JPH01209800A - Method for automatically inserting electronic component - Google Patents

Abstract

PURPOSE:To prevent an improper insertion by disposing a mounting substrate and a dual-in-line package type electronic component above and below, aligning the pin of the component with a pin hole formed in the DIP insertion face of the substrate, raising the component, and inserting it in the hole. CONSTITUTION:A mounting substrate 1 is faced above DIPs 5, 5' held at a jig 2 with the DIP inserting face 1a downward. Then, the DIP 5 to be inserted is lifted by a movable piece 4, and disposed near the DIP inserting face 1a of the substrate 1. Thereafter, it is inserted to the pin hole 1b of the substrate 1 by an optical aligning system 7, and the substrate 1 is relatively displaced while a light is being radiated to the pin 5a of the DIP 5, thereby aligning the pin hole 1b of the substrate 1 to the pin 5a. After the substrate 1 is accurately aligned, the piece 4 is further lifted, and the pin 5a is inserted from below into the hole 1b of the substrate 1. Then, the DIP 5' is similarly inserted. Then, after the insertion is repeated, the positional relationship between the jig 2 and the substrate 2 is inverted upside down, thereby obtaining a normal inserting state.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for automatically inserting electronic components, and more particularly to a method for automatically inserting large dual in-line packaged electronic components onto a mounting board.

[Prior art] Conventionally, this type of automatic insertion method fixes the mounting board, grabs or suctions the dual in-line package type electronic component (hereinafter referred to as DIP) with a robot hand, etc., moves it above the board, and aligns it. The most common method was to insert it after

[Problems to be Solved by the Invention] The conventional automatic insertion method described above has a DIP with 20 pins.
It is effective when the pin size and pin pitch is 100 mm, but recent DIPs tend to increase the number of pins (40 to 64 pins) and reduce the pin pitch (70 to 50 m), especially in semiconductor components. In addition, due to improvements in board manufacturing technology, board wiring patterns have become denser.
The gap between the DIPs has tended to become smaller, causing problems. In other words, if you grab the DIP from both sides, the DI
In addition, the method of suctioning DIPs cannot cope with the increase in weight of multi-pin DIPs, and in both methods, the driving accuracy of the robot hand cannot cope with the large number of pins. Increasingly, insertion failures occur frequently despite careful correction.

An object of the present invention is to provide a method for automatically inserting electronic components that solves the above-mentioned problems.

[Differences between the invention and the prior art] Compared to the conventional automatic insertion method described above, the present invention has a difference in that the DIP is inserted from the bottom of the board.

[Means for Solving the Problems] ■In order to achieve the second objective, in the automatic electronic component insertion method of the present invention, a mounting board and a dual in-line package type electronic component are arranged one above the other, and the mounting board in the upper stage is D
Support the bottom surface of the electronic component with the IP insertion surface facing downward and the pins of the lower electronic component facing upward, aligning the pins of the electronic component with the pin holes provided in the DIP insertion surface of the mounting board, After that, the electronic component is raised and its pins are inserted into the pin holes of the mounting board from below.

[Example] Next, the present invention will be explained with reference to the drawings.

(Example 1) FIG. 1 is a longitudinal sectional view illustrating a first embodiment of the present invention.

The mounting board 1 is installed with the surface 1a into which the DIP is inserted facing downward. The DIP 5.5' to be inserted is arranged at a lower position of the mounting board 1 corresponding to the insertion position of the mounting board, and the pins 5a,
a bottom surface 5b of the DIP 5.5' with 5a' facing upward;
5b' is supported by jig 2 and held in place. At this time, the arrangement of DIP5.5' does not require precision when inserting the pins, and can be achieved by the conventional robot hand method or simply by the shoot method. As shown in the figure, the structure of the jig 2 is, for example, composed of an arrangement hole 3 and a movable piece 4 that moves up and down in the arrangement hole 3, and the depth of the arrangement hole 3 is the height of DIP 5.5'. (including pins 5a and 5a'), it will not affect the arrangement of the adjacent DIP 5.5'.

The insertion procedure is as follows.

First, the mounting board 1 is faced above the DIP 5.5' held by the jig 2 with the DIP insertion surface 1a facing downward.

Next, the DIP 5 to be inserted is pushed up by the movable piece 4 and positioned near the DIP insertion surface 1a of the mounting board 1. After that, D
The mounting board 1 is relatively displaced while the pins 5a of the IP5 are irradiated with light, and the pin holes 1b of the mounting board 1 are aligned with the pins 5a of the DIP5. After accurately aligning the mounting board 1, push up the movable piece 4 further and press the pin 5 of the electronic component 5.
a into the pin hole 1b of the mounting board 1 from below. Then DIP5' is inserted in the same manner. After repeating the following insertions, jig 2. The positional relationship of the mounting board 1 is reversed vertically to obtain a normal insertion state.

For accurate positioning of the mounting board 1, use the pin hole 1b of the mounting board 1.
Optical position determination can be easily carried out through the mounting board 1, and minute movements of the large mounting board 1 can be easily realized because a normal servo motor system is sufficient. According to this superposition method, terminal correction can be made less strict than in the conventional case of automatic insertion based only on physical position, even in the case of a DIP with a large number of pins.

(Example 2) FIG. 2 is a longitudinal sectional view of Example 2 of the present invention.

In this embodiment, the alignment jig 6 is used instead of optical alignment.
is used. - Although there is no film property, in the design of the normal mounting board 1, priority is given to the arrangement of DIPs, so it is possible to use the jig 6 of this method, and the alignment time can be shortened.

The jig 6 is tapered, and after aligning and fixing the jig 6 to the mounting board 1, if it is stacked on the DIP arrangement jig 2, the tapered surface 6a of the jig 6 will align with the guide when inserting the DIP. play a role.

After the insertion is completed, by removing the jig 6, the same insertion state as in the first embodiment can be obtained.

[Effects of the Invention] As described above, the present invention has the effect of being able to solve various problems in holding and aligning the DIP by inserting the DIP from below the substrate.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view illustrating a first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view illustrating a second embodiment.

Claims (1)

[Claims] 1. In a method of mounting a dual in-line package type electronic component on a mounting board, the mounting board and the dual in-line package type electronic component are arranged one above the other, the DIP insertion surface of the upper mounting board faces downward, and the electronic component in the lower stage is Support the bottom of the electronic component with the pins facing upward, align the pins of the electronic component with the pin holes provided in the DIP insertion surface of the mounting board, then raise the electronic component and insert the pins into the mounting board from below. An automatic method for inserting an electronic component into a pin hole.