JPH01200929A - Method for detecting gaps between mold mating surfaces in transfer molding molds - Google Patents

Method for detecting gaps between mold mating surfaces in transfer molding molds

Info

Publication number
JPH01200929A
JPH01200929A JP2626788A JP2626788A JPH01200929A JP H01200929 A JPH01200929 A JP H01200929A JP 2626788 A JP2626788 A JP 2626788A JP 2626788 A JP2626788 A JP 2626788A JP H01200929 A JPH01200929 A JP H01200929A
Authority
JP
Japan
Prior art keywords
mold
cavity
air
gap
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2626788A
Other languages
Japanese (ja)
Inventor
Katsuaki Ito
伊藤 勝章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2626788A priority Critical patent/JPH01200929A/en
Publication of JPH01200929A publication Critical patent/JPH01200929A/en
Pending legal-status Critical Current

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  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To certainly detect a degree of hermetical sealing, by a method wherein air is discharged from or supplied to a clamped hermetically sealed mold to measure the flow rate of said air. CONSTITUTION:A lead frame R is placed on a lower mold 2 and, after an upper mold 1 and the lower mold 2 are clamped, a resin tablet A is placed in a pot 6 and a plunger 7 is allowed to fall. The plunger 7 is allowed to fall to close the opening of the pot 6 and the air in a cavity 5 is reduced in pressure and sucked through an air pipe 9(contrarily, compressed air may be supplied to the cavity 5 from the air pipe 9). When a gap is present between mold registering surfaces, air is penetrated in the cavity 5 from the outside through the gap when the air in the cavity 5 is reduced in pressure and sucked (contrarily, compressed air may be supplied) and, therefore, the internal pressure of the cavity 5 does not change. This pressure change is observed by a pressure gauge 10 to accurately detect the presence of the gap.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、トランスファモールド金型の型締め状態に
おけるすき間の有無検出方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for detecting the presence or absence of a gap in a transfer mold mold in a clamped state.

〔従来の技術〕[Conventional technology]

エポキシ樹脂等の熱硬化性樹脂をポットに投入し、加熱
、加圧によりランナーおよびゲートからキャビティ内に
溶融した成形材料を送り込むようにしたトランスファ成
形は、成形品の寸法精度が1)られ易く、複雑な形状の
インサート部品に対する成形ができるなどの特長を有す
るため、IC1ダイオード、トランジスタ等の電子部品
のインサート成形に非常に多く用いられている。
Transfer molding, in which a thermosetting resin such as an epoxy resin is placed in a pot and heated and pressurized to feed the molten molding material into the cavity through a runner and a gate, improves the dimensional accuracy of the molded product (1); Because it has the advantage of being able to mold insert parts with complex shapes, it is widely used for insert molding of electronic parts such as IC1 diodes and transistors.

上記のような電子部品のインサート成形に際しては、金
型に対して、リードフレームや端子を正確にセントする
必要があるが、リードフレームを入れ忘れたり、2枚の
リードフレームをセントする場合がある。また、リード
フレームにセントの位置ずれが生じたり、一部が欠落し
た不良品のリードフレームをセットする場合もあり、さ
らには、金型の型合わせ面にモールドカスやフレームの
一部が残っている場合もある。
When insert molding electronic components as described above, it is necessary to accurately insert lead frames and terminals into the mold, but there are cases where a lead frame is forgotten or two lead frames are inserted. In addition, the lead frame may be misaligned, or a defective lead frame with a part missing may be set.Furthermore, mold scum or part of the frame may remain on the mold mating surface of the mold. Sometimes there are.

上記のような状態で型締めすると、金型の合わせ面にす
き間が形成されるため、成形時に、上記すき間から樹脂
が流出し、成形品は未充填や形状不良になる。また、金
型の型合わ・1面や金型の側面に樹脂が流れ、その後の
清掃に手間がかかる。
If the mold is clamped in the above state, a gap will be formed between the mating surfaces of the molds, and during molding, resin will flow out from the gap, resulting in unfilled or defective molded products. In addition, the resin flows onto the fitting surface of the mold and the sides of the mold, making subsequent cleaning time-consuming.

(発明が解決しようとする課題〕 上記のような樹脂の流出によるトラブルを防止するため
、従来は、作業者が目視によって正しいセント状態の6
′l認を行なうようにしたが、信+■性がなく、樹脂の
流出を確実に防止することができなかった。
(Problem to be Solved by the Invention) In order to prevent troubles caused by the resin flowing out as described above, in the past, an operator had to visually check the correct cent state.
Although we tried to carry out verification, it was not reliable and it was not possible to reliably prevent the resin from flowing out.

また、金型あるいはモールドプレス機に精度の高い位置
センサを取付けて型合わせ面のすき間の有無を検出する
方法もあるが、金型にセットされたリードフレームが一
部欠落している場合やフレームを入れ忘れた場合、これ
を検出することはできない。
Another method is to attach a highly accurate position sensor to the mold or mold press machine to detect the presence or absence of a gap between the mold mating surfaces. If you forget to insert it, this cannot be detected.

そこで、この発明は上記の不都合を解消し、金型の型合
わせ面におけるすき間の有無を確実に検出することがで
きるすき量検出方法を提供することを目的としている。
SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a gap detection method capable of reliably detecting the presence or absence of a gap in the mating surfaces of a mold, thereby eliminating the above-mentioned disadvantages.

(課題を解決するための手段〕 上記の目的を達成するために、この発明におけるすき量
検出方法においては型締めしたトランスファモールド金
型のボット部をプランジャで密閉したのち、上記金型の
内部に形成されたキャピテイ内の空気を減j工、吸引し
、またはキャビティ内に圧縮空気を圧送し°ζキャビテ
ィ内の圧力又はキャビティに対する空気流■を検出する
構成としである。
(Means for Solving the Problems) In order to achieve the above object, in the gap detection method of the present invention, after the bottom part of the clamped transfer mold mold is sealed with a plunger, the inside of the mold is The structure is such that the air inside the formed cavity is reduced or sucked, or compressed air is forced into the cavity, and the pressure inside the cavity or the air flow to the cavity is detected.

〔作用〕[Effect]

上記のように構成すれば、金型の型合わせ面にすき間が
あると、そのすき間を介してキャビティ内部と外部が連
通ずるため、キャビティ内の空気を吸引し、あるいは圧
縮空気を供給した場合にキャビティ内の圧力変化がきわ
めて小さく、また、キャビティに対する空気の吸引量あ
るいは給気量が大きくなる。このため、キャビティ内の
圧力を検出し、あるいはキャビティに対する空気流1″
lを検出することによって、型合わせ面のすさ間の有無
を検出することができる。
With the above configuration, if there is a gap between the mold mating surfaces of the mold, the inside and outside of the cavity will communicate through that gap, so when air is sucked into the cavity or compressed air is supplied, The pressure change within the cavity is extremely small, and the amount of air sucked into or supplied to the cavity is increased. For this purpose, the pressure inside the cavity can be detected or the air flow 1" relative to the cavity can be detected.
By detecting l, it is possible to detect whether there is a gap between the molding surfaces.

〔実施例〕〔Example〕

以下、この発明の実施例を添付図面に基づいて説明する
Embodiments of the present invention will be described below with reference to the accompanying drawings.

図示のようにトランスファモールド金型は、上型1と下
型2から成り、両型1.2を型締めすると、上型1と下
型2の型合わせ面間にランナー3、ゲート4およびキャ
ビティ5が形成される。
As shown in the figure, the transfer mold mold consists of an upper mold 1 and a lower mold 2. When both molds 1.2 are clamped, a runner 3, a gate 4, and a cavity are formed between the mating surfaces of the upper mold 1 and lower mold 2. 5 is formed.

上型1には、上記ランナー3に連通ずるポット6が形成
され、そのボット6に置かれた樹脂タブレット八は、上
下動可能なプランジャ7の下降動によってランナー3お
よびゲート4を介してキャビティ5に圧入される。
The upper mold 1 is formed with a pot 6 that communicates with the runner 3, and the resin tablet 8 placed in the pot 6 is moved through the runner 3 and the gate 4 into the cavity 5 by the downward movement of a plunger 7 that can move up and down. is press-fitted into the

また、上型1には、ランナー3に連通ずる通路8が形成
され、その通路8に接続した空気管9の途中に圧ノj計
10が取付けられている。
Further, a passage 8 communicating with the runner 3 is formed in the upper mold 1, and a pressure gauge 10 is attached in the middle of an air pipe 9 connected to the passage 8.

上記の構成から成る金型を用いてインサート成形するに
は、下型2上にリードフレームRを載置し、上型1と下
型2を型締めしたのち、ボット6に樹脂タブレットAを
vi置してプランジャ7を下降させる。
To perform insert molding using the mold configured as described above, the lead frame R is placed on the lower mold 2, the upper mold 1 and the lower mold 2 are clamped, and then the resin tablet A is placed in the bot 6. position, and then lower the plunger 7.

上記の成型において、上型1と下型2の型合わせ面にす
き間が存在すると、溶融した樹脂は上記すき間から外部
に流出して種々のトラブルが生じるため、成型する前に
すき間の有無を検出する。
In the above molding process, if there is a gap between the mating surfaces of the upper mold 1 and lower mold 2, the molten resin will flow out through the gap and cause various problems. Therefore, the presence or absence of the gap is detected before molding. do.

その検出に際しては、プランジャ7を下降して、第1図
に示すようにポット6の開口を塞ぎ、空気管Sを介して
キャピテイ5の内部の空気を減圧、吸引し、あるいは逆
に、空気管9からキャビティ5の内部に圧縮空気を供給
する。
When detecting this, the plunger 7 is lowered to close the opening of the pot 6 as shown in FIG. Compressed air is supplied from 9 into the cavity 5.

型合わせ面にすき聞が存在すると、キャビテイ5内部の
空気を減圧、吸引したとき、外部から上記すき間を通し
てキャビティ5の内部に空気が侵入し、また、圧縮空気
を供給したときには、その圧縮空気は上記すき間から外
部に漏洩するため、キャビティ5の内部における圧力の
変化はきわめて小さい。
If a gap exists in the mold mating surface, when the air inside the cavity 5 is decompressed and sucked, air will enter the cavity 5 from the outside through the gap, and when compressed air is supplied, the compressed air will Since it leaks to the outside through the above-mentioned gap, the change in pressure inside the cavity 5 is extremely small.

このため、圧力計10に表示される圧力を見ることによ
って、すき間の有無を検出することができる。
Therefore, by looking at the pressure displayed on the pressure gauge 10, the presence or absence of a gap can be detected.

なお、上記のようなすき間の検出法において、型合わせ
面にすき間が存在すると、空気管9 内を流れる空気の
流量が多くなるため、圧力計10に代えて流量計を取付
け、空気管S内を流れる空気流■の検出によってすき間
の有無を検出してもよい。
In addition, in the gap detection method described above, if there is a gap in the mold mating surface, the flow rate of air flowing inside the air pipe 9 will increase, so a flow meter is installed in place of the pressure gauge 10, and The presence or absence of a gap may be detected by detecting the air flow (■) flowing through.

上記のようなすき間の有無検出後、すき間がない場合に
は、プランジャ7をそのまま下降して成形作業を行なう
After detecting the presence or absence of a gap as described above, if there is no gap, the plunger 7 is directly lowered to perform the molding operation.

その成形時、溶融樹脂が、上型1の通路8に侵入して通
路8を塞ぎ、次の検出作業が出来なくなるため、成形時
のみ、通路8を閉じるようにしておく、その閉鎖手段と
して、上型1に通路8に連通するロッド挿入孔11を形
成し、そのロッド挿入孔11にシリンダ12のピストン
ロッド13を挿入し、そのピストンロッド13の先端部
に取付けたピン14を、ピストンロッド13の軸方向の
移動によって通路8に対して出入りさせる方法がある。
During molding, the molten resin enters the passage 8 of the upper mold 1 and blocks the passage 8, making it impossible to carry out the next detection operation.As a means of closing the passage 8, the passage 8 is closed only during molding. A rod insertion hole 11 communicating with the passage 8 is formed in the upper die 1, a piston rod 13 of the cylinder 12 is inserted into the rod insertion hole 11, and a pin 14 attached to the tip of the piston rod 13 is inserted into the piston rod 13. There is a method of moving the tube in and out of the passage 8 by moving it in the axial direction.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明は、型締めした金型のポットを
プランジャで閉鎖し、その金型のキャビティの内部の空
気を減圧、吸引しあるいは圧縮空気を供給してその時の
キャビティ内部の圧力または空気流量を形成するように
したので、型合わせ面におけるすき間の有無を確実に検
出することができる。
As described above, the present invention closes the pot of a clamped mold with a plunger, reduces the pressure of the air inside the cavity of the mold, suctions it, or supplies compressed air to reduce the pressure inside the cavity at that time. Since the air flow rate is formed, it is possible to reliably detect the presence or absence of a gap in the mold mating surfaces.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、この発明に係る方法に実施するすき量検出装
置の一実施例を示す断面図、第2図は同上の成形状態を
示す断面図である。 1・・・・・・上型、     2・・・・・・下型、
5・・・・・・キャビティ、   6・・・・・・ポッ
ト、7・・・・・・プランジャ、  8・・・・・・通
路、9・・・・・・空気管、     10・・・・・
・圧力計。 特許出願人 住友電気工業株式会社
FIG. 1 is a sectional view showing one embodiment of a gap detection device implemented in the method according to the present invention, and FIG. 2 is a sectional view showing the molding state of the same. 1...Top mold, 2...Bottom mold,
5... Cavity, 6... Pot, 7... Plunger, 8... Passage, 9... Air pipe, 10...・・・
・Pressure gauge. Patent applicant: Sumitomo Electric Industries, Ltd.

Claims (1)

【特許請求の範囲】[Claims] トランスファモールド金型を型締めし、その金型のポッ
トをプランジャで密閉したのち、上記金型の内部に形成
されたキャビティ内の空気を減圧、吸引し、またはキャ
ビティ内に圧縮空気を圧送してキャビティ内の圧力又は
キャビティに対する空気流量を検出するトランスファモ
ールド金型における型合わせ面のすき間検出方法。
After the transfer mold mold is clamped and the pot of the mold is sealed with a plunger, the air in the cavity formed inside the mold is decompressed and suctioned, or compressed air is pumped into the cavity. A method for detecting a gap between mold mating surfaces in a transfer mold die for detecting pressure within a cavity or air flow rate to the cavity.
JP2626788A 1988-02-05 1988-02-05 Method for detecting gaps between mold mating surfaces in transfer molding molds Pending JPH01200929A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2626788A JPH01200929A (en) 1988-02-05 1988-02-05 Method for detecting gaps between mold mating surfaces in transfer molding molds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2626788A JPH01200929A (en) 1988-02-05 1988-02-05 Method for detecting gaps between mold mating surfaces in transfer molding molds

Publications (1)

Publication Number Publication Date
JPH01200929A true JPH01200929A (en) 1989-08-14

Family

ID=12188497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2626788A Pending JPH01200929A (en) 1988-02-05 1988-02-05 Method for detecting gaps between mold mating surfaces in transfer molding molds

Country Status (1)

Country Link
JP (1) JPH01200929A (en)

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