JPH01201943A - Method for connecting external terminal for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent soldering defect and obtain a device with high reliability and high quality, by previously providing a hole in an external terminal side end of an inner electrode frame, provide an extending part covering an upper part of the through hole at the external terminal, soldering the inner electrode frame on the electrode of a substrate and then soldering the external terminal by pressing the inner electrode frame at the extending part. CONSTITUTION:In order to connect an inner electrode frame 5 in which a through hole 11 is formed to a terminal 7 having a pressing piece 12, first, an electrode 3c of a ceramic substrate 3 is connected to the inner electrode frame 5 having one terminal connected to an electrode of a semiconductor element through a cream solder 9. Then, by pressing an end on the side of the through hole 11 of the inner electrode frame 5 by the pressing piece 12, the terminal 7 is connected to the electrode 3c through the cream solder 9. More specifically, by pressing the inner electrode frame 5 by the pressing piece 12, the cream solder is filled into the through hole 11 and between the inner electrode frame 5 and the pressing piece 12, so that the inner electrode frame 5 and the terminal 7 are soldered respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for assembling a semiconductor device, and more particularly to a method for connecting external terminals for a semiconductor device and an internal electrode frame.

[Conventional technology]

Figure 2 is a side sectional view of a flat base type AC control element in which the internal electrode frame and external terminals are connected using the conventional connection method, and Figure 3 is a partially enlarged side sectional view. In the figure, reference numeral 1 denotes a base plate, and this base plate 1 is made of a material with good thermal conductivity, such as metal, in order to easily dissipate the heat generated by the semiconductor element 2 to the outside. Reference numeral 3 designates a ceramic substrate as an insulating member, and electrodes 3a, 3b, and 3c are formed on this ceramic substrate 3 to which the base plate 1, semiconductor element 2, and terminals to be described later are fixed. Reference numeral 4 designates a conductive plate for connecting the electrode 3b of the ceramic substrate 3 and the semiconductor element 2. That is, the electrode 3a formed on the back surface of the ceramic substrate 3 is fixed on the semiconductor element mounting portion 1a of the base plate 1, the conductive plate 4 is fixed on the electrode 3b formed on the upper surface of this ceramic substrate 3, and then the By fixing the semiconductor element 2 thereon, the semiconductor element 2 is fixed onto the base plate 1 via the conductive plate 4 and the ceramic substrate 3. 5 is an internal electrode frame for connecting the electrode (not shown) of the semiconductor element 2 and the electrode 3c of the ceramic substrate 3; 6;
．． 7 is a terminal for connecting an external device (not shown) and the semiconductor element 2, and these terminals 6 and 7 are integrated with the frame 8 by being partially embedded in the holding part 8a of the frame 8. The lower ends 6a, 7 of these terminals 6, 7
A is fixed to the electrodes 3b and 3c with cream solder 9. 10 is filled in the frame 8 to form a semiconductor element 2. Electrodes 3b to 3c + conductive plate 4° This is a sealing resin made of an impermeable resin for sealing the internal electrode frame 5 and the like.

In order to assemble the flat base AC control element constructed in this manner, first, the semiconductor element 2 is fixed onto the base plate 1 via the ceramic substrate 3 and the conductive plate 4.

Next, the electrodes (not shown) of the semiconductor element 2 and the electrodes 3c of the ceramic substrate 3 are connected using the internal electrode frame 5. Then, the terminal 7 is heated to the same temperature as the electrode 3c using the cream solder 9, and the terminal 6 is also fixed to the electrode 3b using the cream solder 9. Thereafter, the sealing resin 10 is injected into the frame 8 to complete the assembly. That is, the internal electrode frame 5 and the terminal 7 are connected by being soldered onto the electrode 3C on the ceramic substrate 3, respectively, as shown in FIG.
The electrodes of the semiconductor element 2 and the terminals 7 will be connected.

[Problem to be solved by the invention]

However, in a semiconductor device assembled by this connection method between the internal electrode frame 5 and the terminal 7,
As shown in FIG. 3, an internal electrode frame 5 is placed on the electrode 3C.
Since the terminal 7 is soldered while being mounted, soldering is likely to cause defects. If a soldering defect occurs, it will cause a characteristic defect (open defect).
A semiconductor device in which the internal electrode frame 5 and the terminal 7 were connected by such a connection method had low reliability.

[Failure to solve the problem]

A method for connecting an external terminal for a semiconductor device according to the present invention includes: drilling a through hole in advance at the end of the internal electrode frame on the external terminal side, and providing the external terminal with an extending portion that covers the upper side of the through hole. After the internal electrode frame is soldered to the electrodes of the substrate, the internal electrode frame is pressed by the extended portion to solder the external terminal.

[Effect]

When the external terminal is soldered by pressing the internal electrode frame with the extension part, solder will be filled in the through hole of the internal electrode frame and between the extension part of the external terminal and the internal electrode frame. The internal electrode frame is firmly soldered by the solder solidified inside.

〔Example〕

Hereinafter, the structure and the like will be explained in detail with reference to the embodiment shown in the drawings.

FIG. 1 is an enlarged side sectional view showing the main parts of a state in which an internal electrode frame and a terminal are connected by the connection method according to the present invention. The same reference numerals are given to the same reference numerals, and detailed explanation thereof will be omitted here. In the figure, reference numeral 11 denotes a through hole, and the through hole 11 is formed at the end of the internal electrode frame 5 on the terminal 7 side at the same time as the internal electrode frame 5 is molded. 12 is a pressing piece for pressing the internal electrode frame 5 from above; this pressing piece 12
are provided by extending the lower end portions 7& of the terminals 7, and are formed to have a length and a width that cover the upper portions of the through holes 11 of the internal electrode frame 5.

In order to connect the internal electrode frame 5 in which the through hole 21 is formed in this manner and the terminal I having the suppressing piece 12, first, a semiconductor element (not shown) is connected to the electrode 3c of the ceramic substrate 3 at the negative end. The internal electrode frame 5 connected to the electrode is connected via cream solder 9. Next, the end portion of the internal electrode frame 5 on the side of the through hole 11 is pressed by the pressing piece 12 to connect the terminal 7 to the electrode 3c via the cream solder 9.

That is, by pressing the internal electrode frame 5 with the suppressing piece 12, the cream solder 9 is filled in the through hole 11 and between the internal electrode frame 5 and the suppressing piece 12, and the internal electrode frame 5 and the terminal 7 are will be soldered to each other.

Therefore, the internal electrode frame 5 is firmly soldered by the cream solder 9 solidified within the through hole 11.

In this embodiment, a flat base AC control element has been described, but the present invention is not limited to this, and the same effect can be obtained even with a power transistor or the like.

〔Effect of the invention〕

As explained above, according to the present invention, a through hole is previously formed at the end of the internal electrode frame on the external terminal side, and an extending portion covering the upper part of the through hole is provided on the external terminal, and the internal electrode frame is After soldering to the electrodes of the board, the extension part presses the internal electrode frame to solder the external terminal. Solder is filled between the extension portion and the internal electrode frame, and the internal electrode frame is firmly soldered by the solder solidified within the through hole. Therefore, soldering is less likely to cause defects, and a highly reliable and high quality semiconductor device can be obtained.

[Brief explanation of the drawing]

FIG. 1 is an enlarged side cross-sectional view showing the main parts of a state in which an internal electrode frame and an external terminal are connected by the connection method according to the present invention, and FIG. 2 is a side sectional view showing an internal electrode frame and an external terminal connected by a conventional connection method. FIG. 3 is a partially enlarged side sectional view of a flat base type AC control element connected to the AC control element. 3. Fist...ceramic substrate, 3C@φ/Φ electrode, 5...
...Internal electrode frame, 7...Terminal, 9...Cream solder, 11...Through hole, 12...Press piece.

Claims (1)

[Claims] In a method for connecting an external terminal for a semiconductor device in which an internal electrode frame and an external terminal, one end of which is connected to a semiconductor element, are soldered to the same electrode on a substrate to connect the two, the external terminal side end of the internal electrode frame is drilling a hole and providing the external terminal with an extension portion that covers the upper part of the through hole;
After soldering the internal electrode frame to the electrodes of the board,
A method for connecting an external terminal for a semiconductor device, characterized in that the external terminal is soldered by pressing the internal electrode frame with the extension part.