JPH0123730B2 - - Google Patents

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Publication number
JPH0123730B2
JPH0123730B2 JP58117122A JP11712283A JPH0123730B2 JP H0123730 B2 JPH0123730 B2 JP H0123730B2 JP 58117122 A JP58117122 A JP 58117122A JP 11712283 A JP11712283 A JP 11712283A JP H0123730 B2 JPH0123730 B2 JP H0123730B2
Authority
JP
Japan
Prior art keywords
signal
circuit
flaw detection
defect
signals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58117122A
Other languages
Japanese (ja)
Other versions
JPS6010167A (en
Inventor
Yoshio Ookubo
Hideaki Tanaka
Ryuji Saikudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP58117122A priority Critical patent/JPS6010167A/en
Publication of JPS6010167A publication Critical patent/JPS6010167A/en
Publication of JPH0123730B2 publication Critical patent/JPH0123730B2/ja
Granted legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/06Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609Display arrangements, e.g. colour displays
    • G01N29/0618Display arrangements, e.g. colour displays synchronised with scanning, e.g. in real-time
    • G01N29/0627Cathode-ray tube displays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • G01N29/07Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/38Detecting the response signal, e.g. electronic circuits specially adapted therefor by time filtering, e.g. using time gates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/044Internal reflections (echoes), e.g. on walls or defects

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  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Description

【発明の詳細な説明】 本発明は超音波探傷信号処理装置に係り、特に
物性に生ずる内部亀裂空洞等を非破かい的に検出
して探傷信号として電子計算機で処理するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic flaw detection signal processing device, and in particular, to detect internal cracks and cavities occurring in physical properties in a non-destructive manner and process them as flaw detection signals by an electronic computer.

従来超音波探傷による探傷信号を電子計算機に
送り情報として加工フアイルするシステムにおい
て探触子にて受信され超音波探傷器にて増幅され
た探傷信号を設定した時間範囲(ゲート範囲)に
おいて時間的に一定なスレツシヨルドレベル(し
きい値)を越えた信号についてピークホールド又
はサンプルホールドしアナログデイジタル変換
(以下A/D変換と呼称す)を行なつたのち電子
計算機に送られる。超音波の特性としては探触子
からの距離に反比例して弱まり同一欠陥大きさで
も距離によつて受信されるレベルが変化する。同
様に被検査材料の結晶組織にて発生する林状エコ
ーも距離によつて変化しこのため林状エコーに対
して例えば2倍以上の信号を欠陥信号として処理
する場合近距離から遠距離までを林状エコーと欠
陥信号との比(SN)を同一比率にて区別するこ
とができない。このため探傷機の入力信号増幅部
において増幅量を時間的に減少させCRTデイス
プレイ上の表示としては林状エコー又は欠陥信号
を距離の変化に対して一定する付加機能が付けら
れている装置もある。しかし増幅器の時間的な減
少量そのものを表示されておらず、信頼性に乏し
く又その減少量を測定し探傷結果を保証する試験
材料を各製品ごとに作成し探傷のステツプごとに
確認する必要があつた。
In a conventional system in which flaw detection signals from ultrasonic flaw detection are sent to an electronic computer and processed as information, the flaw detection signals received by the probe and amplified by the ultrasonic flaw detector are temporally detected within a set time range (gate range). A signal exceeding a certain threshold level is subjected to peak hold or sample hold, analog to digital conversion (hereinafter referred to as A/D conversion), and then sent to an electronic computer. The characteristics of ultrasonic waves are that they weaken in inverse proportion to the distance from the probe, and even for the same defect size, the level received changes depending on the distance. Similarly, forest-like echoes generated in the crystalline structure of the inspected material change depending on the distance, and therefore, when processing a signal that is twice as large as the forest-like echo as a defect signal, it is possible to It is not possible to distinguish the ratio (SN) between the forest echo and the defect signal using the same ratio. For this reason, some devices are equipped with an additional function that reduces the amount of amplification over time in the input signal amplification section of the flaw detector so that the display on the CRT display is a forest echo or defect signal that remains constant over changes in distance. . However, the amount of decrease over time in the amplifier itself is not displayed, making it unreliable, and it is necessary to create test materials for each product to measure the amount of decrease and guarantee the flaw detection results, and to check it at each step of flaw detection. It was hot.

又、電子計算機によるプログラミング制御には
一定時間を必要とするため、探傷器より繰返し得
られる信号をそのまゝ超音速にてデイジタル化し
た信号を処理することができず、前処理としてピ
ークホールド回路又はデイジタル比較回路によつ
て一定時間内の最大値を電子計算機の情報として
いた。このため、一パルス信号によつて複数個の
欠陥信号を受信し処理する高精度のデータ処理シ
ステムにおいては、処理速度の対応可能な高速な
大型電子計算機を必要とした。このためマイクロ
コンピユーターの処理速度では処理できずそれら
複数個の欠陥の中で最大の信号のみを処理してい
た。このような装置では複数個の欠陥が内在して
不合格となるレベルに欠陥情報を得た場合には再
度、人によつてその欠陥部を確認する必要があつ
た。又特公昭56−34060号公報記載のように受信
信号を直接A/D変換する場合にはデータ量が膨
大となる。特にノイズレベルの2倍以上の欠陥信
号を処理する目的では、表層近傍のノイズエコー
を全て、信号として処理しなければならない。前
記公報においても欠陥信号を受信してから50μsec
間のみをA/D変換しているだけで全域にわたつ
てA/D変換を行なつておらず処理能力上限界と
思われる。
In addition, since programming control using an electronic computer requires a certain amount of time, it is not possible to directly process signals obtained repeatedly from a flaw detector and digitized at supersonic speed, so a peak hold circuit is used as preprocessing. Alternatively, the maximum value within a certain period of time was used as information for the electronic computer using a digital comparison circuit. For this reason, a high-precision data processing system that receives and processes a plurality of defect signals using a single pulse signal requires a large, high-speed computer that can handle the processing speed. For this reason, the processing speed of the microcomputer could not process it, and only the largest signal among these multiple defects was processed. In such an apparatus, when defect information is obtained at a level that indicates a failure due to multiple defects, it is necessary to manually confirm the defective part again. Furthermore, when the received signal is directly A/D converted as described in Japanese Patent Publication No. 56-34060, the amount of data becomes enormous. In particular, for the purpose of processing defect signals that are twice the noise level or more, all noise echoes near the surface layer must be processed as signals. Also in the above publication, 50 μsec after receiving the defect signal.
The A/D conversion is performed only in the interval, but not over the entire area, which seems to be at the limit in terms of processing capacity.

以上の点を考慮して本発明では電子計算機から
の信号により或いは手動にて調整可能な時間的に
変化するスレツシヨルドレベル信号を探傷信号を
同一CRTデイスプレイ上に表示し、又これらの
信号を直接比較して欠陥信号のみを取り出すこと
ができるようにして本来の探傷信号を変化させる
ことなく林状エコーに対して例えば2倍以上の欠
陥信号を取り出すようにしたものである。また複
数個の欠陥信号が一パルス信号によつて受信さ
れ、それらを超音速でA/D変換し電子計算機で
処理する場合に、その電子計算機の処理速度に対
応させるためデイジタル信号を一時的にFIFOメ
モリーに格納しマイクロコンピユーターの処理速
度でも高速なデイジタル信号を処理可能とするも
のである。
In consideration of the above points, the present invention displays flaw detection signals on the same CRT display using a time-varying threshold level signal that can be adjusted manually or by a signal from a computer, and also displays these signals on the same CRT display. By making it possible to directly compare and extract only the defect signal, for example, a defect signal twice or more of the forest echo can be extracted without changing the original flaw detection signal. In addition, when multiple defective signals are received as one pulse signal and are A/D converted at supersonic speed and processed by a computer, the digital signal is temporarily converted to correspond to the processing speed of the computer. By storing it in FIFO memory, it is possible to process high-speed digital signals even at the processing speed of a microcomputer.

尚、超音波探傷による受信信号の速度は
500μsec程度(0.5msec)であり、又、探傷信号
はパルス信号であるため、各々のパルス信号の間
隔は1/60〜1/100sec(16msec〜10msec)で
ある。又、複数の欠陥を処理可能とするためには
1μsecごとにデータ処理をする必要がある。この
点ではFIFOメモリ(FIFOバツフアレジスタ或は
一時格納用バツフアメモリ)を用いることにより
パルス信号の間に(16msec〜10msec)データ処
理を行えばよいことになる。尚FIFOは処理速度
への対応であり、林状エコーの2倍以上の信号は
スレツシヨルドレベルと探傷信号の比較によつて
可能となる。第5図はこの場合の信号例線図で
a1,a2はパルス信号、bは欠陥信号、cは欠陥信
号の受信される時間0.5msec、dはFIFOメモリ
なしの処理時間である。
Furthermore, the speed of the received signal by ultrasonic flaw detection is
Since the flaw detection signal is a pulse signal, the interval between each pulse signal is 1/60 to 1/100 sec (16 msec to 10 msec). Also, in order to be able to handle multiple defects,
It is necessary to process data every 1 μsec. In this respect, by using a FIFO memory (FIFO buffer register or buffer memory for temporary storage), data processing can be performed between pulse signals (16 msec to 10 msec). Note that FIFO is a response to processing speed, and signals that are more than twice as large as forest echoes can be obtained by comparing the threshold level and the flaw detection signal. Figure 5 is an example signal diagram in this case.
a 1 and a 2 are pulse signals, b is a defect signal, c is a reception time of the defect signal of 0.5 msec, and d is a processing time without FIFO memory.

かくて本発明は超音波探傷の探傷信号を電子計
算機を介して処理する場合においてクロツク信号
をもとに発生するトリガ信号を受けてて時間的に
変化するスレツシヨルドレベル信号とゲート範囲
信号とを発生するスレツシヨルド回路と、前記探
傷信号とスレツシヨルドレベル信号とを与えられ
欠陥信号だけをとりだす比較回路と、前記欠陥信
号をデイジタル化するサンプルホールド回路並び
にA/D変換回路と、前記デイジタル化せる欠陥
信号を一時的に格納する第1のFIFOメモリと、
前記ゲート範囲信号のスタート並びにエンド信号
とクロツク信号が送られクロツク数がカウントさ
れるカウンタ回路と、前記クロツク信号のカウン
タ量をとりだし、欠陥信号との一致により距離信
号としてとりだす一致回路並びに前記距離信号を
一時的に格納する第2のFIFOメモリとを備え、
これら格納された信号をCPUに組込まれたプロ
グラムにもとずいてデータの解析処理を行いその
結果を主メモリに格納するようにしたことを特徴
とする。かくて本発明によれば先の特公昭56−
34060号公報と相異して最大1μ500mm間を処理す
る必要がある場合膨大なメモリと超高速な処理が
必要で現実的には不可能であるのをアナログ比較
回路によつてデータ量を減少させることによつ
て、A/D変換する範囲を限定することなく処理
が行なえるようにしたものである。
Thus, the present invention provides a threshold level signal and a gate range signal that change over time in response to a trigger signal generated based on a clock signal when processing an ultrasonic flaw detection signal via an electronic computer. a threshold circuit that generates the flaw detection signal and the threshold level signal, a comparison circuit that extracts only the defect signal given the flaw detection signal and the threshold level signal, a sample hold circuit and an A/D conversion circuit that digitize the defect signal, and the digitization circuit. a first FIFO memory for temporarily storing a defective signal;
a counter circuit to which the start and end signals of the gate range signal and the clock signal are sent to count the number of clocks; a matching circuit which extracts the counter amount of the clock signal and extracts it as a distance signal by matching with the defect signal; and the distance signal. and a second FIFO memory that temporarily stores the
The device is characterized in that data analysis processing is performed on these stored signals based on a program built into the CPU, and the results are stored in the main memory. Thus, according to the present invention, the aforementioned Japanese Patent Publication No. 56-
Unlike Publication No. 34060, when it is necessary to process a maximum distance of 1μ500mm, a huge amount of memory and ultra-high-speed processing are required, which is practically impossible, but the amount of data is reduced using an analog comparison circuit. This allows processing to be performed without limiting the range of A/D conversion.

本発明を図の実施例装置について説明すると、
第1図は超音波探傷処理装置のブロツク構成図で
ある。図では1は探触子、2は超音波探傷器、3
はクロツク回路、4はトリガー回路、5はスレツ
シヨルド回路、6は比較回路、7はサンプルホー
ルド回路、8はA/D変換回路、9は第1の
FIFOメモリー、10はカウンタ回路、11は一
致回路、12は第2のFIFOメモリである。
The present invention will be explained with reference to the embodiment shown in the figure.
FIG. 1 is a block diagram of an ultrasonic flaw detection processing apparatus. In the figure, 1 is the probe, 2 is the ultrasonic flaw detector, and 3
is a clock circuit, 4 is a trigger circuit, 5 is a threshold circuit, 6 is a comparison circuit, 7 is a sample hold circuit, 8 is an A/D conversion circuit, 9 is a first
FIFO memory, 10 is a counter circuit, 11 is a coincidence circuit, and 12 is a second FIFO memory.

その他電子計算機に属するものでは、13は
CPU、14はメモリ、或は図示しないが入出力
コントローラ、演算制御器等があり15はバスラ
インであり、バスラインは一例として16ビツトの
データバスと17ビツトのアドレスバス並びに2ビ
ツトのコントロールバスで構成されるものとす
る。次に第1図について動作説明を行う。
For other items belonging to electronic computers, 13 is
A CPU, 14 is a memory, or an input/output controller, an arithmetic controller, etc. (not shown), and 15 is a bus line, which includes, for example, a 16-bit data bus, a 17-bit address bus, and a 2-bit control bus. shall consist of. Next, the operation will be explained with reference to FIG.

まずCPU13がクロツク回路3に始動信号を
与えることによりクロツク回路3においてクロツ
ク信号を発生し、これをもとにトリガー回路4に
与えてトリガー信号を発生する。このトリガー信
号を超音波探傷器2に与えることによりパルス信
号としては探触子1から超音波を被検査物に向つ
て発生しこれにより被検査物の内部に存する亀裂
や空洞などが探触子1から探傷器2への反射波中
に探傷信号として含まれてとりだされる。一方ス
レツシヨルド回路5はトリガー回路4よりのトリ
ガー信号を受けて時間的に変化するスレツシヨル
ドレベル信号とゲート信号を発生し探傷器2に送
られ探傷器2のCRTデイスプレイ上に探傷信号
と時に表示される。又探傷器2よりの探傷信号と
スレツシヨルド回路5より発生せるスレツシヨル
ドレベル信号とゲート範囲信号つまりゲートの始
動信号と終了信号は比較回路6に送られ欠陥信号
だけが取り出される。この欠陥信号はアナログ信
号であるのでサンプルホールド回路7とA/D変
換回路8によつてデイジタル化された電圧レベル
信号としてとりだされ第1のFIFOメモリー9に
一時的に格納される。又、クロツク回路よりのク
ロツク信号はスレツシヨルド回路よりのゲート範
囲の始動信号によつてカウンタ回路10に送られ
てクロツク数がカウントされ始め終了信号により
カウントアウトされる。カウンタ回路10よりの
カウンタ量と比較回路6よりの欠陥信号は一致回
路11に与えられてこのカウント数は距離信号つ
まり探触子1から超音波が亀裂等にて反射され探
傷器2で受信されるまでの時間信号として取り出
され、第2のFIFOメモリー12に一時的に格納
される。尚この距離信号はカウンタ回路10で処
理されるので数値処理が既にデイジタルであり
A/D変換器は不用である。これら第1と第2の
FIFOメモリ9,12に格納された信号はCPUに
組み込まれたプログラムに基づいてデーターの解
折処理を行ないその結果を主メモリー14に格納
するもので必要に応じ読みだすことができる。
First, the CPU 13 provides a start signal to the clock circuit 3, thereby generating a clock signal in the clock circuit 3, and based on this, the clock signal is provided to the trigger circuit 4 to generate a trigger signal. By applying this trigger signal to the ultrasonic flaw detector 2, an ultrasonic wave is generated as a pulse signal from the probe 1 toward the object to be inspected. It is included as a flaw detection signal in the reflected wave from the flaw detector 1 to the flaw detector 2 and is extracted. On the other hand, the threshold circuit 5 receives the trigger signal from the trigger circuit 4 and generates a threshold level signal and gate signal that change over time, which are sent to the flaw detector 2 and displayed on the CRT display of the flaw detector 2 as a flaw detection signal. be done. Further, the flaw detection signal from the flaw detector 2, the threshold level signal and the gate range signal generated by the threshold circuit 5, that is, the gate start signal and end signal, are sent to the comparison circuit 6, and only the defect signal is extracted. Since this defect signal is an analog signal, it is taken out as a digitized voltage level signal by the sample and hold circuit 7 and the A/D converter circuit 8, and is temporarily stored in the first FIFO memory 9. Further, the clock signal from the clock circuit is sent to the counter circuit 10 in response to the gate range start signal from the threshold circuit, and the number of clocks begins to be counted, and is counted out in response to the end signal. The counter value from the counter circuit 10 and the defect signal from the comparator circuit 6 are given to the matching circuit 11, and this count number is converted into a distance signal, that is, the ultrasonic wave from the probe 1 is reflected by a crack or the like and received by the flaw detector 2. The signal is extracted as a time signal until the signal is reached, and is temporarily stored in the second FIFO memory 12. Note that since this distance signal is processed by the counter circuit 10, the numerical processing is already digital and an A/D converter is unnecessary. These first and second
The signals stored in the FIFO memories 9 and 12 undergo data decomposition processing based on a program built into the CPU, and the results are stored in the main memory 14 and can be read out as needed.

尚、第2図は従来のスレツシヨルドレベルにお
ける探傷線図、第3図は同距離振幅補正回路を用
いた探傷線図、第4図は本発明による探傷線図で
ある。一例としてトリガー信号は60〜250Hz、サ
ンプルホールドとしては50μsecで欠陥信号を標本
化し、1μsecの間連続して量子化することにより
その間の最大差圧を抽出し、サンプルホールド回
路で抽出された差圧を450μsecに28ビツトの数値
にアナログ−デイジタル変換部でデイジタル化す
る。
Incidentally, FIG. 2 is a flaw detection line diagram at the conventional threshold level, FIG. 3 is a flaw detection line diagram using the same distance amplitude correction circuit, and FIG. 4 is a flaw detection line diagram according to the present invention. As an example, the trigger signal is 60 to 250 Hz, the sample hold is 50 μsec, the defect signal is sampled, the maximum differential pressure between them is extracted by continuously quantizing for 1 μsec, and the differential pressure extracted by the sample hold circuit is is digitized into a 28-bit value in 450 μsec using an analog-to-digital converter.

この発明は、以上説明したように探傷信号をそ
のまゝにして林状エコーの2倍以上の信号を取り
出すことができ、さらに繰返し発生する高速のデ
イジタル化された信号をマイクロコンピユーター
にて処理できることより、安価なシステムにて信
頼性の高い超音波探傷信号を得ることが不可能に
なつた。
As explained above, the present invention is capable of extracting a signal that is more than twice as large as the forest echo without changing the flaw detection signal, and further, that a microcomputer can process the repeatedly generated high-speed digitized signal. As a result, it has become impossible to obtain highly reliable ultrasonic flaw detection signals using inexpensive systems.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明超音波探傷信号処理装置の実施例
で第1図はブロツク構成図、第2図は従来のスレ
ツシヨルドレベルにおける探傷線図、第3図は同
距離振幅補正回路を用いた探傷線図、第4図は本
発明による探傷線図、第5図は説明のための信号
例線図である。 図で1は探触子、2は超音波探傷器、3はクロ
ツク発生回路、4はトリガー回路、5はスレツシ
ヨルドレベル発生回路、6は比較回路、7はサン
プルホールド回路、8はアナログデイジタル変換
回路、9は第1のFIFOメモリー、10はカウン
ター部、11は一致回路、12は第2のFIFOメ
モリー、13はCPU、14はメモリー。
The drawings show an embodiment of the ultrasonic flaw detection signal processing device of the present invention. Fig. 1 is a block diagram, Fig. 2 is a flaw detection line diagram at the conventional threshold level, and Fig. 3 is a flaw detection using the same distance amplitude correction circuit. FIG. 4 is a flaw detection line diagram according to the present invention, and FIG. 5 is a signal example line diagram for explanation. In the figure, 1 is a probe, 2 is an ultrasonic flaw detector, 3 is a clock generation circuit, 4 is a trigger circuit, 5 is a threshold level generation circuit, 6 is a comparison circuit, 7 is a sample hold circuit, and 8 is an analog/digital circuit. A conversion circuit, 9 a first FIFO memory, 10 a counter section, 11 a coincidence circuit, 12 a second FIFO memory, 13 a CPU, and 14 a memory.

Claims (1)

【特許請求の範囲】[Claims] 1 超音波探傷の探傷信号を電子計算機を介して
処理する場合において、クロツク信号をもとに発
生するトリガ信号を受けて時間的に変化するスレ
ツシヨルドレベル信号とゲート範囲信号とを発生
するスレツシヨルド回路と、前記探傷信号とスレ
ツシヨルドレベル信号とを与えられ欠陥信号だけ
をとりだす比較回路と、前記欠陥信号をデイジタ
ル化するサンプルホールド回路並びにA/D変換
回路と、前記デイジタル化せる欠陥信号を一時的
に格納する第1のFIFOメモリと、前記ゲート範
囲信号のスタート並びにエンド信号とクロツク信
号が送られクロツク数がカウントされるカウンタ
ー回路と、前記クロツク信号のカウンタ量をとり
だし欠陥信号との一致により距離信号としてとり
だす一致回路並びに前記距離信号を一時的に格納
する第2のFIFOメモリとを備え、これら格納さ
れた信号をCPUに組込まれたプログラムにもと
ずいてデータの解析処理を行いその結果を主メモ
リに格納するようにしたことを特徴とする超音波
探傷信号処理装置。
1. When processing ultrasonic flaw detection signals via an electronic computer, a threshold that generates a threshold level signal and a gate range signal that change over time in response to a trigger signal generated based on a clock signal. a comparison circuit that receives the flaw detection signal and the threshold level signal and extracts only the defect signal; a sample-hold circuit and an A/D conversion circuit that digitizes the defect signal; A first FIFO memory for temporary storage, a counter circuit to which the start and end signals of the gate range signal and the clock signal are sent to count the number of clocks, and a counter circuit that takes out the counter amount of the clock signal and matches it with the defect signal. It is equipped with a matching circuit that extracts the distance signal as a distance signal and a second FIFO memory that temporarily stores the distance signal, and analyzes the stored signals based on a program built into the CPU. An ultrasonic flaw detection signal processing device characterized in that results are stored in main memory.
JP58117122A 1983-06-30 1983-06-30 Ultrasonic flaw detection signal processor Granted JPS6010167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58117122A JPS6010167A (en) 1983-06-30 1983-06-30 Ultrasonic flaw detection signal processor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58117122A JPS6010167A (en) 1983-06-30 1983-06-30 Ultrasonic flaw detection signal processor

Publications (2)

Publication Number Publication Date
JPS6010167A JPS6010167A (en) 1985-01-19
JPH0123730B2 true JPH0123730B2 (en) 1989-05-08

Family

ID=14703973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58117122A Granted JPS6010167A (en) 1983-06-30 1983-06-30 Ultrasonic flaw detection signal processor

Country Status (1)

Country Link
JP (1) JPS6010167A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61181958A (en) * 1985-02-07 1986-08-14 Tokyo Keiki Co Ltd Rejection circuit for flaw detector
GB2222119B (en) * 1988-07-29 1992-07-15 Suzuki Motor Co Suspension apparatus for vehicles
JPH02110365A (en) * 1988-10-20 1990-04-23 Hitachi Constr Mach Co Ltd Gate circuit of ultrasonic flaw detector
JP2612322B2 (en) * 1988-10-27 1997-05-21 日立建機株式会社 Gate circuit of ultrasonic flaw detector
JP2755651B2 (en) * 1989-02-06 1998-05-20 東京電力株式会社 Ultrasonic flaw detector

Also Published As

Publication number Publication date
JPS6010167A (en) 1985-01-19

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