JPH01207918A - Leadless component and electrical wiring body - Google Patents

Abstract

PURPOSE:To enable a substrateless desired circuit device to be assembled and to improve packaging density by forming electrode part at projecting and recessed parts of a block member. CONSTITUTION:A pair of a recessed out electrode part 2 and a projecting out electrode part 3 are formed at both side surfaces 11 and 12 in vertical direction of a block member 1. A metal layer 4 is formed on the surface of nearly semi- column recessed part which is extended in the depth direction in this recessed out electrode part 2 and a metal layer 4 is formed on the slightly tip-expanding nearly semi-column surface corresponding to the recessed out electrode 2. Thus, this projected out electrode part 3 can be freely engaged from upper direction for the recessed out electrode part 2 and can be connected so that it cannot be disengaged in horizontal direction if engaged. It allows a substrateless and patternless desired circuit device to be assembled and packaging density to be drastically improved.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to chimbutybe leadless components, particularly leadless circuits that can be assembled into a desired electrical circuit by a fitting operation and that can be made substrateless or patternless. Regarding parts.

[Conventional technology]

BACKGROUND ART Circuits for electronic devices and the like are generally assembled by soldering external electrodes and external leads of electronic components to conductive patterns on a printed circuit board.

Since these conventional methods assume pattern wiring on a printed circuit board, a layout space is required for the circuit configuration. In contrast, a patternless mounting method in which the external electrodes of chip-type electronic components are directly connected to each other by soldering, etc., and a board-less mounting structure in which chip-type components are arranged between lead patterns have been disclosed (Public Utility Model Publication No. 62-3.3351). Publication No.).

As shown in FIG. 3, the patternless mounting method is to print the electronic components 100a, 100b by placing the external electrodes of both chip-type electronic components 100a, 100b facing each other at a position where there is no conductive pattern on the printed wiring board 101. Both electronic components 100 are fixed to a wiring board 101 with an adhesive 102 and immersed in a solder bath.
The opposing external electrodes of electronic components 100a and 100b are directly connected to each other with solder 103, and the external electrodes on opposite sides of electronic components 100a and 100b are connected to conductive patterns 104a and 104b with solder 1.
03.

[Problem to be solved by the invention]

However, although the above mounting method can improve the mounting density to some extent by making it patternless, it is not a so-called board-less circuit device that omits the board itself, and it is necessary to improve the efficiency of the mounting space and reduce costs. There was a problem with reduction.

Furthermore, the structure disclosed in Japanese Utility Model Publication No. 62-33351 without a substrate has problems such as being relatively difficult to assemble.

The present invention has been made in view of the above problems, and its purpose is to enable a board-less and pattern-less wiring circuit device, to facilitate assembly and automation, and to further improve packaging density. It is an object of the present invention to provide a leadless circuit component that can also be used as a leadless circuit component.

[Means to solve the problem]

In order to achieve the above object, the leadless circuit component of the present invention is characterized in that a block member including an electric element is provided with at least one pair of lead-out electrodes having irregular dimensions that can be freely fitted.

For example, a block member is formed with an aspect ratio of 2:1, and electrodes are formed on the side surfaces of the block member.

Electrical elements here include inductors, resistors, capacitors,
It has a broad concept that includes not only various elements such as diodes and transistors, but also complex elements such as simple conductors (terminals) and ICs.

[For production]

When configuring a circuit with a plurality of leadless circuit components of the present invention, the circuit components can be connected to each other by simply fitting the convex lead-out electrode part of another component to be connected into the concave lead-out electrode part. be able to. In particular, if a reliable electromechanical connection method such as soldering is used for the connection parts, the types of electrical elements included in the circuit parts can be selected and the circuit parts can be connected one after another to achieve the desired board-less and pattern-less connection. Able to assemble circuit devices. In addition, by setting the block members with dimensions that do not create gaps between the leadless circuit components that are connected to each other, it is possible to significantly improve the packaging density. Further, since the above-mentioned fitting connection between the concave lead-out electrode part and the convex lead-out electrode part can be easily performed, it is also easy to replace the constants to change, which is useful for automation of assembly.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a perspective view of a leadless circuit component according to an embodiment of the present invention, showing a basic type.

That is, this circuit component consists of a rectangular parallelepiped block member 1 formed by resin-molding a resistive element, and the ratio of the vertical dimension A to the horizontal dimension B of this block member 1 is set to 2:1. As described above, the circuit component of the present invention basically has a block member having an aspect ratio of 2:1.

On both longitudinal sides 11 and 12 of this block member 1,
A pair of concave lead-out electrode portions 2 and convex lead-out electrode portions 3 are formed. This concave lead-out electrode part 2 has a metal layer 4 formed on the surface of a substantially semi-cylindrical concave part extending slightly back, and the convex lead-out electrode part 3 has a slightly tipped shape corresponding to the concave lead-out electrode part 2. A metal layer 4 is formed on the surface of an expanding convex portion having a substantially semi-cylindrical shape. Therefore, this convex lead-out electrode part 3 has a relationship in which it can be freely fitted into the concave lead-out electrode part 2 from above, and when fitted, it can be connected in a lateral direction irremovably. Note that the concave lead-out electrode part 2 and the convex lead-out electrode part 3 are not limited to the above-mentioned shapes, but may have any shape as long as they can be fitted into each other.

Further, it is preferable to print an electric element symbol 5 on the surface of the block member 1 so that the type of electric element inside can be known.

The electric elements included in the block member 1 may be various elements such as inductors, resistors, capacitors, diodes, transistors, etc., as described above, as well as simple conductors (terminals) or composite elements.

FIG. 2 shows an embodiment including a composite element, and the circuit member of this embodiment has a block member 1a with an aspect ratio of 2:
It has a shape in which two basic block members of 1 are arranged in parallel, that is, a square planar shape with an aspect ratio of 2:2, and inside it, a variable capacitance diode, a resistor, a capacitor, and an inductor that make up a tuning circuit are assembled. It is something. Then, the four side surfaces 11a, 12 of the block member 1a
a.

A total of two pairs of concave lead-out electrode portions 2 and convex lead-out electrode portions 3 are formed on the blocks 13a and 14a, and a circuit diagram 6 of a tuning circuit is printed on the surface of the block member 1a to clearly indicate the same.

In the above-mentioned leadless circuit components, circuit components can be connected to each other by simply fitting the convex lead-out electrode part 3 of another component to be connected into the concave lead-out electrode part 2. By selecting the types of electrical elements included in the circuit components and connecting the circuit components one after another, it is possible to assemble a desired circuit device without a board. Moreover, since there is no gap between the circuit components that are connected to each other, it is possible to significantly improve the packaging density, and the above-mentioned fitting connection between the concave lead-out electrode part 2 and the convex lead-out electrode part 3 is possible. Since it is easy to perform, it is easy to automate the assembly.

In addition, if the bonding strength is insufficient only by fitting the concave lead-out electrode 2 and the convex lead-out electrode 3, the fitted portion may be fixed with solder, etc. as necessary to increase the bonding strength and to improve the electrical Preferably, poor connections are prevented.

The size of the leadless circuit component of the present invention is actually about the same size or slightly larger than that of conventional chip-type electronic components, but if necessary, it can be made to the size of a block toy and used as a learning material. It can also be used for electrical circuit assembly experiments, etc.

〔Effect of the invention〕

As is clear from the above description, the leadless circuit component of the present invention allows a desired substrate-less circuit device to be assembled by fitting the concave lead-out electrode and the convex lead-out electrode, and the assembly can also be automated. It is easy to use and has the effect of greatly improving packaging density.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a leadless circuit component according to one embodiment of the present invention, FIG. 2 is a perspective view of a leadless circuit component according to another embodiment of the present invention, and FIG. 3 is a chip-type circuit component according to a conventional method. FIG. 2 is a cross-sectional view of an electronic component in which external electrodes are directly connected to each other by solder or the like and mounted on a printed wiring board. 1.1a...Block member, IL 12. lla, 12a, 13a, 14a
...Side surface, 2...Concave lead-out electrode part, 3...Convex lead-out electrode part.

Claims (7)

[Claims] (1) A leadless component comprising a block member including an electric element and a lead-out electrode portion exposed on the outer surface of this member, the electrode portion being formed in a protrusion and a recess of the block member. (2) A leadless component in which the electric element constituting the circuit is made of a block member molded into a predetermined shape using an insulating resin material, and at least one pair of uneven lead-out electrode portions is formed on the side surface of the block member. (3) The electrical element is a circuit component selected from a conductor, a resistor, a coil, a capacitor, a semiconductor chip, and a composite element, and the uneven electrode portions are formed to have dimensions that allow them to be fitted and detached from each other with other electrode portions. The leadless component according to claim 2, characterized in that: (4) The leadless component according to claim 2, wherein the convex electrode portion is a portion, and the electrode portions are connected by solder. (5) An electrical wiring body in which a predetermined circuit is formed by fitting a plurality of leadless components, each of which has a lead-out electrode portion formed as at least a pair of concave and convex portions on the outer surface of a block member containing an electric element, by fitting the concave and convex portions of the respective concave and convex portions. (6) The electric wiring body according to claim 5, wherein the vertical and horizontal dimension ratios of the block members are made constant, and different block members are fitted into the uneven portions and soldered at the fitting portions to form a predetermined circuit. (7) An electrical wiring body that constitutes a predetermined circuit consisting of a plurality of block members each composed of different electric elements, each block member being provided with at least a pair of uneven lead-out terminals, and between the different block members. An electrical wiring body characterized in that a self-supporting circuit is constructed by electrically and mechanically connecting uneven lead-out terminals.