JPH01253263A - How to manufacture fuse diodes - Google Patents

Abstract

PURPOSE:To form a chip fuse integrally with a chip diode by a method wherein a soldering is performed in the order of the end part of a lead frame on one side, the chip diode, the chip fuse and the end part of a lead frame on the other side and they are molded with an epoxy resin. CONSTITUTION:A chip diode 14 and a chip fuse 15 are respectively placed in each slot 23a to correspond to the end parts 11a and 12a of lead frames 11 and 12 provided on a second jig 23 through each solder pellet 13. Copper plates 16 are respectively inserted in each slot 23a from over the diode 14 and the fuse 15 and a third jig 24 made of carbon is placed. The whole is put in a heating furnace and is subjected to heating treatment. Whereupon, a soldering is performed between the end parts 11a and 12b in the order of the diode 14, the copper plates 16 and the fuse 15. After a resin molding is performed with an epoxy resin, the frames 11 and 12 are cut off from a runner. Thereby, the fuse 15 is formed integrally with the diode 14.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a so-called fuse diode in which a fuse for protecting the diode is integrally formed with the diode.

[Conventional technology]

Conventionally, when a diode is used and a fuse is required to protect the diode, a fuse manufactured separately from the diode is electrically connected to the diode by soldering or the like. are protected by fuses.

[Problem that the invention seeks to solve]

However, many conventional fuses are used for boat fishing, in which the fuse wire is housed in, for example, a glass tube. When trying to achieve diode protection using a fuse formed in this way, the diode is usually formed relatively small, and the equipment etc. to be manufactured using the diode are also relatively small. Because of this, the shape of the fuse increases the size of the circuit and equipment itself, and the need to solder the fuse to a relatively heat-sensitive diode makes assembly complicated. There was a risk of damaging the diode when attaching it.

In view of the above points, an object of the present invention is to provide a method for manufacturing a so-called fuse diode, in which a fuse for protecting the diode is integrally formed with the diode.

[Means and actions for solving the problem] The above purpose is to
According to the present invention, a chip diode and a chip fuse are laminated with a solder pellet interposed between the end portions of at least two lead frames that are to be disposed opposite each other, and the solder pellet is melted by heating. After soldering the end of one lead frame, the chip diode, the chip fuse, and the end of the other lead frame in this order, the fuse is connected to the diode by molding with epoxy resin, leaving the terminal part of the lead frame. This is achieved by a method of manufacturing a fuse diode that is integrally constructed.

In the above method, it is preferable that a chip diode and a chip fuse are placed on each opposing end of the lead frame via a solder pellet, and both ends of the copper plate are bridged on the upper surfaces of both the chip diode and the chip fuse. One end of the lead frame by heating, after which the solder pellet is placed over the chip diode.

The chip fuse and the end of the other lead frame are soldered through the copper plate in this order.

According to this invention, when soldering a chip diode to a lead frame using a solder pellet in a conventional diode manufacturing method, a chip fuse is laminated together with a thousand-knob diode on the front side via a solder pellet, and the chip diode Since the chip fuse is soldered to the chip diode at the same time as the lead frame is soldered, the chip fuse is soldered to the chip diode at the same time as the chip diode is soldered to the lead frame. Since the chip diode only needs to be heated once when soldering, the chip diode will not be damaged by soldering, and since the chip diode is integrated with the chip fuse, the chip diode will not be damaged by soldering. Since there is no need to add a fuse for protection of the diode afterwards, the circuit and equipment themselves do not become larger due to the incorporation of the fuse, and can be made relatively compact.

〔Example〕

The present invention will be described in detail below based on an embodiment shown in the drawings.

FIG. 1 shows a basic method for manufacturing a fuse diode according to the present invention, and this fuse diode 10 is
A chip diode 1 is connected to one side of the end portions 11a and 12a of the two lead frames 11 and 12, which are arranged opposite to each other, through a solder pellet 13 on the upper surface in the illustrated case.
4 and a chip fuse 15 are mounted, and a copper plate 16 whose dimensions are selected so as to straddle both is placed on the upper surface of the 8 chip diode 14 and the chip fuse 15 via the solder pellet 13 in the form of a bridge. It has a suitable structure.

In this state, each solder pellet 13 is melted by heating and cooled, thereby forming the chip diode 14. Chip fuses 15 are connected to each other and to each lead frame 11.
The lead frame 11 is electrically connected to the ends 11a and 12a of the lead frame 11 by soldering.
．． Terminal portion 1 on the opposite side from the ends 11a and 12a of 12
1b.

Resin mold 17 is made of epoxy resin, etc., leaving 12b.
(Fig. 2).

Note that the end portion 11a of the lead frame 11.12.

In order to accurately and easily position the chip diode 14 and the chip fuse 15 with respect to the chip diode 12a, it is convenient to use a jig 18 as shown in FIG.

In this case, the jig 18 has slots 18a corresponding to the ends 11a, 12a of the lead frames 11.degree. ! When mounting the chip diode 14.degree. chip fuse 15 on the ends 11a, 12a of the chip diode 14.2, the chip diode 14.degree. When the chip fuses 15 are inserted, they are easily positioned at appropriate positions relative to the ends 11a and 12a of the lead frames 11 and 12, and when the copper plate 16 is placed i, the copper plate 16 is placed in the slot 18a. By inserting the copper plate 16 inside, the copper plate 16 can be positioned at an appropriate position.

The embodiment of the present invention is constructed as described above, and the fuse diode 10 includes the chip diode 14 and the chip fuse 15 integrally inside the resin mold 17.
It will be formed with a circuit configuration as shown in FIG.

FIG. 4 shows a method for actually producing the fuse diode 10 shown in FIG.

First, the runner 21, in which a plurality of lead frames 11.12 (10 pairs in the illustrated case) are integrally supported and arranged facing each other at a predetermined interval, is connected to each lead frame 11.12. is housed in a first jig 22 made of carbon that can hold the above-mentioned jig 22, and a second jig 23 similarly made of carbon and having the shape of 10 consecutive jigs 18 is placed thereon. .

Next, as shown in FIG. 5, the ends 11a, 1 of each lead frame 11.12 provided on the second jig 23 are
A solder pellet 13 is placed in the slot 23a corresponding to 2a.
The chip diode 14 and the chip fuse 15 are placed through the wafer, and the copper plate I6 is inserted into each thrower 23a from above. Furthermore, a carbon-based jig 24 formed to cover each slot 23a of the jig 23 is placed on top of the jig 23 and fixedly held thereon.

In this state, each solder pellet is melted by putting the whole into a heating furnace and heat-treating it, and then cooling it at room temperature by taking it out of the heating furnace. This solidifies the melted solder pellet 13, so that in each set of lead frames 11 and 12, the ends 11a of the lead frames 11 and the chip diodes 14. copper plate 1
6. The chip fuse 15 and the end 12a of the lead frame 12 are electrically connected in this order by soldering.

Now, if each jig 22, 23, 24 is removed, a chip diode 14. w4 tentative 16. This means that the soldering was performed in the order of chip fuse 15. Then, after each resin mold 17 is formed using epoxy resin, the lead frames 11 and 12 of each set are separated from the runner 21, thereby manufacturing each fuse diode 10.

FIG. 6 shows the case of manufacturing a fuse diode 30 in which two diodes are integrated. In this case, the fuse diode 30 is inserted into a jig 38 made of carbon, and the fuse diode 30 is inserted into a jig 38 made of carbon, and a Two ends 31a of one lead frame 31 whose ends extend laterally toward both sides.

A Chi-knob diode 33 and a chip fuse 34 are sequentially placed on 312' via solder pellets 32, respectively. Furthermore, the ends 35a of the lead frames 35 and 36 are placed on the upper surfaces of both chip fuses 34, respectively.
, 36a are placed through the solder pellets 32. Thereafter, each solder pellet 32 is melted by heating and cooled to form a chip diode 33. Chimp fuses 34 are electrically connected to each other and to ends 31a, 31a' of lead frame 31 and ends 35a, 36a of lead frame 35, 36 by soldering. Subsequently, the lead frame 31,
35.36 said end 31a.

It is manufactured by pouring epoxy resin or the like into the jig 38, leaving the terminal portions on the side opposite to the terminals 31a'', 35a, and 36a, and molding them with resin (not shown).

In this case, the fuse diode 30 has two sets of chip diodes 33 and a chip fuse 34 integrally formed inside the resin mold with a circuit configuration as shown in FIG.

〔Effect of the invention〕

As described above, according to the present invention, a chip diode and a chip fuse are stacked with a solder pellet interposed between the end portions of at least two lead frames that are to be arranged opposite each other, and the solder pellet is melted by heating. ,
After soldering the end of one lead frame, the chip diode, the chip fuse, and the end of the other lead frame in this order, the fuse is connected to the diode by molding with epoxy resin, leaving the terminal part of the lead frame. More preferably, a chip diode and a chip fuse are mounted on each opposing end of the lead frame via a solder pellet, and a chip diode and a chip fuse are mounted on the upper surfaces of both the chip diode and the chip fuse. After both ends of the copper plate are placed in a bridge shape via solder pellets, the copper plate is heated to connect the end of one lead frame, the chip diode, the chip fuse, and the end of the other lead frame in that order. Since the manufacturing method of the fuse diode is configured such that the chip diode is soldered through the chip diode, when the chip diode is soldered to the lead frame using a solder pellet in the conventional diode manufacturing method, the chip fuse is soldered together with the chip diode on the front side. By stacking the chips using solder pellets and simultaneously soldering the chip diode to the lead frame, the chip fuse can be soldered to the chip diode at the same time as the chip diode is soldered to the lead frame. Since the chip diode is soldered at the same time as the chip diode is soldered to the lead frame, the chip diode only needs to be heated once, so there is no possibility that the chip diode will be destroyed by the soldering.

In addition, since the chip diode is integrated with the chimney fuse, there is no need to add a fuse to protect the chip diode afterwards, so there is no need to add a fuse to protect the chip diode, which would otherwise increase the size of the circuit or equipment itself. This means that it can be constructed relatively compactly.

Thus, according to the present invention, it is possible to provide an excellent fuse diode that is compact, easy to use, and has a fuse for protecting the diode integrated with the diode.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a fuse diode manufactured by the method for manufacturing a fuse diode according to the present invention, and FIG.
This figure is a perspective view of a completed fuse diode manufactured according to the embodiment of FIG. 1, and FIG. 3 is a diagram showing the circuit configuration of the fuse diode of FIG. 2. FIG. 4 is an exploded perspective view showing the first step of a specific embodiment of the manufacturing method according to the present invention, FIG. 5 is an exploded perspective view showing the next step after the step shown in FIG. 4, and FIG. FIG. 7 is an exploded perspective view of a fuse diode showing another embodiment of the invention, and FIG. 7 is a diagram showing the circuit configuration of the sixth fuse diode. 10.30... Fuse diode; l'1-12+
31,. 35.36...Lead frame, 13.32
...No\Ninotaperent: 14,33...Chip diode: 15.34...Chip fuse;
16...Copper plate; 17...Resin mold: 1B
, 22.23.24°38... with metal fittings; 21...
runner. Patent applicant: Stanley Electric Co., Ltd. Representative: Patent attorney Kodo Hirayama: Patent attorney Tamotsu Kaizu Figure 4 Figure 5 Figure 7

Claims (1)

[Claims] A chip diode and a chip fuse are laminated with a solder pellet interposed between the ends of at least two lead frames that are to be arranged oppositely, and the solder pellet is melted by heating, and the end of the one lead frame is
After soldering the chip diode, the chip fuse, and the end of the other lead frame in that order, the fuse was configured integrally with the diode by molding with epoxy resin, leaving the terminal part of the lead frame. A method for manufacturing a fuse diode, characterized by: