JPH01228692A - Rotary optical instrument for laser beam machining - Google Patents
Rotary optical instrument for laser beam machiningInfo
- Publication number
- JPH01228692A JPH01228692A JP63054347A JP5434788A JPH01228692A JP H01228692 A JPH01228692 A JP H01228692A JP 63054347 A JP63054347 A JP 63054347A JP 5434788 A JP5434788 A JP 5434788A JP H01228692 A JPH01228692 A JP H01228692A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- rotating
- workpiece
- metal plate
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
被加工物に穿孔するレーザ加工機のレーザ加工用回転光
学装置に関し、
真円度の良好な孔加工の容易化による生産性の向上を目
的とし、
第1の反射板で反射したマルチモードのレーザ光が、第
2の反射板で反射し更に第3の反射板で反射した後入射
光軸と同一方向に射出する如くに少なくとも3個以上奇
数個の平滑な反射板を配設一体化した光学系を、レーザ
光の入射光軸を中心軸として回転させて構成する。[Detailed Description of the Invention] [Summary] The present invention relates to a rotating optical device for laser processing of a laser processing machine that drills holes in a workpiece, and aims to improve productivity by facilitating the drilling of holes with good roundness. An odd number of at least three or more laser beams are arranged so that the multi-mode laser beam reflected by one reflector is reflected by a second reflector, further reflected by a third reflector, and then emitted in the same direction as the incident optical axis. An optical system in which a smooth reflector is integrated is constructed by rotating the incident optical axis of the laser beam as a central axis.
本発明はレーザ光を用いて被加工物に穿孔するレーザ加
工機に係り、特に真円度の良好な孔加工の容易化による
生産性の向上を図ったレーザ加工用回転光学装置に関す
る。The present invention relates to a laser processing machine for drilling holes in a workpiece using a laser beam, and more particularly to a rotating optical device for laser processing that improves productivity by facilitating the processing of holes with good roundness.
板状体に例えば径が0.1〜0.2+nm程度の微細で
精密な孔を穿孔する場合には、通常被加工板の穿孔位置
にレーザ光をスポット照射する方法が多(用いられてい
る。When drilling fine and precise holes with a diameter of, for example, 0.1 to 0.2+ nm in a plate-shaped object, there are many methods that are commonly used, such as spot irradiation of a laser beam onto the drilling position of the workpiece plate. .
この場合、被加工板が例えば金属板の場合にはレーザ光
を使用しまた非金属板のときはガスレーザ光を使用する
等穿孔される材料の種類によってレーザ光を使い分けて
いる。In this case, the laser beam is used depending on the type of material to be drilled, such as when the workpiece is a metal plate, a laser beam is used, and when the workpiece is a non-metallic plate, a gas laser beam is used.
第3図はレーザ光を用いて金属板に穿孔する従来の方法
を示した図であり、(A)は通常の方法をまた(B)は
真円度の向上を図った他の方法を示したものである。Figure 3 shows a conventional method of drilling a hole in a metal plate using a laser beam. (A) shows the normal method and (B) shows another method that improves roundness. It is something that
第3図(八)で、1はX−Yテーブル2の上に搭載され
た厚さ11程度の金属板である。In FIG. 3 (8), 1 is a metal plate with a thickness of about 11 mounted on the X-Y table 2.
3は図示されていない光源から射出した固体レーザ光で
あり、収束レンズ4によって上記金属板1の所定位置P
点に焦点を結ぶように構成されている。3 is a solid laser beam emitted from a light source (not shown), which is directed to a predetermined position P on the metal plate 1 by a converging lens 4.
It is designed to focus on a point.
通常はこの状態でまずP点に微細な孔を穿孔し、次いで
X−Yテーブル2をX方向、Y方向に操作して金属板1
を二次元の方向に移動させて例えばP“点を穿孔する。Normally, in this state, first drill a fine hole at point P, then operate the X-Y table 2 in the X direction and Y direction to
is moved in a two-dimensional direction to drill, for example, a point P''.
以下同様のことを繰り返して該金属板1に複数の所要孔
を穿孔している。Thereafter, a plurality of required holes are bored in the metal plate 1 by repeating the same process.
この場合一般に固体レーザ光3は、ビーム断面の横モー
ドがマルチモードを形成している。In this case, the solid-state laser beam 3 generally has a multi-mode transverse mode in its beam cross section.
例えば図の固体レーザ光3のc−c’における断面3a
では、X軸に対して45度傾いた方向すなわち破線で示
すハンチング領域りにエネルギの大きい部分が形成され
ている。For example, a cross section 3a along c-c' of the solid-state laser beam 3 in the figure
In this case, a portion with high energy is formed in a direction inclined at 45 degrees with respect to the X-axis, that is, in a hunting region indicated by a broken line.
この場合、かかるビームで金属板lを穿孔すると、エネ
ルギの大きい部分から穿孔されるためP点における孔の
形状は1aの如くエネルギの大きいX軸に対して45度
傾いた方向に伸びた楕円状孔となる。In this case, when drilling the metal plate l with such a beam, the hole is drilled starting from the part with the highest energy, so the shape of the hole at point P is an ellipse extending in a direction inclined at 45 degrees with respect to the X-axis where the energy is high, as shown in 1a. It becomes a hole.
一方、穿孔される花形状に特に厳しい真円度が要求され
る場合には、図(B)に示す如く上記固体レーザ光3の
光軸3′と合致する回転軸5でX−Yテーブル2自体を
50〜1100rp程度の回転速度で廻しながら穿孔す
るようにしている。On the other hand, when the flower shape to be perforated requires particularly strict roundness, the X-Y table 2 is rotated with the rotation axis 5 coinciding with the optical axis 3' of the solid-state laser beam 3, as shown in Figure (B). The hole is drilled while rotating itself at a rotational speed of about 50 to 1100 rpm.
この場合には図(八)と同様の固体レーザ光3を使用し
ても、図(八)における楕円形状の孔1aが光軸を中心
として回転しながら穿孔されるため、P点における孔は
1bで示す真円状孔となる。In this case, even if the same solid-state laser beam 3 as in Figure (8) is used, the elliptical hole 1a in Figure (8) is drilled while rotating around the optical axis, so the hole at point P is This results in a perfectly circular hole shown by 1b.
また該金属板1の端部に近い点例えば図のP 77点に
穿孔する場合には、X−Yテーブル2を操作して金属板
lの移動により該P 11点を固体レーザ光3の光軸3
゛に合致させた後、軸5で金属板1を回転させて穿孔す
ることは同様である。When drilling a hole at a point near the end of the metal plate 1, for example, point P77 in the figure, operate the X-Y table 2 and move the metal plate l to drill the point P11 with the solid-state laser beam 3. Axis 3
Similarly, after aligning the holes, the metal plate 1 is rotated about the shaft 5 and the holes are drilled.
従来の固体レーザ光による穿孔作業では、孔の真円度を
得るために被加工物をX−Yテーブルと共に回転させる
必要がある。In conventional drilling operations using solid-state laser light, it is necessary to rotate the workpiece together with an X-Y table in order to obtain the roundness of the hole.
従って被加工物が大型の場合または穿孔位置が被加工物
の端部に近い場合にはその回転に困難を伴うと云う問題
があり、また被加工物の保持および位置決め機構等が複
雑になると云う問題があった。Therefore, if the workpiece is large or the drilling position is close to the edge of the workpiece, there is a problem in that it is difficult to rotate the workpiece, and the holding and positioning mechanism for the workpiece becomes complicated. There was a problem.
上記問題点は、第1の反射板で反射したマルチモードの
レーザ光が、第2の反射板で反射し更に第3の反射板で
反射した後入射光軸と同一方向に射出する如くに少なく
とも3個以上奇数個の平滑な反射板を配設一体化した光
学系を、レーザ光の入射光軸を中心として回転させてな
るレーザ加工用回転光学装置によって解決される。The above problem is such that the multi-mode laser beam reflected by the first reflector is reflected by the second reflector, further reflected by the third reflector, and then exits in the same direction as the incident optical axis. This problem is solved by a rotating optical device for laser processing, which is formed by rotating an optical system in which an odd number of three or more smooth reflecting plates are arranged and integrated, and is rotated about the incident optical axis of the laser beam.
レーザ光を用いて金属板等の被加工物に穿孔する場合、
孔の真円度を得るために被加工物を回転させる従来の方
法に代えてレーザ光自体をその光軸で回転させても同様
の効果を得ることができる。When drilling holes in a workpiece such as a metal plate using laser light,
A similar effect can be obtained by rotating the laser beam itself about its optical axis instead of the conventional method of rotating the workpiece to obtain the roundness of the hole.
本発明では、レーザ光の平行ビーム部分に回転光学系を
挿入し該レーザ光の光軸で回転させるみことによって、
該レーザ光自体の軸回転を実現している。In the present invention, by inserting a rotating optical system into the parallel beam portion of the laser beam and rotating it around the optical axis of the laser beam,
The axis rotation of the laser beam itself is realized.
従って金属板等の被加工物を回転することなく被加工物
に真円度が高く品質の良い孔をあけることができる。Therefore, it is possible to drill a hole of high circularity and quality in a workpiece such as a metal plate without rotating the workpiece.
第1図は、本発明になるレーザ加工用回転光学装置の構
成例を示す断面図であり、第2図は他の実施例を示した
図である。FIG. 1 is a sectional view showing an example of the configuration of a rotating optical device for laser processing according to the present invention, and FIG. 2 is a diagram showing another embodiment.
第1図で、厚さ1mII+程度の金属板1はX−Yテー
ブル2の上に載置されており、図示されてし)ない光源
から射出した固体レーザ光3力く収束レンズ4によって
上記金属板1の所定位置P点に焦点を結ぶように構成さ
れていることは第3図の場合と同様である。In FIG. 1, a metal plate 1 with a thickness of about 1 mII+ is placed on an Similar to the case of FIG. 3, the lens is configured to focus on a predetermined point P on the plate 1.
また該固体レーザ光3の平行ビーム部分の光路中には、
図示されていない外部装置に固定された保持部16にベ
アリング15を介して回転自在な回転光学装置10を光
軸を合わせて配設している。In addition, in the optical path of the parallel beam portion of the solid-state laser beam 3,
A freely rotatable rotating optical device 10 is disposed on a holding part 16 fixed to an external device (not shown) via a bearing 15, with its optical axis aligned.
また該保持部16に装着されているモータ17のプーリ
17aと上記回転光学装置10に設けられているヘルド
溝10aの間は、ベルト18によって連結されている。Further, a belt 18 connects a pulley 17a of a motor 17 mounted on the holding portion 16 and a heald groove 10a provided in the rotary optical device 10.
従って上記モータ17の回転が、ベルト18によって回
転光学装置10の光軸を中心とする軸回転として伝達さ
れる構成になっている。Therefore, the rotation of the motor 17 is transmitted by the belt 18 as axial rotation about the optical axis of the rotating optical device 10.
一方上記回転光学装置10の光路構成部分は、固体レー
ザ光3が図示L1方向から入射し平滑な第1の反射板1
1aの表面で反射した後L2方向に進み、平滑な第2の
反射板11bの表面で反射してL3となり、更に平滑な
第3の反射板11cの表面で反射してL4となって射出
するようになされているが、特に入射光の光軸3′と射
出光の光軸3″とが合致するように構成している。On the other hand, in the optical path constituting portion of the rotating optical device 10, the solid-state laser beam 3 is incident from the direction L1 shown in the figure, and a smooth first reflecting plate 1 is formed.
After being reflected on the surface of 1a, it proceeds in the L2 direction, is reflected on the smooth surface of the second reflecting plate 11b, becoming L3, and further reflected on the smooth surface of the third reflecting plate 11c, becoming L4 and emitting. In particular, the optical axis 3' of the incident light and the optical axis 3'' of the emitted light are configured to coincide with each other.
かかる構成になる回転光学装置10に固体レーザ光3を
入射しながらモータ17を動作させると、該固体レーザ
光3は上記の相対関係を保ったまま回転する3個の反射
板11aとllbおよびIlcで順次反射した後、入射
光の光軸3“の延長線上に光軸3″を持つ固体レーザ光
となって該回転光学装置10から射出する。従って第3
図同様に収束レンズ4によって金属板1の所定位置P点
をスポット照射させることができる。When the motor 17 is operated while the solid-state laser beam 3 is incident on the rotating optical device 10 having such a configuration, the solid-state laser beam 3 is transmitted to the three reflecting plates 11a, llb, and lc which rotate while maintaining the above-mentioned relative relationship. After being sequentially reflected at , the solid-state laser beam is emitted from the rotating optical device 10 as a solid-state laser beam having an optical axis 3'' on an extension of the optical axis 3'' of the incident light. Therefore, the third
As in the figure, a predetermined point P on the metal plate 1 can be spot-irradiated by the converging lens 4.
この際、入射する固体レーザ光3は軸回転する回転光学
装置10の回転速度の2倍の速さでその先軸を中心とし
て捩られる。すなわち回転光学装置lOが一回転する間
に固体レーザ光3自体が二回軸回転する。At this time, the incident solid-state laser beam 3 is twisted about its front axis at twice the rotation speed of the rotary optical device 10, which rotates about its axis. That is, while the rotating optical device IO makes one rotation, the solid-state laser beam 3 itself rotates twice.
従って金属板1の所定位置P点には軸回転しているレー
ザ光が照射されることから、被加工物を回転させる従来
の方法と同等の効果を得ることができる。Therefore, since the predetermined position P of the metal plate 1 is irradiated with the laser beam rotating on the axis, it is possible to obtain the same effect as the conventional method of rotating the workpiece.
第2図は第1図における第3の反射板11cおよび収束
レンズ4を移動して構成したもので、図では回転光学装
置10°からの射出光軸3″を入射光軸3“に対してr
だけずらしている。FIG. 2 shows a configuration in which the third reflecting plate 11c and converging lens 4 in FIG. r
It's shifted by just that.
この場合、該回転光学装置10“を回転させなからレー
ザ光3を金属板1に照射すると、該レーザ光3のスポッ
トは入射光軸31の延長線上にあるP点を中心とする半
径rの円周上をスポット自体が回転しながら移動するた
め、真円度の高い孔加工を行うことができる。In this case, when the laser beam 3 is irradiated onto the metal plate 1 without rotating the rotating optical device 10'', the spot of the laser beam 3 has a radius r centered on the point P on the extension of the incident optical axis 31. Since the spot itself moves while rotating on the circumference, it is possible to machine holes with high roundness.
上述の如く本発明により、マルチモードのレーザ光を用
いて孔加工を行う場合に、被加工物を回転させることな
く真円度の高い孔加工が容易に実施できるレーザ加工用
回転光学装置を提供することができる。As described above, the present invention provides a rotating optical device for laser processing that can easily perform hole processing with high roundness without rotating the workpiece when performing hole processing using multi-mode laser light. can do.
【図面の簡単な説明】
第1図は、本発明になるレーザ加工用光学装置の構成例
を示す断面図、
第2図は他の実施例を示した図、
第3図はレーザ光を用いて金属板に穿孔する従来の方法
を示した図、
である。図において、
1は金属板、 2はx−yテーブル、3は固体レ
ーザ光、 3“、3″は光軸、4は収束レンズ、
io、io’はレーザ加工用回転光学装置、10aはベ
ルト溝、
11a、 Ilb、 llcは反射板、15はベアリン
グ、16は保持部、
17はモータ、 17aはプーリ、18はベルト
、
をそれぞれ表わす。
X
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限オ、9゛碧ラロ第 12
怖θ)粋夕1厖串しは」つ
夷 2 口[Brief Description of the Drawings] Fig. 1 is a sectional view showing a configuration example of an optical device for laser processing according to the present invention, Fig. 2 is a view showing another embodiment, and Fig. 3 is a cross-sectional view showing an example of the configuration of an optical device for laser processing according to the present invention. 1 is a diagram illustrating a conventional method of drilling a hole in a metal plate. In the figure, 1 is a metal plate, 2 is an x-y table, 3 is a solid-state laser beam, 3" and 3" are optical axes, 4 is a converging lens, io and io' are rotating optical devices for laser processing, and 10a is a belt 11a, Ilb, and llc are reflecting plates, 15 is a bearing, 16 is a holding portion, 17 is a motor, 17a is a pulley, and 18 is a belt. X HofusakuC flowing L-sa blade 0 knives...transfer stopper■, Jiro6f limit O, 9゛Heki Ralo No. 12 fear θ) stylish evening 1 skewer is'' Tsui 2 mouths
Claims (1)
2の反射板で反射し更に第3の反射板で反射した後入射
光軸と同一方向に射出する如くに少なくとも3個以上奇
数個の平滑な反射板を配設一体化した光学系を、レーザ
光の入射光軸を中心軸として回転させてなることを特徴
とするレーザ加工用回転光学装置。The multi-mode laser beam reflected by the first reflector is reflected by the second reflector, further reflected by the third reflector, and then emitted in the same direction as the incident optical axis. 1. A rotating optical device for laser processing, comprising an optical system integrally equipped with a smooth reflecting plate, which is rotated about the incident optical axis of laser light as a central axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63054347A JPH01228692A (en) | 1988-03-08 | 1988-03-08 | Rotary optical instrument for laser beam machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63054347A JPH01228692A (en) | 1988-03-08 | 1988-03-08 | Rotary optical instrument for laser beam machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01228692A true JPH01228692A (en) | 1989-09-12 |
Family
ID=12968093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63054347A Pending JPH01228692A (en) | 1988-03-08 | 1988-03-08 | Rotary optical instrument for laser beam machining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01228692A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5223692A (en) * | 1991-09-23 | 1993-06-29 | General Electric Company | Method and apparatus for laser trepanning |
| US6215098B1 (en) * | 1998-07-16 | 2001-04-10 | Murata Manufacturing Co., Ltd. | Method for manufacturing a holding tray for chip components |
| CN103717346A (en) * | 2011-06-29 | 2014-04-09 | 通快机床两合公司 | Optical element of a laser material machining tool, laser machining head having an optical element, and method for operating a laser machining tool |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59191583A (en) * | 1983-04-13 | 1984-10-30 | Mitsubishi Electric Corp | Hole machining by laser |
-
1988
- 1988-03-08 JP JP63054347A patent/JPH01228692A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59191583A (en) * | 1983-04-13 | 1984-10-30 | Mitsubishi Electric Corp | Hole machining by laser |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5223692A (en) * | 1991-09-23 | 1993-06-29 | General Electric Company | Method and apparatus for laser trepanning |
| US6215098B1 (en) * | 1998-07-16 | 2001-04-10 | Murata Manufacturing Co., Ltd. | Method for manufacturing a holding tray for chip components |
| CN103717346A (en) * | 2011-06-29 | 2014-04-09 | 通快机床两合公司 | Optical element of a laser material machining tool, laser machining head having an optical element, and method for operating a laser machining tool |
| US9393643B2 (en) | 2011-06-29 | 2016-07-19 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Optical element of a laser material-processing machine |
| CN103717346B (en) * | 2011-06-29 | 2016-12-21 | 通快机床两合公司 | The optical element of Materialbearbeitung mit Laserlicht machine, there is the laser Machining head of optical element and for the method running laser machine |
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