JPH01255288A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH01255288A JPH01255288A JP8341988A JP8341988A JPH01255288A JP H01255288 A JPH01255288 A JP H01255288A JP 8341988 A JP8341988 A JP 8341988A JP 8341988 A JP8341988 A JP 8341988A JP H01255288 A JPH01255288 A JP H01255288A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- porous metal
- resin
- integrally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 239000011888 foil Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000012784 inorganic fiber Substances 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 239000002759 woven fabric Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 1
- 239000000123 paper Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- -1 polyphenylene Polymers 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は′電気機器、電子機器、通信機器、計算機器等
に用りられるプリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board used in electrical equipment, electronic equipment, communication equipment, computing equipment, etc.
従来、プリント配線板は最外層に電気回路が存在するも
ので、最近の各種電気機器の氾濫によりて、他の電気機
器による電磁波妨害が問題となっている。Conventionally, printed wiring boards have electrical circuits on the outermost layer, and with the recent proliferation of various electrical devices, electromagnetic interference from other electrical devices has become a problem.
従来の技術で述べたように、今迄のプリント配線板は最
外層に電気回路が存在するため、外部からの電磁波妨害
に影響されるところは大でありだ。As mentioned in the section on conventional technology, printed wiring boards to date have electrical circuits on the outermost layer, so they are highly susceptible to electromagnetic interference from the outside.
この対策としてプリント配線板の回路上に絶縁層を介し
て導鴫塗料を全面被覆することが提案されたが１．４亀
塗料を均一を布することは困難で、信頼性に欠ける点が
ありだ。本発明は従来の技術における上述の問題点に鑑
みてなされたもので、その目的とするところはａｍ磁波
妨害対して信頼性のあるプリント配線板を提供すること
にある。As a countermeasure to this problem, it has been proposed to cover the entire surface of the circuit of the printed wiring board with conductive paint via an insulating layer, but it is difficult to spread the 1.4 tortoise paint uniformly, and it lacks reliability. is. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a printed wiring board that is reliable against AM magnetic interference.
本発明はプリント配線板の上面及び又は下面〆こ、両面
哨脂被〜多孔金４箔を配設一体化してなることを特徴と
するプ１１ント配線板のため、外部からの％磁波妨害は
上面及び又は下面の多孔金属箔で途去されるもので、以
下本発明の詳細な説明■る。The present invention is a printed wiring board characterized in that the upper and/or lower surfaces of the printed wiring board are integrally coated with 4-hole gold foil on both sides. A detailed description of the present invention will be given below.
本発明のプ１１ント配線板は、樹脂としてはフェノール
ｆｆ１Ｊ Ｉｌｌ 、エポキシ圀脂、不飽和ポリエステ
ル樹脂、ボ１１イミド樹１階、ポリフェニレンオやサイ
ド樹脂、フッ化愼脂等の瓜独、変ｌ！ｌ１１．＠、混合
物のように熱可塑性樹脂、熱硬化ヰ斑脂を問わず、廣材
としてはガラス繊維、ポリエステル樹脂繊維、ポリアミ
ド樹脂繊維、ポリイミド樹脂線維等のような有機、無機
繊維の迅独、混合からなる織布、不織布、ベーパー、寒
冷紗等で、更に紙をも包含するものである。又プリント
配線板としては片面、両面、多層プリント配線板等の全
てを包含するものである。両面側１指被撞子孔金稿箔と
しては、銅、鉄、アルミニウム、二・・ケル、徂鉛、銀
等のＩ３Ａ独、合金、被合品からなる金属箔に微細孔を
多１？ｊＩ′Ａ孔したものや、大口径の開孔部をあたか
もネ−Ｊ ト状、寒冷紗状に開孔したものであり開孔面
積、開孔状態等は特に限定するものではない。両面に被
栓する樹脂としては、プリント配線板本体に用いられる
各種の樹脂をそのまま用いることができるが、史にＵＶ
硬化性樹脂をも包含するものである。樹脂は塗膜形成さ
れたものやフィルム、シート、スプレー形成されたもの
等で特に限定するものではなＡ６なお両面樹脂被覆多孔
金属箔は片面丈に配設してもよく、両面ｌこ配設しても
よく任意である。一体化手段としてはプレス、ロール、
ダブルベルトＪのように積層一体化できるものであれば
よく特に限定するものではない。The printed wiring board of the present invention is made of resins such as phenol resin, epoxy resin, unsaturated polyester resin, polyimide resin, polyphenylene resin, side resin, fluorinated resin, etc. ! l11. ＠、Regardless of whether it is a mixture of thermoplastic resin or thermosetting resin, as a material, it is a mixture of organic and inorganic fibers such as glass fiber, polyester resin fiber, polyamide resin fiber, polyimide resin fiber, etc. It includes woven fabrics, non-woven fabrics, vapor, cheesecloth, etc., and also includes paper. The printed wiring board includes single-sided, double-sided, multilayer printed wiring boards, etc. For gold leaf with one finger perforation on both sides, there are many fine holes in metal foil made of copper, iron, aluminum, I3A, alloys, and mating products such as copper, iron, aluminum, lead, and silver. These include those with JI'A holes, and those with large-diameter holes that look like a net or cheesecloth, and there are no particular limitations on the area of the holes, the state of the holes, etc. As the resin for plugging both sides, various resins used for the main body of printed wiring boards can be used as they are, but
It also includes curable resins. The resin may be coated, film, sheet, spray-formed, etc., and is not particularly limited. Note that the A6 double-sided resin-coated porous metal foil may be placed on one side, or both sides may be placed on both sides. It is optional. Press, roll,
There is no particular limitation as long as it can be laminated and integrated like the double belt J.
以下本発明を実施例にもとづｂて説明する。The present invention will be explained below based on examples.
実施例
厚さｌｆｌのガラス布基材エホキシ樹脂両面プリント配
線板の上下面に、厚さ０．０１８絹の伽箔に山径２ Ｉ
Ｉの孔を開口率３０壬で股はた表裏面に硬化剤含有エポ
キシ樹脂を厚みＱ、’１１１１に塗布、乾燥してなる両
面エポキシ樹脂液〜多孔餉箔を夫々配設してから成形圧
力ｌＯにｑ／ｃｉ 、１６０ Ｃで６０分間加熱加圧成
形してシールド層付きのプリント配線板を得た。Example: On the upper and lower surfaces of a glass cloth base material epoxy resin double-sided printed wiring board with a thickness of lfl, a 0.018-thick silk foil with a mountain diameter of 2 I was applied.
A hardening agent-containing epoxy resin is applied to the front and back surfaces of the holes I with an opening ratio of 30 mm to a thickness of Q, 1111 mm, and the resulting double-sided epoxy resin liquid ~ porous porcelain foil is placed on each side, then molding pressure is applied. A printed wiring board with a shield layer was obtained by heat-pressing molding at 160 C for 60 minutes at q/ci of lO.
比較例
実施例の両面ブ１１ント配線板の上下酊に、夫々硬化剤
含有エポキシ樹脂を厚みり、Ｉｆｆ賃に父右後、１６０
℃で６０分間加熱硬ｆヒし、次にその上にシールド用−
亀注毫科（ローｌクペイント株式会社製、品名４９ Ｂ
シールドニーＩケル）を厚みＱ、 ｌ ！Ｒ１１を
右後、１００℃で５分間加熱し、更にその上に硬化剤含
有エポキシ樹脂を厚み０．１ｆｆ塗布後、１６０℃で６
０分間加熱硬化してシールド１−付きのプリント配線板
を得た。Comparative Example A hardening agent-containing epoxy resin was applied to the upper and lower sides of the double-sided printed wiring board of Example, respectively, and if the thickness was 160
Heat harden for 60 minutes at ℃, then apply shielding layer on top
Turtle paint (manufactured by Rolk Paint Co., Ltd., product name 49 B)
Shield knee I Kel) to thickness Q, l! R11 was heated at 100℃ for 5 minutes on the right side, and then a hardening agent-containing epoxy resin was applied on top of it to a thickness of 0.1ff, and then heated at 160℃ for 6 minutes.
A printed wiring board with a shield 1- was obtained by heating and curing for 0 minutes.
実施例及び比較例のプリント配線板の性能は第１表のよ
うである。The performances of the printed wiring boards of Examples and Comparative Examples are shown in Table 1.
注 ※ 従来を１００とした場合の比である。note *This is the ratio when the conventional value is set as 100.
本発明は上述した６０ ＜構成されている。特許請求の
範囲第１項に記載した構成を有するプリント配線板にお
いてはシールド信頼性が大で、シールド層の接ｄ性も大
きく、且つ全工数が短縮される効果がある。The present invention is constructed as described above. The printed wiring board having the structure described in claim 1 has the effect of having high shielding reliability, high contact d property of the shield layer, and shortening the total number of man-hours.
Claims (1)
被覆多孔金属箔を配設一体化してなることを特徴とする
プリント配線板。(1) A printed wiring board characterized in that a double-sided resin-coated porous metal foil is integrally disposed on the upper and/or lower surfaces of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341988A JPH01255288A (en) | 1988-04-05 | 1988-04-05 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8341988A JPH01255288A (en) | 1988-04-05 | 1988-04-05 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255288A true JPH01255288A (en) | 1989-10-12 |
Family
ID=13801920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8341988A Pending JPH01255288A (en) | 1988-04-05 | 1988-04-05 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000101289A (en) * | 1998-09-18 | 2000-04-07 | Tomoegawa Paper Co Ltd | Processing method of electromagnetic wave shielding material for flexible printed wiring board |
-
1988
- 1988-04-05 JP JP8341988A patent/JPH01255288A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000101289A (en) * | 1998-09-18 | 2000-04-07 | Tomoegawa Paper Co Ltd | Processing method of electromagnetic wave shielding material for flexible printed wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102047777A (en) | Electromagnetic-wave shielding material, and printed-wiring board | |
| JPH03246986A (en) | Flexible/Rigid Printed Wiring Board | |
| JPH01255288A (en) | Printed wiring board | |
| JPS6369106A (en) | Laminate plate for electricity and printed wiring board using the same | |
| JPS6255991A (en) | Flexible printed circuit board with shield | |
| JPS63224934A (en) | laminate board | |
| JP2779649B2 (en) | Manufacturing method of printed wiring board | |
| JPH07120854B2 (en) | Multilayer wiring board | |
| JPS63199635A (en) | Laminated board | |
| JP2000252594A (en) | Double-sided printed-wiring board | |
| JPH02277297A (en) | Manufacture of printed wiring board | |
| JPH0371693A (en) | Manufacture of wiring board | |
| JPH0482198B2 (en) | ||
| JPH01150537A (en) | Metal foil with resin and, laminated plate, multilayered circuit board using it | |
| JPS5474883A (en) | Preparation of copper-clad laminate | |
| JPS63111699A (en) | Manufacture of metal foil cladded laminated board | |
| JPH07120855B2 (en) | Multilayer wiring board | |
| JPH02277293A (en) | Manufacture of printed wiring board | |
| JPS63199638A (en) | Laminated board | |
| JPH02250393A (en) | Manufacture of printed board | |
| JPH0371691A (en) | Wiring board | |
| JPH04130797A (en) | Printed wiring board | |
| JPH01150388A (en) | Multilayer interconnection sheet | |
| JPH02277298A (en) | Manufacture of printed wiring board | |
| JPH01225394A (en) | Manufacture of multilayer printed board |