JPH0124076B2 - - Google Patents
Info
- Publication number
- JPH0124076B2 JPH0124076B2 JP58174313A JP17431383A JPH0124076B2 JP H0124076 B2 JPH0124076 B2 JP H0124076B2 JP 58174313 A JP58174313 A JP 58174313A JP 17431383 A JP17431383 A JP 17431383A JP H0124076 B2 JPH0124076 B2 JP H0124076B2
- Authority
- JP
- Japan
- Prior art keywords
- glaze
- layer
- substrate
- thermal head
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Non-Adjustable Resistors (AREA)
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
本発明は、感熱記録あるいは熱転写記録に用い
られるサーマルヘツドに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head used for thermal recording or thermal transfer recording.
第１図は従来のサーマルヘツドの断面図であ
る。アルミナなどの絶縁性基板１の全面にグレー
ズ層２が形成され、その上にドツト状の発熱抵抗
体３、導体４及びオーバーコート層５が順次形成
される。グレーズ層２は、発熱抵抗体３で発生し
た熱を蓄え、感熱紙の発色に必要な温度を得る目
的で使用される。 FIG. 1 is a sectional view of a conventional thermal head. A glaze layer 2 is formed on the entire surface of an insulating substrate 1 made of alumina or the like, and a dot-shaped heating resistor 3, a conductor 4, and an overcoat layer 5 are sequentially formed thereon. The glaze layer 2 is used for the purpose of storing the heat generated by the heating resistor 3 and obtaining the temperature necessary for coloring the thermal paper.
ところが、第１図のような絶縁性基板１の全面
にグレーズ層２が形成されると、発熱抵抗体３で
発生した熱がグレーズ層２の広い範囲にわたつて
蓄えられるため、発熱抵抗体３の発熱が終了して
絶縁基板１が冷えるのに時間がかかる。これは熱
応答性の低下として現われ、特に高速度で印字す
る場合には、印字文字が次第に濃くなり、ついに
は白抜けや尾引き等を生じ印字品質の低下を招
く。 However, when the glaze layer 2 is formed on the entire surface of the insulating substrate 1 as shown in FIG. It takes time for the heat generation to finish and for the insulating substrate 1 to cool down. This appears as a decrease in thermal responsiveness, and especially when printing at high speeds, the printed characters gradually become darker, eventually causing white spots, trailing, etc., resulting in a decrease in print quality.
そこで第２図に示すように、発熱抵抗体３の付
近だけにグレーズ層２を設けた、所謂部分グレー
ズ基板が使用され、前述の問題解決が図られてい
る。 Therefore, as shown in FIG. 2, a so-called partial glaze substrate in which a glaze layer 2 is provided only in the vicinity of the heat generating resistor 3 is used to solve the above-mentioned problem.
しかしながら、部分グレーズ基板は全面グレー
ズ基板に比べ生産コストが高価になる。またグレ
ーズ層２の幅ｗ及び厚みｈを常に一定にすること
は難しく、これらの寸法のバラツキがサーマルヘ
ツドの熱特性等に重大な影響を及ぼすことにな
り、品質の点で問題がある。 However, the production cost of a partially glazed substrate is higher than that of a fully glazed substrate. Furthermore, it is difficult to always keep the width w and thickness h of the glaze layer 2 constant, and variations in these dimensions have a serious effect on the thermal characteristics of the thermal head, resulting in a quality problem.
本発明は以上のような部分グレーズ基板の難点
を解消するためになされたもので、比較的安価で
熱応答性が良く、しかも熱特性のバラツキが小さ
いサーマルヘツドを提供することにある。 The present invention has been made in order to solve the above-mentioned disadvantages of partially glazed substrates, and it is an object of the present invention to provide a thermal head that is relatively inexpensive, has good thermal responsiveness, and has small variations in thermal characteristics.
以下図面に従つて本発明の実施例を説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第３図は、本発明の実施例に係るサーマルヘツ
ドの断面図である。基板としては通常の全面グレ
ーズ基板が用いられる。この基板のグレーズ層２
において発熱抵抗体３が形成される付近のみが突
出するように、その他のグレーズ部をフオト・エ
ツチング技術を用いて部分的に除去する。次に、
このエツチングによつて陥没したグレーズ部には
蒸着等で熱伝導層、例えば金属層６を形成し、さ
らにこの上をグレーズ突出部２ａも含めて薄い絶
縁層７でおおう。このようにして出来た基板上に
従来と同様の方法を用いて発熱抵抗体３、導体
４、オーバーコート層５が順次形成されてサーマ
ルヘツドが構成される。 FIG. 3 is a sectional view of a thermal head according to an embodiment of the present invention. A normal full-surface glazed substrate is used as the substrate. Glaze layer 2 of this substrate
In this step, the other glaze portions are partially removed using a photo-etching technique so that only the area where the heating resistor 3 is formed protrudes. next,
A thermally conductive layer, for example, a metal layer 6, is formed by vapor deposition on the glazed portion depressed by this etching, and a thin insulating layer 7 is further covered on this layer, including the glaze protrusion 2a. A heating resistor 3, a conductor 4, and an overcoat layer 5 are sequentially formed on the substrate thus produced using a conventional method to construct a thermal head.
この実施例においては、グレーズ部のエツチン
グ深さを30μmとし、この陥没したグレーズ部に
DC・マグネトロン・スパツタリング法で10μmの
厚みのCu層を形成して金属層６とした。次にこ
の上をグレーズ突出部２ａも含めて約5000Åの厚
みのTa2O5膜でおおい、絶縁層７とし、発熱抵抗
体３としてTa2N膜を、導体４としてNi―Cr／
Au2層膜を、オーバーコート層５としてはSiO2／
Ta2O52層膜を形成してサーマルヘツドを構成し
た。 In this example, the etching depth of the glaze part is 30 μm, and the depressed glaze part is
A metal layer 6 was formed by forming a Cu layer with a thickness of 10 μm using a DC magnetron sputtering method. Next, this is covered with a Ta 2 O 5 film with a thickness of about 5000 Å, including the glaze protrusion 2a, to form the insulating layer 7, a Ta 2 N film as the heating resistor 3, and a Ni-Cr/Ni-Cr/conductor 4.
Au2 layer film is used as overcoat layer 5 with SiO 2 /
A thermal head was constructed by forming a Ta 2 O 5 two-layer film.
以上説明したように、本発明によれば、熱伝導
層を形成したことにより、発熱抵抗体の発熱終了
後の基板冷却が速かに行なわれるから、優れた熱
応答性を有するサーマルヘツドが提供できる。し
かも、実施例のように全面グレーズ基板を加工す
る方法をとれば、部分グレーズ基板より安価であ
り、部分グレーズ基板で問題となつているグレー
ズ層の幅及び厚みも、フオトエツチングを用いて
グレーズ突出部を形成すれば量産時のバラツキが
小さく、サーマルヘツドの熱特性も安定する。 As explained above, according to the present invention, by forming the heat conductive layer, the substrate is quickly cooled down after the heating resistor finishes generating heat, so that a thermal head with excellent thermal responsiveness is provided. can. Moreover, if a method of processing a full-surface glazed substrate as in the example is used, it is cheaper than a partially glazed substrate, and the width and thickness of the glaze layer, which are problems with partially glazed substrates, can be reduced by using photo etching to make the glaze protrude. By forming a section, variations during mass production will be small and the thermal characteristics of the thermal head will be stable.
第１図は全面グレーズ基板を用いた従来のサー
マルヘツドの断面図、第２図は部分グレーズ基板
を用いた従来のサーマルヘツドの断面図、第３図
は本発明の実施例により構成されたサーマルヘツ
ドの断面図である。
１……絶縁基板、２……グレーズ層、２ａ……
グレーズ突出部、３……発熱抵抗体、４……導
体、５……オーバーコート層、６……金属層、７
……絶縁層。
FIG. 1 is a sectional view of a conventional thermal head using a fully glazed substrate, FIG. 2 is a sectional view of a conventional thermal head using a partially glazed substrate, and FIG. 3 is a sectional view of a conventional thermal head using a partially glazed substrate. FIG. 3 is a sectional view of the head. 1... Insulating substrate, 2... Glaze layer, 2a...
Glaze protrusion, 3... Heat generating resistor, 4... Conductor, 5... Overcoat layer, 6... Metal layer, 7
...Insulating layer.
Claims (1)
部を設けたグレーズ層と、該グレーズ層上に前記
グレーズ突出部を覆わないように形成した熱伝導
層と、少なくとも前記熱伝導層を覆うように形成
した絶縁層と、該絶縁層上に形成した導体と、該
導体により接続され、前記グレーズ突出部上に形
成した発熱抵抗体とを備えたことを特徴とするサ
ーマルヘツド。1 a substrate, a glaze layer formed on the substrate and provided with glaze projections, a thermally conductive layer formed on the glaze layer so as not to cover the glaze projections, and a thermally conductive layer so as to cover at least the thermally conductive layer. 1. A thermal head comprising: an insulating layer formed on the insulating layer; a conductor formed on the insulating layer; and a heating resistor connected by the conductor and formed on the glaze protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174313A JPS6067173A (en) | 1983-09-22 | 1983-09-22 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58174313A JPS6067173A (en) | 1983-09-22 | 1983-09-22 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6067173A JPS6067173A (en) | 1985-04-17 |
| JPH0124076B2 true JPH0124076B2 (en) | 1989-05-10 |
Family
ID=15976464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58174313A Granted JPS6067173A (en) | 1983-09-22 | 1983-09-22 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6067173A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62153179A (en) * | 1985-12-25 | 1987-07-08 | 日立化成工業株式会社 | Manufacture of glazed ceramic substrate for heat sensitive head |
| JP4276212B2 (en) * | 2005-06-13 | 2009-06-10 | ローム株式会社 | Thermal print head |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737467B2 (en) * | 1973-02-05 | 1982-08-10 | ||
| JPS5151339A (en) * | 1974-10-31 | 1976-05-06 | Tokyo Shibaura Electric Co | |
| JPS55154189A (en) * | 1979-05-18 | 1980-12-01 | Mitsubishi Electric Corp | Heat-sensitive head |
-
1983
- 1983-09-22 JP JP58174313A patent/JPS6067173A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6067173A (en) | 1985-04-17 |
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