JPH01258499A - Chiplike electronic component feeding method - Google Patents
Chiplike electronic component feeding methodInfo
- Publication number
- JPH01258499A JPH01258499A JP63086822A JP8682288A JPH01258499A JP H01258499 A JPH01258499 A JP H01258499A JP 63086822 A JP63086822 A JP 63086822A JP 8682288 A JP8682288 A JP 8682288A JP H01258499 A JPH01258499 A JP H01258499A
- Authority
- JP
- Japan
- Prior art keywords
- component
- chip
- pin
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000013039 cover film Substances 0.000 abstract description 5
- 239000010408 film Substances 0.000 abstract description 2
- 206010034719 Personality change Diseases 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、チップ状電子部品装着工程における部品供給
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a component supply method in a chip-shaped electronic component mounting process.
（ロ） 従来の技術
チップ状電子部品を回路基板に装着する工程において、
チップ状電子部品をキャリヤテープのポケットに入れて
供給する方式は既に広く採用されるところとなっており
、装置例としても実開昭６１−２７４０１号公報、同５
７−１４８８ｎ号公報に記載されたものの外、多数を挙
げることができる。他方基板上の実装密度を高めるため
、これまで最大面積側面を基板面にあてがって装着する
のが通例であったチップ状電子部品を、その最大面積イ
則面を垂直に立てて（第５図参照）装着する方式が注目
きれ出している。このような考え方の例は、実開昭５４
−１３１９４６号公報、同５６−１１２９７１号公報、
同５７−６１８６８号公報等に見ることができる。(b) Conventional technologyIn the process of attaching chip-shaped electronic components to a circuit board,
The method of supplying chip-shaped electronic components by placing them in the pockets of a carrier tape has already been widely adopted, and examples of the device include those disclosed in Japanese Utility Model Application No. 61-27401 and Japanese Utility Model Application Publication No. 5.
In addition to those described in JP 7-1488n, there are many others. On the other hand, in order to increase the mounting density on the board, chip-shaped electronic components, which up until now had been customary to be mounted with their largest area sides facing the board surface, are now being mounted with their largest area sides perpendicular (see Figure 5). Reference) The method of attachment is attracting a lot of attention. An example of this kind of thinking is
-131946 publication, 56-112971 publication,
This can be found in Japanese Patent No. 57-61868.
（ハ）発明が解決しようとする課題
本発明は、チップ状電子部品を、その最大面積側面を垂
直にした状態で部品吸着装置に吸着さ叶ることのでさる
部品供給方法を提供しようとするものである。(C) Problems to be Solved by the Invention The present invention seeks to provide a component supply method in which a chip-shaped electronic component is sucked into a component suction device with its largest area side face perpendicular. It is.
（ニ）課題を解決するための手段
本発明においては、チップ状電子部品の供給手段として
、チップ状電子部品を、その最大面積側面がポケット底
面に接する状態で収納したキャリヤアープを用いる。そ
して、部品吸着に先立ち、ポケット内に底面より部品突
き上げピンを侵入させる。侵入位置はポケット中心から
外すものとする。(d) Means for Solving the Problems In the present invention, as a means for supplying chip-shaped electronic components, a carrier arc is used in which chip-shaped electronic components are housed in a state where the side surface with the largest area is in contact with the bottom surface of the pocket. Then, prior to component suction, a component push-up pin is inserted into the pocket from the bottom. The entry point shall be away from the center of the pocket.
（ホ）作用
ボケ・／ト内に侵入した部品突き上げピンにより、チッ
プ状重子部品は片側を突き上げられ、最大面積側面が垂
直に向く、すなわち立った状態になる。この状態で真空
吸着装置を接近させれば、チップ状重子部品は初期の姿
勢で吸着されることになる。(e) Operation blur: The chip-like weighted component is pushed up on one side by the component push-up pin that has entered the hole, and the side surface with the largest area is oriented vertically, that is, it is in an upright state. If the vacuum suction device is approached in this state, the chip-like heavy element component will be suctioned in its initial posture.
（へ〉 実施例
第１図において、（１０）はチップ状電子部品（１）を
１個づつ供給するキャリヤテープである。キャリヤテー
プ（１０）は厚紙製で、チップ状電子部品（１）を収納
するためのポケット（１１）と送り用パーフォレーショ
ン（１２〉とを一定ピツチで打ち抜き、ポケッ）（１１
）にチップ状重子部品（１）を入れ、上下面に透明なカ
バーフィルム（１３）（１４＞を貼り付けたものである
。チップ状電子部品（１〉は直方体形状であって、ポケ
ット（１１）の底面を構成するカバーフィルム（１４）
に、その最大面積側面が接する形で収納されている。キ
ャリヤテープ（１０）は、図示しないスプロケットにパ
ーフォレーション（１２）を係合させ、１ピツチづつ前
進せしめられる。キャリヤテープ（１０）は第２図に示
すテープ支持板（２０）とテープ押さえ板（２１）の間
をくぐって水平に１ｔｉｉ進する。テープ押さえ板（２
１）の先端近くにはテープ送り方向と直角なスリット（
２２）を一方の側縁から切り込む形で形成し、カバーフ
ィルム（１３）のみこのスリット（２２）を通して折り
返し、図示しない巻き取りリールに巻きつける。テープ
押さえ板（２１）の、スリット（２２）より先の部分は
、上面露出状態となったポケット（１１）からチップ状
重子部品（１）が脱出するのを阻止する、部品押さえ（
２３）となっている、上面露出状態のポケット（１１）
が部品押さえ（２３）からほぼ姿を現わしたところでキ
ャリヤテープ（１０）の１ピッチ送り動作が終了し、キ
ャリヤテープ（１０）はその位置に暫時停止する。この
時部品押さえ（２３〉の先端は、僅かにオーバーハング
となってポウ゛ット（１１）の縁に張り出している。
（２５）は部品吸着装置で、図においてはノズル先端部
分のみ示してこれを象徴させている。 （２７）は先端
の尖った部品突き上げピンで、テープ支持板（２０）の
透孔（２８）を通じ、部品押さえ（２３）の下から抜は
出したボう゛ット（１１）に侵入する。侵入位置はポケ
ット（１１）の中心より前部りに偏位している。(F) Example In FIG. 1, (10) is a carrier tape that supplies the chip-shaped electronic components (1) one by one.The carrier tape (10) is made of cardboard and is used to supply the chip-shaped electronic components (1) Punch out the storage pocket (11) and the feeding perforation (12) at a certain pitch, and make the pocket (11).
), and transparent cover films (13) (14>) are pasted on the top and bottom surfaces.The chip-like electronic component (1>) has a rectangular parallelepiped shape, and has a pocket (11). ) cover film (14) that forms the bottom surface of the
It is stored in such a way that its largest area side is in contact with the . The carrier tape (10) is advanced one pitch at a time by engaging the perforations (12) with sprockets (not shown). The carrier tape (10) passes between the tape support plate (20) and the tape pressing plate (21) shown in FIG. 2 and advances horizontally. Tape holding plate (2
1) Near the tip there is a slit (
22) is formed by cutting it from one side edge, and only the cover film (13) is folded back through the slit (22) and wound around a take-up reel (not shown). The part of the tape holding plate (21) beyond the slit (22) is a part holding plate (21) that prevents the chip-like weighted component (1) from escaping from the pocket (11) whose upper surface is exposed.
23) Pocket with exposed top (11)
The one-pitch feeding operation of the carrier tape (10) ends when the carrier tape (10) almost emerges from the component holder (23), and the carrier tape (10) temporarily stops at that position. At this time, the tip of the component holder (23) slightly overhangs and protrudes over the edge of the port (11).
(25) is a parts suction device, and in the figure, only the nozzle tip is shown to symbolize this. Reference numeral (27) is a component push-up pin with a sharp tip, which penetrates through the through hole (28) of the tape support plate (20) and into the port (11) pulled out from under the component holder (23). The entry position is offset toward the front from the center of the pocket (11).
次に第２図乃至第４図に基き一連の動作を説明する。第
２図はこれから吸い上げられるべきチップ状電子部品（
１）を収納したポケット（１１）が部品押きえ（２３）
の下から出て来て停止したところである０部品吸着装置
（２５）はその上方で待機している。ここで部品突き上
げピン（２７）を上昇させると、部品突き上げピン（２
７）はカバーフィルム（１４）を突き破ってポケット（
１１）に侵入しく第３図）、チップ状電子部品（１）の
前部を持ち上げる０部品突き上げピン（２７〉を更に上
昇させると、チップ状重子部品（１）の最大面積側面は
次第に垂直に立って行く０部品押さえ（２３〉のオーバ
ーハング部はチップ状電子部品（１）の後部を引っ掛け
てチップ状重子部品の姿勢変換をより確実にする役割を
果たす、チップ状電子部品（１）がすっかり立ち上がっ
たところで部品吸着装置（２５〉を降下させると、チッ
プ状電子部品（１）は予定した姿勢で部品吸着装置ｔ（
２５）に吸い付けられることになる。その後部品吸着装
置（２５）は上昇してチップ状重子部品（１）を運び去
り、部品突き上げピン（２７）は下降してカバーフィル
ム（１４）から抜ける。Next, a series of operations will be explained based on FIGS. 2 to 4. Figure 2 shows the chip-shaped electronic components (
The pocket (11) that stores 1) is the parts holder (23)
The zero-component suction device (25), which came out from below and stopped, is waiting above it. If the component push-up pin (27) is raised here, the component push-up pin (27) will be raised.
7) breaks through the cover film (14) and inserts the pocket (
11) and lifts up the front part of the chip-shaped electronic component (1) (Fig. 3) further, the maximum area side of the chip-shaped heavy element (1) gradually becomes vertical. The overhang part of the 0-component holder (23) that stands up plays the role of hooking the rear part of the chip-shaped electronic component (1) to ensure the attitude change of the chip-shaped heavy component (1). When the component suction device (25) is lowered once it has fully stood up, the chip-shaped electronic component (1) is placed in the planned position on the component suction device t (
25). Thereafter, the component suction device (25) ascends and carries away the chip-like heavy component (1), and the component push-up pin (27) descends and comes out of the cover film (14).
（ト）発明の効果
本発明によれば、通例の如く最大面積側面がポケット底
面に接する形でキャリヤテープに収納されたチップ状電
子部品を、取り出しの都度確実に立ち上がらせることが
でき、チップ状電子部品高密度実装・＼の道を部品供給
の局面において開き得るものである。(g) Effects of the Invention According to the present invention, it is possible to reliably stand up chip-shaped electronic components that are normally stored in a carrier tape with the side surface with the largest area in contact with the bottom surface of the pocket each time the chip-shaped electronic component is taken out. This could pave the way for high-density electronic component packaging in the component supply aspect.
第１図乃至第４図は本発明の方法を実行するチップ状重
子部品供給装置の一例を示し、第１図は斜視図、第２図
乃至第４図は一例の動作を説明する断面図である。第５
図は最大面積側面を垂直にしてチップ状電子部品を供給
する意義を説明する斜視図である。
（１）・・・チップ状電子部品、（１０）・・・キャリ
ヤテープ、（１１）・・・ポケット、（２５〉・・・部
品吸着装置、（２７）・・・部品突き上げピン。1 to 4 show an example of a chip-like heavy element supply device for carrying out the method of the present invention, FIG. 1 is a perspective view, and FIGS. 2 to 4 are sectional views explaining the operation of the example. be. Fifth
The figure is a perspective view illustrating the significance of supplying a chip-shaped electronic component with its largest area side vertically. (1)...Chip-shaped electronic component, (10)...Carrier tape, (11)...Pocket, (25>...Component suction device, (27)...Component push-up pin.
Claims (1)
に、チップ状電子部品を、その最大面積側面がポケット
底面に接する状態で収納し、このポケットを順次部品吸
着装置の下に位置させて部品を吸着させるものにおいて
、 前記ポケット内に、その底面より、且つ中心を外れた位
置において、部品突き上げピンを侵入させ、もって最大
面積側面が水平から垂直に転するようチップ状電子部品
の姿勢を変え、この状態のチップ状電子部品の上面を前
記部品吸着装置に吸着させることを特徴とする電子部品
供給方法。(1) Chip-shaped electronic components are stored in pockets formed at a predetermined pitch on the carrier tape, with the side surface with the largest area touching the bottom of the pocket, and the pockets are sequentially positioned under the component suction device to pick up the components. In the device for suction, a component push-up pin is inserted into the pocket from the bottom surface and at a position off the center, thereby changing the posture of the chip-shaped electronic component so that the side surface with the largest area turns from horizontal to vertical; A method for supplying electronic components, characterized in that the upper surface of the chip-shaped electronic component in this state is sucked by the component suction device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63086822A JPH01258499A (en) | 1988-04-07 | 1988-04-07 | Chiplike electronic component feeding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63086822A JPH01258499A (en) | 1988-04-07 | 1988-04-07 | Chiplike electronic component feeding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01258499A true JPH01258499A (en) | 1989-10-16 |
Family
ID=13897500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63086822A Pending JPH01258499A (en) | 1988-04-07 | 1988-04-07 | Chiplike electronic component feeding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01258499A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5565008A (en) * | 1990-07-17 | 1996-10-15 | Mitsubishi Denki Kabushiki Kaisha | Process of raising a semiconductor device out of a pallet using a positioning rod |
| US8210357B2 (en) * | 2007-03-08 | 2012-07-03 | Panasonic Corporation | Taped component and method of mounting product using the same |
-
1988
- 1988-04-07 JP JP63086822A patent/JPH01258499A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5565008A (en) * | 1990-07-17 | 1996-10-15 | Mitsubishi Denki Kabushiki Kaisha | Process of raising a semiconductor device out of a pallet using a positioning rod |
| US8210357B2 (en) * | 2007-03-08 | 2012-07-03 | Panasonic Corporation | Taped component and method of mounting product using the same |
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