JPH012394A - Transfer circuit forming jig - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 〔Technical field〕 The present invention relates to a transfer electric path forming jig.

(Background Art) One method for creating a so-called printed wiring board in which electric circuits are formed on an insulating layer is to first form a predetermined pattern of electric circuits on the surface of a transfer circuit forming jig in a releasable manner, There is a manufacturing method in which the electrical circuit is transferred onto an insulating layer to complete the wiring board.

Specifically, the following two manufacturing methods are used.

FIGS. 3(a) to 3(e) and FIGS. 4(al to fd) each show the process of creating a conventional printed wiring board.

The manufacturing method shown in FIGS. 3(a) to 3(Te) will be explained. Third
As shown in FIG. 3A, first, a mask 32 is formed using an alkali-soluble resist material or a solvent-soluble resist material on a metal plate 31, which is a transfer electric path forming jig. This mask 32 has a pattern opposite to the electric circuit pattern. Then, as shown in Figure 3(b),
Electrical circuits 33 are formed by electrolytic plating. The electric line 33 is
It is formed only in areas where there is no mask 32 to form a predetermined pattern. Then, as shown in FIG. 3 (TC), the mask 32 is peeled off, and as shown in FIG. Complete the board.

Next, the manufacturing method shown in FIGS. 4(a) to (d+) will be explained.

In this manufacturing method, the mask 32' is transferred to the insulating layer 34 together with the electric circuit 33 without being peeled off.

In the above manufacturing method, the masks 32 and 32' do not have good releasability from the insulating layer 34. Therefore, the mask 32 must be peeled off before the electric circuit 33 is transferred, or the mask 32' must be transferred together with the electric circuit 33. Therefore, the mask 32, 32' must always be re-formed each time. The process for updating the masks 32, 32' occupies a relatively large proportion of the total process, and also requires a large amount of resist material.

Therefore, re-forming the masks 32, 32' each time is a major factor that increases the cost of printed wiring boards.

[Object of the Invention] In view of the above-mentioned circumstances, an object of the present invention is to provide a transfer electric circuit forming jig that does not require re-forming a mask each time and can significantly reduce costs.

[Disclosure of the invention]

In order to achieve the above object, the present invention provides a transfer circuit forming jig in which a mask defining a pattern of a transfer circuit is provided on the surface of a metal base material, wherein the mask is composed of multiple layers, and the lowermost layer is made of a material that has good adhesion to the metal base material, and the surface layer is made of a material that has good releasability from the material to which the electric path is to be transferred. The gist is:

Hereinafter, one embodiment of the transfer electric path forming jig according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of one embodiment of the transfer electric path forming jig according to the present invention. Figures 2(a) to fe) show the step-by-step process of creating a printed wiring board using this jig.

As shown in FIG. 2(b), the transfer electric circuit forming jig 1 has the following features:
This is for forming a transfer path 4 of a predetermined pattern in a removable manner. The transfer electric circuit forming jig 1 includes a metal base material 2,
It consists of a mask 3 formed on the surface of this base material 2. The mask 3 is made of metal wood 2 in a pattern opposite to the predetermined pattern.
It is formed to cover the surface of In other words, if a predetermined pattern of non-masked areas is formed on the surface of the metal base material 2 using the mask 3 with a reverse pattern, and electrolytic plating is applied to the transfer electric circuit forming jig 1, the area covered with the mask 3 will not be plated. Instead, only the non-masked areas are plated to form the electric paths 4 in a predetermined pattern. The mask 3 is for defining the pattern of the transfer electric path.

The mask 3 has an upper layer (surface N) 3a and a lower layer (lowest layer) 3b.
It has a two-layer structure. The lower layer 3b is made of a material that has good adhesion to the metal base material 2. The upper layer 3a is made of a material that has good mold releasability with respect to the insulating layer (transferred material) 5 to which the electric circuit 4 is transferred. As the materials for forming the upper layer 3a and the lower layer 3b, materials with good heat resistance are usually used. Figure 2 (
This is because, as shown in C1, the electric circuit 4 is transferred by heating and curing the insulating layer 5 made of, for example, a semi-hardened resin. Further, the material for forming the lower Fi 3b is preferably a relatively hard material in order to firmly maintain the shape of the mask 3. The material for forming the upper J'53a is made of a material with high elasticity, as shown in Fig. 2 (C1), in order to make it easily conform to the insulating layer 5 and to make it difficult to break even if it hits an object. It is preferable that the material is made of a material that

The upper N3a of the mask 3 has excellent mold releasability with respect to the insulating layer 5.

Therefore, after the electric circuit 4 is transferred, the mask 3 does not stick to the insulating layer 5 and peel off. On the other hand, since the lower layer 3b is also strongly bonded to the metal base material 2, the mask 3 is more difficult to peel off. Therefore, when the electric path forming jig 1 for transfer is peeled off after transferring the electric path 4, the electric path forming jig 1 for transfer returns to its original state with the normal mask 3 attached, as shown in FIG. Meanwhile, a printed wiring board 6 with the electric circuit 4 transferred thereto is completed as shown in FIG. 2(d).

In this way, the transfer electric path forming jig 1 returns to the state before forming the electric circuit 4 without damaging the mask 3, so the electrolytic plating process is immediately started without re-forming the mask 3, and the electric path 4 is formed again. Can be formed. After this, the electric path transfer and electric path formation are repeated. By providing a highly durable mask 3, printed wiring boards can be efficiently created one after another without having to re-form the mask 3. Since the mask 3 is formed only once, only a small amount of resist material is required. Therefore, the cost of printed wiring boards can be significantly reduced.

Next, mask 3 will be explained in more detail.

The material for forming the upper layer 3a is a resin that has a heat resistance temperature of 180° C. or higher, a hardness of rubber hardness of 75° or less, and a resin that adheres to metal or resin at 0.1 kg/am (T-shaped peeling: 180° bending) or less. preferable. Examples of resins having such characteristics include silicone rubber and polyfluoroethylene resins such as 4-fluoroethylene resin. The material for forming the lower layer 3b is heat resistant temperature: 180°C or higher, hardness: hardness: 5H or higher, and close contact with metal 0.4 kg/
Resins having characteristics of am (T-peel = 180° bending) or higher are preferred. Examples of resins having such characteristics include polyimide resins.

The upper and lower layers 3a, 3b are formed by screen printing liquid silicone rubber or polyimide solder resist and then curing it.

In the case of liquid silicone, it can be cured by heat treatment at about 150° C. In the case of a polyimide solder resist, it can be cured by heat treatment at about 150° C.

The upper layer 3a is formed with a thickness of about 10 μm using the above liquid silicone rubber, and has a rubber hardness of 42° and an elongation rate of 38.
0%, tensile strength: 55 kgF /cnt, and heat resistance temperature: about 250°C. The lower layer 3b formed using the polyimide solder resist with a thickness of about 10 μm is
Adhesion to stainless steel (metal base material) 0.75
kg/cm (T-type R1t: 180° bending), hardness:
The hardness was near H.

Next, more specific production of the printed wiring board will be explained.

Stainless steel slope (SUS) with a thickness of 0.5 mm is used as the metal base material 3.
304), and on top of this, a mask 3 with a total thickness of 20 μm consisting of the above-mentioned upper layer 3a with a thickness of 10 μm and lower layer 3b.
A transfer electric circuit forming jig 1 was prepared. Then, using the metal base material 2 as an electrode, the jig 1 was heated in a copper sulfate bath for 35 minutes.
Electroplated for 1 minute. The thickness of the electric circuit 4 made of the copper layer thus formed was about 35 μm.

The transfer electric circuit forming jig 1 with the electric circuit 4 formed in this way is placed on an aluminum slope (not shown) whose surface is coated with an adhesive (resin) layer, and heated and pressurized to form the electric circuit on the adhesive layer. A printed wiring board with an aluminum substrate was obtained.

Heating and pressurizing conditions are: temperature: approximately 180℃, pressure crab approximately 40k
g/an! , time: about 30 minutes.

An electric path 4 was again formed on the transfer electric path forming jig 1 by electrolytic plating, and the same printed wiring board as described above was produced repeatedly. It was confirmed that the mask 3 could be used continuously up to 30 times without having to be re-formed. Note that the electric path formed on the printed wiring board is a pattern obtained by inverting the predetermined pattern.

The transfer electric path forming jig according to the present invention is not limited to the above embodiments. For example, the mask may be composed of three or more layers instead of two layers. The mask forming material is also not limited to those exemplified above. The metal base material may be made of a metal material other than stainless steel. Further, the transfer method may be, for example, a method in which a transfer electric path forming jig in which the electric circuit has been formed is placed in a mold, and the object to be transferred is molded into the electric path.

〔Effect of the invention〕

In the transfer electric circuit forming jig of the present invention, in which a mask defining the pattern of the transfer electric circuit is provided on the surface of the gold 1 base material, the mask is composed of multiple layers, and the lowermost layer is formed on the metal base material. On the other hand, the surface layer is made of a material that has good adhesion, and the surface layer is made of a material that has good releasability from the material to which the electric circuit is transferred. Therefore, the same mask can be used to continuously create transfer electric paths without having to re-form the mask, so the cost can be significantly reduced by omitting the mask-forming process and saving mask-forming materials.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the structure of an embodiment of the transfer electric path forming jig according to the present invention, and FIGS. Figure 3 (al to (e)) and Figure 4 (a) to (d) are explanatory diagrams showing the process step by step of creating a conventional printed wiring board, respectively. It is a figure. 1... Electric circuit formation jig for transfer 2... Metal base material 3.
...Mask 3a...Upper layer (surface layer) 3b...
・Lower layer (lowest layer) 4...Electric circuit (transfer circuit) Agent Patent attorney Takehiko Matsumoto Figure 1 Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) In a transfer circuit forming jig in which a mask defining a pattern of a transfer circuit is provided on the surface of a metal base material, the mask is composed of multiple layers, and the bottom layer is in close contact with the metal base material. 1. A jig for forming electric circuits for transfer, characterized in that the jig is formed of a material with good releasability from a material to which the electric circuit is to be transferred, and the surface layer is formed of a material with good releasability from a material to which the electric circuit is to be transferred. (2) The electric circuit forming jig for transfer according to claim 1, wherein the material with good adhesion is a polyimide resin, and the material with good mold release property is silicone rubber or a polyfluoroethylene resin.