JPH0119573B2 - - Google Patents
Info
- Publication number
- JPH0119573B2 JPH0119573B2 JP11100381A JP11100381A JPH0119573B2 JP H0119573 B2 JPH0119573 B2 JP H0119573B2 JP 11100381 A JP11100381 A JP 11100381A JP 11100381 A JP11100381 A JP 11100381A JP H0119573 B2 JPH0119573 B2 JP H0119573B2
- Authority
- JP
- Japan
- Prior art keywords
- compounds
- group
- polymer compound
- basic
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000001875 compounds Chemical class 0.000 claims description 36
- 229920000642 polymer Polymers 0.000 claims description 30
- 239000000178 monomer Substances 0.000 claims description 27
- -1 aromatic nitro compounds Chemical class 0.000 claims description 24
- 229910052757 nitrogen Inorganic materials 0.000 claims description 21
- 150000007513 acids Chemical class 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Chemical group 0.000 claims description 9
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 8
- 125000001424 substituent group Chemical group 0.000 claims description 8
- 229910052717 sulfur Inorganic materials 0.000 claims description 8
- 239000011593 sulfur Chemical group 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical group [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 239000003504 photosensitizing agent Substances 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 239000011669 selenium Chemical group 0.000 claims description 4
- JWGLGQHIGMBQRK-UHFFFAOYSA-N [3-(4-chlorophenyl)-5-thiophen-2-yl-3,4-dihydropyrazol-2-yl]-phenylmethanone Chemical class C1=CC(Cl)=CC=C1C1N(C(=O)C=2C=CC=CC=2)N=C(C=2SC=CC=2)C1 JWGLGQHIGMBQRK-UHFFFAOYSA-N 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 230000003993 interaction Effects 0.000 claims description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 3
- 150000004053 quinones Chemical class 0.000 claims description 3
- 239000003125 aqueous solvent Substances 0.000 claims description 2
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 238000003918 potentiometric titration Methods 0.000 claims description 2
- 150000004961 triphenylmethanes Chemical class 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 239000010408 film Substances 0.000 description 21
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 239000002253 acid Substances 0.000 description 12
- 125000005907 alkyl ester group Chemical group 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 238000007639 printing Methods 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 150000004820 halides Chemical class 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 238000006068 polycondensation reaction Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 150000002334 glycols Chemical class 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 238000007645 offset printing Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- JYOZNNLCUAEXSE-NSHDSACASA-N (2s)-2-anilino-3-(1h-imidazol-5-yl)propanoic acid Chemical compound C([C@@H](C(=O)O)NC=1C=CC=CC=1)C1=CNC=N1 JYOZNNLCUAEXSE-NSHDSACASA-N 0.000 description 3
- XWKAVQKJQBISOL-ZETCQYMHSA-N (2s)-2-anilinopropanoic acid Chemical compound OC(=O)[C@H](C)NC1=CC=CC=C1 XWKAVQKJQBISOL-ZETCQYMHSA-N 0.000 description 3
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 3
- PBDMLLFEZXXJNE-UHFFFAOYSA-N 2-carbazol-9-ylacetic acid Chemical compound C1=CC=C2N(CC(=O)O)C3=CC=CC=C3C2=C1 PBDMLLFEZXXJNE-UHFFFAOYSA-N 0.000 description 3
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229940048053 acrylate Drugs 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- SULYEHHGGXARJS-UHFFFAOYSA-N 2',4'-dihydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1O SULYEHHGGXARJS-UHFFFAOYSA-N 0.000 description 2
- DRMOCHGNKTXIBF-UHFFFAOYSA-N 2-(2-methoxyanilino)acetic acid Chemical compound COC1=CC=CC=C1NCC(O)=O DRMOCHGNKTXIBF-UHFFFAOYSA-N 0.000 description 2
- KZXFAYGKDCLTER-UHFFFAOYSA-N 2-(3-chloroanilino)acetic acid Chemical compound OC(=O)CNC1=CC=CC(Cl)=C1 KZXFAYGKDCLTER-UHFFFAOYSA-N 0.000 description 2
- AVHSSMVTBDPMIP-UHFFFAOYSA-N 2-[2-[carboxymethyl(methyl)amino]ethyl-methylamino]acetic acid Chemical compound OC(=O)CN(C)CCN(C)CC(O)=O AVHSSMVTBDPMIP-UHFFFAOYSA-N 0.000 description 2
- VARKIGWTYBUWNT-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanol Chemical compound OCCN1CCN(CCO)CC1 VARKIGWTYBUWNT-UHFFFAOYSA-N 0.000 description 2
- JERMFLFKXHHROS-UHFFFAOYSA-N 2-[4-(carboxymethyl)piperazin-1-yl]acetic acid Chemical compound OC(=O)CN1CCN(CC(O)=O)CC1 JERMFLFKXHHROS-UHFFFAOYSA-N 0.000 description 2
- FNEQUOWQJWSAHK-UHFFFAOYSA-N 2-[carboxy(phenyl)methyl]selanyl-2-phenylacetic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)[Se]C(C(O)=O)C1=CC=CC=C1 FNEQUOWQJWSAHK-UHFFFAOYSA-N 0.000 description 2
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 2
- ZOHAPDDPDSPUTE-UHFFFAOYSA-N 3-[carboxymethyl(methyl)amino]propanoic acid Chemical compound OC(=O)CN(C)CCC(O)=O ZOHAPDDPDSPUTE-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- AUNGANRZJHBGPY-SCRDCRAPSA-N Riboflavin Chemical compound OC[C@@H](O)[C@@H](O)[C@@H](O)CN1C=2C=C(C)C(C)=CC=2N=C2C1=NC(=O)NC2=O AUNGANRZJHBGPY-SCRDCRAPSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- SEOVTRFCIGRIMH-UHFFFAOYSA-N indole-3-acetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CNC2=C1 SEOVTRFCIGRIMH-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- NIQQIJXGUZVEBB-UHFFFAOYSA-N methanol;propan-2-one Chemical compound OC.CC(C)=O NIQQIJXGUZVEBB-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- LCPDWSOZIOUXRV-UHFFFAOYSA-N phenoxyacetic acid Chemical compound OC(=O)COC1=CC=CC=C1 LCPDWSOZIOUXRV-UHFFFAOYSA-N 0.000 description 2
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- TYHHDWAHJRRYCU-UHFFFAOYSA-N (2-nitrophenoxy)acetic acid Chemical compound OC(=O)COC1=CC=CC=C1[N+]([O-])=O TYHHDWAHJRRYCU-UHFFFAOYSA-N 0.000 description 1
- PMUMUYYQHZMXNQ-VIFPVBQESA-N (2s)-5-amino-2-anilino-5-oxopentanoic acid Chemical compound NC(=O)CC[C@@H](C(O)=O)NC1=CC=CC=C1 PMUMUYYQHZMXNQ-VIFPVBQESA-N 0.000 description 1
- QSNAVZQFIDCTQI-UHFFFAOYSA-N 1,2,3-trinitro-9h-fluorene Chemical compound C1=CC=C2C(C=C(C(=C3[N+]([O-])=O)[N+]([O-])=O)[N+](=O)[O-])=C3CC2=C1 QSNAVZQFIDCTQI-UHFFFAOYSA-N 0.000 description 1
- PLUFITIFLBGFPN-UHFFFAOYSA-N 1,2-dichloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=C(Cl)C(Cl)=CC=C3C(=O)C2=C1 PLUFITIFLBGFPN-UHFFFAOYSA-N 0.000 description 1
- YRSDILSVEAAWQJ-UHFFFAOYSA-N 1,2-dinitro-9h-fluorene Chemical compound C1=CC=C2C3=CC=C([N+](=O)[O-])C([N+]([O-])=O)=C3CC2=C1 YRSDILSVEAAWQJ-UHFFFAOYSA-N 0.000 description 1
- NMNSBFYYVHREEE-UHFFFAOYSA-N 1,2-dinitroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=C([N+]([O-])=O)C([N+](=O)[O-])=CC=C3C(=O)C2=C1 NMNSBFYYVHREEE-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical compound CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- PVOAHINGSUIXLS-UHFFFAOYSA-N 1-Methylpiperazine Chemical compound CN1CCNCC1 PVOAHINGSUIXLS-UHFFFAOYSA-N 0.000 description 1
- BJRXTJPSWZNCIV-UHFFFAOYSA-N 1-[2-hydroxypropyl(propan-2-yl)amino]propan-2-ol Chemical compound CC(O)CN(C(C)C)CC(C)O BJRXTJPSWZNCIV-UHFFFAOYSA-N 0.000 description 1
- CFKSCQPPKNDTED-UHFFFAOYSA-N 1-[4-(2-hydroxy-2-methylnonyl)piperazin-1-yl]-2-methylnonan-2-ol Chemical compound CCCCCCCC(C)(O)CN1CCN(CC(C)(O)CCCCCCC)CC1 CFKSCQPPKNDTED-UHFFFAOYSA-N 0.000 description 1
- DTQIXUAQWTUJSV-UHFFFAOYSA-N 1-[4-(2-hydroxypropyl)-2,5-dimethylpiperazin-1-yl]propan-2-ol Chemical compound CC(O)CN1CC(C)N(CC(C)O)CC1C DTQIXUAQWTUJSV-UHFFFAOYSA-N 0.000 description 1
- AVAGDIXDPQCKCQ-UHFFFAOYSA-N 1-nitro-1,2-dihydroacenaphthylene Chemical compound C1=CC(C([N+](=O)[O-])C2)=C3C2=CC=CC3=C1 AVAGDIXDPQCKCQ-UHFFFAOYSA-N 0.000 description 1
- YIYBRXKMQFDHSM-UHFFFAOYSA-N 2,2'-Dihydroxybenzophenone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1O YIYBRXKMQFDHSM-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- CRRHIKLYQDYTBR-UHFFFAOYSA-N 2,2-bis(3-aminopropoxymethyl)-n,n-dimethylbutan-1-amine Chemical compound NCCCOCC(CC)(COCCCN)CN(C)C CRRHIKLYQDYTBR-UHFFFAOYSA-N 0.000 description 1
- IVOMCIOXYNVSEW-UHFFFAOYSA-N 2,3,4-trinitroaniline Chemical compound NC1=CC=C([N+]([O-])=O)C([N+]([O-])=O)=C1[N+]([O-])=O IVOMCIOXYNVSEW-UHFFFAOYSA-N 0.000 description 1
- FKNIDKXOANSRCS-UHFFFAOYSA-N 2,3,4-trinitrofluoren-1-one Chemical compound C1=CC=C2C3=C([N+](=O)[O-])C([N+]([O-])=O)=C([N+]([O-])=O)C(=O)C3=CC2=C1 FKNIDKXOANSRCS-UHFFFAOYSA-N 0.000 description 1
- USAYMJGCALIGIG-UHFFFAOYSA-N 2,3-dichlorocyclohexa-2,5-diene-1,4-dione Chemical compound ClC1=C(Cl)C(=O)C=CC1=O USAYMJGCALIGIG-UHFFFAOYSA-N 0.000 description 1
- SVPKNMBRVBMTLB-UHFFFAOYSA-N 2,3-dichloronaphthalene-1,4-dione Chemical compound C1=CC=C2C(=O)C(Cl)=C(Cl)C(=O)C2=C1 SVPKNMBRVBMTLB-UHFFFAOYSA-N 0.000 description 1
- RNIPJYFZGXJSDD-UHFFFAOYSA-N 2,4,5-triphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 RNIPJYFZGXJSDD-UHFFFAOYSA-N 0.000 description 1
- LTMPEYZFRFPAMX-UHFFFAOYSA-N 2-(2,4-dichloroanilino)acetic acid Chemical compound OC(=O)CNC1=CC=C(Cl)C=C1Cl LTMPEYZFRFPAMX-UHFFFAOYSA-N 0.000 description 1
- GHNOXWBKEQOSQC-UHFFFAOYSA-N 2-(2,4-dimethoxyanilino)acetic acid Chemical compound COC1=CC=C(NCC(O)=O)C(OC)=C1 GHNOXWBKEQOSQC-UHFFFAOYSA-N 0.000 description 1
- VGLQMSUHPXEUIJ-UHFFFAOYSA-N 2-(2-bromoanilino)acetic acid Chemical compound OC(=O)CNC1=CC=CC=C1Br VGLQMSUHPXEUIJ-UHFFFAOYSA-N 0.000 description 1
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- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 239000003617 indole-3-acetic acid Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229960003505 mequinol Drugs 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- HYSQEYLBJYFNMH-UHFFFAOYSA-N n'-(2-aminoethyl)-n'-methylethane-1,2-diamine Chemical compound NCCN(C)CCN HYSQEYLBJYFNMH-UHFFFAOYSA-N 0.000 description 1
- COJUXMTZOSXAOW-UHFFFAOYSA-N n'-[2-[3-aminopropyl(methyl)amino]ethyl]-n'-methylpropane-1,3-diamine Chemical compound NCCCN(C)CCN(C)CCCN COJUXMTZOSXAOW-UHFFFAOYSA-N 0.000 description 1
- UTSYWKJYFPPRAP-UHFFFAOYSA-N n-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCNC(=O)C=C UTSYWKJYFPPRAP-UHFFFAOYSA-N 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- KLAKIAVEMQMVBT-UHFFFAOYSA-N p-hydroxy-phenacyl alcohol Natural products OCC(=O)C1=CC=C(O)C=C1 KLAKIAVEMQMVBT-UHFFFAOYSA-N 0.000 description 1
- GVKCHTBDSMQENH-UHFFFAOYSA-L phloxine B Chemical compound [Na+].[Na+].[O-]C(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C([O-])=C(Br)C=C21 GVKCHTBDSMQENH-UHFFFAOYSA-L 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002151 riboflavin Substances 0.000 description 1
- 229960002477 riboflavin Drugs 0.000 description 1
- 235000019192 riboflavin Nutrition 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical compound ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- PRZSXZWFJHEZBJ-UHFFFAOYSA-N thymol blue Chemical compound C1=C(O)C(C(C)C)=CC(C2(C3=CC=CC=C3S(=O)(=O)O2)C=2C(=CC(O)=C(C(C)C)C=2)C)=C1C PRZSXZWFJHEZBJ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 125000001834 xanthenyl group Chemical class C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Polymerisation Methods In General (AREA)
Description
本発明は、新規な感光性樹脂組成物に関し、さ
らに詳しくは、感光性化合物の親水性の度合い、
または水に対する溶解度を光化学的に変化せしめ
る方法を用いた感光性樹脂組成物に関する。
近年、情報量の増加に伴い、種々の分野におい
て感光材料の要求が高まつており、それに対応す
る新しい感光材料の研究が盛んに行われているこ
とは周知のとおりである。これら新しい感光材料
に対する解像力、感光速度、シエルフライフ、プ
ロセツシングの容易さなどの性能要求は一段と厳
しくなつている。
本発明者らは、この様な状況下で鋭意研究を重
ねた結果、特開昭55−98744号公報に開示したよ
うな従来の感光材料とは異なつた新しい特徴を有
する感光性樹脂組成物を得ることに成功した。こ
の組成物は光照射による水不溶性と水溶性との間
の大きな変化差、高い解像力、一旦得られた像の
修正的消去の可能性、空気中からの酸素分子の拡
散が起こり易い薄膜状態での反応速度の安定性、
極めて永いシエルフライフなど優れた特徴を有す
るため、多方面への応用が可能であつた。しかし
ながら、ただ光反応速度がやや遅く、実用上問題
があつた。そこで本発明者らは上記の種々の特徴
を有し、さらに光反応速度の速い高感度の新規感
光性樹脂組成物について鋭意研究した結果、本発
明を完成するに到つた。
すなわち本発明は、(1)それ自体では親水性が低
いか、または水不溶性であるが、酸性を有する化
合物との共存下で酸塩基相互作用により親水性が
高くなるか、または水溶性になる様な性質を有す
る塩基性高分子化合物の少なくとも1種および(2)
下記一般式()−a、()−b、()−c、
()および()で示される酸性化合物の少な
くとも1種を含有することを特徴とする感光性樹
脂組成物である。
〔式中、Xは窒素、酸素、イオウ、セレン、R1、
R2はそれぞれ水素、置換基を有するか有しない
炭素数1〜6個のアルキル基、フエニル基、R5
は水素、置換基を有するか有しない炭素数1〜6
個のアルキル基、nは0または1、mはXが窒素
のときは1、Xが酸素、イオウ、セレンのときは
0を示す。〕
〔式中、YはNR8、イオウであり、R7およびR8
はそれぞれH、炭素数1〜3個のアルキル基を示
す。〕
〔式中、Zは酸素、イオウであり、R9は置換基
を有するか有しないフエニル基、kは0または1
を示す。〕
本発明において一般式()〜()で示され
る酸性化合物は本来酸性であつて、光照射を受け
ることにより化学変化を起こして酸性を失うか、
または(1)の塩基性高分子化合物との共存下で光照
射を受けることにより該高分子化合物との間の酸
塩基相互作用が消失される様な化合物であり、一
般式()−aにおいて、R1、R2に有する置換基
としてはハロゲン、水酸基、低級アルキル基、ニ
トロ基、シアノ基、アルキルカルボニル基、アル
コキシ基、N−置換カルバモイル基、N−置換ス
ルフアモイル基などが挙げられる。またR5、R6
に有する置換基としては水酸基、イミダゾリル
基、アミノカルボニル基などが挙げられる。一般
式()−a〜()−cで示される化合物の具体
例としては、N−フエニルグリシン、N−(3−
クロロフエニル)グリシン、N−(2,4−ジク
ロルフエニル)グリシン、N−(4−アセチルフ
エニル)グリシン、N−(2−ニトロフエニル)
グリシン、N−(4−ニトロフエニル)グリシン、
N−(2,4−ジニトロフエニル)グリシン、N
−(4−シアノフエニル)グリシン、N−(3−ク
ロロフエニル)グリシン、N−(2−ブロモフエ
ニル)グリシン、N−(2−メチルフエニル)グ
リシン、N−(2−メトキシフエニル)グリシン、
N−(2−メトキシフエニル)グリシン、N−
(2,4−ジメトキシフエニル)グリシン、N−
メチル−N−フエニルグリシン、N−メチル−N
−(2−メチルフエニル)グリシン、N−メチル
−N−(4−クロルフエニル)グリシン、N−メ
チル−N−(2−ニトロフエニル)グリシン、N
−メチル−N−(2−メトキシフエニル)グリシ
ン、N−(2−カルバモイルフエニル)グリシン、
N−(4−スルフアモイルフエニル)グリシン、
N−フエニルアラニン、N−フエニルセリン、N
−フエニルヒスチジン、N−フエニルアスパラギ
ン、N−フエニルグルタミン、N−カルボキシメ
チルカルバゾール、3−アニリノ−2−プロペン
−1−カルボン酸、インドール−3−酢酸、フエ
ノキシ酢酸、2−メチルフエノキシ酢酸、(3−
メトキシフエノキシ)酢酸、(2−ニトロフエノ
キシ)酢酸、(3−クロルフエノキシ)酢酸、(4
−メチルフエノキシ)酢酸、チオフエノキシ酢
酸、3−メトキシチオフエノキシ酢酸、2−クロ
ルチオフエノキシ酢酸、2−メチルチオフエノキ
シ酢酸、4−ニトロチオフエノキシ酢酸、S−ヒ
ドロキシエチルチオ酢酸、S−n−ブチルチオ酢
酸、フエニルカルボキシメチルセレニドなどが挙
げられる。
一般式()で示される化合物の具体例として
は、インドキシル酸、4−ニトロインドキシル
酸、チオインドキシル酸、N−メチルインドキシ
ル酸などが挙げられる。
次に一般式()においてR10に有する置換基
としては、ハロゲン、ニトロ基、アルコキシ基、
アルキル基、アミノ基などが挙げられ、一般式
()で示される化合物の具体例としてはベンゾ
イル蟻酸、2−クロルベンゾイル蟻酸、4−クロ
ルベンゾイル蟻酸、N−ジメチルアミノベンゾイ
ル蟻酸、チオベンゾイル蟻酸、ベンゾイル酢酸、
チオベンゾイル酢酸などが挙げられる。
本発明で用いる塩基性高分子化合物とは、該高
分子化合物を形成する単量体が塩基性を示す基を
有し、かつ水溶媒系において電位差滴定により測
定して塩基性基がpka2以上を示すものをいい、
次に例示する様な分子内に塩基性を示す基を有す
る単量体および必要ならば他の単量体を用いて重
縮合、重付加反応などの一般的な重合反応によつ
て製造される高分子化合物、または合成高分子化
合物もしくは天然高分子化合物に対して化学的変
性により塩基性を付与した変性高分子化合物を包
含する。
この様な重合体はホモポリマーのみならず、ラ
ンダムコポリマーまたはブロツクコポリマーであ
つてもよい。
本発明で用いる塩基性高分子化合物の例として
は塩基性窒素原子を有するものが挙げられるが、
この場合、高分子化合物中の窒素含量が0.1〜25
当量/Kg、特に0.1〜14当量/Kgであることが好
ましい。
塩基性を有するポリアミドとしては、下記一般
式()〜()で示される単量体を重合原料と
するものが挙げられる:
〔式中、R、R′は水素または炭素数1〜10の炭
化水素残基;R″、Rは炭素数1〜10の炭化水
素残基;R11、R12、R13は炭素数1〜15のアルキ
レン基;R14、R15は炭素数1〜10の炭化水素酸
基を表わし、R14とR15は共同して環または異節
環を形成してもよい。R16は炭素数1〜3の低級
アルキル基または
The present invention relates to a novel photosensitive resin composition, and more specifically, the degree of hydrophilicity of a photosensitive compound,
Or it relates to a photosensitive resin composition using a method of photochemically changing its solubility in water. In recent years, with the increase in the amount of information, the demand for photosensitive materials has increased in various fields, and it is well known that research on new photosensitive materials to meet this demand has been actively conducted. Performance requirements for these new photosensitive materials, such as resolving power, photosensitive speed, shelf life, and ease of processing, are becoming increasingly strict. As a result of extensive research under these circumstances, the present inventors have developed a photosensitive resin composition that has new characteristics different from conventional photosensitive materials as disclosed in JP-A No. 55-98744. succeeded in obtaining it. This composition has a large difference in water insolubility and water solubility upon irradiation with light, high resolution, possibility of corrective erasure of an image once obtained, and a thin film state in which oxygen molecules easily diffuse from the air. stability of the reaction rate,
Because it has excellent features such as an extremely long shelf life, it can be applied in many fields. However, the photoreaction rate was rather slow, which caused problems in practical use. Therefore, the present inventors conducted extensive research on a new highly sensitive photosensitive resin composition that has the above-mentioned various characteristics and further exhibits a high photoreaction rate, and as a result, completed the present invention. In other words, the present invention provides (1) a compound that has low hydrophilicity or is water-insoluble by itself, but becomes highly hydrophilic or water-soluble due to acid-base interaction in the coexistence with an acidic compound; at least one basic polymer compound having similar properties, and (2)
The following general formulas ()-a, ()-b, ()-c,
A photosensitive resin composition characterized by containing at least one of the acidic compounds represented by () and (). [Wherein, X is nitrogen, oxygen, sulfur, selenium, R 1 ,
R 2 is hydrogen, an alkyl group having 1 to 6 carbon atoms with or without a substituent, a phenyl group, R 5
is hydrogen, carbon number 1-6 with or without substituents
n is 0 or 1, m is 1 when X is nitrogen, and 0 when X is oxygen, sulfur, or selenium. ] [Wherein, Y is NR 8 , sulfur, R 7 and R 8
each represents H and an alkyl group having 1 to 3 carbon atoms. ] [In the formula, Z is oxygen or sulfur, R 9 is a phenyl group with or without a substituent, and k is 0 or 1
shows. ] In the present invention, the acidic compounds represented by the general formulas () to () are originally acidic, and when exposed to light, undergo a chemical change and lose their acidity, or
Or, it is a compound whose acid-base interaction with the basic polymer compound of (1) is eliminated by light irradiation in the coexistence with the polymer compound, and in the general formula ()-a, , R 1 and R 2 include halogen, hydroxyl group, lower alkyl group, nitro group, cyano group, alkylcarbonyl group, alkoxy group, N-substituted carbamoyl group, N-substituted sulfamoyl group, and the like. Also R 5 , R 6
Examples of the substituents included in this group include a hydroxyl group, an imidazolyl group, and an aminocarbonyl group. Specific examples of compounds represented by general formulas ()-a to ()-c include N-phenylglycine, N-(3-
chlorophenyl)glycine, N-(2,4-dichlorophenyl)glycine, N-(4-acetylphenyl)glycine, N-(2-nitrophenyl)
Glycine, N-(4-nitrophenyl)glycine,
N-(2,4-dinitrophenyl)glycine, N
-(4-cyanophenyl)glycine, N-(3-chlorophenyl)glycine, N-(2-bromophenyl)glycine, N-(2-methylphenyl)glycine, N-(2-methoxyphenyl)glycine,
N-(2-methoxyphenyl)glycine, N-
(2,4-dimethoxyphenyl)glycine, N-
Methyl-N-phenylglycine, N-methyl-N
-(2-methylphenyl)glycine, N-methyl-N-(4-chlorophenyl)glycine, N-methyl-N-(2-nitrophenyl)glycine, N
-Methyl-N-(2-methoxyphenyl)glycine, N-(2-carbamoylphenyl)glycine,
N-(4-sulfamoylphenyl)glycine,
N-phenylalanine, N-phenylserine, N
-Phenylhistidine, N-phenylasparagine, N-phenylglutamine, N-carboxymethylcarbazole, 3-anilino-2-propene-1-carboxylic acid, indole-3-acetic acid, phenoxyacetic acid, 2-methylphenoxyacetic acid, (3-
methoxyphenoxy)acetic acid, (2-nitrophenoxy)acetic acid, (3-chlorophenoxy)acetic acid, (4
-methylphenoxyacetic acid, thiophenoxyacetic acid, 3-methoxythiophenoxyacetic acid, 2-chlorothiophenoxyacetic acid, 2-methylthiophenoxyacetic acid, 4-nitrothiophenoxyacetic acid, S-hydroxyethylthioacetic acid, Examples include S-n-butylthioacetic acid and phenylcarboxymethylselenide. Specific examples of the compound represented by the general formula () include indoxylic acid, 4-nitroindoxylic acid, thioindoxylic acid, N-methylindoxylic acid, and the like. Next, in the general formula (), the substituents for R10 include halogen, nitro group, alkoxy group,
Examples of compounds represented by the general formula () include benzoyl formate, 2-chlorobenzoyl formate, 4-chlorobenzoyl formate, N-dimethylaminobenzoyl formate, thiobenzoyl formate, and benzoyl formate. acetic acid,
Examples include thiobenzoyl acetic acid. The basic polymer compound used in the present invention is one in which the monomer forming the polymer compound has a group showing basicity, and the basic group has a pka of 2 or more as measured by potentiometric titration in an aqueous solvent system. What you show is what you say.
Manufactured by general polymerization reactions such as polycondensation and polyaddition reactions using monomers having a basic group in the molecule as exemplified below and other monomers if necessary. It includes a polymer compound, or a modified polymer compound obtained by imparting basicity to a synthetic polymer compound or a natural polymer compound by chemical modification. Such polymers may be not only homopolymers but also random copolymers or block copolymers. Examples of the basic polymer compound used in the present invention include those having a basic nitrogen atom,
In this case, the nitrogen content in the polymer compound is 0.1-25
Equivalents/Kg, particularly preferably 0.1 to 14 equivalents/Kg. Examples of basic polyamides include those using monomers represented by the following general formulas () to () as polymerization raw materials: [In the formula, R, R' are hydrogen or hydrocarbon residues having 1 to 10 carbon atoms; R'', R are hydrocarbon residues having 1 to 10 carbon atoms; R 11 , R 12 , and R 13 are hydrogen residues having 1 to 10 carbon atoms; ~15 alkylene group; R 14 and R 15 represent a hydrocarbon acid group having 1 to 10 carbon atoms, and R 14 and R 15 may jointly form a ring or a heterocyclic ring. R 16 is a carbon lower alkyl group of numbers 1 to 3 or
【式】(ここでR14、
R15は前記と同意義。)を表わす。またA、Bは
−NH2、−COOH、−COOR′′′′(ここでR′′′′は
炭
素数1〜10の炭化水素残基を示す。)からなる群
から選ばれた基を表わし、AとBは同時に同一ま
たは相異なつてもよい。またYは3−アミノプロ
ピル基を表わす。〕
上記一般式()で示される単量体としては、
N−(2−アミノエチル)ピペラジン、N−(4−
アミノシクロヘキシル)ピペラジン、N−(2−
アミノエチル)−3−メチルピベラジンなどのジ
アミン類、N−カルボキシメチルピペラジン、N
−(4−カルボキシシクロヘキシル)ピペラジン、
N−(2−カルボキシエチル)−3−メチルピペラ
ジンなどのω−アミノ酸あるいはこれらの低級ア
ルキルエステル類などがある。
一般式()で示される単量体としては、たと
えばN,N′−ビス(アミノメチル)ピペラジン、
N−(アミノメチル)−N′−(2−アミノエチル)
ピペラジンなどのジアミン類、N,N′−ビス
(カルボキシメチル)ピペラジン、N,N′−ビス
(カルボキシメチル)−2,6−ジメチルピペラジ
ン、N−(2−カルボキシエチル)−N′−(カルボ
キシメチル)ピペラジンなどのジカルボン酸類あ
るいはこれらの低級アルキルエステル、酸ハロゲ
ン化物、およびN−(アミノメチル)−N′−(カル
ボキシメチル)ピペラジン、N−(アミノメチル)
−N′−(カルボキシメチル)−2−メチルピペラ
ジンなどのω−アミノ酸類あるいはこれらの低級
アルキルエステル類などがある。
一般式()で示される単量体としては、たと
えばN,N−ビス(2−アミノエチル)−メチル
アミン、N,N−ビス(3−アミノプロピル)−
シクロヘキシルアミンなどのジアミン類、N,N
−ビス(カルボキシメチル)−メチルアミン、N
−カルボキシメチル−N−(2−カルボキシエチ
ル)−メチルアミンなどのジカルボン酸類あるい
はこれらの低級アルキルエステル、酸ハロゲン化
物、およびN−(アミノメチル)−N−(カルボキ
シメチル)−メチルアミン、N−(アミノメチル)
−N−(2−カルボキシエチル)−イソプロピルア
ミンなどのω−アミノ酸類あるいはこれらの低級
アルキルエステル類などがある。
一般式()で示される単量体としては、たと
えばN,N′−ジメチル−N,N′−ビス(3−ア
ミノプロピル)エチレンジアミン、N,N′−ジ
シクロヘキシル−N,N′−ビス(3−アミノプ
ロピル)ヘキサメチレンジアミンなどのジアミン
類、N,N′−ジメチル−N,N′−ビス(カルボ
キシメチル)エチレンジアミン、N,N′−ジメ
チル−N,N′−ビス(3−カルボキシプロピル)
ヘキサメチレンジアミンなどのジカルボン酸類あ
るいはこれらの低級アルキルエステル、酸ハロゲ
ン化物、N,N′−ジメチル−N−(アミノメチ
ル)−N′−(カルボキシメチル)エチレンジアミ
ン、N,N′−ジメチル−N−(アミノメチル)−
N′−(カルボキシエチル)ヘキサメチレンジアミ
ンなどのω−アミノ類あるいはこれらの低級アル
キルエステル類などがある。
一般式()で示される単量体としては、たと
えば6−メチル−6−(N,N−ジメチルアミノ
メチル)−4,8−ジオキサ−1,11−ウンデカ
ンジアミン、6−エチル−6−(N,N−ジメチ
ルアミノメチル)−4,8−ジオキサ−1,11−
ウンデカンジアミン、6,6−ビス(N,N−ジ
メチルアミノメチル)−4,8−ジオキサ−1,
11−ウンデカンジアミンなどのジアミン類があ
る。
これらの塩基性を有する単量体は2種以上併用
してもよい。
本発明に用いるポリアミドの重合成分としては
前記一般式()〜()で示される単量体のほ
かに、通常のポリアミドの重合に用いられる脂肪
族および/または芳香族のジカルボン酸、ジアミ
ン、ω−アミノ酸、ラクタムなどがある。
塩基性を有するポリエステルとしては、下記一
般式()〜(XII)で示される単量体を重合原料
とするものがある:
〔式中、R、R′、R″、R、R11、R12、R13、
R14、R15、R16は前記と同意義。A′、B′は−OH、
−COOH、−COOR′′′′(ここでR′′′′は炭素数1
〜
10の炭化水素残基を示す。)からなる群から選ば
れた基を表わし、A′とB′は同時に同一または相
異なつてもよい。〕。
上記一般式()で示される単量体としては、
具体的にはN,N′−ビス(カルボキシメチル)
ピペラジン、N,N′−ビス(カルボキシメチル)
−2,6−ジメチルピペラジン、N−(2−カル
ボキシエチル)−N′−(カルボキシメチル)ピペ
ラジンなどのジカルボン酸類あるいはこれらの低
級アルキルエステル、酸ハロゲン化物、N,
N′−ビス(ヒドロキシメチル)ピペラジン、N,
N′−ビス(2−ヒドロキシプロピル)−2,5−
ジメチルピペラジン、N,N′−ビス(2−ヒド
ロキシシクロヘプチル)ピペラジン、N,N′−
ビス(2−メチル−2−ヒドロキシノニル)ピペ
ラジンなどのグリコール類を挙げることができ
る。
一般式()で示される単量体としては、たと
えばN,N′−ビス(カルボキシメチル)−メチル
アミン、N−カルボキシメチル−N−(2−カル
ボキシエチル)−メチルアミンなどのジカルボン
酸類あるいはこれらの低級アルキルエステル、酸
ハロゲン化物およびN,N−ビス(2−ヒドロキ
シエチル)アミン、N,N−ビス(2−ヒドロキ
シプロピル)−イソプロピルアミンなどのグリコ
ール類である。
一般式(XI)で示される単量体としては、たと
えばN,N′−ジメチル−N,N′−ビス(カルボ
キシメチル)エチレンジアミン、N,N′−ジメ
チル−N,N′−ビス(3−カルボキシプロピル)
ヘキサメチレンジアミンなどのジカルボン酸類あ
るいはこれらの低級アルキルエステル、酸ハロゲ
ン化物、N,N′−ジメチル−N,N′−ビス(2
−ヒドロキシエチル)エチレンジアミン、N,
N′−ジシクロヘキシル−N,N′−ビス(2−ヒ
ドロキシエチル)ヘキサメチレンジアミン、N,
N′−ジメチル−N,N′−ビス(2−ヒドロキシ
エチル)−2,2,4−トリメチル−ヘキサメチ
レンジアミンなどのグリコール類がある。
一般式(XII)で示される単量体としては、たと
えば2−メチル−2−(N,N′−ジメチルアミノ
メチル)−1,3−プロパンジオール、2−メチ
ル−2−(N,N−ジイソプロピルアミノメチル)
−1,3−プロパンジオール、2−メチル−2−
ピペリジノメチル−1,3−ブロパンジオール、
ビス(2−N,N−ジイソプロピルアミノメチ
ル)−1,3−プロパンジオールなどのグリコー
ル類が挙げられる。
これらの塩基性を有する単量体は2種以上併用
してもよい。
本発明において用いるポリエステルの重合原料
としては、前記一般式()〜(XII)で示される
単量体のほかに通常のポリエステルの重合に用い
られる脂肪族および/または芳香族のジカルボン
酸あるいはその低級アルキルエステル、グリコー
ル、オキシ酸などを併用してもよい。
塩基性を有するビニル系ポリマーとしては、4
−ビニルピリジンの重合体、または下記一般式
():
〔式中、R′、R″、R、R11は前記と同意義。Q
はエステル結合またはアミド結合を表わす。〕
で示される単量体を重合原料とするものが挙げら
れる。
上記一般式()で示される単量体として
は、たとえば2−(N,N−ジメチルアミノ)エ
チルメタクリレート、3−(N,N−ジエチル)
プロピルメタクリレートなどのメタクリレート
類、3−(N,N−ジメチルアミノ)プロピルメ
タクリルアミド、3−(N,N−ジエチルアミノ)
プロピルメタクリルアミドなどのメタクリルアミ
ド類などがある。
これらの塩基性を有する単量体は2種以上併用
してもよい。
本発明において用いられるビニル系ポリマーの
重合原料としては、前記4−ビニルピリジンまた
は一般式()で示される単量体の他に通常の
ビニルポリマーの重合に用いられるビニルモノマ
ーを併用してもよい。
塩基性を有するポリエーテルとしては、塩基性
を有するジオール、たとえば前記一般式()
で表わされるジオールもしくはそれらの機能的誘
導体から重縮合により得られるもの、またはその
他のジオールもしくはそれらの機能的誘導体とも
重縮合して得られるものがある。
その他のジオールもしくはその機能的誘導体と
してはエチレングリコール、プロピレングリコー
ル、テトラメチレングリコール、ヘキサメチレン
グリコール、ジエチレングリコール、分子量200
〜3000、好ましくは200〜1000のポリエチレング
リコール、ポリテトラメチレングリコール、ビス
(4−ヒドロキシフエニル)メタン、1,1−ビ
ス(4−ヒドロキシフエニル)シクロヘキサン、
ビス(4−ヒドロキシフエニル)チオエーテル、
ビス(4−ヒドロキシフエニル)スルホン、2,
2′−ジヒドロキシベンゾフエノン、2,2′−ジヒ
ドロキシ−4,4′−ジメトキシベンゾフエノン、
クレゾール、レゾルシン、ヒドロキノン、2,4
−ジヒドロキシアセトフエノン、1,5−ジヒド
ロキシナフタレン、p−、m−またはo−キシリ
レングリコールなどを挙げることができる。
上記ポリエーテルは通常の方法に従い重縮合し
て製造されるものである。
変性高分子化合物の例としては、エチレンアミ
ンによつて変性されたセルロース誘導体、たとえ
ばアミノエチルセルロース、または高分子化合物
の一般的な変性法として知られているグラフト反
応により塩基性が付与された変性高分子化合物な
どが挙げられる。
さらに、本発明の組成物においては、塩基性を
有する高分子化合物に加え、他種の高分子化合物
を併用することも可能である。
該塩基性高分子化合物と前記一般式()−a、
()−b、()−c、()および()で示さ
れる酸性化合物の組成物における混合量および混
合割合は、両者の組合わせる種類によつて異な
り、また実際使用する時に要求される特性(たと
えば光照射前後における親水性または水溶性の
差、力学的性質、反応速度など)により選択され
るが、全組成物中に酸性化合物が0.4〜700g/Kg
の割合で含有されており、両者の配合割合は、酸
性化合物の酸性基と塩基性高分子化合物に含まれ
る塩基性窒素の当量比が0.02〜1になるようにす
るのが好ましい。
本発明の組成物には、前記一般式()−a、
()−b、()−c、()および()で示さ
れる酸性化合物の他に必要ならば光照射を受けて
も原則として酸性を失わない様な酸性化合物を併
用して、光照射前後の親水性または水溶性の差を
制御することも可能である。
また、同様の目的および力学的性質の制御のた
めに、従来から知られている光不溶化剤を併用す
ることも勿論可能である。
併用できる光不溶化剤としては、たとえばアク
リル酸、メタクリル酸、メチルアクリレート、メ
チルメタクリレート、シクロヘキシルアクリレー
ト、アクリルアミド、メタクリルアミド、N−メ
チロールアクリルアミド、n−ブトキシメチルア
クリルアミド、ナトリウムアクリレート、アンモ
ニウムアクリレート、アクリロニトリル、スチレ
ン、スチレンスルホン酸ソーダ、ビニルピリジン
等の不飽和二重結合を1個有する単量体、あるい
はグリシジルメタクリレート、アリルメタクリレ
ート、エチレングリコールジ(メタ)アクリレー
ト、1,3−プロパンジオール(メタ)アクリレ
ート、トリメチロールプロパントリ(メタ)アク
リレート、トリアクリロイルオキシエチルホスフ
エイト、メチレンビス(メタ)アクリルアミド等
の不飽和二重結合を2個以上有する単量体があ
る。
本発明組成物において、さらに光増感剤を添加
することによつて感度を上げてもよい。本発明に
用いられる光増感剤としては、たとえば、4,
4′−ビスジメチルアミノベンゾフエノン、チオキ
サントン、フルオレノン、トリニトロフルオレノ
ンなどの芳香族ケトン系化合物、4,4′−ビスジ
メチルアミノチオベンゾフエノンなどの芳香族チ
オケトン化合物、ベンゾキノン、ジクロルベンゾ
キノン、テトラクロルベンゾキノン、ジクロルナ
フトキノン、フエナントレンキノン、ジクロルア
ントラキノン、ジニトロアントラキノン、アリザ
リン、ベンズアントラキノンなどのキノン系化合
物、ジニトロフルオレン、テトラニトロフルオレ
ン、トリニトロフルオレン、ニトロアセナフテ
ン、2,4,6−トリニトロアニリンなどの芳香
族ニトロ化合物、トリフエニルピラゾリンなどの
トリアリールピラゾリン系化合物、テトラフエニ
ルイミダゾール、トリフエニルイミダゾールなど
のモノイミダゾール系化合物、フルオレセイン、
エオシンY、ローズベンガル、エリトロシンB、
フロキシンなどのキサンテン系化合物、アクリフ
ラビン、リボフラビンなどのアクリジン系化合
物、7−N−ジメチルアミノクマリンなどのクマ
リン系化合物、チモールブルー、ブロムチモール
ブルー、ブロムクレゾールグリーンなどのトリフ
エニルメタン系化合物などがあり、中でも芳香族
ケトン系化合物、キノン系化合物、芳香族ニトロ
化合物、トリアリールピラゾリン系化合物クマリ
ン系化合物が好ましい。なお、前記光増感剤は全
組成物に対して0.1〜1重量%、特に0.1〜5.0重量
%添加するのが好ましい。
本発明の組成物の調製にあたつては、塩基性化
合物と一般式()〜()で示される酸性化合
物の両者を適当な溶媒に溶解して均一に混合し、
両者の酸塩基対を形成させる方法が採用される。
適当な溶媒としてはメタノール、エタノール、イ
ソプロパノールのような低級アルコール、アセト
ン、メチルエチルケトンのようなケトン類、メチ
ルセロソルブ、エチルセロソルブなどのエステル
類、トルエン、キシレンなどの芳香族化合物また
はこれらの2種以上の混合物を用いることができ
る。しかし、用いる塩基性高分子化合物が常温で
液体であるか、またはその融点、軟化点、流動点
が比較的低い場合には、溶媒を使用することなく
直接両者を混合する方法も採用される。
この様にして調製された本発明の組成物は、た
とえば溶液流延法、熱プレス法、注型法、溶融押
し出し法などにより所望の厚みの膜、フイルム、
シート状物と成すことができる。また、これらを
接着層を介してまたは介さずに支持体に積層する
ことができる。支持体としてはスチール、アルミ
ニウム、プルスチツクフイルム、ガラスなど任意
のものが使用できる。
本発明の組成物に対する感光光源としては、た
とえば各種水銀灯、炭素アーク灯、キセノンラン
プ、紫外線螢光灯など400mμ以下の波長の光線
に富むものが好ましい。
これらの光源からの本発明の組成物に対する光
照射方法としては、光透過部分および遮光部分か
ら成る所望の画像またはパターン像を有するいわ
ゆるネガフイルムまたはポジフイルムを通して行
われる。あるいは、この様な光源からの光ビーム
により本発明の組成物の面上を、所望の画像また
はパターン像を軌跡として走査することにより行
われる。
光照射により本発明の組成物の面上に先ず形成
される潜像は、光照射を受けなかつた部分と比較
して親水性が低下しているか、殆んど疎水性に変
化している。このことは光照射部分の極性が非照
射部分のそれよりも低下していると表現すること
もできる。
一つの面上に得られた極性の異なる画像潜像ま
たはパターン潜像は、何らの追加的処理をも行わ
ずにそのまま利用することもでき、また何らかの
現像処理を施こして利用することもできる。
現像処理が溶媒を必要とする場合、溶媒の選択
は、光照射部分と非照射部分の極性の差に対応し
て任意に行われ得る。一般的には水の利用が最も
便利であり、かつ好ましいが、本発明の組成物に
関しては水現像の採用が可能である。この場合、
PH5.5〜7.5の水の使用が好ましい。
本発明の組成物の効果的利用は、前述の様に、
主として膜状、フイルム状またはシート状などの
比較的薄い層によつてなされ、かつ多くの場合は
適当な支持体との積層物として利用される。具体
的利用に当つては、層状物の面上に光照射を行つ
て得られる極性または親水性の差を層状物の形態
を変えることなく利用する場合と、水によるエツ
チングまたはウオツシユアウト操作を加えて利用
する場合がある。前者の利用例は、極性の差から
必然的に発生する導電性の差を利用した電子写真
用途、静電印刷用途があり、さらに染色性の差を
利用した画像記録材料としても用いられる。一
方、後者の利用例は、各種ネガ型レジストとし
て、またオフセツト印刷版用としての用途があ
り、さらにレリーフとしては凸版印刷用樹脂版、
ネームプレート、鋳型用樹脂型、エンボス加工用
樹脂型などの利用が挙げられる。
本発明の組成物は、前以つて染料または顔料を
混じた系でも利用され、パターン遮光用各種マス
キング用途にも有効な材料を提供する。
以上かかる構成よりなる本発明組成物の特長と
するところは、その主成分である2種の化合物
(塩基性を有する高分子化合物および光照射によ
り酸性を失う一般式()〜()で示される酸
性化合物)の各々の選択種および相互の量比を広
い範囲にわたり組み合わせることにより、光照射
による極くわずかな親水性の変化から、水不溶性
乃至水溶性という大きな変化にわたる所望の性能
変化を発現させ得ることである。また、本発明の
組成物の光反応は連鎖反応に依つて進行するもの
ではないので、解像力が極めて高く、換言すれ
ば、本発明の組成物は樹脂の3次元反応と異な
り、光照射後の体積収縮、すなわち像の歪みを全
く伴わず、従つて高い解像力を保持することがで
きる。加えて、3次元化していない高分子化合物
は本質的に溶媒可溶であることから、本発明の化
合物により、たとえばレジスト像やレリーフ像を
製造する場合に、一旦得られた像の修正的消去が
可能となる。更に本発明の組成物の光反応は、光
重合反応のごとく酸素によつて妨害されることは
ないので、空気中からの酸素分子の拡散が起り易
い薄膜状態での反応速度にも何らの支障も生じな
い。あわせて熱的な安定性も高く、本発明の組成
物では極めて永いシエルフライフが保証される。
本発明の組成物の今一つの特徴は、レジスト像
やレリーフ像を得る場合のエツチングまたはウオ
ツシユアウトに際して、単なる水が採用できる点
である。このことは、安全性の面で特に好ましい
作業環境と操作性を約束することになる。さらに
本発明組成物は光反応速度が速く、高感度である
ため充分市場に供し得るものである。
次に実施例を示し、本発明を更に具体的に説明
する。なお、実施例中、部とあるは特記しない限
り重量部を表わす。
実施例1〜6、比較例1〜2
2−メチル−2−(N,N−ジメチルアミノ)
メチル−13−プロパンジオールとテレフタル酸か
ら直接重合法により得られたポリエステル1部お
よび第1表に示す酸性化合物の所定量をそれぞれ
メチルエチルケトンに溶解した。
得られた溶液を陽極酸化処理した厚さ200μの
アルミ板に厚さ2μにそれぞれ均一に塗布し、50
℃で5分間温風乾燥した。次に1枚毎にネガテイ
ブ・オリジナルフイルムを密着して、高圧水銀灯
(オーク社製:ポリマープリンター3000)に各々
2分、5分および10分間露光を行なつた。露光
後、それぞれの感光版を20℃、PH=7の水に浸漬
しウオツシヤー(大日本スクリーン社製)で現像
を行ない、水洗、水切り後、ガム液(富士フイル
ム社製GU)でガム引きを行ない、室温で風乾し
た。
以上の方法によつて得られた刷版のそれぞれの
外観とリヨウビKR480型オフセツト印刷機(リ
ヨウビ社製)にセツトして印刷した結果を第1表
に示す。[Formula] (where R 14 and R 15 have the same meanings as above). In addition, A and B are groups selected from the group consisting of -NH 2 , -COOH, -COOR′′′′ (where R′′′′ represents a hydrocarbon residue having 1 to 10 carbon atoms). A and B may be the same or different at the same time. Moreover, Y represents a 3-aminopropyl group. ] As the monomer represented by the above general formula (),
N-(2-aminoethyl)piperazine, N-(4-
aminocyclohexyl)piperazine, N-(2-
Diamines such as (aminoethyl)-3-methylpiverazine, N-carboxymethylpiperazine, N
-(4-carboxycyclohexyl)piperazine,
Examples include ω-amino acids such as N-(2-carboxyethyl)-3-methylpiperazine, and lower alkyl esters thereof. Examples of the monomer represented by the general formula () include N,N'-bis(aminomethyl)piperazine,
N-(aminomethyl)-N'-(2-aminoethyl)
Diamines such as piperazine, N,N'-bis(carboxymethyl)piperazine, N,N'-bis(carboxymethyl)-2,6-dimethylpiperazine, N-(2-carboxyethyl)-N'-(carboxy Dicarboxylic acids such as (methyl)piperazine or their lower alkyl esters, acid halides, and N-(aminomethyl)-N'-(carboxymethyl)piperazine, N-(aminomethyl)
Examples include ω-amino acids such as -N'-(carboxymethyl)-2-methylpiperazine, and lower alkyl esters thereof. Examples of the monomer represented by the general formula () include N,N-bis(2-aminoethyl)-methylamine, N,N-bis(3-aminopropyl)-
Diamines such as cyclohexylamine, N,N
-bis(carboxymethyl)-methylamine, N
-Dicarboxylic acids such as carboxymethyl-N-(2-carboxyethyl)-methylamine or their lower alkyl esters, acid halides, and N-(aminomethyl)-N-(carboxymethyl)-methylamine, N- (aminomethyl)
Examples include ω-amino acids such as -N-(2-carboxyethyl)-isopropylamine, and lower alkyl esters thereof. Examples of monomers represented by the general formula () include N,N'-dimethyl-N,N'-bis(3-aminopropyl)ethylenediamine, N,N'-dicyclohexyl-N,N'-bis(3-aminopropyl) -aminopropyl)hexamethylenediamine, N,N'-dimethyl-N,N'-bis(carboxymethyl)ethylenediamine, N,N'-dimethyl-N,N'-bis(3-carboxypropyl)
Dicarboxylic acids such as hexamethylene diamine or their lower alkyl esters, acid halides, N,N'-dimethyl-N-(aminomethyl)-N'-(carboxymethyl)ethylenediamine, N,N'-dimethyl-N- (aminomethyl)-
Examples include ω-aminos such as N'-(carboxyethyl)hexamethylene diamine, and lower alkyl esters thereof. Examples of the monomer represented by the general formula () include 6-methyl-6-(N,N-dimethylaminomethyl)-4,8-dioxa-1,11-undecanediamine, 6-ethyl-6-( N,N-dimethylaminomethyl)-4,8-dioxa-1,11-
undecanediamine, 6,6-bis(N,N-dimethylaminomethyl)-4,8-dioxa-1,
There are diamines such as 11-undecanediamine. Two or more of these basic monomers may be used in combination. In addition to the monomers represented by the general formulas () to () above, the polymerization components of the polyamide used in the present invention include aliphatic and/or aromatic dicarboxylic acids, diamines, and -Amino acids, lactams, etc. Examples of basic polyesters include those using monomers represented by the following general formulas () to (XII) as polymerization raw materials: [In the formula, R, R′, R″, R, R 11 , R 12 , R 13 ,
R 14 , R 15 , and R 16 have the same meanings as above. A′, B′ are −OH,
-COOH, -COOR′′′′ (where R′′′′ is 1 carbon number
~
The 10 hydrocarbon residues are shown. ), and A' and B' may be the same or different at the same time. ]. As the monomer represented by the above general formula (),
Specifically, N,N'-bis(carboxymethyl)
Piperazine, N,N'-bis(carboxymethyl)
Dicarboxylic acids such as -2,6-dimethylpiperazine, N-(2-carboxyethyl)-N'-(carboxymethyl)piperazine, or their lower alkyl esters, acid halides, N,
N'-bis(hydroxymethyl)piperazine, N,
N'-bis(2-hydroxypropyl)-2,5-
Dimethylpiperazine, N,N'-bis(2-hydroxycycloheptyl)piperazine, N,N'-
Glycols such as bis(2-methyl-2-hydroxynonyl)piperazine can be mentioned. Examples of monomers represented by the general formula () include dicarboxylic acids such as N,N'-bis(carboxymethyl)-methylamine and N-carboxymethyl-N-(2-carboxyethyl)-methylamine; lower alkyl esters, acid halides, and glycols such as N,N-bis(2-hydroxyethyl)amine and N,N-bis(2-hydroxypropyl)-isopropylamine. Examples of the monomer represented by general formula (XI) include N,N'-dimethyl-N,N'-bis(carboxymethyl)ethylenediamine, N,N'-dimethyl-N,N'-bis(3- carboxypropyl)
Dicarboxylic acids such as hexamethylene diamine or their lower alkyl esters, acid halides, N,N'-dimethyl-N,N'-bis(2
-hydroxyethyl)ethylenediamine, N,
N'-dicyclohexyl-N,N'-bis(2-hydroxyethyl)hexamethylenediamine, N,
There are glycols such as N'-dimethyl-N,N'-bis(2-hydroxyethyl)-2,2,4-trimethyl-hexamethylenediamine. Examples of the monomer represented by general formula (XII) include 2-methyl-2-(N,N'-dimethylaminomethyl)-1,3-propanediol, 2-methyl-2-(N,N- diisopropylaminomethyl)
-1,3-propanediol, 2-methyl-2-
piperidinomethyl-1,3-propanediol,
Examples include glycols such as bis(2-N,N-diisopropylaminomethyl)-1,3-propanediol. Two or more of these basic monomers may be used in combination. In addition to the monomers represented by the general formulas () to (XII), the raw materials for polymerization of the polyester used in the present invention include aliphatic and/or aromatic dicarboxylic acids or their lower Alkyl esters, glycols, oxyacids, etc. may be used in combination. As a vinyl polymer having basicity, 4
- Polymer of vinylpyridine, or the following general formula (): [In the formula, R′, R″, R, and R 11 have the same meanings as above.Q
represents an ester bond or an amide bond. ] Those using monomers shown in the following as polymerization raw materials are mentioned. Examples of the monomer represented by the above general formula () include 2-(N,N-dimethylamino)ethyl methacrylate, 3-(N,N-diethyl)
Methacrylates such as propyl methacrylate, 3-(N,N-dimethylamino)propyl methacrylamide, 3-(N,N-diethylamino)
Examples include methacrylamides such as propyl methacrylamide. Two or more of these basic monomers may be used in combination. As a polymerization raw material for the vinyl polymer used in the present invention, in addition to the above-mentioned 4-vinylpyridine or the monomer represented by the general formula (), a vinyl monomer used in the polymerization of ordinary vinyl polymers may be used in combination. . As the polyether having basicity, a diol having basicity, for example, the above general formula ()
There are those obtained by polycondensation from the diols represented by these or their functional derivatives, and those obtained by polycondensation with other diols or their functional derivatives. Other diols or functional derivatives thereof include ethylene glycol, propylene glycol, tetramethylene glycol, hexamethylene glycol, diethylene glycol, molecular weight 200
-3000, preferably 200-1000 polyethylene glycol, polytetramethylene glycol, bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)cyclohexane,
bis(4-hydroxyphenyl)thioether,
Bis(4-hydroxyphenyl)sulfone, 2,
2'-dihydroxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone,
Cresol, resorcinol, hydroquinone, 2,4
-dihydroxyacetophenone, 1,5-dihydroxynaphthalene, p-, m- or o-xylylene glycol, and the like. The above polyether is produced by polycondensation according to a conventional method. Examples of modified polymer compounds include cellulose derivatives modified with ethyleneamine, such as aminoethyl cellulose, and modified polymers that have been given basicity by a graft reaction, which is known as a general modification method for polymer compounds. Examples include molecular compounds. Furthermore, in the composition of the present invention, in addition to the basic polymer compound, other kinds of polymer compounds can also be used in combination. The basic polymer compound and the general formula ()-a,
The amount and mixing ratio of the acidic compounds represented by ()-b, ()-c, () and () in the composition vary depending on the type of combination of the two, and the characteristics required during actual use. (For example, the difference in hydrophilicity or water solubility before and after light irradiation, mechanical properties, reaction rate, etc.)
It is preferable that the proportion of both is such that the equivalent ratio of the acidic group of the acidic compound to the basic nitrogen contained in the basic polymer compound is 0.02 to 1. The composition of the present invention includes the general formula ()-a,
In addition to the acidic compounds shown in ()-b, ()-c, () and (), if necessary, acidic compounds that do not lose their acidity even when exposed to light are used in combination before and after light irradiation. It is also possible to control differences in the hydrophilicity or water solubility of. Furthermore, it is of course possible to use a conventionally known photoinsolubilizing agent in combination for the same purpose and to control mechanical properties. Examples of photoinsolubilizers that can be used in combination include acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, cyclohexyl acrylate, acrylamide, methacrylamide, N-methylolacrylamide, n-butoxymethylacrylamide, sodium acrylate, ammonium acrylate, acrylonitrile, styrene, Monomers with one unsaturated double bond such as sodium styrene sulfonate and vinylpyridine, or glycidyl methacrylate, allyl methacrylate, ethylene glycol di(meth)acrylate, 1,3-propanediol(meth)acrylate, and trimethylol There are monomers having two or more unsaturated double bonds, such as propane tri(meth)acrylate, triacryloyloxyethyl phosphate, and methylenebis(meth)acrylamide. In the composition of the present invention, sensitivity may be increased by further adding a photosensitizer. Examples of the photosensitizer used in the present invention include 4,
Aromatic ketone compounds such as 4'-bisdimethylaminobenzophenone, thioxanthone, fluorenone, trinitrofluorenone, aromatic thioketone compounds such as 4,4'-bisdimethylaminothiobenzophenone, benzoquinone, dichlorobenzoquinone, Quinone compounds such as tetrachlorobenzoquinone, dichlornaphthoquinone, phenanthrenequinone, dichloroanthraquinone, dinitroanthraquinone, alizarin, benzanthraquinone, dinitrofluorene, tetranitrofluorene, trinitrofluorene, nitroacenaphthene, 2,4,6 - Aromatic nitro compounds such as trinitroaniline, triarylpyrazoline compounds such as triphenylpyrazoline, monoimidazole compounds such as tetraphenylimidazole and triphenylimidazole, fluorescein,
Eosin Y, Rose Bengal, Erythrosin B,
These include xanthene compounds such as phloxine, acridine compounds such as acriflavin and riboflavin, coumarin compounds such as 7-N-dimethylaminocoumarin, and triphenylmethane compounds such as thymol blue, bromthymol blue, and bromcresol green. Among these, aromatic ketone compounds, quinone compounds, aromatic nitro compounds, triarylpyrazoline compounds, and coumarin compounds are preferred. The photosensitizer is preferably added in an amount of 0.1 to 1% by weight, particularly 0.1 to 5.0% by weight, based on the total composition. In preparing the composition of the present invention, both a basic compound and an acidic compound represented by general formulas () to () are dissolved in an appropriate solvent and mixed uniformly,
A method of forming acid-base pairs between the two is adopted.
Suitable solvents include lower alcohols such as methanol, ethanol and isopropanol, ketones such as acetone and methyl ethyl ketone, esters such as methyl cellosolve and ethyl cellosolve, aromatic compounds such as toluene and xylene, or two or more of these. Mixtures can be used. However, if the basic polymer compound used is liquid at room temperature or has a relatively low melting point, softening point, or pour point, a method of directly mixing the two without using a solvent may also be adopted. The composition of the present invention prepared in this way can be formed into a membrane, film, or film of a desired thickness by, for example, a solution casting method, a hot press method, a casting method, a melt extrusion method, etc.
It can be made into a sheet-like material. Further, these can be laminated on a support with or without an adhesive layer. As the support, any material such as steel, aluminum, plestic film, glass, etc. can be used. Preferred light sources for the composition of the present invention include those rich in light having a wavelength of 400 mμ or less, such as various mercury lamps, carbon arc lamps, xenon lamps, and ultraviolet fluorescent lamps. The composition of the present invention is irradiated with light from these light sources through a so-called negative film or positive film having a desired image or pattern image consisting of a light-transmitting part and a light-blocking part. Alternatively, it is carried out by scanning the surface of the composition of the present invention with a light beam from such a light source in the form of a locus of a desired image or pattern image. The latent image that is first formed on the surface of the composition of the present invention by light irradiation has decreased hydrophilicity or has changed to almost hydrophobicity compared to the area that has not received light irradiation. This can also be expressed as the polarity of the light-irradiated portion being lower than that of the non-irradiated portion. The image latent image or pattern latent image with different polarities obtained on one surface can be used as is without any additional processing, or can be used after being subjected to some development processing. . When the development process requires a solvent, the solvent can be selected arbitrarily depending on the polarity difference between the light-irradiated portion and the non-irradiated portion. Although the use of water is generally most convenient and preferred, water development can be employed with the compositions of the present invention. in this case,
Preferably, water with a pH of 5.5 to 7.5 is used. As mentioned above, the effective use of the composition of the present invention is as follows.
It is mainly formed in relatively thin layers such as membranes, films or sheets, and is often used as a laminate with a suitable support. In terms of specific uses, there are cases where the difference in polarity or hydrophilicity obtained by irradiating the surface of a layered material with light is utilized without changing the form of the layered material, and cases where etching or washout operations with water are used. It may be used in addition. Examples of the former use include electrophotography and electrostatic printing that take advantage of the difference in conductivity that inevitably arises from the difference in polarity, and also as image recording materials that take advantage of the difference in dyeability. On the other hand, the latter is used as various negative resists and for offset printing plates, and as a relief, resin plates for letterpress printing,
Examples of uses include name plates, resin molds for molds, and resin molds for embossing. The compositions of the present invention may also be used in systems premixed with dyes or pigments, providing materials that are also effective in various masking applications for patterned shading. The feature of the composition of the present invention having the above configuration is that its main components are two types of compounds (a polymeric compound having basicity and a general formula () to () that loses acidity upon irradiation with light). By combining selected types of acidic compounds (acidic compounds) and their mutual amount ratios over a wide range, it is possible to express desired performance changes ranging from a very slight change in hydrophilicity due to light irradiation to a large change in water insolubility to water solubility. It's about getting. Furthermore, since the photoreaction of the composition of the present invention does not proceed through a chain reaction, the resolution is extremely high.In other words, unlike the three-dimensional reaction of resins, the composition of the present invention There is no volumetric shrinkage, that is, no image distortion, and therefore high resolution can be maintained. In addition, since non-three-dimensional polymeric compounds are essentially solvent-soluble, when producing, for example, resist images or relief images using the compounds of the present invention, the images once obtained can be corrected and erased. becomes possible. Furthermore, since the photoreaction of the composition of the present invention is not hindered by oxygen unlike the photopolymerization reaction, there is no problem with the reaction rate in a thin film state where oxygen molecules tend to diffuse from the air. will not occur. In addition, thermal stability is high, and the composition of the present invention is guaranteed to have an extremely long shelf life. Another feature of the composition of the present invention is that simple water can be used for etching or washout when obtaining resist images or relief images. This promises a particularly favorable working environment and operability in terms of safety. Furthermore, the composition of the present invention has a fast photoreaction rate and high sensitivity, so it can be sufficiently marketed. EXAMPLES Next, the present invention will be explained in more detail with reference to Examples. In the examples, parts represent parts by weight unless otherwise specified. Examples 1-6, Comparative Examples 1-2 2-methyl-2-(N,N-dimethylamino)
One part of a polyester obtained by direct polymerization from methyl-13-propanediol and terephthalic acid and a predetermined amount of the acidic compound shown in Table 1 were each dissolved in methyl ethyl ketone. The resulting solution was applied uniformly to a thickness of 2 μm on each anodized aluminum plate with a thickness of 200 μm.
It was dried with warm air at ℃ for 5 minutes. Next, a negative original film was attached to each sheet and exposed to a high-pressure mercury lamp (Polymer Printer 3000, manufactured by Oak Co., Ltd.) for 2 minutes, 5 minutes, and 10 minutes, respectively. After exposure, each photosensitive plate was immersed in water at 20℃ and pH=7, developed with a washer (manufactured by Dainippon Screen Co., Ltd.), washed with water, drained, and then gummed with a gum solution (GU, manufactured by Fujifilm). and air-dried at room temperature. Table 1 shows the appearance of each printing plate obtained by the above method and the results of printing on a Ryobi KR480 offset printing machine (manufactured by Ryobi Co., Ltd.).
【表】
第1表中
A:解像性の良い鮮明な連続階調の画像が得られ
た。
B:細点、網点、独立点が部分的に欠け満足な画
像が得られなかつた。
C:細線、網点、独立点がとび、部分的に画像が
出なかつた。
〇:原図画像を良好に再現した鮮明な印刷物が得
られた。
△:細線、網点、独立点が部分的に欠け原図画像
を満足に再現しなかつた。
×:細線、網点、独立点がとび、インキ着肉性も
悪く、満足な印刷物が得られなかつた。
第1表より明らかなように、比較例1、2は光
反応速度が遅く、実用性の点から満足できるもの
ではなかつたが、本発明組成物は高感度の性能を
有し、鮮明な印刷物を得ることができた。
実施例 7
N−(β−アミノエチル)ピペラジン40部、ア
ジピン酸50部およびε−カプロラクタム38部を重
縮合して得られたポリアミド100部とN−カルボ
キシメチルカルバゾール50部をメタノールを溶媒
として完全に溶解混合した。
この溶液を、陽極酸化処理した厚さ200μのア
ルミ板上に厚さ1μに均一にコートし、50℃で2
分間温風乾燥した。該感光板にネガテイブオリジ
ナルフイルムを密着し3K.W.超高圧水銀燈で4分
間露光した。露光後該感光板を20℃のPH7の水に
浸漬し、ウオツシヤー(大日本スクリーン社製)
でブラツシングを行ない、水洗、水切り後、60℃
で10分間温風乾燥機で乾燥し、次いでガム液(富
士フイルム社製:GU)でガム引きを行なつた。
室温風乾燥後、オフセツト印刷機(リヨウビ社製
KR480型)で印刷テストを行なつた結果、イン
キ着肉性のよい良好な印刷サンプルが得られた。
網点解像性は150line/inch以上であつた。
実施例 8
実施例7で有機化合物N−カルボキシメチルカ
ルバゾールの代りに、N−フエニルアラニン0.6
部を用いて同様に感光版を得た。この感光版にネ
ガテイブオリジナルフイルムを密着し、実施例7
と同じ操作を実施し、印刷テストを行なつた結
果、実施例7と同様な結果が得られた。
実施例 9
実施例8で有機化合物N−フエニルアラニンの
代りにフエニルカルボキシルメチルセレニド0.4
部をアセトン−メタノール混合溶媒に溶解しして
均一な樹脂組成物の溶液を調製し、実施例7と同
様に実施し、全く同様の結果を得た。
実施例 10
式[Table] A in Table 1: A clear continuous tone image with good resolution was obtained. B: Fine points, halftone dots, and independent points were partially missing, and a satisfactory image could not be obtained. C: Thin lines, halftone dots, and independent points were skipped, and the image did not appear in some areas. ○: A clear printed matter that reproduced the original image well was obtained. Δ: Fine lines, halftone dots, and independent points were partially missing, and the original image could not be reproduced satisfactorily. ×: Thin lines, halftone dots, and independent dots were skipped, and the ink receptivity was poor, and a satisfactory printed matter could not be obtained. As is clear from Table 1, the photoreaction rate of Comparative Examples 1 and 2 was slow and unsatisfactory from the practical point of view, but the composition of the present invention has high sensitivity and clear printed matter. I was able to get Example 7 100 parts of a polyamide obtained by polycondensing 40 parts of N-(β-aminoethyl)piperazine, 50 parts of adipic acid, and 38 parts of ε-caprolactam and 50 parts of N-carboxymethylcarbazole were completely condensed using methanol as a solvent. were dissolved and mixed. This solution was coated uniformly to a thickness of 1μ on a 200μ thick anodized aluminum plate, and heated to 50℃ for 2 hours.
Dry with hot air for a minute. A negative original film was adhered to the photosensitive plate and exposed to a 3K.W. ultra-high pressure mercury lamp for 4 minutes. After exposure, the photosensitive plate was immersed in PH7 water at 20°C and washed with a washer (manufactured by Dainippon Screen Co., Ltd.).
After brushing, washing with water and draining water, store at 60℃.
The film was dried in a hot air dryer for 10 minutes, and then gummed with a gum solution (FUJIFILM Corporation: GU).
After drying with room temperature air, use an offset printing machine (manufactured by Ryobi Co., Ltd.)
As a result of a printing test using the KR480 model, a good printed sample with good ink receptivity was obtained.
The halftone dot resolution was 150 lines/inch or more. Example 8 In Example 7, N-phenylalanine 0.6 was used instead of the organic compound N-carboxymethylcarbazole.
A photosensitive plate was obtained in the same manner. A negative original film was closely attached to this photosensitive plate, and Example 7
As a result of carrying out the same operations as in Example 7 and performing a printing test, the same results as in Example 7 were obtained. Example 9 In Example 8, 0.4 phenylcarboxylmethylselenide was used instead of the organic compound N-phenylalanine.
A homogeneous solution of the resin composition was prepared by dissolving a portion of the resin composition in an acetone-methanol mixed solvent, and the same procedure as in Example 7 was carried out to obtain exactly the same results. Example 10 Formula
【式】で示
されるアミノアルキルメタクリレート30部ならび
にエチレン70部を重合して得た高分子化合物1部
および4−ニトロチオインドキシル酸0.5部をメ
チルエチルケトン/トルエン(容量比5/5)の
混合溶媒に溶解した。得られた溶液をポリプロピ
レンフイルム(厚さ60μ商標名東洋紡パイレンフ
イルムP1120#60、東洋化成工業株式会社製)に
ワイヤーバーで被覆し、70℃で5分間乾燥を行な
い厚さ5μの感光層を有する感光フイルムを得た。
この感光フイルムにネガテイブ・オリジナルフイ
ルムを重ね、ケミカルランプ(20W×10本、ラン
プー感光版距離45cm)で6分間露光した。
ブロムフエノールブルー0.005部を水/メタノ
ール(容量比4/6)混合溶媒10部に溶解した現
像液に露光後のフイルムを30秒間浸漬して深青色
のポジ画像を得た。網点解像性は150line/inch
以上であつた。
実施例 11
ポリ4−ビニルピリジン(広栄化学株式会社
製)50部および4−ニトロベンゾイル蟻酸15部を
アセトン−メタノール混合溶媒に溶解して均一な
樹脂組成物の溶液を調製した。この溶液を厚さ
0.3mmの紙面にバーコーターを用いて塗した後、
風乾乾燥して約5μの厚みの樹脂組成物が被覆さ
れた感光紙を得た。得られた感光紙の樹脂コート
面上に実施例10と同じ露光機で約3分間露光を行
なつた。露光した感光紙をフアツクスオフセツト
機(リコー株式会社製)に取付けて印刷テストを
行なつた結果、良好な印刷サンプルが得られた。
実施例 12
N,N′−ビス(アミノプロピル)ピペラジン
26部、アジピン酸19部およびε−カプロラクタム
55部を重縮合して得られるポリアミド100部とN
−フエニルヒスチジン35部、エチレングリコール
ジメタアクリレート30部、ベンゾイルメチルエー
テル10部、ヒドロキノンメチルエーテル0.1部、
カーボンブラツク15部およびメタノール500部か
ら成る組成物を厚さ100μのポリエチレンテレフ
タレートの2軸延伸フイルム上に塗布し、乾燥し
て厚さ3μの感光性積層体を得た。
分光光度計を用いて300〜400mμの波長範囲の
活性光線吸収率を測定したところ、99.9%以上で
あつた。この感光性積層体に実施例10で用いた画
像ネガフイルムを密着させて3K.W.の超高圧水銀
燈を用い、50cmの距離で4分間露光を行なつた。
その後スプレーノズルから2Kg/cm2の水圧の水道
水を約0.5分間噴きつけ、水を切つて乾燥を行な
つた結果、網点濃度2%から90%の範囲で極めて
忠実な白黒画像が得られた。この白黒画像を有す
るポジフイルムを前述の未露光感光性積層体上に
密着させて同様の処理を行なうと、網点を忠実に
再現した反転白黒画像が得られた。
更にこのネガフイルムを感光性樹脂版、東洋紡
プリンタイトEF−95に密着させて実施例7で用
いた露光機で3.5分間露光し、東洋紡プリンタイ
ト用洗出し機(大日本スクリーン(株)社製)で2.5
分間水洗を行なつて非常に再現性の良好な凸版用
レリーフ版を得た。このレリーフを用いて、自動
凸版校正機(毛利製作所製)による印刷テストを
行なつた結果、原図画像を良好に再現した印刷サ
ンプルが得られた。
実施例 13
実施例12で用いたN−フエニルヒスチジンの代
りにフエニルカルボキシメチルセレード40部を用
いて、実施例12と全く同様に実施し、実施例12と
同様の結果が得られた。
実施例 14
N,N′−ビス(ヒドロキシエチル)ピペラジ
ン258部、テレフタール酸ジメチル130部に触媒と
してチタン酸テトライソピロピル0.2部を加え、
重縮合して得られる樹脂100部とN−フエニルグ
リシン30部を、溶媒としてメタノールを用いて完
全溶解混合した。得られた溶液を陽極酸化処理し
た厚さ200μのアルミ板に厚さ2μに均一に塗布し、
50℃で5分間温風乾燥した。
次にこの感光版にネガテイブオリジナルフイル
ムを密着して高圧水銀灯(オーク社製:ポリマー
プリンター3000)にて4分間露光を行なつた。露
光後感光版を20℃PH=7の水に浸漬し、ウオツシ
ヤ−(大日本スクリーン製)で現像を行ない、水
洗、水切り後、ガム液GU−2(富士フイルム社
製)でガム引を行ない、室温で風乾した。得られ
た刷版をリヨウビKR480型オフセツト印刷機
(リヨウビ社製)にセツトして印刷した結果、原
図を非常によく再現した良好な印刷サンプルが得
られた。
実施例 15
実施例14で用いたN,N′−ビス(ヒドロキシ
エチル)ピペラジンとテレフタール酸ジメチルに
より得られる樹脂の代りにポリ4−ビニルピリジ
ン100部にN−フエニルグリシン50部を用いメタ
ノールを溶媒として完全混合溶解した。得られた
溶液を実施例14と全く同様に実施し、実施例14と
同様な印刷サンプルを得ることができた。1 part of a polymer compound obtained by polymerizing 30 parts of aminoalkyl methacrylate represented by the formula and 70 parts of ethylene and 0.5 part of 4-nitrothioindoxylic acid in a mixed solvent of methyl ethyl ketone/toluene (volume ratio 5/5) dissolved in. The obtained solution was coated with a wire bar on a polypropylene film (60μ thick, trade name Toyobo Pylene Film P1120#60, manufactured by Toyo Kasei Kogyo Co., Ltd.) and dried at 70°C for 5 minutes to form a photosensitive layer with a thickness of 5μ. A photosensitive film was obtained.
This photosensitive film was overlaid with a negative original film and exposed for 6 minutes using a chemical lamp (20W x 10, lamp-photosensitive plate distance 45cm). The exposed film was immersed for 30 seconds in a developer solution in which 0.005 part of bromophenol blue was dissolved in 10 parts of a mixed solvent of water/methanol (volume ratio 4/6) to obtain a deep blue positive image. Halftone resolution is 150 line/inch
That's all. Example 11 50 parts of poly-4-vinylpyridine (manufactured by Koei Chemical Co., Ltd.) and 15 parts of 4-nitrobenzoyl formic acid were dissolved in an acetone-methanol mixed solvent to prepare a uniform solution of a resin composition. Thicken this solution
After coating on a 0.3mm paper surface using a bar coater,
A photosensitive paper coated with a resin composition having a thickness of about 5 μm was obtained by air-drying. The resin-coated surface of the obtained photosensitive paper was exposed for about 3 minutes using the same exposure machine as in Example 10. A printing test was carried out by attaching the exposed photosensitive paper to a fax offset machine (manufactured by Ricoh Co., Ltd.), and as a result, good printed samples were obtained. Example 12 N,N'-bis(aminopropyl)piperazine
26 parts, adipic acid 19 parts and ε-caprolactam
100 parts of polyamide obtained by polycondensing 55 parts of N
- 35 parts of phenylhistidine, 30 parts of ethylene glycol dimethacrylate, 10 parts of benzoyl methyl ether, 0.1 part of hydroquinone methyl ether,
A composition consisting of 15 parts of carbon black and 500 parts of methanol was coated on a biaxially stretched film of polyethylene terephthalate having a thickness of 100 μm and dried to obtain a photosensitive laminate having a thickness of 3 μm. When the active light absorption rate in the wavelength range of 300 to 400 mμ was measured using a spectrophotometer, it was 99.9% or more. The image negative film used in Example 10 was brought into close contact with this photosensitive laminate and exposed for 4 minutes at a distance of 50 cm using a 3 K.W. ultra-high pressure mercury lamp.
After that, we sprayed tap water at a pressure of 2 kg/cm 2 from a spray nozzle for about 0.5 minutes, then drained the water and dried it. As a result, we were able to obtain extremely faithful black and white images with dot density ranging from 2% to 90%. Ta. When the positive film containing this black-and-white image was brought into close contact with the unexposed photosensitive laminate described above and the same process was carried out, an inverted black-and-white image in which the halftone dots were faithfully reproduced was obtained. Furthermore, this negative film was brought into close contact with a photosensitive resin plate, Toyobo Printite EF-95, and exposed for 3.5 minutes using the exposure machine used in Example 7. ) at 2.5
After rinsing with water for a minute, a relief plate for relief printing with very good reproducibility was obtained. Using this relief, a printing test was conducted using an automatic letterpress proofing machine (manufactured by Mori Seisakusho), and as a result, a printed sample that reproduced the original image well was obtained. Example 13 The same procedure as in Example 12 was carried out using 40 parts of phenylcarboxymethylcerade in place of the N-phenylhistidine used in Example 12, and the same results as in Example 12 were obtained. . Example 14 0.2 part of tetraisopropyl titanate was added as a catalyst to 258 parts of N,N'-bis(hydroxyethyl)piperazine and 130 parts of dimethyl terephthalate.
100 parts of the resin obtained by polycondensation and 30 parts of N-phenylglycine were completely dissolved and mixed using methanol as a solvent. The obtained solution was applied uniformly to a thickness of 2μ on a 200μ thick aluminum plate that had been anodized.
It was dried with hot air at 50°C for 5 minutes. Next, a negative original film was adhered to this photosensitive plate and exposed for 4 minutes using a high pressure mercury lamp (manufactured by Oak Co., Ltd.: Polymer Printer 3000). After exposure, the photosensitive plate was immersed in water at 20℃PH=7, developed with washer (manufactured by Dainippon Screen), washed with water, drained, and gummed with gum solution GU-2 (manufactured by Fujifilm). and air-dried at room temperature. The resulting printing plate was set in a Ryobi KR480 offset printing machine (manufactured by Ryobi Co., Ltd.) and printed, resulting in a good printed sample that reproduced the original drawing very well. Example 15 Instead of the resin obtained from N,N'-bis(hydroxyethyl)piperazine and dimethyl terephthalate used in Example 14, 100 parts of poly-4-vinylpyridine and 50 parts of N-phenylglycine were used, and methanol was used. Completely mixed and dissolved as a solvent. The obtained solution was processed in exactly the same manner as in Example 14, and a printed sample similar to that in Example 14 could be obtained.
Claims (1)
溶性であるが、酸性を有する化合物との共存下で
酸塩基相互作用により親水性が高くなるか、また
は水溶性になる様な性質を有する塩基性高分子化
合物の少なくとも1種および(2)下記一般式()
−a、()−b、()−c、()および()
で示される酸性化合物の少なくとも1種を含有す
ることを特徴とする感光性樹脂組成物。 〔式中、Xは窒素、酸素、イオウ、セレン、R1、
R2はそれぞれ水素、置換基を有するか有しない
炭素数1〜6個のアルキル基、フエニル基、R5
は水素、置換基を有するか有しない炭素数1〜6
個のアルキル基、nは0または1、mはXが窒素
のときは1、Xが酸素、イオウ、セレンのときは
0を示す。〕 〔式中、YはNR9、イオウであり、R7およびR9
はそれぞれ水素、炭素数1〜3個のアルキル基、
R8は水素、ニトロ基、シアノ基、ハロゲン、ア
ルコキシ基を示す。〕 〔式中、Zは酸素、イオウであり、R10は置換基
を有するか有しないフエニル基、Kは0または1
を示す。〕 2 塩基性高分子化合物が、該高分子化合物を形
成する単量体が塩基性を示す基を有し、かつ水溶
媒系において電位差滴定により測定して塩基性基
がPka2以上を示すものである特許請求の範囲第
1項記載の感光性樹脂組成物。 3 塩基性高分子化合物が、該高分子化合物を形
成する単量体が塩基性窒素原子を有し、かつ該高
分子化合物中の窒素含量が0.1〜25当量/Kgであ
るものである特許請求の範囲第1項記載の感光性
樹脂組成物。 4 さらに、芳香族ニトロ化合物、芳香族ケトン
系化合物、芳香族チオケトン系化合物、キノン系
化合物、クマリン系化合物、トリフエニルメタン
系化合物、トリアリールピラゾリン系化合物、モ
ノイミダゾール系化合物から選択された少なくと
も一種の光増感剤を含有する特許請求の範囲第1
項記載の感光性樹脂組成物。[Scope of Claims] 1 (1) It has low hydrophilicity or is water-insoluble by itself, but becomes highly hydrophilic or water-soluble due to acid-base interaction in the coexistence with an acidic compound. At least one basic polymer compound having properties such that (2) the following general formula ()
-a, ()-b, ()-c, () and ()
A photosensitive resin composition comprising at least one acidic compound represented by: [Wherein, X is nitrogen, oxygen, sulfur, selenium, R 1 ,
R 2 is hydrogen, an alkyl group having 1 to 6 carbon atoms with or without a substituent, a phenyl group, R 5
is hydrogen, carbon number 1-6 with or without substituents
n is 0 or 1, m is 1 when X is nitrogen, and 0 when X is oxygen, sulfur, or selenium. ] [Wherein, Y is NR 9 , sulfur, R 7 and R 9
are hydrogen, an alkyl group having 1 to 3 carbon atoms, and
R 8 represents hydrogen, nitro group, cyano group, halogen, or alkoxy group. ] [In the formula, Z is oxygen or sulfur, R 10 is a phenyl group with or without a substituent, and K is 0 or 1
shows. [2] The basic polymer compound is one in which the monomer forming the polymer compound has a group showing basicity, and the basic group shows Pka2 or more as measured by potentiometric titration in an aqueous solvent system. A photosensitive resin composition according to claim 1. 3. A patent claim in which the basic polymer compound is one in which the monomer forming the polymer compound has a basic nitrogen atom, and the nitrogen content in the polymer compound is 0.1 to 25 equivalents/Kg. The photosensitive resin composition according to item 1. 4 Furthermore, at least one selected from aromatic nitro compounds, aromatic ketone compounds, aromatic thioketone compounds, quinone compounds, coumarin compounds, triphenylmethane compounds, triarylpyrazoline compounds, and monoimidazole compounds. Claim 1 containing a kind of photosensitizer
The photosensitive resin composition described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11100381A JPS5811933A (en) | 1981-07-16 | 1981-07-16 | Photosensitive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11100381A JPS5811933A (en) | 1981-07-16 | 1981-07-16 | Photosensitive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5811933A JPS5811933A (en) | 1983-01-22 |
| JPH0119573B2 true JPH0119573B2 (en) | 1989-04-12 |
Family
ID=14549928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11100381A Granted JPS5811933A (en) | 1981-07-16 | 1981-07-16 | Photosensitive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5811933A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6078781A (en) * | 1983-10-05 | 1985-05-04 | Fuji Photo Film Co Ltd | Thermal recording paper |
| JPS60140236A (en) * | 1983-12-27 | 1985-07-25 | Toppan Printing Co Ltd | Image forming material |
| JP4910238B2 (en) * | 2001-03-06 | 2012-04-04 | Jsr株式会社 | Chemically amplified radiation sensitive resin composition |
-
1981
- 1981-07-16 JP JP11100381A patent/JPS5811933A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5811933A (en) | 1983-01-22 |
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