JPH01200640A - Lead recognition in bonding apparatus - Google Patents

Abstract

PURPOSE:To improve an index of a bonding apparatus by a method wherein a position of a lead during a self-teaching operation and a position of a lead of an actual product are compared by using a binary-coded image and the lead which has deviated from the position of the lead during the self-teaching operation is detected. CONSTITUTION:Positions of leads 1-22 during a self-teaching operation and positions of leads of an actual product are compared by using a binary-coded image; only the leads which have deviated from the positions of the leads during the self-teaching operation are detected. By this setup, it is possible to prevent a drop in an index due to a lead recognition operation for the leads which have not deviated, or to prevent a defect such as a fall of the leads when the leads designated for the lead recognition operation have been deformed; it is possible to surely recognize the leads when the positions of the leads have deviated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding apparatus, and particularly to a lead recognition method.

[Conventional technology]

Conventionally, this type of lead recognition bonding apparatus has a mechanism in which a lead to be recognized is specified in advance during self-teach (hereinafter referred to as ST).

[Problem to be solved by the invention]

The conventional bonding apparatus described above has a mechanism that specifies the lead to be recognized in advance at 57 o'clock, so if a lead that is not specified is deformed or misaligned, defects such as lead drop may occur. Furthermore, if all the leads are designated, lead recognition is performed even for leads that are not misaligned due to lead deformation 9, so there is a drawback that the index of the bonding device decreases.

An object of the present invention is to provide a lead recognition method that solves the above problems.

[Differences between the invention and the prior art]

The traditional lead mentioned above! 2 In contrast to the slight force method, the present invention compares the positions of all leads with the positions of all leads at 57 o'clock and determines the position i.
The difference is that only leads with rt deviation or deformation are detected, and lead recognition is performed only on these leads.

[Means to solve the problem]

In order to achieve the above object, in the bonding apparatus of the present invention, the lead position at the time of self-teaching and the lead position of the actual product are compared by one bite in the binary image, and the lead position at the time of self-teaching is deviated from the lead position at the time of self-teaching. Detect leads that are
Lead recognition is performed only on misaligned or deformed leads.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view showing the lead position at 37 o'clock, and FIG. 2 is a plan view showing the lead position of the actual product.

Figures 3 and 4 are respectively from Figure 1.

The positions of the leads shown in Figure 2 are recognized at once by a camera.
This is a valued image. The positions of leads 1 to 22 are compared using the binarized images shown in FIGS. 3 and 4. Comparing the images shown in Figures 3 and 4, leads 2, 3, 5,
6, 8, 9. 10, 12, 14, 15, 16.1? ,1
9, 20, 21, 22 and the island portion 23 are misaligned.

No deformation has occurred and they are consistent with each other.

However, the leads 1, 4, 7, 11, 13, and 18 are deviated from the lead position at 37 o'clock. Therefore, based on the binarized image, the positional shift (or deformation)
Detect leads 1, 4, 7, 11, 13, and 18 that are causing this.

As shown in FIG. 5, only these leads 1, 4, 7, 11, 13, and 18 are individually binarized using a recognition camera to perform lead recognition.

〔Effect of the invention〕

As explained above, the present invention compares the lead position at 37 o'clock with the lead position of the actual product using a binary image, and detects only the leads that have deviated from the lead position at 37 o'clock. Lead L2Tf1 for no lead
This has the effect of preventing defects such as a drop in the index due to implementation or lead drop when a lead is deformed for a lead that is not designated for lead recognition, and ensures lead recognition when there is a shift in the lead position. be.

[Brief explanation of the drawing]

1 to 5 are diagrams showing one embodiment of the present invention. FIG. 1 is a plan view showing the lead position at 37 o'clock, and FIG. 2 is a plan view showing the lead position of an actual product. Figures 3 and 4 are images showing binarized images of the lead positions in Figures 1 and 2, respectively, and Figure 5 is a binary image of the lead positions during lead recognition.
FIG. 3 is a diagram showing a valued image. 1-22...Lead 23...Island part Figure 1 Figure 2 Figure 3 Figure 4 Roni E2

Claims (1)

[Claims] 1. Compare the lead position during self-teaching with the lead position on the actual product using a binary image, detect leads that have deviated from the lead position during self-teaching, and detect only the misaligned or deformed leads. A lead recognition method in a bonding device, characterized by performing lead recognition.