JPH01228575A - Spin coater - Google Patents
Spin coaterInfo
- Publication number
- JPH01228575A JPH01228575A JP63054417A JP5441788A JPH01228575A JP H01228575 A JPH01228575 A JP H01228575A JP 63054417 A JP63054417 A JP 63054417A JP 5441788 A JP5441788 A JP 5441788A JP H01228575 A JPH01228575 A JP H01228575A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- cup
- spin coater
- lid
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、Siウェハーや液晶デバイス用ガラス基扱等
にレジストを塗布するために用いられるスピンコーター
の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to the structure of a spin coater used for applying resist to Si wafers, glass substrates for liquid crystal devices, and the like.
[従来の技術1
従来のスピンコーターの構造は、第2図に示すように塗
膜を形成する試料5及び試料を固定する試料台2が同一
回転軸を中心に同一回転するのに対し、前記試料台周辺
を覆うカップ1は固定で独立した構造であった。[Prior art 1] The structure of a conventional spin coater is that, as shown in FIG. The cup 1 that covered the area around the sample stage had a fixed and independent structure.
[発明が解決しようとする課題]
しかし、前述の従来技術では、試料形状が丸型でない場
合、試料上の塗模厚均−性が悪く、かつ、試料裏面への
塗液の廻り込みが生じるという問題点を有する。そこで
本発明はこのような問題点を解決するもので、その目的
とするところは。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, when the sample shape is not round, the coating thickness on the sample is not uniform, and the coating liquid may go around to the back surface of the sample. There is a problem. The present invention is intended to solve these problems, and its purpose is to:
試料上の塗謹厚均−性が良(、かつ、試料がどのような
形状であっても試料裏面への塗液の廻り込みを生じない
スピンコーターを提供するところにある。The purpose of the present invention is to provide a spin coater that has good uniformity in coating thickness on a sample (and does not cause the coating liquid to run around to the back surface of the sample, regardless of the shape of the sample).
〔課題を解決するための手段J
本発明のスピンコーターは、少なくとも塗膜を形成する
試料を固定する試料台と前記試料台周辺の空間を覆うカ
ップ及び蓋を構成要素とするスピンコーターにおいて、
前記試料台、カップ、及び蓋が同一回転軸を中心に同一
回転することを特徴とする特
[作 用1
本発明の上記の構造によれば、試料とその周囲の気体が
いっしょに回転することにより試料の周囲の気流が乱れ
ないため不均一な風乾が生じることなく、かつ、試料の
回転に伴なって試料裏面に流れ込む気流を生じない。従
って、試料上の塗膜厚の均一性が良く、かつ、試料裏面
への塗液の廻り込みも生じない。[Means for Solving the Problems J] The spin coater of the present invention includes at least a sample stage for fixing a sample on which a coating film is to be formed, a cup and a lid for covering a space around the sample stage, and the spin coater comprises:
Feature 1: According to the above-described structure of the present invention, the sample and the surrounding gas rotate together. Because the airflow around the sample is not disturbed, uneven air drying does not occur, and no airflow flows into the back surface of the sample as the sample rotates. Therefore, the uniformity of the coating film thickness on the sample is good, and the coating liquid does not run around to the back surface of the sample.
〔実 施 例1
本発明のスピンコーターの一実施例を第1図を用いて説
明する。第1図は、本実施例のスピンコーターの断面図
である。カップlは試料5周辺を覆い、回転により試料
端部から飛散した塗液が試料に再付着するのを防止する
よう受は止め、貯める部分であり、試料を固定する試料
台2、及びモーターの回転を伝達する連結部3と一体化
されている。蓋4は、閉めた場合にカップlと一体化し
て試料台周辺の空間を閉空間にするものである。第1図
のスピンコーターを使用し、試料として厚さ0.1=1
00auw、口5〜口1000++n+のガラス基板や
φ3〜8インチのSiウェハー、三角形、・四角形・五
角形・六角形・七角形・六角形のガラス基板を使用し、
市販のポジ型及びネガ型フォトレジストを粘度3〜20
0 cp、滴下量0.1−1000ccを滴下し、スピ
ンコーター回転条件lO〜8000rpIl、o、t−
tooo秒でスピンコードな行なったところ、全ての試
料において試料端面付近まで均一な膜厚が得られ、かつ
、試料裏面への塗液の廻り込みも全くない結果を得た。[Example 1] An example of the spin coater of the present invention will be described with reference to FIG. FIG. 1 is a sectional view of the spin coater of this embodiment. The cup 1 is a part that covers the area around the sample 5, and is a part that catches and stores the coating liquid that has been scattered from the edge of the sample due to rotation to prevent it from re-attaching to the sample. It is integrated with the connecting portion 3 that transmits rotation. When the lid 4 is closed, it is integrated with the cup 1 to make the space around the sample stage a closed space. Using the spin coater shown in Figure 1, the thickness of the sample is 0.1 = 1.
00auw, glass substrates with openings of 5 to 1000++n+, Si wafers of φ3 to 8 inches, triangular, square, pentagonal, hexagonal, heptagonal, and hexagonal glass substrates are used.
Commercially available positive and negative photoresists with a viscosity of 3 to 20
0 cp, dropping amount 0.1-1000 cc, spin coater rotation conditions 10-8000 rpIl, o, t-
When the spin code was run for too many seconds, a uniform film thickness was obtained for all samples up to the vicinity of the end surface of the sample, and there was no leakage of the coating liquid to the back surface of the sample.
[比 較 例]
第2図は、従来のスピンコーターの断面図である。カッ
プlは試料5周辺を覆い回転により試料端部から飛散し
た塗液が試料に再付着するのを防止するよう受は止め、
貯める部分であり、試料5の回転に対して独立しており
固定されているため、回転することはない。試料5を固
定する試料台2とモーターの回転を伝達する連結部3は
一体化されている。従って、カップlで覆われた内部の
気体はモータの回転とは独立しており、静止している気
体層の中を試料が回転するために乱気流及び試料裏面に
流れ込む気流を生じる。よって、従来のスピンコーター
を使用してスピンコードを行なうと試料の回転に伴なっ
て生じる乱気流によって試料表面上の塗膜厚が不均一と
なり、かつ、試料裏面に流れ込む気流のために試料裏面
への塗液の廻り込みが生じる。前記試料裏面に塗液が廻
り込んだ場合の問題点として、通常スピンコード後試料
を取り扱う際には試料裏面との接触があり、この際、試
料裏面と接触した部分に廻り込んだ塗液があると試料と
の接触部に塗液が付着したり、試料裏面に廻り込んだ塗
膜を削ってゴミの発生を招いたり、スピンコード後の流
動工程中に試料を真空吸着する工程があると試料裏面に
廻り込んだ塗液の凹凸により吸着不良の発生などがある
。[Comparative Example] FIG. 2 is a sectional view of a conventional spin coater. The cup l covers the area around the sample 5 and is stopped to prevent the coating liquid that has been scattered from the edge of the sample due to rotation from re-adhering to the sample.
It is a storage part and is fixed and independent of the rotation of the sample 5, so it does not rotate. The sample stage 2 for fixing the sample 5 and the connecting portion 3 for transmitting the rotation of the motor are integrated. Therefore, the gas inside the cup 1 is independent of the rotation of the motor, and as the sample rotates in the stationary gas layer, turbulence and airflow flowing to the back surface of the sample occur. Therefore, when performing spin coding using a conventional spin coater, the coating thickness on the sample surface becomes uneven due to the turbulent airflow that occurs as the sample rotates, and the coating film thickness on the sample surface becomes uneven due to the airflow flowing into the backside of the sample. This causes the coating liquid to circulate. The problem with the coating liquid going around the back side of the sample is that there is usually contact with the back side of the sample when handling the sample after the spin cord, and at this time, the coating liquid that has gone around to the part that came into contact with the back side of the sample is Otherwise, the coating liquid may adhere to the contact area with the sample, the coating film that has gone around the back of the sample may be scraped, causing dust, or there may be a step in which the sample is vacuum-adsorbed during the flow process after the spin cord. Poor adsorption may occur due to unevenness of the coating liquid that has gotten around to the back side of the sample.
以上述べたように本発明によれば、試料とその周囲の気
体がいっしょに回転することにより気流が乱れないため
試料表面に均一な塗膜を得ることができ、かつ、試料の
回転に伴なって試料裏面に流れ込む気流を生じないため
試料裏面への塗液の摺り込みも生じないスピンコードが
できる。As described above, according to the present invention, since the sample and the surrounding gas rotate together, the airflow is not disturbed, so a uniform coating film can be obtained on the sample surface. Since no air current flows into the back surface of the sample, a spin cord is created in which the coating liquid does not rub onto the back surface of the sample.
第1図は本発明のスピンコーターの一実施例を示す主要
断面図。第2図は従来のスピンコーターを示す主要断面
図。
l・・・カップ
2・・・試料台
3・・・連結部
4・・・蓋
5・・・試料
6・・・モーター
以上
出願人 セイコーエプソン株式会社
本)’Ti1l ム オロ 1日 十 器
l μ 子算 t 浦 1 に )
l鐸団1代ツt。FIG. 1 is a main sectional view showing an embodiment of the spin coater of the present invention. FIG. 2 is a main sectional view showing a conventional spin coater. l...Cup 2...Sample stand 3...Connection part 4...Lid 5...Sample 6...Motor and above Applicant: Seiko Epson Co., Ltd. μ child calculation t ura 1 ni)
1st generation of Takudan.
Claims (1)
記試料台周辺の空間を覆うカップ及び蓋を構成要素とす
るスピンコーターにおいて、前記試料台、カップ、及び
蓋が同一回転軸を中心に同一回転することを特徴とする
スピンコーター。In a spin coater that includes at least a sample stand for fixing a sample on which a coating film is to be formed, and a cup and a lid that cover a space around the sample stand, the sample stand, the cup, and the lid rotate in the same manner around the same rotation axis. A spin coater that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63054417A JPH01228575A (en) | 1988-03-08 | 1988-03-08 | Spin coater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63054417A JPH01228575A (en) | 1988-03-08 | 1988-03-08 | Spin coater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01228575A true JPH01228575A (en) | 1989-09-12 |
Family
ID=12970127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63054417A Pending JPH01228575A (en) | 1988-03-08 | 1988-03-08 | Spin coater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01228575A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02307567A (en) * | 1989-05-22 | 1990-12-20 | Fujitsu Ltd | Rotary coating device |
| JPH097918A (en) * | 1995-06-19 | 1997-01-10 | M Setetsuku Kk | Substrate coating chuck |
| JP2002263553A (en) * | 2001-03-05 | 2002-09-17 | Konica Corp | Substrate to be coated, coating apparatus containing the same, coating method, and element production method |
-
1988
- 1988-03-08 JP JP63054417A patent/JPH01228575A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02307567A (en) * | 1989-05-22 | 1990-12-20 | Fujitsu Ltd | Rotary coating device |
| JPH097918A (en) * | 1995-06-19 | 1997-01-10 | M Setetsuku Kk | Substrate coating chuck |
| JP2002263553A (en) * | 2001-03-05 | 2002-09-17 | Konica Corp | Substrate to be coated, coating apparatus containing the same, coating method, and element production method |
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