JPH0126117Y2 - - Google Patents

Info

Publication number
JPH0126117Y2
JPH0126117Y2 JP1983069981U JP6998183U JPH0126117Y2 JP H0126117 Y2 JPH0126117 Y2 JP H0126117Y2 JP 1983069981 U JP1983069981 U JP 1983069981U JP 6998183 U JP6998183 U JP 6998183U JP H0126117 Y2 JPH0126117 Y2 JP H0126117Y2
Authority
JP
Japan
Prior art keywords
stem body
reflector
stem
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983069981U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59176166U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983069981U priority Critical patent/JPS59176166U/ja
Publication of JPS59176166U publication Critical patent/JPS59176166U/ja
Application granted granted Critical
Publication of JPH0126117Y2 publication Critical patent/JPH0126117Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Optical Couplings Of Light Guides (AREA)
JP1983069981U 1983-05-11 1983-05-11 光半導体装置 Granted JPS59176166U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983069981U JPS59176166U (ja) 1983-05-11 1983-05-11 光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983069981U JPS59176166U (ja) 1983-05-11 1983-05-11 光半導体装置

Publications (2)

Publication Number Publication Date
JPS59176166U JPS59176166U (ja) 1984-11-24
JPH0126117Y2 true JPH0126117Y2 (cs) 1989-08-04

Family

ID=30200129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983069981U Granted JPS59176166U (ja) 1983-05-11 1983-05-11 光半導体装置

Country Status (1)

Country Link
JP (1) JPS59176166U (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6874910B2 (en) * 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
US7425083B2 (en) * 2005-05-02 2008-09-16 Samsung Electro-Mechanics Co., Ltd. Light emitting device package
JP4765563B2 (ja) * 2005-11-07 2011-09-07 セイコーエプソン株式会社 光モジュール
US8581487B2 (en) 2009-11-27 2013-11-12 Kyocera Corporation Light-emitting device with reflection layers

Also Published As

Publication number Publication date
JPS59176166U (ja) 1984-11-24

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