JPH01215532A - Thermal processing device - Google Patents

Abstract

PURPOSE:To obtain a device easy to handle, by constituting the title device so that water from a source of water supply is discharged through a plurality of holes on the circumference of the tip of a guide pipe and after the same is turned into vapor by heating the sane with a primary heater while the same is flowing through within a porous member by dispersing the same, the same is turned into the vapor of a fixed temperature by heating further with a secondary heater fitted to a heater bobbin and discharged through a nozzle. CONSTITUTION:A fluid such as water supplied to a guide pipe 8 is discharged to the tip part of a hole 73 through a capillary tube 75 of the tip of the guide pipe 8 and flows through the inside of a porous member 74 toward a pressure equalization chamber 78 by dispersing evenly. As the porous member 74 is heated by a heater 72 along with a heater bobbin 70, the fluid flowing through the porous member 74 is turned into vapor and led to the pressure equalization chamber 78. Then after equalization of the pressure, the vapor led to through holes 71 each is reheated up to a fixed temperature with the heater 72 and then discharged through a nozzle port 7 of a nozzle chip 6. The fluid can be turned into the vapor of the fixed temperature with only the heater 72. As the vapor is made a heating medium, handling of the tille device can be made easy.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a thermal processing device, particularly for soldering.

The present invention relates to a thermal processing device that performs thermal processing such as welding, adhesion, baking, and melting using high-temperature steam.

[Prior Art] Conventionally, tools used for thermal processing such as soldering electronic parts, welding or melting plastic materials, drying articles, or heat shrinking tubes have been made using air heaters that are introduced into equipment by fans. A thermal processing apparatus is generally known that has a structure in which heat is heated by a temperature of 100 nm and then the material is discharged from a nozzle.

[Problem to be solved by the invention] By the way, recent electronic components have been made into microchips, and the method of mounting them on circuit boards has changed from inserting electronic component bottles into through holes and soldering them to circuit boards. Surface mounting, in which electronic components are soldered with electronic components placed on top, is moving toward the surface mounting method.

When surface-mounting such electronic components using the conventional thermal processing equipment described above, the conventional equipment uses high-temperature air, so its heat capacity is small, and it takes time to raise the temperature of the target object, resulting in poor workability. The problem is that it's bad. For this reason, the amount of high-temperature air discharged from the nozzle has to be increased, but if the amount of discharged air is increased, the electronic components may move due to the pressure, or the cream solder used may flow due to the discharged air pressure.
Not only is it impossible to solder electronic components, but there is a risk that the soldering may solidify in unnecessary locations and short-circuit the circuit.

Therefore, some attempts have been made to use inert gases such as nitrogen gas and carbon gas instead of air, but the gases used are not easy to handle and have safety issues.
Not practical.

The present invention has been developed in view of the current situation, and is easy to handle and can obtain a large amount of heat energy with a small flow rate. Even when surface-mounted electronic components are soldered, the electronic components do not move or cream. A first object of the present invention is to provide a thermal processing device in which there is no risk of solder flowing.

A second object of the present invention is to provide a thermal processing device that can shorten the axial length of the device or make it thinner.

A third object of the present invention is to provide a thermal processing apparatus that can effectively utilize the heat of a heater bobbin to obtain steam at a predetermined temperature using only a primary heater.

[Means for Solving Problem R] As a means for achieving the first object, the present invention includes a guide pipe that discharges water supplied from a water source from a plurality of holes provided on the circumferential surface of the tip. A porous member that is attached to the outer periphery of the tip of the guide pipe and allows the water discharged from each hole to seep out almost uniformly; A primary heater that is attached to the heater bobbin and further heats the water vapor from the primary heater to a predetermined temperature, and a nozzle that discharges the water vapor heated by the secondary heater. Features.

Further, the present invention provides, as a means for achieving the second object,
The heater bobbin is attached to the outer periphery of the porous member, and a secondary heater is wound around the outer periphery of the heater bobbin, or the heater bobbin with the secondary heater wound around the outer periphery is connected to the porous member and the nozzle. It is characterized by being placed between.

Further, the present invention provides, as a means for achieving the third object,
A heater bobbin in which heaters are respectively inserted into a plurality of through holes penetrating the heater bobbin in the axial direction; : a porous member disposed in the hole, which allows water discharged from the guide pipe to seep out almost uniformly from the axial base end of the hole to turn it into water vapor; and : provided on the axial base end side of the heater bobbin; A pressure equalizing chamber that equalizes the pressure of water vapor from the porous member and guides it to each through hole of the heater bobbin; and a pressure equalizing chamber that is arranged at the tip end side in the axial direction of the heater bobbin and is heated to a predetermined temperature while passing through each through hole. A heat processing device equipped with a nozzle that discharges water vapor is used, or a heater bobbin in which a heater is inserted into each of a plurality of through holes penetrating in the axial direction is used. Water supplied ・
a guide pipe that is heated by the heat of the heater bobbin to turn it into steam; and a pressure equalization chamber that is provided on the base end side in the axial direction of the heater bobbin and equalizes the pressure of the steam discharged from the guide pipe and guides it to each through hole of the heater bobbin. The heat processing device is characterized by using a thermal processing device equipped with: a nozzle disposed on the axial end side of the heater bobbin and discharging steam heated to a predetermined temperature while passing through each through hole. do.

[Function] In the thermal processing apparatus according to the present invention, water from the water source is
The water is discharged from a plurality of holes provided on the circumferential surface of the tip of the guide pipe, and is heated by the primary heater and becomes water vapor while flowing uniformly through the porous member. This water vapor is
It is further heated by a secondary heater attached to the heater bobbin, and becomes water vapor at a predetermined temperature. This water vapor is then discharged from the nozzle. That is, water vapor is used as a heat medium. Therefore, it is easy to handle, and a large amount of heat energy can be obtained with a small flow rate.

At this time, a heater bobbin is attached to the outer circumference of the porous member, a secondary heater is wound around the outer circumferential surface of the heater bobbin, and water vapor from the primary heater is discharged to the proximal end side of the porous member in the axial direction. By flowing the outer circumferential portion of the heater bobbin toward the tip end in the axial direction and guiding it to the nozzle, it is possible to shorten the axial length of the device.

In addition, the secondary heater is wound around the outer circumferential surface of the heater bobbin, and the heater bobbin is placed between the porous member and the nozzle, so that the water vapor from the primary heater is guided to the nozzle by flowing around the outer circumference of the heater bobbin. By making
It becomes possible to make the device thinner.

Further, in another thermal processing apparatus according to the present invention, the heaters are inserted into the plurality of through holes that axially penetrate the heater bobbin, and a steam chamber is provided on the base end side of the heater bobbin in the axial direction, Water from the water source is heated in a hole provided at the base end axis of the heater bobbin or in a guide pipe wound around the outer surface of the heater bobbin, and becomes water vapor. This water vapor is sent to a pressure equalization chamber, where the pressure is equalized, and then guided to each through hole of the heater bobbin. The water vapor is further heated by a heater in the through hole to become water vapor at a predetermined temperature, and is discharged from the nozzle. That is, by effectively utilizing the heat of the heater bobbin, water vapor at a predetermined temperature can be obtained using only the primary heater. Therefore, the structure can be simplified.

[Example] Hereinafter, the present invention will be explained with reference to the drawings.

1 and 2 show a thermal processing apparatus according to a first embodiment of the present invention. This thermal processing apparatus l is equipped with a portable handle body 2, and the tip of the handle body 2 is Through a heat insulating casing 3 having a cooling opening 4,
A cylindrical heater casing 5 with a closed proximal end is attached, and a nozzle tip 5 having a nozzle lower for discharging fluid such as water vapor is detachably attached to the tip of the heater casing 5.

As shown in FIG. 1, a guide pipe 8 made of stainless steel, for example, is attached to the heater casing 5 and passes through the center of the base end of the heater casing 5. 8 to 12 small holes 9 with a diameter of about 0.3 to 0.5 nm are provided, and the outer periphery of the tip of the guide pipe 8 has a porosity of about 5 to 15% and an average pore diameter of 5 to 10 μm. A cylindrical primary heater bobbin IO made of porous ceramic is attached. and,
As shown in FIG. 1, a primary heater 11 made of nichrome wire, platinum rhodium wire, etc. is wound around the outer periphery of the primary heater bobbin IO. The other end of the primary heater 11 is connected to a primary heater terminal 14 passing through the base end of the heater casing 5 via an insulator 13.

The base end of the primary heater bobbin 10 is fixed to the guide pipe 8 with a ceramic adhesive 15, as shown in FIG. It is fixed to the tip of the guide pipe 8 together with the secondary heater bobbin 17 .

The guide pipe 8 is then bonded with this ceramic adhesive 16.
The tip is closed.

As shown in FIG. 1, the secondary heater bobbin 17 is formed into a cylindrical shape with a closed end using porous ceramics. It is mounted with a predetermined gap G formed between it and the outer circumferential surface of. As shown in FIG.
is wound around the secondary heater 18, and one end of the secondary heater 18 is connected to the heater casing 5 via a ground point 19.
The other end of the secondary heater 18 is connected to a secondary heater terminal 21 passing through the base end of the heater casing 5 via an insulator 20.

A common ground terminal 23 is connected to the base end of the heater casing 5 via a conductive rivet 22 as shown in FIG. It is pulled out from the base end of the handle main body 2 while being disposed in the cable collecting tube 24 together with the heater terminal 14.21. A heat-resistant rubber tube 25 is also drawn out from the base end of the handle body 2, as shown in FIG. 2, and is connected to the guide pipe 8. a fluid source F,
, Ft or F3.

That is, the fluid source F includes a water tank 27 storing water 26' as shown in FIG. Water pressure control unit 3 connected to the outlet side
0, a return pipe 31 that returns overflow water from the water pressure control unit 30 to the water tank 27, and a water supply pipe 32 that supplies water at a constant pressure. 3
2 is maintained at a constant pressure regardless of its flow rate, and the excess water that is not being supplied is returned to the return pipe 31.
The water is returned to the water tank 27 via the water tank 27.

Further, the fluid source Ft is a pressure-resistant water tank 3 as shown in FIG.
3 and the water 26 in this pressure-resistant water tank 33 at 2 to 4 kg/
cm” and a hand-operated air pump 34 and a pressure gauge 3.
5 and a water supply pipe 37 connected to the bottom of the pressure-resistant water tank 33 via a needle valve 36.

Further, the fluid source F3 includes a gas tank 38 for air or nitrogen gas, an on-off valve 39, a pressure control valve 40, a pressure gauge 41, and a gas supply pipe 42.
The gas in the gas tank 38 is transferred to the pressure control valve 4
The pressure is regulated at 0 and the gas is sent out through the gas supply pipe 42.

Water supply pipes 32 for each of these fluid sources F+, F2, F-
．． 37 or the gas supply pipe 42, as shown in FIG. The end is connected to the heat-resistant rubber tube 25 via an electromagnetic on-off valve 45. The electromagnetic on-off valve 45 is connected to a power supply circuit 48 having a fuse 46 and a power switch 47 as shown in FIG.
and a power supply line 51 having a hand switch 50, and are controlled to open by operating one of the switches 49 and 50.

On the other hand, each of the terminals 14, 21, 23 is connected to the power supply circuit 48 via a primary heater voltage controller 52 or a secondary heater voltage controller 53, as shown in FIG. .53 is provided with control knobs 52a and 53a, respectively.

Further, the power supply circuit 48 is provided with a pilot lamp 54 that lights up when the thermal processing apparatus 1 is operated.

Next, the operation of this embodiment will be explained.

In use, C connects the connecting pipe 44 to a predetermined fluid source F1. Ft
, Fs and turn on the power switch 47.
L, supplies power to each heater 11, 18. As a result, each heater bobbin 10.17 is heated.

In this state, the foot switch 49 or the hand switch 5
0 is ONL, 'ai magnetic on-off on-off valve 45 is controlled. Then, the water 26 or the gas in the gas tank 38 whose flow rate is adjusted by the flow rate control valve 43 is guided to the guide pipe 8 via the heat-resistant rubber tube 25.
It is discharged from each small hole 9 at the tip. Thereafter, the liquid leaches out inside the primary heater bobbin IO almost uniformly toward the outer surface, and during that time, it is heated by the primary heater 11 and becomes a heated gas such as water vapor.

Note that the small hole 9 is not provided in the entire area of the guide pipe 8 where the primary heater bobbin 10 is attached, but is provided in a limited area on the tip side. , this is due to the following reasons.

That is, if the small hole 9 is provided in the entire area of the primary heater bobbin 10 attachment part of the guide pipe 8, the temperature of the entire area of the primary heater 11 will be lowered, but the small hole 9 is provided only in the tip part of the guide pipe 8. Then, a temperature gradient occurs in the primary heater 11, and the temperature at the distal end of the primary heater 11 decreases, but the temperature at the proximal end remains high. The high-temperature gas generated by passing through the primary heater bobbin 10 flows through the gap G toward the proximal end as described later, so if the high-temperature gas is water vapor, the water vapor is reheated during that time. Completely dry dry steam can be obtained, and when the high-temperature gas is a gas other than water vapor, the temperature of the gas can be efficiently heated.

Since the secondary heater bobbin 17 is made of porous ceramic, the high-temperature gas generated by passing through the primary heater bobbin 10 flows through the gap G between the two heater bobbins 10.17 toward the proximal end, and further It flows along the outer periphery of the secondary heater bobbin 17 toward the tip side. During this time, it is heated again by the secondary heater 18 to a high temperature (5
00 to 1000°C), and is then discharged from the nozzle lower of the nozzle chip 6.

Thus, the fluid exuding in a substantially uniformly dispersed state within the primary heater bobbin 10 is first heated by the primary heater 11 to become heated gas, and this heated gas is heated again by the secondary heater 18. So the fluid is air,
Not only in the case of gases such as nitrogen gas, but also in the case of water,
It is possible to efficiently heat the water vapor to a predetermined temperature. When water vapor is used as a heat medium, the specific heat of water vapor is about twice that of air, so it can carry more thermal energy than air. Therefore, a large amount of heat energy can be obtained with a small flow rate, and even when surface-mounted electronic components are soldered, there is no risk that the electronic components will move or cream solder will flow. Furthermore, unlike air, water vapor does not have an oxidizing effect, so it has the advantage of being difficult to form an oxide film on the solder surface, and since water vapor has a cleaning effect, it also has the advantage of being able to remove dirt from the surface of the workpiece.

Note that the primary heater bobbin 10 is made of mullite.

Although cordierite-based ceramics are used as raw materials, according to the inventors' extensive experience, silicon carbide-based ceramics have good heat resistance and thermal shock resistance, and good results have been obtained.

Further, when water vapor is used as a heat medium, it is preferable to use ultrapure water using a reverse osmosis membrane or the like or distilled water from the viewpoint of the life of the apparatus and prevention of contamination of the workpiece.

FIG. 4 shows a second embodiment of the present invention.
In place of the secondary heater bobbin 17 and secondary heater 18 in the embodiment, a secondary heater bobbin 60 and a secondary heater 6 are used.
1 is provided.

That is, as shown in FIG. 4, the secondary heater bobbin 60 has a solid rod shape with large diameter portions 61 at both axial ends, and a secondary heater 62 is provided on the outer peripheral surface of the secondary heater bobbin 60. is wound around each large diameter portion 61, and each large diameter portion 61 has four windings.
Ventilation portions 63 each consisting of ~8 small holes are formed. This secondary heater bobbin 60 is arranged within the nozzle chip 6 as shown in FIG.

In addition, in this embodiment, the heat insulating casing 3 completely envelops the heater casing 5, and further covers the nozzle tip 6.
The common ground terminal 23 has a conductive rivet 22 attached to the base end of the heat insulating casing 3.
connected via. Furthermore, due to the difference in the flow direction of the heating gas, the small hole 9 at the tip of the guide pipe 8 is limited to the proximal side of the portion where the primary heater bobbin 17 is attached, rather than the distal side, unlike in the first embodiment. It is set in. In other respects, the configuration is basically the same as that of the first embodiment.

Next, the operation of this embodiment will be explained.

The fluid such as water supplied to the guide pipe 8 is
It is discharged from each small hole 9 at the tip, is distributed almost uniformly toward the outer surface, and passes through the primary heater bobbin 10. During that time, it is heated and becomes heated gas such as water vapor.

This heated gas passes between the primary heater bobbin lO and the heater casing 5 and flows to the tip side, during which time it is heated again at the high temperature part on the tip side of the primary heater 11, and in the case of water vapor, it is dried without moisture. It becomes steam.

This gas is further guided into the nozzle tip 6, where it is reheated to a predetermined temperature by a secondary heater 62. After that, it is discharged from the nozzle lower.

Therefore, the secondary heater bobbin 60 and the secondary heater 62
By incorporating into the nozzle chip 6, the thermal processing device l
The tip can be made thinner, making it suitable for working between narrow spaces.

FIGS. 5 to 7 show a third embodiment of the present invention. Unlike the second embodiment, high-temperature gas at a predetermined temperature can be obtained only by the primary heater.

That is, the heater casing 5 in this embodiment has a cylindrical shape as shown in FIG. A ceramic heater bobbin 70 is disposed.

As shown in FIG. 6, this heater bobbin 70 is provided with, for example, six through holes 71 at equal intervals in the circumferential direction.
One heater 72 is continuously and loosely fitted into these through holes 71 . Further, a hole 73 having a depth approximately equal to the length of the heater bobbin 70 is provided at the base end axis of the heater bobbin 70, as shown in FIG.
3 ↓ This is, for example, 100 to 150 as shown in Figure 7.
A porous member 74 with a high porosity formed by sintering and molding μm mullite beads is disposed, and this porous member 7
4, as shown in Fig. 5, up to a position near its tip.
A guide pipe 8 having a capillary tube 75 having an inner diameter of approximately 0.1 to 0.3 mm at its tip is inserted.

As shown in FIG. 5, a stopper 77 made of, for example, nonporous ceramics is fixed to the inside of the base end of the heater casing 5, and supports the conductor 76 and the guide pipe 8 drawn out from the heater 72 in an insulated state. A pressure equalizing chamber 78 is formed between this stopper 77 and the heater bobbin 70.

As shown in FIG. 5, an inner heat insulating casing 79 is attached to the outer periphery of the base end of the heater casing 5.
An outer heat insulating casing 8 having an opening on its outer periphery
0 is attached via a holding member 81. In other respects, the configuration is basically the same as that of the first embodiment.

Next, the operation of this embodiment will be explained.

The fluid such as water supplied to the guide pipe 8 is discharged from the capillary tube 75 at the tip of the guide pipe 8 to the tip of the hole 73, and thereafter is almost uniformly dispersed and flows inside the porous member 74 toward the pressure equalization chamber 78. . Since the porous member 74 and the heater bobbin 70 are heated to about 800° C. by the heater 72, the fluid flowing through the porous member 74 instantaneously turns into heated gas such as water vapor and is guided to the pressure equalization chamber 78. After the pressure is equalized within this pressure equalization chamber 78, it is introduced into each through hole 71.

The heated gas guided to each through hole 71 is reheated to a predetermined temperature by a heater 72 while passing through the through hole 71,
After that, it is discharged from the nozzle lower of the nozzle chip 6.

By effectively utilizing the heat of the heater bobbin 70, the fluid can be turned into a high-temperature gas at a predetermined temperature using only the primary heater (ie, the heater 72).

FIG. 8 shows a fourth embodiment of the present invention.
In place of the hole 73 and porous member 74 in the embodiment, a spiral tube 90 and a porous member 91 are provided.

That is, a spiral tube 90 is formed at the tip of the guide pipe 8 as shown in FIG. 8, and this spiral tube 90 is wound around the outer circumference of the heater bobbin 70 as shown in FIG. The tip is inserted into a porous member 91 arranged at the end of the pressure equalization chamber 78 on the stopper 77 side. The fluid such as water supplied to the guide pipe 8 becomes heated gas such as water vapor by the heat of the heater bobbin 70 while passing through the spiral tube 90, and then passes through the porous member 9I and enters the pressure equalization chamber 78. The pressure is equalized here. In other respects, the configuration is basically the same as that of the third embodiment.

Even with this configuration, the fluid can be turned into a high-temperature gas at a predetermined temperature using only the primary heater, as in the third embodiment.

9 to 11 show a fifth embodiment of the present invention, in which the thermal processing apparatus 1 is constructed as a tabletop type. That is, in FIG. 9, reference numeral 100 indicates that the upper surface is the workbench 10.
1, and this control box lOO is assembled with the parts of the configuration shown in FIG. 3 except for the fluid sources Fl, Fz, and Fs, and each fluid source F... F,, F, is fluid connector 1
02, and is connected to the power supply through a connection plug 103.
It is designed to be connected via.

Further, on the workbench 101, as shown in FIG. 9, a support column 104 is erected, and a metal fitting 106 is attached to the support column 104, which can be moved up and down by loosening an adjustment knob 105. A fixing metal fitting 108 is attached to the metal fitting 106, which can be moved back and forth by loosening an adjustment knob 107. And thermal processing equipment
is attached to the fixture 108 facing downward, so that a workpiece 109 on the workbench 101 can be thermally processed.

Further, the nozzle tip 6 at the lower end of the thermal processing device 1 has a ninth
As shown in Figures 1 to 11, the surface mounting has a rectangular shape that matches the dimensions of the electronic component 110 of the system, and the bottom surface of the surface mounting has a rectangular shape that matches the dimensions of the electronic component 110, as shown in Figures 1o and 11.
Elongated slit-shaped nozzle lowers are provided corresponding to the ten bin arrays.

With this configuration, it can also be used as a tabletop type. Note that this tabletop device is installed on the workbench 1.
By replacing 01 with an X-Y table and performing NG control, it can also be made into an automatic machine.

[Effects of the Invention] As explained above, the present invention uses water vapor as a heat medium, so it is easy to handle and moreover, a large amount of thermal energy can be obtained with a small flow rate. Therefore, even when soldering electronic components using the surface mounting method, there is no risk of the electronic components moving or the cream solder flowing, and there is no oxide film forming on the solder surface, and the cleaning effect is also improved. can get.

Additionally, by placing the secondary heater on the outer periphery of the primary heater, the length of the device can be shortened, and by placing the secondary heater at the tip of the primary heater, the device can be made thinner. can.

In addition, by effectively utilizing the heat of the heater bobbin,
Steam at a predetermined temperature can be obtained using only the primary heater,
The structure can be simplified.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of the main parts of a thermal processing device according to a first embodiment of the present invention, FIG. 2 is a similar overall configuration diagram, and FIG. 3 is an explanatory diagram showing the configuration of a pressure control section of the thermal processing device. , FIG. 4 is a diagram equivalent to FIG. 1 showing a second embodiment of the present invention, FIG. 5 is a diagram equivalent to FIG. 1 showing a third embodiment of the invention, and FIG. 6 is a diagram equivalent to FIG. 7 is an enlarged exploded perspective view showing the structure of the porous member and guide pipe in FIG. 5; FIG. 8 is a view corresponding to FIG. 1 showing the fourth embodiment of the present invention; FIG. FIG. 9 is a perspective view of a tabletop thermal processing apparatus showing a fifth embodiment of the present invention, FIG. 10 is an enlarged view of the nozzle tip in FIG. 9 viewed from the bottom side, and FIG. It is a cutting line sectional view. l: Thermal processing device 5: Heater casing 6: Nozzle tip 7: Nozzle port 8: Guide pipe 9: Small hole lO knee next upper heater bobbin 1 primary heater 17.60: Secondary←-tubobin 18.62: Secondary heater 52 - Primary heater voltage controller 53: Secondary heater voltage controller 70: Heater bobbin 71: Through hole 72: Heater 73: Hole 74.91: Porous member 78: Pressure equalization chamber 90: Spiral tube Ft, Fs, Fs: fluid source

Claims (1)

[Scope of Claims] 1) a. A guide pipe that discharges water supplied from a water source from a plurality of holes provided on the circumferential surface of the tip, and b. A guide pipe that is attached to the outer circumference of the tip of the guide pipe, and each of the holes a porous member that allows water discharged from the porous member to seep out almost uniformly; c. a primary heater attached to the porous member that heats the water flowing within the porous member to turn it into steam; and d. a primary heater attached to the heater bobbin. A thermal processing apparatus comprising: a secondary heater that further heats the steam from the primary heater to a predetermined temperature; e. a nozzle that discharges the steam heated by the secondary heater. 2) The heater bobbin is attached to the outer circumference of the porous member, and the secondary heater is wound around the outer circumference of the heater bobbin, and the water vapor from the primary heater is directed to the proximal end side of the porous member in the axial direction. 2. The thermal processing apparatus according to claim 1, wherein the thermal processing apparatus is discharged from the heater bobbin, and further flows along the outer peripheral portion of the heater bobbin toward the distal end side in the axial direction and is guided to the nozzle. 3) The secondary heater is wound around the outer circumference of the heater bobbin, and the heater bobbin is placed between the porous member and the nozzle, and the water vapor from the primary heater flows around the outer circumference of the heater bobbin. 2. The thermal processing apparatus according to claim 1, wherein the thermal processing apparatus is guided to a nozzle. 4) a. A heater bobbin in which heaters are respectively inserted into a plurality of through holes penetrating in the axial direction, and b. Water is supplied from a water source to the axial tip of the hole provided in the proximal shaft center of the heater bobbin. a guide pipe that guides water; c. a porous member disposed within the hole that allows the water discharged from the guide pipe to almost uniformly seep out from the base end in the axial direction of the hole to turn it into steam; d) a heater bobbin. a pressure equalizing chamber provided on the base end side in the axial direction and equalizing the pressure of water vapor from the porous member and guiding it to each through hole of the heater bobbin; e. A thermal processing device comprising: a nozzle that discharges steam heated to a predetermined temperature while passing through the nozzle. 5) a. A heater bobbin in which heaters are respectively inserted into a plurality of through holes penetrating in the axial direction; and b. A heater bobbin wound around the outer surface of the heater bobbin to heat water supplied from a water source with the heat of the heater bobbin. a guide pipe that converts water vapor into water vapor; c. a pressure equalization chamber provided on the axial base end side of the heater bobbin to equalize the pressure of the water vapor discharged from the guide pipe and guide it to each through hole of the heater bobbin; d) the heater bobbin. A thermal processing device comprising: a nozzle disposed on the axially distal end side of the nozzle for discharging water vapor heated to a predetermined temperature while passing through each through hole.