JPH01228190A - Circuit board - Google Patents

Abstract

PURPOSE:To enable the reduction of a circuit board in an assembling man-hour and the size-reduction of a socket and the board by a method wherein the board and the socket provided on the board are formed by molding into one piece using a thermosetting resin. CONSTITUTION:A board 1 and a socket main body 2a are formed into one piece by the use of a thermosetting resin, and a socket contact 2b is buried inside the socket main body 2a, and a case section 3 housing a discharge gap and others is formed into one piece with the socket main body 2a and the board 1 using the same thermosetting resin. And, electronic elements such as a printed resistor 4, a capacitor 5, a transistor 6, and others are mounted on the surface of the board 1, variable resistors 7 are set, and a circuit pattern is formed on the rear of the board 1, which is connected to the electronic components formed on the front of the board 1 through a through-hole 8. By these processes, the man-hour of manufacturing the circuit board 1 can be reduced and the size-reduction can be also realized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board used in electronic equipment and provided with various electronic elements, circuits, etc.

[Conventional technology]

Conventionally, a circuit board is made up of a thermosetting resin laminate with electronic elements mounted thereon, and a socket or the like is later attached thereto for transmitting and receiving signals to and from the outside.

On the other hand, in recent years, circuit boards have been proposed in which thermoplastic resin is molded into a board by injection molding, and circuits and electronic elements are attached to the board.

[Problem to be solved by the invention]

In the former case of the above-mentioned conventional technology, in response to the recent demand for mass production of electronic devices and reduction in manufacturing man-hours, a relatively large number of man-hours are required to assemble the circuit board, such as mounting a socket. Moreover,
Since sockets and the like are added later, the size becomes large, which hinders efforts to make the device smaller and lighter.

In addition, although the latter of the above conventional techniques is suitable for mass production, it has the disadvantage that the thermoplastic resin for circuit boards is relatively expensive, and the manufacturing cost will be high unless it is mass produced. there were.

The present invention has been made in view of the above-mentioned problems with the conventional technology.It is an object of the present invention to provide a circuit board that requires fewer manufacturing steps, is less costly, allows for high-density mounting, and contributes to the reduction in size and weight of electronic devices. With the goal.

[Means to solve the problem]

This invention involves integrally molding a substrate and a socket body using thermoplastic resin, further providing a circuit pattern on this substrate, attaching socket contacts to the socket body, and electronic elements electrically connected to the circuit pattern and socket contacts. This is a circuit board equipped with.

[Effect]

In the circuit board of the present invention, the board and the socket attached to the board are integrally molded from thermoplastic resin, thereby reducing the number of steps required to assemble the circuit board and making it possible to downsize the board.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

1 to 3 show a first embodiment of the present invention, which is an embodiment of a circuit board attached to a CRT. In this circuit board, the substrate 1 is made of a thermoplastic resin having good heat resistance such as polysulfone, polyethersulfone, polyetherimide, polyetheretherketone, polyphenylene sulfide, polyallyl sulfone, and other polyimide resins. Further, the socket body 2a of the CRT socket 2 is also formed of the same thermoplastic resin, and a socket contact 2b is embedded inside the socket body 2a. The case portion 3, which houses the discharge gap etc. integrally with the socket body 2a and the substrate 1, is also made of the same thermoplastic resin.

Furthermore, electronic elements such as a printed resistor 4, a capacitor 5, and a transistor 6 are mounted on the surface of the substrate 1, and a variable resistor whose slider moves on the resistor printed on the surface of the substrate 1 is further mounted. 7 is installed. A circuit pattern is formed on the back surface of the substrate 1 by a method described later, and is connected to each electronic element on the front surface by through holes 8.

The manufacturing of this circuit board is shown in Figures 2 and 3 (A), (B) (
As shown in C), the substrate 1, the socket 2, and the case part 3 are integrally formed by injection molding using the transfer molding machine 10. In this molding method, thermoplastic resin is sent from a hopper 11 to a heating cylinder 12, heated and kneaded, and is injected into a fluidized state into a gate of a fixed mold 13. At this time, a carrier film 15 is provided on the front surface of the movable mold 14 by the transfer device 16, and with the movable mold 14 in contact with the fixed mold 13, a copper foil circuit is formed on the surface of the carrier film 15. The pattern 17 is transferred to the injected resin.

This transfer is accomplished by the heat and pressure of the injected resin. The carrier film 15 is sent one frame at a time by a transfer device 16 each time injection molding is performed, and the circuit pattern on the carrier film 15 is sequentially transferred onto the injection molded substrate 1 (substrate 1, socket, and case portion). After injection molding in step 3, the socket contact 2b is attached to the socket body 2a, a discharge gap etc. are provided in the case portion 3, and electronic elements are further attached to complete the circuit board.

According to this embodiment, the socket body 2 is also molded at the same time as the board 1, and the circuit pattern 17 is also molded on the board 1 at the same time.
The number of manufacturing steps is extremely small, and the socket main body 2 can also be made smaller, which greatly contributes to reducing the cost, size, and weight of circuit boards.

Next, a second embodiment of the present invention will be described based on FIG. 4.

In the circuit board of this embodiment, the socket 2 into which the connector 20 is inserted and the board 1 are integrally molded from thermoplastic resin. This circuit board is, for example, a printed board hybrid IC for TV, and there is an LS on the board 1.
121, a transistor 6, a transformer 22, etc.

Similarly to the first embodiment, the circuit board of this embodiment is also formed by molding the board 1 and the socket body 2a at the same time, and transferring the circuit pattern at the same time. Furthermore, a socket contact is also later attached to the socket main body 2a in the same manner.

With this embodiment, it is possible to reduce the number of man-hours required for later attaching the socket for the connector to the board, and it is also possible to increase the mounting strength of the socket.

In addition to the above-described embodiments, the circuit board of the present invention may be provided with a socket formed by secondary molding on the board using a different type of thermoplastic resin. Furthermore, instead of attaching the socket contact later, the contact itself may be fixed in a mold during injection molding and may be attached by insert molding. As a result, the number of man-hours required for attaching the socket contacts can also be reduced. In addition to transfer, the circuit board may be formed by a so-called additive method, a semi-additive method, other plating and etching methods, or printing with a conductive paint.

〔Effect of the invention〕

In the circuit board of the present invention, the board and the socket provided on the board are integrally molded from thermoplastic resin.
It is possible to reduce the number of steps required to assemble the circuit board, and
The mounting strength of the socket portion can be increased, and the shapes of the socket and the board can also be made smaller. Furthermore, since there is no need to retrofit sockets, it is possible to increase the mounting density of electronic elements on the board, and the position of the socket can be determined arbitrarily, making it easy to manufacture circuit boards with optimal shapes. can. Furthermore, since the through holes can be formed during substrate molding, there is no increase in the number of steps, and they can be easily provided at any desired position.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a first embodiment of the circuit board of this invention, Fig. 2 is a side view of a transfer molding machine for manufacturing the circuit board of this embodiment, and Figs. 3 (A) (B) (C). 4 is a process diagram showing the manufacturing process of the circuit board of this embodiment, and FIG. 4 is a perspective view of a second embodiment of the circuit board of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Socket, 2a... Socket body, 2b... Socket contact, 17... Circuit pattern Fig. 1 Fig. 2 Fig. 4

Claims (1)

[Claims] 1. A substrate formed by integrally molding thermoplastic resin, a socket body formed by integrally molding thermoplastic resin with this substrate, and socket contacts provided on this socket body and electrically connected to external connection terminals. A circuit board comprising: a circuit pattern formed on the substrate and connected to the socket contact; and an electronic element provided on the substrate and connected to the circuit pattern.