JPH011902A - Press mold clearance measurement method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the measurement of the clearance between a punch and a die of a punching die, and particularly to a measurement method for high-precision press working of thin objects.

[Conventional technology]

As a conventional method for measuring the clearance of a punching die, as shown in FIG. The clearances X, , X2 were indirectly measured for centering.

[Problem that the invention seeks to solve]

The above-described conventional method for measuring the clearance of a punching die has the disadvantage that when the clearance is minute, accurate measurement cannot be made due to distortion of the material that occurs during punching.

The present invention solves the above-mentioned drawbacks of the conventional measurement method, and at the same time achieves uniform clearance between the punch and die, which was previously impossible to adjust, and provides optimal clearance for shapes such as corners and straight parts. With the settings of
By shortening mold assembly and adjustment man-hours, minimizing and uniformizing the cracks of workpieces, we can reduce mold costs, improve the availability of materials for mold design, and improve the quality of processed parts. The aim is to achieve various ripple effects.

[Means for solving problems]

The method for measuring the clearance of a press mold according to the present invention uses an optical means that does not directly contact either the punch or the die to measure the clearance between the punch and the die in the final assembled state of the press. It is characterized by determining 11ll.

[For production]

Therefore, the problem of measurement errors due to material distortion, etc. that occur during punching of the workpiece material is solved, and minute tolerances can be accurately measured.

〔Example〕

Next, embodiments of the present invention will be explained with reference to the drawings.

FIG. 1 is a side view of an embodiment of the method for determining the clearance A11 of a press die according to the present invention and a measuring device used therefor.

A punch plate 2 with a punch 3 set in the center is attached to the H-type die set 1, and a punch plate 5 with a die 4 set in the center is attached to the lower die set 6. A fixing magnet 8 is magnetically attracted to the side surface of the Goui plate 5, and the fixing magnet 8 has an objective lens 7a at its tip, and an optical unit 7 whose focus can be adjusted by a feed guide 8, and which illuminates the measurement site. An illumination lamp 9 and a measuring device 13 with an ITV camera 10 are installed, the ITV camera 10 being connected to a monitor TVII.

FIG. 2 is a detailed diagram of the measurement method of this example.

The optical unit 7 is moved parallel to the upper surface of the gouly plate 5, and the objective lens 7a is positioned 1.1ffi above the end surface of the die 4.
When the image is projected on monitor TVII with focus on p, a point P2 on the side of punch 3 is also focused at the same time, so PI is projected on monitor TVII.

12, and the clearance X determined by the inclination angle θ of the objective lens perpendicular to the line segment PIF is X = M
Calculated by simO--(1).

In this embodiment, one measuring device was used to measure the clearance, but centering can be achieved in a very short amount of time by setting the measuring devices at symmetrical positions and in a direction perpendicular to the symmetrical positions, and by measuring at the same time and making fine adjustments. Furthermore, if the optical system is made flexible by using optical fibers, interferences such as guide posts between the molds can be avoided, making measurement easier.

〔Effect of the invention〕

As explained below, the present invention measures the clearance between the punch and the die in the final assembled state of the press mold in a non-contact state using optical means, thereby making it possible to determine the Jln during actual processing, which previously could not be determined. Clearance can be measured down to 1 micron.

1. The clearance can be adjusted uniformly, and the optimum clearance can be set for shapes such as corners and some straight sections. 2. The man-hours required for mold assembly can be reduced, and the crispness of the workpiece can be made uniform and minimized. This has the effect of reducing mold costs, accumulating materials for mold design, and improving the quality of workpieces.

[Brief explanation of drawings]

1st IN is a side view of an embodiment of the press die clearance measuring method of the present invention and the 414 gauge used therein;
FIGS. 2(a) and 2(b) are detailed explanatory views of the Al11 standard method, and FIG. 3 is an explanatory view of the conventional clearance measurement method. 1...Upper die set, 2...Punch plate, 3...Punch, 4...Die, 5...Gui plate, 6 ...Lower mold set, 7...Optical-L knit. 7a... Objective lens, 8... Fixing magnet, 9... Illumination lamp, 10... ITV camera. 11... Monitor TV, 12... Feeding guide. 13... Measuring device. Patent applicant: Canon Electronics Co., Ltd. Representative: Tadashi Wakabayashi 21st! l (DJ Figure 3

Claims (1)

[Claims] In a method for measuring the clearance between a punch and a die of a press mold, the clearance between the punch and the die in the final assembled state of the press mold is measured by an optical means that does not come into direct contact with either the punch or the die. A press die clearance measuring method characterized by the following.