JPH01257529A - Part taking out method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component extraction method that can be suitably used in an electronic component mounting machine, etc., which takes out components from a tray containing components in a matrix and mounts them on a board. .

Conventional technology For example, in an electronic component mounting machine that targets large IC components, electronic components are sucked by a suction nozzle from a component supply section in which trays containing electronic components in a matrix are stacked in multiple stages. The type that can be taken out and attached to a board is often used.

To take out components from the component supply section, the component arrangement pitch of the trays and the number of stacked trays are manually input into the control section, or by reading a display means etc. provided on the box in which the trays are stacked and stored. Based on the control program, the suction nozzle is moved horizontally and positioned above the parts to be suctioned in sequence in the tray, and is moved at high speed to the height of the tray. It descends to pick up the parts, picks up the parts, rises, and transports them to a predetermined position on the board. This process is repeated. When the tray becomes empty, the tray is discarded, and the suction/X"le is It repeats the operation of being positioned above the parts in the next tray to be taken out sequentially, and descending at high speed to a position equal to the height of the previous tray minus the thickness of one tray to pick up the parts. : The components in the stacked trays are automatically and efficiently taken out one after another.

Problems to be Solved by the Invention However, with the above method, if a tray is added midway or a box in which trays are stacked is replaced, data to correct the number of stacked trays must be input correctly. If the suction nozzle interferes with the tray and there is a large error in the height position of the tray due to uneven tray height or accumulated deflection, the suction nozzle, etc. 8! There was a problem that the structural part was destroyed, and there was also a problem that the operation of inputting the correction data for the number of stacked layers was troublesome.

In direct view of the above-mentioned conventional problems, the present invention solves the following problems:) addition of rays;
The object of the present invention is to provide a parts removal method that can safely and automatically take out parts without inputting correction data for the number of stacked layers each time it is replaced.

Means for Solving the Problems In order to achieve the above object, the present invention uses a suction unit 77 which is horizontally movable and capable of raising and lowering parts in a parts supply unit which is made up of a plurality of stacked trays containing parts in a matrix. ：Method of taking out parts by suction with a tray - 2, when taking out the parts at the first take-out position of each tray, the parts are immediately removed to the vicinity of the height of the tray from which the parts were taken out, or the trays are stacked. If there is a change in the number of trays, lower the suction/: ! ! At the same time, the suction nozzle was lowered by suction and taken out, and the position where the suction nozzle contacted the component was memorized as the height position of this tray, and from now on, the suction nozzle was lowered at high speed to near the height position of this tray. It is characterized by being lowered at low speed to pick up parts and take them out.

Function Since the present invention has the above configuration, it is possible to add a tray,
When the number of trays is changed by replacing a box with stacked trays, the suction nozzle descends at high speed to a position close to the tray height when the maximum number of trays are stacked, and then descends at low speed to stack the trays. The height position of the tray is detected and memorized, and from then on, it descends at high speed to that detected height position to take out the parts, and even when the tray is empty and the first part of the next tray is taken out, the previous tray is After descending at high speed to the height position of There is no need to input correction data when adding or replacing the tray, and there is no risk that the suction/7: lever will interfere with the tray even if the tray height is uneven or there is deflection.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 4.

In FIG. 3 showing the entire electronic component mounting machine, reference numeral 1 denotes a tray containing electronic components in a matrix, which is held in a tray box 2 in a plurality of stacked stages. A plurality of tray boxes 2 are arranged in parallel in the component supply section 3.

4 is a horizontal movement mechanism consisting of an X tape 4a and a Y tape 411 for moving the rad 5 to take out in the horizontal X direction and the be. Reference numeral 7 denotes a centering table, which positions the electronic component so that the electronic component supplied to position A of fjrJl by suction nozzle 6 is moved to second position B. Reference numeral 8 denotes a mounting head, which is placed between the second position B of the centering table 7 and the substrate 1 on the X-Y table 9.
0 is movable in the horizontal direction between arbitrary positions, and a mounting/holding lever 11 for holding electronic components by suction is provided so as to be removable. The electronic component is mounted on the board by correcting the detected position and orientation deviation using a position detection means that detects minute deviations in position and orientation of the electronic component.

As shown in FIG. 4, the tray box 2 has a pair of positionally adjustable regulating means 1 so as to be able to regulate and hold trays 1 of various sizes stacked in multiple stages.
3a and 13b. In addition, the parts supply section 3 includes
A pair of positioning members 14a, 1-4b are provided to position and install the tray box 2 at a predetermined position, and a microswitch 15 for detecting attachment/detachment of the tray box 2 is also provided. 16 is tray box 2
It is a magnet that attracts and fixes.

Moreover, the ejector rad 5 has an elevating mechanism 8 for elevating and lowering the suction nozzle 6! A detection means 17 is provided for detecting when the suction nozzle 6 comes into contact with an electronic component and retracts. Although not shown, a tray suction nozzle for suctioning and discarding empty trays is also provided.

Next, the operation will be explained.

To explain the operation of taking out an electronic component from the tray 1 and mounting it on the board 10, the horizontal movement mechanism 4 moves the gamma board 5 to position it above the electronic component to be taken out, and then the elevator M1116 picks it up. The nozzle 6 is lowered at high speed to near the pre-stored height position of the tray 1, and then lowered at low speed. When the suction nozzle 6 comes into contact with an electronic component, the suction nozzle 6 moves back and forth, which is detected by the detection means 17, stops the descent and suctions the electronic component, and then the suction nozzle 6 rises to take out the electronic component. Radar 5 moves horizontally and supplies electronic components to first position A of centering table 7.

The electronic components supplied to the centering table 7 are transported to the second position B and positioned therebetween.

Further, this positioned electronic component is held at the second position B by suction by the mounting nozzle 11 of the mounting pad 8, and then the position detection means 12 detects minute deviations in position and posture. , the electronic component is positioned at a predetermined mounting position on the board 10 using the X-Y table 9, and the electronic component is mounted onto the board 10 after correction of deviations in the position and posture of the electronic component by the mounting N7 nozzle 11.

By repeating the above operations, the electronic components held in the tray 1 are sequentially taken out and mounted on the board 10.Next, when the tray 1 becomes empty and the electronic components are taken out from the next tray, , and if you add tray 1 to tray box 2 or replace tray box 2, fi! ! The operation of the take-out nozzle that can automatically cope with changes in control data will be explained based on charts 70 in FIGS. 1 and 2.

First, after starting the operation, as a prerequisite operation, the suction nozzle 6
is the topmost tray 1 when the maximum number of trays 1 is stacked.
Tray 1 descends at high speed until it reaches the height of
In step S1, it is determined whether there has been a change such as an addition. This tray change determination is performed sequentially as shown in FIG. 2. BrJ, in step Sll, if this is the first operation after the electronic component removal data has been changed due to a model change, etc., if the previous height position information has been reset in step S12, in step S13, the addition of tray 1 is Tray box 2 is attached and detached for
If this is detected by the microswitch 15, it is determined that each tray 1 has been changed, and if none of them is detected, it is determined that there is no change.

If there is no change in the tray 1, the suction nozzle 6 is lowered at high speed to near the currently stored height position of the tray in step S2. Next, in step S3, it is determined whether or not to take out the first component on the tray 1, and if it is the second or subsequent component, in step S4, the suction 7/zzle 6 is lowered at low speed until it comes into contact with the electronic component.

On the other hand, if tray 1 is changed in step S1, from the maximum height position, or if the first electronic component of tray 1 is to be taken out as determined in step s3, near the currently stored height position of the previous tray. At the same time, the suction/:
), the height position at which it abuts on the electronic component is stored as the current height position in step S6.

Next, in step S7, the electronic components are taken out as described above, and then in step S8, it is determined whether or not all the electronic parts on tray 1 have been taken out.If there are any electronic parts left on tray 1, then step S1 is carried out. If there is no remaining tray 1, the tray 1 is discarded in step S9, and in step S10 it is determined whether or not tray 1 remains in the tray box 2. If there is, the process returns to step S1. If there are no trays left, the ejecting operation is stopped, and a warning message indicating that there are no trays is displayed as necessary.

As described above, even if there is a change in the stacked number of trays 1 due to the addition of tray 1, electronic components can be automatically taken out one by one using the suction nozzle without inputting correction data. There is no risk of interference between the suction nozzle 6 and the tray 16. Effects of the Invention According to the parts removal method of the present invention, the number of trays can be changed by adding a tray or replacing the box with stacked trays as described above. If there is, the suction nozzle descends at high speed to near the tray height position when the maximum number of trays are stacked, and then descends at low speed to detect and memorize the tray height position. It descends at high speed to the detection height position and takes out the parts, and when the tray is empty and takes out the first part of the next tray, it descends at high speed to the height position of the previous tray and then repeats the above process. Similarly, the height position of the next tray is detected and memorized, and from then on, it descends at high speed to the detected height position and takes out the parts, so there is no need to input correction data when adding or replacing a tray. , there is no risk of the suction nozzle interfering with the tray even if the tray height is uneven or there is deflection, and the low-speed descending section during normal parts removal operation can be shortened, and it can be used in other than normal operations. Since the stroke of lowering the suction nozzle at a low speed is not very long, it has great effects, such as improving the overall efficiency of picking out parts, considering the time and effort required to input the correction data.

[Brief explanation of the drawing]

1 to 4 show an embodiment of the present invention, in which FIG. 1 is a 70-chart for an electronic component removal operation, FIG. 2 is a 70-chart for a tray change judgment subroutine, and FIG. 3 is a 70-chart for an electronic component removal operation. FIG. 4 is a plan view showing the overall configuration of the mounting machine, and FIG. 4 is a partially cutaway perspective view showing the configuration of the tray box and the take-out head. 1...Tray 2...Tray box 4...Horizontal movement mechanism 5...Take-out head 6. ......Adsorption nozzle 15...Micro switch 16...
...Lifting mechanism 17...Detection means. Acting Am Patent Attorney Toshio Nakao and 1 other person Figure 1 Figure 2 1-1 To L A 6- Vertical a22, °11-

Claims (1)

[Claims] In a component retrieval method in which components are removed by suction from a component supply unit, which is made up of multiple stacked trays containing components in a matrix, using a suction nozzle that can be moved horizontally and can be raised and lowered, the first retrieval position of each tray is When taking out a part, the height of the tray that is close to the height of the tray from which the part was taken out before, or if the number of stacked trays has changed, the height of the top tray when the maximum number of trays is stacked. The suction nozzle is lowered at high speed until it comes into contact with the component, and then lowered at low speed until it comes into contact with the component to pick up the component and take it out. The method for taking out parts is characterized in that a suction nozzle is lowered at high speed to near the height of this tray and then lowered at low speed to suck and take out the parts.