JPH0124932Y2 - - Google Patents
Info
- Publication number
- JPH0124932Y2 JPH0124932Y2 JP1982147019U JP14701982U JPH0124932Y2 JP H0124932 Y2 JPH0124932 Y2 JP H0124932Y2 JP 1982147019 U JP1982147019 U JP 1982147019U JP 14701982 U JP14701982 U JP 14701982U JP H0124932 Y2 JPH0124932 Y2 JP H0124932Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- winding
- wire
- package
- wound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
- Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
Description
本考案は半導体装置のワイヤーボンデイングに
用いるためのフアインワイヤー供給用パツケージ
に関するものである。
半導体装置の組立工程において、半導体素子上
の電極とリード端部とを金属細線(以下フアイン
ワイヤーという)で接続するワイヤーボンデイン
グ作業がある。このボンデイング作業はワイヤー
ボンダーによつて行なわれ、該ボンダーにはフア
インワイヤーを円筒状の胴部を有するスプールに
巻き付けたパツケージとして供給される。近年ワ
イヤーボンダーの改良によりボンデイング速度が
著るしく向上して来たが、それに伴なつて該パツ
ケージ1ケ当りに保有するワイヤー長さも長尺化
の傾向にある。この長尺化は整列巻方式をクロス
巻方式とすることにより実現されている(例えば
実開昭55−155766、実開昭57−93144等)。クロス
巻の利点は整列巻に比べて多層にした場合ワイヤ
ーが下層のワイヤー間に食い込む機会が少なくワ
イヤーボンデイング中の断線及びワイヤーの折れ
曲り頻度が著るしく減少する点にある。
しかしながらこのようなクロス巻パツケージに
おいても巻き戻す際のワイヤーの食い込みを皆無
にすることはできない。特にスプールに円筒状の
胴部を有するものを用いた場合にこの食い込みが
やや多くなる傾向にある。この原因は通常使用し
ている表面をアルマイト加工したアルミニウム製
スプールは表面が滑らかであり、これにクロス巻
すると一定の張力は掛つているものの、取扱中の
シヨツク、温度変化によるスプール及びワイヤー
の膨張収縮量の差等で最下層の巻き層が幾分ずれ
るためであると考えられる。スプール胴部をエン
タシス状にしたり、胴部表面を梨地仕上すればこ
の欠点を解消できるが、スプールのコスト増は避
けられない。
本考案者らは上記事情に鑑み、巻き付け方の工
夫により食い込みを少なくする方策を種々検討し
た結果、第1層目のみを整列巻とすることにより
食い込みが減少することを見出して本考案に到達
した。即ち、本考案のパツケージは第1図に示す
ようにスプール胴部1に接する第1層目に整列巻
層2を有し、該整列巻層の上に巻始めの整列巻部
2Aが露出するようにかつ整列巻層の部分よりは
み出ることのないようにしたクロス巻層3を有す
る点に特徴がある。
整列巻層2の巻きピツチはワイヤー直径の1.1
〜1.5倍程度であれば充分である。クロス巻層3
の幅を整列巻層2の幅より狭くするのは巻始の整
列巻部2Aを断線検出装置に接続できるようにす
るためであり、従つてこの露出幅はわずかで良
い。整列巻層2の上には引続き従来の仕方により
クロス巻きすれば良い。例えばスプール胴部直径
が50mm程度であれば、巻きピツチは4〜5mmにす
れば良い。クロス巻の場合、折り返しを緩かにす
る必要があるが、このため巻き付け量が増すと巻
き層端部が盛り上つてくる。これを回避するには
例えば100〜700トラバース毎に巻き付け幅が両端
部でそれぞれワイヤー直径の10〜100倍宛狭くな
るように巻き付けると良い。
本考案のパツケージによれば全層をクロス巻と
したパツケージに比べてワイヤーの断線及び折れ
曲り頻度を半減することができる。
本考案のパツケージでワイヤー食い込みが減少
する理由は明らかではないが、スプール胴部1に
直接する整列巻層2がその上のクロス巻層3のす
べり止めになり、クロス巻層3のズレを防止する
ためであろうと考えられる。
実施例
外径50mm、長さ49mmの円筒状胴部を有する表面
アルマイト処理したアルミニウム製スプールに直
径20ミクロンの金線1000mを2通りの方法で巻き
The present invention relates to a fine wire supply package for use in wire bonding of semiconductor devices. 2. Description of the Related Art In the assembly process of semiconductor devices, there is wire bonding work in which electrodes on a semiconductor element and lead ends are connected using fine metal wires (hereinafter referred to as fine wires). This bonding operation is carried out by a wire bonder, and the fine wire is supplied to the bonder in the form of a package wound around a spool having a cylindrical body. In recent years, improvements in wire bonders have significantly improved the bonding speed, but with this, the length of wire held per package has also tended to become longer. This lengthening has been achieved by changing the aligned winding method to a cross winding method (for example, Utility Model Application No. 55-155766, Utility Model Application No. 57-93144, etc.). The advantage of cross winding, compared to aligned winding, is that when multiple layers are used, there is less chance of the wire getting stuck between the wires in the lower layer, and the frequency of wire breakage and wire bending during wire bonding is significantly reduced. However, even in such a cross-wound package, it is not possible to completely eliminate the wire biting during unwinding. Particularly, when a spool having a cylindrical body is used, this biting tends to increase somewhat. The reason for this is that the normally used aluminum spool with an anodized surface has a smooth surface, and although a certain tension is applied when cross-wound on this spool, the spool and wire expand due to shock and temperature changes during handling. This is thought to be due to the lowermost layer being slightly shifted due to differences in the amount of shrinkage. This drawback can be overcome by making the spool body into an entasis shape or by finishing the body surface with a satin finish, but an increase in the cost of the spool cannot be avoided. In view of the above circumstances, the inventors of the present invention investigated various ways to reduce the bite by devising the winding method, and as a result, they discovered that the bite could be reduced by aligning only the first layer, and arrived at the present invention. did. That is, as shown in FIG. 1, the package of the present invention has an aligned winding layer 2 as the first layer in contact with the spool body 1, and an aligned winding portion 2A at the beginning of winding is exposed on the aligned winding layer. It is characterized in that it has a cross-wound layer 3 which is arranged so that it does not protrude beyond the aligned winding layer. The winding pitch of the aligned winding layer 2 is 1.1 of the wire diameter.
~1.5 times is sufficient. Cross winding layer 3
The reason for making the width narrower than the width of the aligned winding layer 2 is to enable the aligned winding section 2A at the beginning of the winding to be connected to a disconnection detection device, and therefore, the exposed width may be small. On top of the aligned winding layer 2, cross winding may then be carried out in a conventional manner. For example, if the diameter of the spool body is about 50 mm, the winding pitch should be 4 to 5 mm. In the case of cross winding, it is necessary to make the folds gentle, but as the amount of winding increases, the ends of the wound layers swell up. To avoid this, for example, it is recommended to wrap the wire so that the winding width becomes narrower at each end by 10 to 100 times the wire diameter every 100 to 700 traverses. According to the package of the present invention, the frequency of wire breakage and bending can be halved compared to a package in which all layers are cross-wound. It is not clear why wire digging is reduced in the package cage of the present invention, but the aligned winding layer 2 directly on the spool body 1 prevents the cross winding layer 3 above from slipping, preventing the cross winding layer 3 from slipping. It is thought that this is to do so. Example: 1000 m of gold wire with a diameter of 20 microns was wound in two ways around an aluminum spool with a surface anodized finish having a cylindrical body with an outer diameter of 50 mm and a length of 49 mm.
【表】
第1表の結果から本考案のパツケージは全層ク
ロス巻したものに比べて折れ曲り、断線回数が半
減することが分る。[Table] From the results in Table 1, it can be seen that the package cage of the present invention bends and breaks by half the number of times compared to a package with all layers cross-wound.
第1図は本考案のフアインワイヤー供給パツケ
ージの説明図でクロス巻層の1部分が剥ぎとられ
て整列巻層の状態が示されている。
1……スプール胴部、2……整列巻層、3……
クロス巻層。
FIG. 1 is an explanatory view of the fine wire supply package of the present invention, in which a portion of the cross-wound layer has been removed to show the aligned winding layer. 1... Spool body, 2... Aligned winding layer, 3...
Cross-wound layer.
Claims (1)
るスプールに多層に巻き付けたパツケージであつ
て、該胴部に接する第1層目が整列巻とされ、該
整列巻層の上に巻始めの整列巻部が露出するよう
にかつ整列巻層の部分よりはみ出ることなくクロ
ス巻されて成るフアインワイヤー供給用パツケー
ジ。 It is a package in which a long fine wire is wound in multiple layers around a spool having a cylindrical body, and the first layer in contact with the body is aligned winding, and the winding starting layer is placed on top of the aligned winding layer. A package for supplying fine wire, which is cross-wound so that the aligned winding portion is exposed and does not protrude beyond the aligned winding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982147019U JPS5952629U (en) | 1982-09-30 | 1982-09-30 | Fine wire supply package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982147019U JPS5952629U (en) | 1982-09-30 | 1982-09-30 | Fine wire supply package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5952629U JPS5952629U (en) | 1984-04-06 |
| JPH0124932Y2 true JPH0124932Y2 (en) | 1989-07-27 |
Family
ID=30327064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982147019U Granted JPS5952629U (en) | 1982-09-30 | 1982-09-30 | Fine wire supply package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952629U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5267852B2 (en) * | 2008-07-23 | 2013-08-21 | Tdk株式会社 | Coil component and method for manufacturing coil component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6116690Y2 (en) * | 1980-11-27 | 1986-05-22 |
-
1982
- 1982-09-30 JP JP1982147019U patent/JPS5952629U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5952629U (en) | 1984-04-06 |
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