JPH01216562A - Hybrid integrated circuit component - Google Patents
Hybrid integrated circuit componentInfo
- Publication number
- JPH01216562A JPH01216562A JP63042755A JP4275588A JPH01216562A JP H01216562 A JPH01216562 A JP H01216562A JP 63042755 A JP63042755 A JP 63042755A JP 4275588 A JP4275588 A JP 4275588A JP H01216562 A JPH01216562 A JP H01216562A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit component
- component
- peripheral circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は異なった複数個の部品を同一パ・ツケージ内に
搭載する混成集積回路部品に関し、特に光デバイス部品
とその周辺回路部品を搭載した混成集積回路部品に関す
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a hybrid integrated circuit component in which a plurality of different components are mounted in the same package, and in particular to a hybrid integrated circuit component in which a plurality of different components are mounted in the same package, and in particular, a hybrid integrated circuit component in which a plurality of different components are mounted in the same package, and in particular, a hybrid integrated circuit component in which a plurality of different components are mounted in the same package. Concerning hybrid integrated circuit components.
従来、光デバイスとその周辺回路部品とは光に対して相
反する特性を有することから、必然的に全く異なったパ
ッケージ形態がとられていた。従って、両者を一つのパ
ッケージ内に搭載することは困難であるので、かかる部
品は未だ開発されていない。Conventionally, since optical devices and their peripheral circuit components have contradictory characteristics with respect to light, they have necessarily taken completely different package forms. Therefore, it is difficult to include both in one package, so such a component has not yet been developed.
しかしながら、最近における回路部品の小形化への要望
の高まりから、光デバイス部品とその周辺回路部品との
同一パッケージ化が求められて来ている。However, due to the recent increasing demand for miniaturization of circuit components, there has been a demand for the same packaging of optical device components and their peripheral circuit components.
本発明の目的は、上記の要望に鑑み、光デバイス部品と
その周辺回路部品とを一つのパッケージ内に搭載した集
積回路部品を提供することである。In view of the above-mentioned needs, an object of the present invention is to provide an integrated circuit component in which an optical device component and its peripheral circuit components are mounted in one package.
本発明によれば、混成集積回路部品は、光デバイス部品
とその周辺回路部品を同一パッケージ内に搭載し、前記
周辺回路部を光遮断用の着色樹脂で封止すると共に、全
体を透明樹脂でトランスファーモールドすることを含ん
で構成される。According to the present invention, the hybrid integrated circuit component has an optical device component and its peripheral circuit components mounted in the same package, the peripheral circuit part is sealed with a colored resin for blocking light, and the entire component is made of a transparent resin. The structure includes transfer molding.
以下図面を参照して本発明の詳細な説明する。 The present invention will be described in detail below with reference to the drawings.
第１図および第２図はそれぞれ本発明の一実施例の構造
を示す混成集積回路部品の斜視図およびそのＡ−Ａ’断
面図である。本実施例によれば、信号を処理あるいは増
幅する周辺回路部品４は黒色等の光遮断用着色樹脂２で
覆われた後、受光または発光を行う光デバイス部品３と
共に光を透過する透明トランスファ・モールド樹脂１で
全体をモールド封止される。ここで５は配線基板、６は
外部リード端子、７は配線基板５と外部リード端子６と
を接続する接続用ワイヤである。1 and 2 are a perspective view and a sectional view taken along line AA' of a hybrid integrated circuit component showing the structure of an embodiment of the present invention, respectively. According to this embodiment, the peripheral circuit components 4 that process or amplify signals are covered with a light-blocking colored resin 2 such as black, and then together with the optical device component 3 that receives or emits light, a transparent transfer film that transmits light is formed. The entire structure is molded and sealed with mold resin 1. Here, 5 is a wiring board, 6 is an external lead terminal, and 7 is a connection wire that connects the wiring board 5 and the external lead terminal 6.
このように、光デバイス部品３上は透明樹脂１で、また
光を嫌う周辺回路部品４上は光を遮断する着色樹脂２で
それぞれ区分されて被覆されるので、両者それぞれ特性
を充分に引き出すことができ、また、全体が透明樹脂１
でトランスア・モールドされるので表面保護を充分に行
うことができる。In this way, the optical device parts 3 are coated with the transparent resin 1, and the peripheral circuit parts 4, which are sensitive to light, are covered with the colored resin 2, which blocks light, so that the characteristics of both parts can be fully brought out. can be made, and the whole is made of transparent resin 1
Since it is trans-a-molded, the surface can be sufficiently protected.
以上詳細に説明したように、本発明によれば、光デバイ
ス部品とその周辺回路部品とを同一配線基板上に搭載し
た混成集積回路部品を得ることができるので、この種集
積回路部品の小形化に大きな効果をあげることが可能で
ある。As explained in detail above, according to the present invention, it is possible to obtain a hybrid integrated circuit component in which an optical device component and its peripheral circuit components are mounted on the same wiring board, thereby reducing the size of this type of integrated circuit component. It is possible to have a great effect on
第１図および第２図はそれぞれ本発明の一実施例の構造
を示す混成集積回路部品の斜視図およびそのＡ−Ａ’断
面図である。
１・・・透明トランスファーモールド樹脂、２・・・光
遮断用着色樹脂（黒色等）、３・・・光デバイス部品、
４・・・周辺回路部品、５・・・配線基板、６・・・外
部−リード端子、７・・・接続用ワイヤ。1 and 2 are a perspective view and a sectional view taken along line AA' of a hybrid integrated circuit component showing the structure of an embodiment of the present invention, respectively. 1... Transparent transfer mold resin, 2... Colored resin for light blocking (black etc.), 3... Optical device parts,
4... Peripheral circuit components, 5... Wiring board, 6... External lead terminal, 7... Connection wire.
Claims (1)
内に搭載し、前記周辺回路部を光遮断用の着色樹脂で封
止すると共に、全体を透明樹脂でトランスファーモール
ドすることを特徴とする混成集積回路部品。A hybrid integrated circuit component characterized in that an optical device component and its peripheral circuit components are mounted in the same package, the peripheral circuit part is sealed with a colored resin for blocking light, and the whole is transfer molded with a transparent resin. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63042755A JPH01216562A (en) | 1988-02-24 | 1988-02-24 | Hybrid integrated circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63042755A JPH01216562A (en) | 1988-02-24 | 1988-02-24 | Hybrid integrated circuit component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01216562A true JPH01216562A (en) | 1989-08-30 |
Family
ID=12644815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63042755A Pending JPH01216562A (en) | 1988-02-24 | 1988-02-24 | Hybrid integrated circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01216562A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5296782A (en) * | 1990-10-18 | 1994-03-22 | Mitsubishi Denki Kabushiki Kaisha | Front mask of display device and manufacturing method thereof |
| KR20000040355A (en) * | 1998-12-18 | 2000-07-05 | 가나자와 요쿠 | Ic package for control of game machine |
-
1988
- 1988-02-24 JP JP63042755A patent/JPH01216562A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5296782A (en) * | 1990-10-18 | 1994-03-22 | Mitsubishi Denki Kabushiki Kaisha | Front mask of display device and manufacturing method thereof |
| KR20000040355A (en) * | 1998-12-18 | 2000-07-05 | 가나자와 요쿠 | Ic package for control of game machine |
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