JPH03210990A - Laser processing method - Google Patents
Laser processing methodInfo
- Publication number
- JPH03210990A JPH03210990A JP907690A JP769090A JPH03210990A JP H03210990 A JPH03210990 A JP H03210990A JP 907690 A JP907690 A JP 907690A JP 769090 A JP769090 A JP 769090A JP H03210990 A JPH03210990 A JP H03210990A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- optical axis
- processing method
- workpiece
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims description 7
- 230000003287 optical effect Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「産業上の利用分野」
この発明はレーザ光を集光して切断、穴あけ等のレーザ
加工をリング（環）状に行う方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a method of condensing laser light and performing laser processing such as cutting and drilling into a ring shape.
「従来の技術」
従来の通常のレーザ加工機においては円筒形をなす平行
光線のレーザ光をレンズによりスポット（−点）に集光
し被加工物（ワーク）に照射して切断、溶接、表面処理
等を行っている。``Conventional technology'' In conventional laser processing machines, parallel cylindrical laser beams are focused on a spot (-point) by a lens and irradiated onto the workpiece for cutting, welding, and surface processing. Processing etc. are being carried out.
加工作業の内、ワークをリング状に切断、溶接、表面処
理する場合にはワークをステージの上に乗せてスポット
から外れた点を中心として回転させるか、または加工ヘ
ッド全体を円周状に移動させて集光スポットをリング状
にワークの上を移動させるか、或いはアキシコンレンズ
と言われる円筒形の平行光線のビームをリング状に集光
させる機能を有する光学部品を用いて加工を行っていた
。When cutting, welding, or surface-treating a workpiece into a ring shape during machining work, place the workpiece on a stage and rotate it around a point away from the spot, or move the entire machining head in a circumferential manner. Processing is performed by moving the focused spot over the workpiece in a ring shape, or by using an optical component called an axicon lens, which has the function of focusing a cylindrical parallel beam of light into a ring shape. Ta.
「発明が解決しようとする課題」
しかしワークをステージの上に乗せて回転させたり、加
工ヘッド全体を円周状に移動させるような機構をもうけ
ることはスペース、重量が大きくなりコストが掛かって
しまうという課題がある。``Problem to be solved by the invention'' However, creating a mechanism to place the workpiece on a stage and rotate it, or to move the entire processing head in a circumferential manner, requires a large amount of space and weight, which increases cost. There is a problem.
一方アキシコンレンズを用いる場合にはレンズの形状が
複雑で製造が難しくまたレンズのコストが高くなる課題
があった。On the other hand, when an axicon lens is used, there are problems in that the shape of the lens is complicated, making it difficult to manufacture and increasing the cost of the lens.
「課題を解決するための手段」
この発明は、光軸と外れた位置にレーザ光を集光して焦
点を結ぶレンズを使用し、ワークを回転させたり加工ヘ
ッド全体をリング状に移動することなく、該レンズを光
軸を中心として回転することによって被加工物上にレー
ザ光の集光スポットをリング状に移動して加工すること
を特徴とする加工方法であり、従来方法の欠点を解消し
たものである。"Means for Solving the Problem" This invention uses a lens that focuses laser light at a position off the optical axis to rotate the workpiece and move the entire processing head in a ring shape. This processing method is characterized by rotating the lens around the optical axis to move the focused spot of the laser beam onto the workpiece in a ring shape, eliminating the drawbacks of conventional methods. This is what I did.
以下図面により本発明の詳細な説明する。The present invention will be explained in detail below with reference to the drawings.
第１図は本発明のための加工ヘッドの構造を示す断面図
、第２図はその原理を示す図面であり、これらの図面は
、片側（第１面）が球面、片面（第２面）が平面の平凸
の単レンズを使用する例を示すものである。Fig. 1 is a sectional view showing the structure of the processing head for the present invention, and Fig. 2 is a drawing showing its principle. This shows an example in which a plano-convex single lens with a flat surface is used.
図面のようにレンズ（１）をレンズマウント（２）の中
に固定し、該レンズマウント（２）は加工ヘッド本体（
４）の中に回転自在に保持されている。このレンズマウ
ント（２）の先端の外側には歯車が切られており、その
歯車にはビニオン歯車（３）が噛み合っている。As shown in the drawing, the lens (1) is fixed in the lens mount (2), and the lens mount (2) is attached to the processing head body (
4) is rotatably held within the holder. A gear is cut on the outside of the tip of this lens mount (2), and a binion gear (3) meshes with the gear.
ピニオン歯車（３）を回転するとレンズマウント（２）
、及びレンズ（１）が光軸を中心として回転する。加工
ヘッド（４）の軸は光の入射軸すなわち光軸と一致させ
である。レンズは光軸上の点Ａを曲率中心とし半径孔の
球面である第１面（７）と一方は平面の第２面（８）と
から形成されている。レンズ（１）は第１面（７）の中
心をこの光軸上にセットするが、一方の平面の第２面（
８）はその法線と光軸とのなす角度が（の、但しθ≠０
、となるように傾斜させたものである。When the pinion gear (3) is rotated, the lens mount (2)
, and the lens (1) rotate around the optical axis. The axis of the processing head (4) is aligned with the incident axis of light, that is, the optical axis. The lens has a center of curvature at point A on the optical axis and is formed of a first surface (7) which is a spherical surface with a radial hole and a second surface (8), one of which is a flat surface. The center of the first surface (7) of the lens (1) is set on this optical axis, but the second surface (
8), the angle between its normal and the optical axis is (, however, θ≠0
It is tilted so that it becomes .
第２図に示すように００傾斜した平面を第２面とするし
゛ンズにおいては、θの小さな場合にはレンズの焦点距
離をｆ１焦点Ｆの光軸からの変位をｒとすると、平行な
レーザ光（６）はレンズ（１）によりレンズからｆの距
離で光軸から、
ｒ≠ｋｆθ
但し ｋ＝レンズ材の屈折率による定数の関係のｒだけ
離れた位置に焦点を結ぶようになる。As shown in Fig. 2, in a lens whose second surface is a 00-inclined plane, when θ is small, the focal length of the lens is f1, and the displacement of the focal point F from the optical axis is r, then the parallel laser The light (6) is focused by the lens (1) at a distance f from the lens and a distance r from the optical axis, where r≠kfθ, where k=a constant determined by the refractive index of the lens material.
「作用」
前記の本発明の加工ヘッドを用いると、レーザ光は光軸
からｒだけ変位した位置に集光されるので、ピニオンを
用いてレーザマウントすなわちレンズを光軸の回りに回
転すると、加工ヘッド全体を移動することなく焦点の面
に置いた被加工物の表面上をレーザ光のスポットは光軸
を中心として半径ｒの円周上を移動することになる。従
ってこの方法によってリング（環）状に被加工物を加工
することができる。"Operation" When the processing head of the present invention is used, the laser beam is focused at a position displaced by r from the optical axis, so when the laser mount, that is, the lens is rotated around the optical axis using a pinion, the processing can be performed. Without moving the entire head, the spot of the laser beam moves on the circumference of a radius r around the optical axis on the surface of the workpiece placed on the focal plane. Therefore, a workpiece can be processed into a ring shape using this method.
以上はレンズとして平凸レンズを用いた場合を説明した
が、第２面が光軸とずれた点を中心とする球面でもよい
。またレンズマウントを歯車とピニオンの結合によって
回転する場合を説明したが、要するに光軸を中心として
レンズを回転すればよく、そのための回転機構はどんな
ものでも良いことは勿論である。Although the case where a plano-convex lens is used as the lens has been described above, a spherical surface whose second surface is centered at a point offset from the optical axis may also be used. Furthermore, although a case has been described in which the lens mount is rotated by coupling a gear and a pinion, it is sufficient to simply rotate the lens around the optical axis, and it goes without saying that any rotation mechanism for this purpose may be used.
「発明の効果」
以上に詳しく説明したように、本発明は光軸から外れた
位置に焦点を結ぶレンズ、例えば第２面を傾斜させた平
凸レンズを用いて、該レンズを光軸の回りに回転させる
だけでスポットをリング（環）状に移動できるので、被
加工物をリング状に切断、表面処理する等のレーザ加工
の際に利用すると非常に効果的なものである。"Effects of the Invention" As explained in detail above, the present invention uses a lens that focuses at a position off the optical axis, for example, a plano-convex lens with an inclined second surface, and rotates the lens around the optical axis. Since the spot can be moved in a ring shape simply by rotating it, it is very effective when used in laser processing such as cutting a workpiece into a ring shape and surface treatment.
第１図は本発明の具体例の断面図、第２図はその原理を
示す原理図である。
１：レンズ ２：レンズマウント３：ピニオ
ン ４：加工ヘッド本体５：ピニオン軸
６：レーザ光
７：第１面 ８：第２面
Ａ：球面中心 Ｒ二球面半径
θ：傾斜角 Ｆ：焦点
ｆ：焦点距離 ｒ：焦点ズレFIG. 1 is a sectional view of a specific example of the present invention, and FIG. 2 is a diagram showing the principle thereof. 1: Lens 2: Lens mount 3: Pinion 4: Processing head body 5: Pinion shaft
6: Laser beam 7: First surface 8: Second surface A: Center of spherical surface R2 spherical radius θ: Inclination angle F: Focus f: Focal length r: Focus deviation
Claims (1)
状に加工するレーザ加工方法において、光軸と外れた位
置にレーザ光を集光して焦点を結ぶレンズを使用し、該
レンズを光軸を中心として回転することによって被加工
物上にレーザ光の集光スポットをリング状に移動して加
工することを特徴とするレーザ加工方法 ２、レンズとして片面が球面であり、他の面が光軸に直
角な面に傾斜した平面である平凸レンズを用いることを
特徴とした請求項１記載のレーザ加工方法 ３、加工ヘッド本体に光軸と外れた位置に焦点を結ぶレ
ンズを取り付けたレンズマウントを回転自在に取り付け
て、該レンズマウントを外部から回転駆動するようにし
たことを特徴とする請求項１もしくは２記載のレーザ加
工方法[Claims] 1. Ring the workpiece with a laser beam spot
In a laser processing method that processes a workpiece into a shape, a lens is used to focus the laser beam at a position off the optical axis, and by rotating the lens around the optical axis, the laser beam is directed onto the workpiece. Laser processing method 2, characterized by processing by moving a focused spot in a ring shape, a plano-convex lens in which one side is a spherical surface and the other surface is a plane inclined to a plane perpendicular to the optical axis. A laser processing method 3 according to claim 1, characterized in that a lens mount having a lens that focuses at a position off the optical axis is rotatably attached to the processing head body, and the lens mount is rotated from the outside. The laser processing method according to claim 1 or 2, characterized in that the laser processing method is driven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP907690A JPH03210990A (en) | 1990-01-16 | 1990-01-16 | Laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP907690A JPH03210990A (en) | 1990-01-16 | 1990-01-16 | Laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03210990A true JPH03210990A (en) | 1991-09-13 |
Family
ID=11672778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP907690A Pending JPH03210990A (en) | 1990-01-16 | 1990-01-16 | Laser processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03210990A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030026906A (en) * | 2001-09-25 | 2003-04-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US6765176B2 (en) | 2001-05-21 | 2004-07-20 | Lpkf Laser & Electronics Ag | Apparatus for treating materials by means of a laser beam |
| US7564006B2 (en) * | 2003-05-16 | 2009-07-21 | Lasag Ag | Apparatus for generating a rotating laser beam |
| JP2011143420A (en) * | 2010-01-12 | 2011-07-28 | Japan Unix Co Ltd | Laser machining device and machining method |
| CN108127249A (en) * | 2017-12-20 | 2018-06-08 | 广东省焊接技术研究所（广东省中乌研究院） | A Focus Controlled Laser Welding Method |
| CN108500460A (en) * | 2018-06-28 | 2018-09-07 | 苏州天弘激光股份有限公司 | Limited power wide cut laser welding head and laser-beam welding machine |
-
1990
- 1990-01-16 JP JP907690A patent/JPH03210990A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6765176B2 (en) | 2001-05-21 | 2004-07-20 | Lpkf Laser & Electronics Ag | Apparatus for treating materials by means of a laser beam |
| KR100936642B1 (en) * | 2001-09-25 | 2010-01-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device manufacturing method |
| US10366885B2 (en) | 2001-09-25 | 2019-07-30 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US7138306B2 (en) | 2001-09-25 | 2006-11-21 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| SG143971A1 (en) * | 2001-09-25 | 2008-07-29 | Semiconductor Energy Lab | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| KR20030026906A (en) * | 2001-09-25 | 2003-04-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US7943885B2 (en) | 2001-09-25 | 2011-05-17 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and method of manufacturing semiconductor device |
| EP1304186A3 (en) * | 2001-09-25 | 2005-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US8686315B2 (en) | 2001-09-25 | 2014-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US9748099B2 (en) | 2001-09-25 | 2017-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US10910219B2 (en) | 2001-09-25 | 2021-02-02 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device |
| US7564006B2 (en) * | 2003-05-16 | 2009-07-21 | Lasag Ag | Apparatus for generating a rotating laser beam |
| JP2011143420A (en) * | 2010-01-12 | 2011-07-28 | Japan Unix Co Ltd | Laser machining device and machining method |
| CN108127249A (en) * | 2017-12-20 | 2018-06-08 | 广东省焊接技术研究所（广东省中乌研究院） | A Focus Controlled Laser Welding Method |
| CN108500460A (en) * | 2018-06-28 | 2018-09-07 | 苏州天弘激光股份有限公司 | Limited power wide cut laser welding head and laser-beam welding machine |
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