, preferably 10 to 30 μm. If the thickness of the photoconductive layer 43 is too small, a sufficient charging potential cannot be obtained, and if it is too large, the residual potential increases, which is insufficient for practical use.
また、上記電荷ブロッキング層44は、基板41からの
電子の注入を十分に防ぎ、感度、帯電能の向上のために
は、周期表第1IIA族元素(例えばボロン)をグロー
放電分解でドープして、P型(更にはP 型)化する。Further, in order to sufficiently prevent electron injection from the substrate 41 and improve sensitivity and charging ability, the charge blocking layer 44 is doped with an element of Group IIA of the periodic table (for example, boron) by glow discharge decomposition. , becomes P type (and further P type).
ブロッキング層の組成によって、次のようにドーピング
量を制御するのが望ましい。It is desirable to control the doping amount as follows depending on the composition of the blocking layer.
a−5i:H(H含有IF 5〜40ats%):(B
2 Hs) / (S i H4) =10’〜10
4容量ppm(更には10−1〜102容量ppm )
(PH3)/ (S iH+)−10″3〜104容量
ppm(更には10−1〜102容量ppm )a−3
iC:H(H含有量5〜50at11%、C含有量5〜
100 at−%) :
(B z He〕/ (S i H4) =10″3〜
106容量ppm(更には10−1〜104容量ppm
)(PH3)/ (S 1H4)=10’〜106容
量ppm(更には1o−t〜104容量pp論)a−3
iN:H(H含有量5〜50at+w%、N含有量5〜
60a を精%):
(B z Hs) / (S i H4) =1(1’
〜106容量pps+(更には10−1〜104容量p
pm )(PH3)/ (S 1H4)=10’〜10
6容量pp+*(更には10−1〜104容量ppm
)また、ブロッキング層44は膜厚100人〜2μmが
よい、厚みが小さすぎるとブロッキング効果が弱く、ま
た大きすぎると電荷輸送能が悪くなり易い。a-5i:H (H-containing IF 5-40 ats%): (B
2 Hs) / (S i H4) = 10'~10
4 volume ppm (even 10-1 to 102 volume ppm)
(PH3)/(S iH+)-10″3 to 104 volume ppm (further 10-1 to 102 volume ppm) a-3
iC:H (H content 5~50at11%, C content 5~
100 at-%): (B z He]/ (S i H4) = 10″3~
106 capacity ppm (furthermore 10-1 to 104 capacity ppm
) (PH3)/(S 1H4) = 10' to 106 capacity ppm (further 1o-t to 104 capacity ppm theory) a-3
iN:H (H content 5-50at+w%, N content 5-50at+w%
60a): (B z Hs) / (S i H4) = 1(1'
~106 capacity pps+ (furthermore 10-1~104 capacity p
pm)(PH3)/(S1H4)=10'~10
6 capacity pp+* (and 10-1 to 104 capacity ppm
) The blocking layer 44 preferably has a thickness of 100 to 2 μm; if the thickness is too small, the blocking effect will be weak, and if it is too large, the charge transport ability will tend to deteriorate.
なお、上記の各層は水素を含有することが必要である。Note that each of the above layers needs to contain hydrogen.
特に、光導電性1ii(電荷発生層)43中の水素含有
量は、ダングリングボンドを補償して光導電性及び電荷
保持性を向上させるために必要である。In particular, the hydrogen content in the photoconductive layer 1ii (charge generation layer) 43 is necessary to compensate for dangling bonds and improve photoconductivity and charge retention.
また、ドープする不純物としては、ボロン以外にも、A
j!、Ga、I n、T1等の周期表第1[IA族元素
を使用できるし、またリン以外にも、As、sb等の周
期表第VA族元素を使用できる。In addition to boron, the impurities to be doped include A
j! , Ga, In, T1, etc. can be used, and in addition to phosphorus, elements of Group VA of the periodic table such as As, sb, etc. can be used.
次に、上記した感光体(例えばドラム状)の製造方法及
びその装置に(グロー放電装置)を第2図について説明
する。Next, a method for manufacturing the above-mentioned photoreceptor (eg, drum-shaped) and its apparatus (glow discharge device) will be explained with reference to FIG.
この装置51の真空槽52内ではドラム状の基板41が
垂直に回転可能にセントされ、ヒーター55で基板41
を内側から所定温度に加熱し得るようになっている。基
板41に対向してその周囲に、ガス導出口53付きの円
筒状高周波電極57が配され、基板41との間に高周波
電源56によりグロー放電が生ぜしめられる。なお、図
中の62はS i H4又はガス状シリコン化合物の供
給源、63はCI 4等の炭化水素ガスの供給源、64
はN2等の窒素化合物ガスの供給源、65は02等の酸
素化合物ガスの供給源、66はAr等のキャリアガス供
給源、67は不純物ガス(例えばB2H6)供給源、6
8は各流量計である。このグロー放電装置において、ま
ず支持体である例えばA2基板41の表面を清浄化した
後に真空槽52内に配置し、真空槽52内のガス圧が1
O−6Torrとなるように調節して排気し、かつ基板
41を所定温度、特に100〜350℃(望ましくは1
50〜300℃)に加熱保持する。次いで、高純度の不
活性ガスをキヤに導入し、例えば0.01〜1QTor
rの反応圧下で高周波電源56により高周波電圧(例え
ば13.56 Mllz)を印加する。これによって、
上記各反応ガスを電極57と基板41との間でグロー放
電分解し、a−3i :H,a−3i :H,a−3i
C:Hを上記の層44.43.45として基板上に連続
的に(即ち、例えば第1図の例に対応して)堆積させる
。A drum-shaped substrate 41 is vertically rotatably placed in a vacuum chamber 52 of this device 51, and a heater 55 is used to rotate the substrate 41.
can be heated to a predetermined temperature from the inside. A cylindrical high frequency electrode 57 with a gas outlet 53 is disposed around and facing the substrate 41, and a glow discharge is generated between the electrode 57 and the substrate 41 by a high frequency power source 56. In addition, 62 in the figure is a supply source of S i H4 or a gaseous silicon compound, 63 is a supply source of hydrocarbon gas such as CI 4, and 64
65 is a supply source of nitrogen compound gas such as N2, 65 is a supply source of oxygen compound gas such as 02, 66 is a carrier gas supply source such as Ar, 67 is an impurity gas (for example, B2H6) supply source, 6
8 is each flow meter. In this glow discharge device, first, the surface of a support, for example, an A2 substrate 41, is cleaned and then placed in a vacuum chamber 52, and the gas pressure in the vacuum chamber 52 is reduced to 1.
The temperature of the substrate 41 is adjusted to 0-6 Torr and evacuated, and the substrate 41 is heated to a predetermined temperature, particularly 100 to 350°C (preferably 1
50-300°C). Next, a high purity inert gas is introduced into the carrier, e.g. 0.01 to 1Q Tor.
A high frequency voltage (for example, 13.56 Mllz) is applied by a high frequency power supply 56 under a reaction pressure of r. by this,
Each of the above reaction gases is decomposed by glow discharge between the electrode 57 and the substrate 41, and a-3i:H, a-3i:H, a-3i
C:H is deposited as layers 44, 43, 45 as described above on the substrate in succession (i.e. corresponding to the example of FIG. 1, for example).
上記製造方法においては、支持体上にa−3i系の層を
製膜する工程で支持体温度を100〜350℃としてい
るので、感光体の膜質(特に電気的特性)を良くするこ
とができる。In the above manufacturing method, the support temperature is set at 100 to 350°C in the step of forming the a-3i layer on the support, so the film quality (especially electrical properties) of the photoreceptor can be improved. .
なお、上記a−3i系感光体感光層の形成時において、
ダングリングボンドを補償するためには、上記したHの
かわりに、或いはI]と併用してフッ素等のハロゲンを
SiF4等の形で導入し、a −3i :F、a−3i
:H:F、a−3iN:F。In addition, when forming the above a-3i photoreceptor photosensitive layer,
In order to compensate for dangling bonds, a halogen such as fluorine is introduced in the form of SiF4 instead of the above H or in combination with I, and a-3i :F, a-3i
:H:F, a-3iN:F.
なお、上記の製造方法はグロー放電分解法によるもので
あるが、これ以外にも、スパッタリング法、イオンブレ
ーティング法や、水素放電管で活性化又はイオン化され
た水素導入下でSiを蒸発させる方法(特に、本山順人
による特開昭56−78413号(特開昭54−152
455号)の方法)等によっても上記感光体の製造が可
能である。The above manufacturing method is based on the glow discharge decomposition method, but there are also sputtering methods, ion blating methods, and methods in which Si is evaporated while introducing activated or ionized hydrogen in a hydrogen discharge tube. (In particular, JP-A-56-78413 by Junto Motoyama (JP-A-54-152)
The above photoreceptor can also be manufactured by the method of No. 455).
以下、本発明を具体的な実施例について説明する。Hereinafter, the present invention will be described with reference to specific examples.
グロー放電分解法により、ドラム状Al支持体上に第1
図の構造の電子写真感光体を作製した。By glow discharge decomposition method, the first
An electrophotographic photoreceptor having the structure shown in the figure was manufactured.
即ち、まず支持体である、例えば平滑な表面を持つドラ
ム状A2基Fi41の表面を清浄化した後に、第2図の
真空槽52内に配置し、真空槽52内のガス圧が10’
Torrとなるように調節して排気し、かつ基板41を
所定温度、特に100〜350℃(望ましくは150〜
300℃)に加熱保持する。次いで、高純度のArガス
をキャリアガスとして導入し、0.5 Torrの背圧
のもとて周波数13.56 MHzの高周波電力を印加
し、10分間の予備放電を行った。次いで、SiH4と
BzHaからなる反応ガスを導入し、流量比1 : 1
: (1,5Xl0−3)の(Ar+S iH4+
B2H6)混合ガスをグロー放電分解することにより、
電荷プロ・ノキング機能を担うP+型のa−3i:H層
44を6pm/hrの堆積速度で所定厚さに製膜した。That is, first, after cleaning the surface of the support, for example, a drum-shaped A2 group Fi41 with a smooth surface, it is placed in the vacuum chamber 52 shown in FIG.
Torr, and exhaust the air, and keep the substrate 41 at a predetermined temperature, particularly 100 to 350°C (preferably 150 to 350°C).
Heat and maintain at 300°C. Next, high-purity Ar gas was introduced as a carrier gas, high-frequency power with a frequency of 13.56 MHz was applied under a back pressure of 0.5 Torr, and preliminary discharge was performed for 10 minutes. Next, a reaction gas consisting of SiH4 and BzHa was introduced at a flow rate ratio of 1:1.
: (Ar+S iH4+ of (1,5Xl0-3)
B2H6) By glow discharge decomposition of mixed gas,
A P+ type a-3i:H layer 44 having a charge pro-noking function was formed to a predetermined thickness at a deposition rate of 6 pm/hr.
引き続き、流ithヒ1 : 1 : (5xlO−6
)の(Ar+SiH4十B2H6)混合ガスを放電分解
し、所定厚さのボロンドープドa−3i:8層43を形
成した。引続いて、不純物ガスを供給停止し、流量比4
0:3:90の(Ar:5tH4:CH4)混合ガスを
反応圧力p =Q、5 Torr、放電パワーR1=4
00 Wでグロー放電分解し、所定厚さの中間層を形成
し、更に、流量比40:3:90の(Ar : S 1
)14 :CFI4)混合ガスを反応圧力P = 1.
0 Torr、放電パワーRf=400 Wでグロー放
電分解して表面保護層45を更に設け、電子写真感光体
を完成させた。なお、表面層45をa−3iCOとする
ときは、酸素源としてCO2を使用した。次に、上記の
各感光体を使用して各種のテストを次のように行った。Subsequently, the flow rate was 1: 1: (5xlO-6
) (Ar+SiH4+B2H6) mixed gas was subjected to discharge decomposition to form a boron-doped a-3i:8 layer 43 of a predetermined thickness. Subsequently, the impurity gas supply is stopped and the flow rate ratio is 4.
0:3:90 (Ar:5tH4:CH4) mixed gas at reaction pressure p = Q, 5 Torr, discharge power R1 = 4
Glow discharge decomposition was performed at 00 W to form an intermediate layer of a predetermined thickness, and further, (Ar: S 1
)14:CFI4) Mixed gas at reaction pressure P = 1.
Glow discharge decomposition was performed at 0 Torr and discharge power Rf=400 W to further provide a surface protective layer 45, thereby completing an electrophotographic photoreceptor. Note that when the surface layer 45 was made of a-3iCO, CO2 was used as the oxygen source. Next, various tests were conducted using each of the photoreceptors described above as follows.
31肘ジ2コ仁元ス」−
電子写真複写機U −Bix 2500 (コニカ株式
会社製)改造機を用い、次のステップでジャムテストを
行った。Using a modified electrophotographic copying machine U-Bix 2500 (manufactured by Konica Corporation), a jam test was conducted in the following steps.
■ 分離電流をゼロにし、強制的にジャムを発生させる
。■ Set the separation current to zero and force a jam.
■ 紙づまりの状態で30秒空まわしする。■ If there is a paper jam, let it run for 30 seconds.
■ ■、■を30回繰返す。■ Repeat ■ and ■ 30 times.
■ 画出しによりジャム傷の有無を判断。■ Determine the presence or absence of jam damage by displaying the image.
○ ジャム傷なし
△ ジャム傷数本発生
× ジャム傷多数発生
■二が土到度
第3図に示すように、感光体39面に垂直に当てた0、
3Rダイヤ針70に荷重Wを加え、感光体をモータ71
で回転させ、傷をつける。次に、上記の複写機で画像出
しを行い、何gの荷重から画像に白スジが現れるかで、
その感光体の引っかき強度(g)とする。○ No jamming scratches △ Several jamming scratches occurred × Many jamming scratches occurred
A load W is applied to the 3R diamond needle 70, and the photoreceptor is moved by the motor 71.
Rotate it with and scratch it. Next, print an image using the above-mentioned copying machine, and check the load at which white streaks appear on the image.
Let this be the scratch strength (g) of the photoreceptor.
結果を下記表−1にまとめて示した。この結果から、本
発明に基づいて感光体(魚1〜4)を作成すれば、電子
写真用として特に耐スクラッチ性に優れた感光体が得ら
れることが分かる。The results are summarized in Table 1 below. From these results, it can be seen that if the photoreceptors (Fish 1 to 4) are prepared according to the present invention, photoreceptors particularly excellent in scratch resistance for use in electrophotography can be obtained.
表 −1
*既述した5i−CH3に起因する波数1240cm−
’付近での赤外吸収面積S
上記の感光体隘1〜7の各赤外吸収面積Sは、実際には
、各表面改質層の膜材料をSiウェハ上に上述した方法
で堆積させ、得られた各試料を赤外分光器にかけて赤外
吸収スペクトルを測定し、これから算出したものである
。このうち、例えば感光体1Ilhl、2.3.5.7
についての赤外吸収スペクトル図とその波数1240c
m−’近傍の拡大図とを夫々、第4A図及び第4B図(
隘1)、第5A図及び第5B図(lth2)、第6A図
及び第6B図(隅3)、第7A図及び第7B図(11k
L5)、第8A図及び第8B図(Nl17 )に示した
。これらの図中、dは表面改質層の厚さであり、またS
i % C10の組成比(a Lm%)も併せて示し
た。また各拡大図には赤外吸収面積Sも記した。但し、
0量については0.1又は0.2 atn+%程度はほ
ぼゼロとみなし得る。Table-1 *Wave number 1240cm caused by 5i-CH3 mentioned above-
The infrared absorption area S near the photoreceptor 1 to 7 is actually determined by depositing the film material of each surface modification layer on the Si wafer by the method described above. Each obtained sample was subjected to an infrared spectrometer to measure the infrared absorption spectrum, and calculations were made from the infrared absorption spectrum. Among these, for example, photoreceptor 1Ilhl, 2.3.5.7
Infrared absorption spectrum diagram and its wave number 1240c
An enlarged view of the vicinity of m-' is shown in Fig. 4A and Fig. 4B (
1), Figures 5A and 5B (lth2), Figures 6A and 6B (corner 3), Figures 7A and 7B (11k
L5), as shown in Figures 8A and 8B (Nl17). In these figures, d is the thickness of the surface modified layer, and S
The composition ratio (a Lm%) of i % C10 is also shown. In addition, the infrared absorption area S is also written in each enlarged view. however,
Regarding the amount of 0, approximately 0.1 or 0.2 atn+% can be considered to be almost zero.
これらのスペクトル図から、表面改質層の赤外吸収面積
Sは、C及びOの含有量によって変化する傾向があるこ
とが分かる。但し、0量を多くすると膜構造の乱れ(S
i CH3等によるネットワーク構造の乱れ)によっ
て、吸収がブロードとなり、Sが必要以上に太き(なる
傾向があると考えられる。From these spectrograms, it can be seen that the infrared absorption area S of the surface modified layer tends to change depending on the C and O contents. However, if the amount of 0 is increased, the film structure will be disturbed (S
It is thought that due to disturbance of the network structure due to i CH3 etc., absorption becomes broad and S becomes thicker than necessary.
なお、上記した方法において、5i−CH3の赤外線吸
収強度は反応圧力を低くすることによって低下すること
が分かった。また、感光体の暗抵抗(ρD)と光照射時
の抵抗(pL)の比:ρ。In addition, in the above method, it was found that the infrared absorption intensity of 5i-CH3 was decreased by lowering the reaction pressure. Also, the ratio of the dark resistance (ρD) of the photoreceptor to the resistance during light irradiation (pL): ρ.
/ρ、は反応圧力を上げると1.0に近づくこと、反応
圧力を上げると膜中のS、 D、 (Spin de
nsityニスピン密度=ダングリングボンドの密度)
が増質屓を製膜するときのCH4流量、反応圧力によっ
て5i−CH3に起因する吸収面積Sが変化することも
判明している。これを以下に説明すると、まず、CH4
流量による影響は、次の条件下で測定し、下記表−2に
示した。/ρ approaches 1.0 as the reaction pressure increases, and as the reaction pressure increases, S, D, (Spin de
nsity pin density = dangling bond density)
It has also been found that the absorption area S due to 5i-CH3 changes depending on the CH4 flow rate and reaction pressure when forming a thickened layer. To explain this below, first, CH4
The influence of flow rate was measured under the following conditions and is shown in Table 2 below.
条−註 S i 84 =15 SCCM A r =200SCCM Rf =400 W P =0.5 Torr (以下余白、次頁に続く。) 表 −2 また、反応圧力によるコントロールを次に示ス。Article-Note S i 84 = 15 SCCM A r = 200SCCM Rf = 400W P = 0.5 Torr (Margin below, continued on next page.) Table-2 Also, control using reaction pressure is shown below.
条−豆 S i H4=15 SCCM CH4=450SCCM A r =200SCCM Rf =400 W 表 −3row-bean S i H4=15 SCCM CH4=450SCCM A r = 200SCCM Rf = 400W Table-3
第1図〜第8図は本発明の実施例を示すものであって、
第1図はa−3t系感光体の断面図、
第2図はグロー放電装置の概略断面図、第3図は引っか
き強度試験機の概略図、第4A図、第5A図、第6A図
、第7A図、第8A図は各感光体の表面改質層の赤外吸
収スペクトル図、
第4B図、第5B図、第6B図、第7B図、第8B図は
同赤外吸収スペクトルの要部拡大図である。
なお、図面に示された符号において、
39・・・・・・・・・a−3i系感光体41・・・・
・・・・・支持体(基板)43・・・・・・・・・光導
電性層
44・・・・・・・・・電荷ブロッキング層45・・・
・・・・・・表面改質層
である。1 to 8 show examples of the present invention, in which FIG. 1 is a sectional view of an a-3t photoreceptor, FIG. 2 is a schematic sectional view of a glow discharge device, and FIG. 3 is a sectional view of a glow discharge device. A schematic diagram of the scratch strength tester; Figures 4A, 5A, 6A, 7A, and 8A are infrared absorption spectra of the surface modified layer of each photoreceptor; Figures 4B and 5B; , FIG. 6B, FIG. 7B, and FIG. 8B are enlarged views of essential parts of the same infrared absorption spectrum. In addition, in the symbols shown in the drawings, 39...a-3i type photoreceptor 41...
... Support (substrate) 43 ... Photoconductive layer 44 ... Charge blocking layer 45 ...
......Surface modified layer.
Claims (1)
含有するアモルファス水素化及び/又はハロゲン化シリ
コンからなる表面改質層を有し、この表面改質層につい
て測定した赤外吸収曲線の波数1200〜1300cm
^−^1での積分面積(S)が、▲数式、化学式、表等
があります▼ 〔但し、a(ω)=−(1/d)log_1_0I(ω
)/Ioで表され、ωは赤外波数(cm^−^1)、d
は表面改質層の膜厚(cm)、I(ω)は透過光強度、
Ioは入射光強度である。〕 で示される範囲にある感光体。[Claims] 1. A surface modified layer made of amorphous hydrogenated and/or halogenated silicon containing at least carbon atoms and oxygen atoms, and an infrared ray measured for this surface modified layer. Absorption curve wave number 1200-1300cm
The integral area (S) at ^-^1 is ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [However, a(ω)=-(1/d)log_1_0I(ω
)/Io, ω is the infrared wave number (cm^-^1), d
is the thickness of the surface modified layer (cm), I(ω) is the transmitted light intensity,
Io is the incident light intensity. ] Photoreceptor within the range shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP905888A JPH01185641A (en) | 1988-01-19 | 1988-01-19 | Photosensitive body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP905888A JPH01185641A (en) | 1988-01-19 | 1988-01-19 | Photosensitive body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01185641A true JPH01185641A (en) | 1989-07-25 |
Family
ID=11710021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP905888A Pending JPH01185641A (en) | 1988-01-19 | 1988-01-19 | Photosensitive body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01185641A (en) |
-
1988
- 1988-01-19 JP JP905888A patent/JPH01185641A/en active Pending
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