JPH02182003A - Chip shaped inductor - Google Patents

Abstract

PURPOSE:To attain the automation of mounting components onto a board and to prevent the reduction in the selectivity Q of a high frequency module by forming respective electrodes for a circuit forming side and a ground side to a lower face of an inductor main body. CONSTITUTION:A dielectric resonator 8 being a chip shaped inductor consists of a dielectric substance 10 being an inductor main body whose semi-circular recessed parts 9a, 9b are provided to both side faces with respect to planes penetrated vertically, a conductor 11 formed to the entire upper face of the dielectric substance 10, conductors 12a, 12b formed separately so as to be placed respectively to both side ends and the middle of the lower face of the dielectric substance 10, a conductor 13, and conductors 14a, 14b formed to the recessed parts 9a, 9b of the dielectric substance 10 so as to make electric continuity between the upper face conductor 11 and the lower face conductors 12a, 12b. Through the constitution above, the conductors 11, 12a, 12b and 14a, 14b are electrodes of one side (circuit forming side) of the dielectric resonator 8 and the conductor 13 is an electrode for other side (ground side).

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip-type inductor such as a dielectric resonator used in a high-frequency module such as a car phone.
In particular, it relates to a structure that is effective when mounted on a board.

[Prior Art] FIG. 3 is a perspective view showing a state in which a conventional chip-type inductor is mounted on a substrate.

In the figure, l is a dielectric resonator as a chip-type inductor, and this dielectric resonator 1 includes a dielectric body 2 as an inductor body having a rectangular cross-sectional shape, for example, and an internal electrode provided inside the dielectric body 2. 3 and an external electrode 4 provided so as to cover all four sides of the dielectric 2 except for both sides, and the internal electrode 3 and the external electrode 4 are connected to each other by a short circuit (not shown) on the other side of the dielectric 2. connected by electrodes.

5 is a lead terminal bent into a predetermined shape, 6 is a substrate, and 7 is a connection pattern formed on the circuit forming side of the substrate 6.

When mounting the dielectric resonator 1 on the substrate 6 in this configuration, first connect one end of the lead terminal 5 to the end of the internal electrode 3 located on one side of the dielectric 2, and then connect the other end of the lead terminal 5 to the end of the internal electrode 3 located on one side of the dielectric 2. is soldered onto the connection pattern 7, and the board 6 is soldered onto the connection pattern 7.
The external electrode 4 is connected to a ground side connection pattern (not shown) formed above.

Thereby, the dielectric resonator 1 is mounted on the substrate 6, and constitutes a high frequency module together with other circuit elements (not shown).

Furthermore, apart from this, there is a technique disclosed in Japanese Utility Model Application Publication No. 60-25218 as a method of mounting the dielectric resonator 1 on the substrate 6.

In this technique, the lead terminals 5 of the dielectric resonator 1 are directly connected to elements such as capacitors and coils mounted on the substrate 6, and the connection pattern 7 is omitted, simplifying the effort at the time of mounting.

[Problem to be solved by the invention]

However, in the conventional techniques described above, when mounting a dielectric resonator on a substrate, one end of the lead terminal 5 is connected to the end of the internal electrode 3 located on one side of the dielectric resonator. Since the other end of the lead terminal must be reliably soldered to the connection pattern or other circuit elements, it is difficult to automate the mounting process and must be done manually, resulting in the problem of poor mounting efficiency. be.

Furthermore, as is clear from the above explanation, since the dielectric resonator is connected to the connection pattern and other circuit elements through lead terminals, there is also the problem that the selectivity Q of the high frequency module is reduced. .

The present invention was made to solve these problems, and aims to realize a chip-type inductor that can automate mounting on a board and prevent a decrease in selectivity Q of a high-frequency module. It is something to do.

[Means to solve the problem]

In order to achieve the above-mentioned object, a chip-type inductor of the present invention includes an inductor main body having vertically penetrating recesses on both sides thereof, a conductor formed on the upper surface of the inductor main body, and a lower surface of the inductor main body. electrically connecting at least two conductors formed on the top surface of the inductor body and one of the at least two conductors formed on the bottom surface of the inductor body; The inductor body has a conductor formed in the recess, and the conductors on the upper and lower surfaces of the inductor body connected by the conductor formed in the recess are used as electrodes on the circuit forming side, and the other conductor formed in the lower surface of the inductor body The conductor is used as the earth-side electrode.

(Function) The chip-type inductor of the present invention having the above-mentioned configuration has the following features:
Since electrodes for the circuit formation side and the ground side are formed on the bottom surface of the inductor body, these electrodes can be directly connected to connection patterns or circuit elements formed or mounted on the board by soldering, etc. This allows it to be mounted on a substrate to configure a high frequency module.

Therefore, according to this, it is possible to use a device such as a chip mounter when mounting on the board, and the mounting process can be automated, so the efficiency of the mounting work can be improved, and the connection with the dielectric resonator is possible. It is possible to prevent the selectivity Q of the high frequency module from decreasing due to direct connection with patterns or other circuit elements.

〔Example〕

Examples will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of a chip-type inductor according to the present invention, and is shown upside down here.

In the figure, reference numeral 8 denotes a dielectric resonator as a chip-type inductor, and this dielectric resonator 8 has a dielectric body 10 as an inductor body provided on both sides with concave portions 9a and 9b having a semicircular planar shape penetrating in the vertical direction. A conductor 11 formed on the entire upper surface of the dielectric 10, conductors 12a and 12b formed in sections at both ends and the center of the lower surface of the dielectric 10, recesses 9a, 9b of the dielectric 10 so as to electrically connect the body 13, the conductor 11 on the upper surface, and the conductors 12a, 12b on the lower surface;
It is composed of conductors 14a and 14b formed in the same manner.

Here, a method for manufacturing the dielectric resonator 8 of this example will be explained.

First, a plurality of dielectric bodies 10 are integrally formed from one dielectric plate material, and holes are made in the thickness direction at positions on the side surfaces of each dielectric body 10. These holes become recesses 9a and 9b when the dielectric plate material is later cut into individual dielectrics 10.

A conductive material such as Ag-Pd alloy is printed in the form of a film on one side, for example, the top surface, of a dielectric plate material provided with holes in this way.
This conductor material then penetrates into the hole, so that about half of the hole is also covered by the membrane.

Thereafter, the same conductive material as described above is printed in a film form on the lower surface of the dielectric plate. At this time, the conductive material also enters the hole, and the remaining half of the hole is also covered with the film of the conductive material.

After printing the film of conductive material in this way, the film on the lower surface of the conductive material can be divided, thereby obtaining conductors 11.12a, 12b, 1314a and 14b each consisting of a film of conductive material. Thereafter, the illustrated dielectric resonator 8 is obtained by cutting the dielectric plate material into predetermined dimensions.

In this configuration, the conductors 11, 12a, 12b and 14a, 14b serve as electrodes on one side (circuit forming side) of the dielectric resonator 8, and the conductor 13 serves as an electrode on the other side (on the ground side).

Next, the operation of the above-described configuration will be explained using FIG. 2.

FIG. 2 is a perspective view showing the state in which the chip type inductor shown in FIG. 1 is mounted on a substrate.
, 16b is a connection pattern on the circuit forming side, 17 is a connection pattern on the ground side, and each connection pattern 16a, 16b
, 17 are formed at corresponding positions to be attached to the conductors 12a, 12b, and 13 forming each electrode when the dielectric resonator 8 is mounted on the substrate 15.

For mounting, first, a dispenser supplies an appropriate amount of conductive adhesive material such as cream solder to the upper surface of each connection pattern 16a, 16b, and 17, and then a chip mounter applies the dielectric resonator 8 to the conductors 12a, 12b, and 13.
are automatically mounted so that they are positioned on each of the connection patterns 16a, 16b, and 17.

Thereafter, the conductive adhesive material is thermally melted to connect the conductors 12a, 12b, 13 of the dielectric resonator 8 to the connection patterns 16a, 16b, 17, thereby connecting the dielectric resonator 8 to the substrate 15. It is mounted on top to form a high-frequency module together with other circuit elements.

In the embodiment described above, conductors 12a and 12b were provided at two locations as electrodes on the circuit forming side, and these conductors 12a and 12b were connected to connection patterns 16a and 16b on the substrate 15, respectively. However, depending on the circuit configuration, only one of them may be formed and connected.

Furthermore, the dielectric resonator 8 described above can be connected not only to the connection patterns 16a and 16b on the substrate 15, but also directly to elements such as capacitors and coils mounted on the substrate.

[Effects of the Invention] As explained above, the present invention has an inductor body that is divided into an inductor body having vertically penetrating recesses on both sides, a conductor formed on the upper surface of the inductor body, and a lower surface of the inductor body. at least two conductors formed by
a conductor formed in the recess so as to electrically connect a conductor formed on the upper surface of the inductor body and one of at least two conductors formed separately on the lower surface; The conductors on the upper and lower surfaces of the inductor body connected by the conductors formed on the inductor body are used as electrodes on the circuit formation side, and the other conductor formed on the lower surface of the inductor body is used as the earth side electrode, and this picture electrode is connected to the substrate. It is possible to connect directly onto the connection pattern or circuit element formed or mounted thereon.

Therefore, according to this, it is possible to use equipment such as a chip mounter when mounting on the board, and the mounting process can be automated, so the efficiency of the mounting work can be improved, and the dielectric resonator and other devices can be used. The effect is that the connection pattern and other circuit elements can be directly connected, and the selectivity Q of the high frequency module can be prevented from decreasing.

Furthermore, since the electrodes of the chip-type inductor according to the present invention have recesses that penetrate vertically on both sides of the inductor body, they can be formed by simply printing conductive material on both the top and bottom surfaces of the inductor body. This also provides the advantage of easy manufacturing.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the chip inductor according to the present invention, FIG. 2 is a perspective view showing the chip inductor shown in FIG. 1 mounted on a substrate, and FIG. FIG. 3 is a perspective view showing a state where it is mounted on a board. 9a, 9b: recess 10: dielectric 11, 12a, 12b, 13.14a, 14b
: Conductor 15 : Substrate 16 a , 16 b , 17 : Connection pattern patent applicant Oki Electric Industry Co., Ltd.

Claims (1)

[Claims] (1) An inductor body having vertically penetrating recesses on both sides, a conductor formed on the top surface of the inductor body, and at least two conductors formed separately on the bottom surface of the inductor body. and a conductor formed in the recess so as to electrically connect the conductor formed on the upper surface of the inductor body and one of at least two conductors formed separately on the lower surface, The conductors on the upper and lower surfaces of the inductor body connected by the conductor formed in the recess are used as electrodes on the circuit forming side, and the other conductor formed on the lower surface of the inductor body is used as the electrode on the ground side. Chip type inductor.