JPH01257314A - Chip-type capacitor - Google Patents
Chip-type capacitorInfo
- Publication number
- JPH01257314A JPH01257314A JP63161430A JP16143088A JPH01257314A JP H01257314 A JPH01257314 A JP H01257314A JP 63161430 A JP63161430 A JP 63161430A JP 16143088 A JP16143088 A JP 16143088A JP H01257314 A JPH01257314 A JP H01257314A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- chip
- lead wire
- outer package
- package frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 76
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 39
- 238000003860 storage Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 238000005452 bending Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、コンデンサの改良にかかり、特に、基板へ
の表面実装に適したチップ形のコンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to improvements in capacitors, and particularly to chip-type capacitors suitable for surface mounting on a substrate.
従来、コンデンサのチップ化を実現するには、コンデン
サ素子に樹脂モールド加工を施し、樹脂端面から導出し
た外部接続用のリード線を樹脂端面に沿って折り曲げ、
プリント基板の配線バクーンに臨ませていた。Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the lead wire for external connection led out from the resin end was bent along the resin end.
The printed circuit board wiring was exposed.
あるいは、例えば、実公昭５９−３５５７号公報に記載
された考案のように、従来のコンデンサを外装枠に収納
し、リード線を外装枠の端面と同一平面に配置したもの
がｔｌ案されていた。また、特開昭６０−２４５１１６
号公報および特開昭６０−２４５１１５号公報に記載さ
れた発明のように、有底筒状の外装枠にコンデンサを設
置して外装枠底面の貫通孔からリード線を導出し、この
リード線を外装枠の外表面に設けた凹部に納めるよう折
り曲げたものが提案されていた。このような従来のチッ
プ形コンデンサは通常のコンデンサの構造を変更するこ
となく、表面実装を可能にしている。Alternatively, for example, as in the idea described in Japanese Utility Model Publication No. 59-3557, a tl plan was proposed in which a conventional capacitor was housed in an exterior frame and the lead wires were arranged on the same plane as the end face of the exterior frame. . Also, JP-A-60-245116
As in the inventions described in Japanese Patent Publication No. 60-245115, a capacitor is installed in a cylindrical exterior frame with a bottom, a lead wire is led out from a through hole in the bottom of the exterior frame, and the lead wire is It has been proposed that the device be bent to fit into a recess provided on the outer surface of the exterior frame. Such conventional chip capacitors can be surface mounted without changing the structure of the normal capacitor.
しかしながら、モールド加工を施すチップ形コンデンサ
では、モールド加工時の熱的ストレスによりコンデンサ
素子が熱劣化するおそれがあり、また、その製造方法も
煩雑であった。However, in chip-type capacitors that are molded, there is a risk that the capacitor element will be thermally degraded due to thermal stress during the molding process, and the manufacturing method thereof is also complicated.
また、通常のコンデンサを利用したチップ形コンデンサ
では、外装枠が直接プリント基板と接触するため、この
チップ形コンデンサをプリント基板に実装して半田付け
りフロー処理を施すと、半田熱が直接にチップ形コンデ
ンサに伝導し、外装枠に収納されたコンデンサ本体に熱
的ストレスがかかることになる。そのため、コンデンサ
が熱劣化し、寿命特性に悪影響を及ぼしていた。In addition, in a chip capacitor that uses a normal capacitor, the outer frame is in direct contact with the printed circuit board, so when this chip capacitor is mounted on a printed circuit board and soldering flow processing is performed, the solder heat is directly applied to the chip. Thermal stress is conducted to the capacitor, and thermal stress is applied to the capacitor body housed in the outer frame. As a result, the capacitor deteriorates due to heat, which adversely affects its life characteristics.
また、リード線の先端部を外装枠の一平面とほぼ同一面
上に配置するには精密な加工精度を要求される。あるい
はリード線を凹部等に収納する場合でも、リード線をほ
ぼ完全に凹部に収納する必要がある。そのため、いずれ
の場合でも製造工程を煩雑にしているとともに、加工精
度によってはチップ形コンデンサのプリント基板との当
接面、すなわち底面部に微小な段差が生じ、チップ形コ
ンデンサの安定性を欠く場合があった。Moreover, precise processing accuracy is required to arrange the tip of the lead wire on substantially the same plane as one plane of the exterior frame. Alternatively, even when the lead wire is housed in a recess or the like, it is necessary to almost completely store the lead wire in the recess. Therefore, in any case, the manufacturing process is complicated, and depending on the processing accuracy, a minute difference in level may occur on the contact surface of the chip capacitor with the printed circuit board, that is, the bottom surface, which may cause the chip capacitor to lack stability. was there.
この発明の目的は、通常のコンデンサの構造を変更する
ことなく、耐熱性に優れかつ製造工程での加工精度に影
響されることのないチップ形コンデンサを提供すること
にある。An object of the present invention is to provide a chip-type capacitor that has excellent heat resistance and is not affected by processing accuracy in the manufacturing process without changing the structure of a normal capacitor.
この発明は、コンデンサの外径寸法に適合した収納空間
を有するとともに、底面にコンデンサのリード線の外径
寸法とほぼ同じ高さ寸法の突起部を備えた外装枠にコン
デンサを収納し、コンデンサのリード線を外装枠の開口
端面から底面に沿って折り曲げたことを特徴としている
。This invention stores the capacitor in an exterior frame that has a storage space that matches the outer diameter of the capacitor and has a protrusion on the bottom with a height that is approximately the same as the outer diameter of the capacitor's lead wire. It is characterized in that the lead wire is bent from the open end surface of the exterior frame along the bottom surface.
この発明では、第２図に示したように、外装枠２のプリ
ント基板１０に面する側面には、リード線３の厚みもし
くは径寸法とほぼ同一寸法の突起部６が設けられている
。したがって、リード線３を外装枠２の開口端面から突
起部６が形成された側面に沿って折り曲げることにより
、一対のリード線３の先端部分と、前記外装枠２の突起
部６との少な（とも３点以上でチップ形コンデンサを支
持することとなり、半田付は工程におけるリフロー熱が
コンデンサ１に直接に伝導することはなくなる。また、
従来のような厳密な加工精度を要求されることなく外装
枠の底面をほぼ平面状態にすることができ、チップ形コ
ンデンサの安定性を確保できる。In this invention, as shown in FIG. 2, a protrusion 6 having substantially the same thickness or diameter as the lead wire 3 is provided on the side surface of the exterior frame 2 facing the printed circuit board 10. Therefore, by bending the lead wires 3 from the open end surface of the exterior frame 2 along the side surface on which the protrusion 6 is formed, the tip portions of the pair of lead wires 3 and the protrusion 6 of the exterior frame 2 can be bent ( In both cases, the chip type capacitor is supported at three or more points, and the reflow heat during the soldering process is not directly conducted to the capacitor 1.
The bottom surface of the outer frame can be made almost flat without requiring the strict processing precision required in the past, and the stability of the chip capacitor can be ensured.
次いで、この発明の実施例を図面にしたがい説明する。 Next, embodiments of the invention will be described with reference to the drawings.
第１図は、この発明の実施例を示した斜視図、第２図は
、この発明の実施例によるデツプ形コンデンサを示した
一部断面図である。第３図は、リード線の部分斜視図、
第４図は、この発明の第２の実施例、第５図は、この発
明の第３の実施例を示した斜視図である。FIG. 1 is a perspective view showing an embodiment of the invention, and FIG. 2 is a partially sectional view showing a dip-type capacitor according to an embodiment of the invention. FIG. 3 is a partial perspective view of the lead wire;
FIG. 4 is a perspective view showing a second embodiment of the invention, and FIG. 5 is a perspective view showing a third embodiment of the invention.
コンデンサ１本体は、図示しない電極箔と電解紙とを巻
回して形成したコンデンサ素子をアルミニウム等がちな
る有底筒状の外装ケースに収納し、外装ケース開口端を
封口体４で密封するとともに、コンデンサ素子から導出
されたリード線３を前記封口体４を貫通させて外部に導
いた構成からなる。The capacitor 1 body houses a capacitor element formed by winding electrode foil and electrolytic paper (not shown) in a bottomed cylindrical outer case made of aluminum or the like, and seals the open end of the outer case with a sealing body 4. It consists of a structure in which a lead wire 3 led out from a capacitor element is passed through the sealing body 4 and guided to the outside.
このコンデンサ１は、内部にコンデンサ１の外径寸法に
適合した円筒状の収納空間を有する外装枠２に収納され
る。This capacitor 1 is housed in an exterior frame 2 that has a cylindrical storage space that matches the outer diameter of the capacitor 1 inside.
この外装枠２は耐熱性に優れた材質を使用することが望
まれ、好ましくは、耐熱性に優れたエポキシ、フェノー
ル、ポリイミド等の耐熱性合成樹脂、セラミック材等が
適当である。また別の実施例として第４図に示したよう
に、外装枠２の開口端部、特にコンデンサ１のリード線
３の導出側開口端部にコンデンサ１を係止する突片５を
設けてもよい。It is desirable to use a material with excellent heat resistance for the exterior frame 2, and preferably heat-resistant synthetic resins such as epoxy, phenol, polyimide, etc., which have excellent heat resistance, ceramic materials, etc. are suitable. As another embodiment, as shown in FIG. 4, a projecting piece 5 for locking the capacitor 1 may be provided at the open end of the outer frame 2, particularly at the open end on the lead-out side of the lead wire 3 of the capacitor 1. good.
更に、コンデンサ１のリードｖＡ３の先端部分が配置さ
れる外装枠２の底面７には、リード線３の外形寸法とほ
ぼ同じ高さの寸法に形成された突起部６が設けられてい
る。この実施例では、突起部６は、コンデンサ１のリー
ド線３が導出された開口端面に対向する端面と、リード
線の先端部分が接する側面（図面中の底面７）との縁部
付近に設けた。この突起部６は、リード線３の先端部分
とともにチップ形コンデンサ全体を支持することになる
。Furthermore, on the bottom surface 7 of the exterior frame 2 where the tip end portion of the lead vA3 of the capacitor 1 is arranged, a protrusion 6 is provided which is formed to have approximately the same height as the external dimension of the lead wire 3. In this embodiment, the protrusion 6 is provided near the edge of the end surface opposite to the opening end surface from which the lead wire 3 of the capacitor 1 is led out, and the side surface (bottom surface 7 in the drawing) that is in contact with the tip of the lead wire. Ta. This protrusion 6 supports the entire chip-type capacitor together with the tip portion of the lead wire 3.
外部接続用のリード線３はコンデンサ１の導出部から外
装枠２の開口端面、更には外装枠２の底面７に沿って、
コンデンサ１の端面にほぼ平行に折り曲げられてプリン
ト基板に臨む。このとき、リード線３には、第３図に示
したように、予め一部に偏平部８を設け、この偏平部８
を基点にリード線３を折り曲げると加工が容易となる。The lead wire 3 for external connection runs from the lead-out portion of the capacitor 1 to the open end surface of the exterior frame 2 and further along the bottom surface 7 of the exterior frame 2.
It is bent almost parallel to the end face of the capacitor 1 and faces the printed circuit board. At this time, as shown in FIG.
Processing becomes easier by bending the lead wire 3 based on .
このようにして形成されたチップ形コンデンサは、第２
図に示したように、リード線３の先端部分と、突起部６
とによって、プリント基板１０上に平行に支持される。The chip capacitor formed in this way is
As shown in the figure, the tip of the lead wire 3 and the protrusion 6
are supported in parallel on the printed circuit board 10.
次いで第４図に示した発明の第２の実施例を説明する。Next, a second embodiment of the invention shown in FIG. 4 will be described.
第１の実施例と同様に形成されたコンデンサ１は、内部
に収納空間を有する外装枠１１に収納される。この外装
枠１１は、底面のほぼ中央部付近において、リード線３
の外径寸法とほぼ同じ高さ寸法であるとともに、底面を
２分する突起部９を備えている。この突起部９は、外装
枠１１に収納したコンデンサ１から導かれたリード線３
の中間に位置し、２本のリード線３を２分することにな
る。そのため、この突起部９が半田付は工程における半
田の拡散をこの突起部９で抑止し、半田の架橋によるシ
ョートを防止することもできる。A capacitor 1 formed in the same manner as the first embodiment is housed in an exterior frame 11 having a storage space inside. This exterior frame 11 has a lead wire 3 near the center of the bottom surface.
It is provided with a protrusion 9 which has a height dimension that is approximately the same as the outer diameter dimension and which divides the bottom surface into two. This protrusion 9 is connected to a lead wire 3 led from a capacitor 1 housed in an exterior frame 11.
It is located midway between the two lead wires 3 and divides the two lead wires 3 into two. Therefore, the protrusion 9 can suppress the diffusion of solder during the soldering process, and can also prevent short circuits due to crosslinking of the solder.
第５図は、この発明の第３の実施例を外装枠１２の底面
方向から示した斜視図である。この実施例では、外装枠
１２の底面に、この底面の長手方向の辺部にリード線３
の外径寸法とほぼ同じ高さに形成された突起部１３を設
けた。そして、コンデンサ１のリード線３は、第１およ
び第２の実施例と同様に外装枠１２の開口端面から底面
に沿って折り曲げられ、底面の突起部１３に当接してい
る。FIG. 5 is a perspective view of a third embodiment of the present invention, viewed from the bottom of the exterior frame 12. In this embodiment, lead wires 3 are attached to the bottom surface of the exterior frame 12 on the longitudinal sides of the bottom surface.
A protrusion 13 is formed to have a height approximately the same as the outer diameter dimension. The lead wire 3 of the capacitor 1 is bent from the open end surface of the exterior frame 12 along the bottom surface, as in the first and second embodiments, and is in contact with the protrusion 13 on the bottom surface.
この実施例の場合も、第１および第２の実施例と同様に
、外装枠１２の底面に設けられた突起部１３がコンデン
サｌのリード線３とほぼ同じ高さに形成されているので
、外装枠１２の安定性が確保できる。また、外装枠１２
の外部側面からの半田等の侵入を防止することができる
。In this embodiment, as in the first and second embodiments, the protrusion 13 provided on the bottom surface of the exterior frame 12 is formed at approximately the same height as the lead wire 3 of the capacitor l. The stability of the exterior frame 12 can be ensured. In addition, the exterior frame 12
It is possible to prevent solder, etc. from entering from the external side of the device.
なお、外装枠の底面に設けられる突起部は、上記にあげ
た第１ないし第３の実施例に限定されるものではなく、
リード線の外形寸法とほぼ同じ高さ寸法の突起部であれ
ば他の形状であってもよい。Note that the protrusion provided on the bottom surface of the exterior frame is not limited to the first to third embodiments listed above.
The protrusion may have any other shape as long as it has approximately the same height as the external dimension of the lead wire.
例えば外装枠側面の角部に非連続状の突起部を設−ける
と、チップ形コンデンサとプリント基板との間隙が拡大
するので、半田熱の放熱効果が向上する。For example, if a discontinuous protrusion is provided at the corner of the side surface of the outer frame, the gap between the chip capacitor and the printed circuit board will be enlarged, thereby improving the heat dissipation effect of soldering heat.
また、リード線の形状を偏平状に形成してもよい。この
場合は、偏平状のリード線の厚みとほぼ同じ高さの突起
部を外装枠の側面に設けることになる。Further, the shape of the lead wire may be formed into a flat shape. In this case, a protrusion having approximately the same height as the thickness of the flat lead wire is provided on the side surface of the exterior frame.
以上のように、この発明は、円筒形のコンデンサと、こ
のコンデンサの外径寸法に適合した円筒状の収納空間を
有し、かつ少なくとも−の外側面に、コンデンサの外部
接続用のリード線の外形寸法とほぼ同じ高さ寸法に形成
した突起部を有する外装枠とからなり、該外装枠に収納
されたコンデンサから導かれたリード線が、外装枠の開
口端面から突起部が形成された外表面に沿って折り曲げ
られたことを特徴としているので、この発明によるチッ
プ形コンデンサはリード線の先端部分および外装枠側面
の突起部の少なくとも３点で支持されることになり、プ
リント基板に実装して半田付工程を施した場合、その半
田熱が直接にコンデンサ本体に伝導することがなくなる
。したがって、半田熱よる熱劣化を抑制することができ
、結果としてコンデンサの寿命特性を助長させることが
可能となる。As described above, the present invention has a cylindrical capacitor, a cylindrical storage space that matches the outer diameter of the capacitor, and a lead wire for external connection of the capacitor on at least the outer surface of the capacitor. It consists of an exterior frame having a protrusion formed to have approximately the same height as the exterior dimensions, and a lead wire led from a capacitor housed in the exterior frame is connected to the exterior with the protrusion formed from the open end surface of the exterior frame. Since the chip capacitor according to the present invention is characterized by being bent along the surface, it is supported by at least three points: the tip of the lead wire and the protrusion on the side of the exterior frame, and is easy to mount on a printed circuit board. If a soldering process is performed on the capacitor, the soldering heat will not be directly conducted to the capacitor body. Therefore, thermal deterioration due to soldering heat can be suppressed, and as a result, the life characteristics of the capacitor can be improved.
また、半田熱により膨張した空気は、リード線の先端部
分および突起により形成された空隙から外部に放出され
る。そのため、半田付は工程での膨張した空気圧による
コンデンサの位置ズレを防止することができる。Further, air expanded by the soldering heat is discharged to the outside from the gap formed by the tip portion of the lead wire and the protrusion. Therefore, soldering can prevent the capacitor from shifting due to expanded air pressure during the process.
また、外装枠側面に設けられた突起は、リード線の外形
寸法とほぼ同じ高さ寸法に形成されているので、このコ
ンデンサの製造工程では、リード線の先端部分を外装枠
の突起部が形成された側面に沿って、かつ突起部を基準
に折り曲げれば、コンデンサとプリント基板との平行状
態を実現できる。したがって、従来のように、特にリー
ド線の折り曲げ位置を調節することな（、また、溝部等
にリード線を収納することなく、リード線の先端部分と
突起部とをほぼ同一平面上に位置させることが容易とな
る。そこで、この発明によるチップ形コンデンサをプリ
ン）ｌ板に載置すると、プリント基板とほぼ平行に載置
されることになり、極めて安定した状態を得ることがで
きる。In addition, the protrusions on the side of the outer frame are formed to have almost the same height as the external dimensions of the lead wires, so in the manufacturing process of this capacitor, the protrusions on the outer frame form the tips of the lead wires. By bending the capacitor along the curved side surface and using the protrusion as a reference, the capacitor and the printed circuit board can be placed in a parallel state. Therefore, unlike conventional methods, it is not necessary to adjust the bending position of the lead wire (or store the lead wire in a groove, etc.), and the tip of the lead wire and the protrusion can be positioned on almost the same plane. Therefore, if the chip capacitor according to the present invention is placed on a printed circuit board, it will be placed almost parallel to the printed circuit board, and an extremely stable state can be obtained.
更に、この発明では、内部に収納空間を有する筒状の外
装枠にコンデンサを収納している。したがって、製造工
程においては、従来のように外装枠に設けた貫通孔等に
リード線を挿通させる手間が省け、製造工程を筒路にす
ることができる。Furthermore, in this invention, the capacitor is housed in a cylindrical exterior frame that has a storage space inside. Therefore, in the manufacturing process, there is no need to insert the lead wire into a through hole or the like provided in the exterior frame as in the conventional case, and the manufacturing process can be performed in a cylindrical manner.
以上のように、この発明は、通常のコンデンサの構造を
変更することなく優れた耐熱性を示し、かつ製造工程で
のリード線の加工精度に影古されることなく安定性を維
持するチップ形コンデンサを簡易に提供することができ
る。As described above, the present invention has developed a chip shape that exhibits excellent heat resistance without changing the structure of an ordinary capacitor, and that maintains stability without being affected by the machining accuracy of lead wires during the manufacturing process. Capacitors can be easily provided.
第１図は、この発明の実施例を示した斜視図、第２図は
、この発明の実施例によるチップ形コンデンサを示した
一部断面図である。第３図は、リード線の部分斜視図、
第４図は、この発明の第２の実施例、第５図は、この発
明の第３の実施例を示した斜視図である。
１・・コンデンサ、２．ｌＬ１２・・外装枠、３・・リ
ード線、４・・封口体、５・・突片、６．９．１３・・
突起部、８・・偏平部、１０・・プリント基板。FIG. 1 is a perspective view showing an embodiment of the invention, and FIG. 2 is a partially sectional view showing a chip-type capacitor according to an embodiment of the invention. FIG. 3 is a partial perspective view of the lead wire;
FIG. 4 is a perspective view showing a second embodiment of the invention, and FIG. 5 is a perspective view showing a third embodiment of the invention. 1. Capacitor, 2. lL12... Exterior frame, 3... Lead wire, 4... Sealing body, 5... Projection piece, 6.9.13...
Projection part, 8... Flat part, 10... Printed circuit board.
Claims (1)
るとともに、底面にコンデンサのリード線の外径寸法と
ほぼ同じ高さ寸法の突起部を備えた外装枠にコンデンサ
を収納し、コンデンサのリード線を外装枠の開口端面か
ら底面に沿って折り曲げたことを特徴とするチップ形コ
ンデンサ。(1) The capacitor is stored in an exterior frame that has a storage space that matches the outside diameter of the capacitor and has a protrusion on the bottom with a height that is approximately the same as the outside diameter of the capacitor lead wire. A chip-type capacitor characterized by a wire that is bent from the open end surface of the outer frame along the bottom surface.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161430A JPH0650698B2 (en) | 1987-12-09 | 1988-06-29 | Chip type capacitor |
| US07/281,456 US4972299A (en) | 1987-12-09 | 1988-12-08 | Chip type capacitor and manufacturing thereof |
| DE88120654T DE3887480T2 (en) | 1987-12-09 | 1988-12-09 | Chip capacitor and manufacturing method. |
| KR1019880016387A KR970006430B1 (en) | 1987-12-09 | 1988-12-09 | Tip type condenser and its manufacturing method |
| DE3854437T DE3854437T2 (en) | 1987-12-09 | 1988-12-09 | Chip capacitor. |
| EP88120654A EP0320013B1 (en) | 1987-12-09 | 1988-12-09 | Chip type capacitor and manufacturing thereof |
| EP92116062A EP0522600B1 (en) | 1987-12-09 | 1988-12-09 | Chip type capacitor |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-311409 | 1987-12-09 | ||
| JP31140987 | 1987-12-09 | ||
| JP63161430A JPH0650698B2 (en) | 1987-12-09 | 1988-06-29 | Chip type capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01257314A true JPH01257314A (en) | 1989-10-13 |
| JPH0650698B2 JPH0650698B2 (en) | 1994-06-29 |
Family
ID=26487580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161430A Expired - Lifetime JPH0650698B2 (en) | 1987-12-09 | 1988-06-29 | Chip type capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650698B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530U (en) * | 1983-08-03 | 1985-03-01 | 信英通信工業株式会社 | capacitor |
| JPS61203540U (en) * | 1985-06-07 | 1986-12-22 |
-
1988
- 1988-06-29 JP JP63161430A patent/JPH0650698B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530U (en) * | 1983-08-03 | 1985-03-01 | 信英通信工業株式会社 | capacitor |
| JPS61203540U (en) * | 1985-06-07 | 1986-12-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0650698B2 (en) | 1994-06-29 |
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