JPH01263100A - Production of metallic ornament with gem particles - Google Patents
Production of metallic ornament with gem particlesInfo
- Publication number
- JPH01263100A JPH01263100A JP63091661A JP9166188A JPH01263100A JP H01263100 A JPH01263100 A JP H01263100A JP 63091661 A JP63091661 A JP 63091661A JP 9166188 A JP9166188 A JP 9166188A JP H01263100 A JPH01263100 A JP H01263100A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- grains
- base material
- metal base
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adornments (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は宝石粒付き金属製装飾品の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing a metal ornament with gem grains.
〈従来の技術〉
従来より、メガネフレーム、ネクタイビン、ネックレス
、ブローチ、ブレスレット、指輪、カフス、時計バンド
、ピアス、イアリング、バックルなどの金属製装飾品に
、高価な天然及び人造の宝石を取付けることにより、金
属製装飾品の装飾効果を高めることが知られている。<Prior art> Traditionally, expensive natural and artificial jewelry has been attached to metal accessories such as eyeglass frames, tie bins, necklaces, brooches, bracelets, rings, cuffs, watch bands, earrings, buckles, etc. It is known that this enhances the decorative effect of metal ornaments.
〈発明が解決しようとする課題〉
しかしながら、このような従来の技術にあっては、比較
的大きめの宝石粒塊を機械的に金属製装飾品の表面に嵌
め込んで取付ける場合が殆どであったため、金属製装飾
品自体が甚だ高価なものになると共に、金属製装飾品を
形成する金属基材自体の加工も煩雑であった。従って、
量産には不向きであり、且つ機械的に嵌め込むようにし
ていたので、宝石粒塊が脱落してしまうおそれもあった
。<Problems to be Solved by the Invention> However, in most of these conventional techniques, relatively large gemstone agglomerates are mechanically fitted onto the surface of metal ornaments. However, the metal ornament itself has become extremely expensive, and the processing of the metal base material itself forming the metal ornament has been complicated. Therefore,
It was not suitable for mass production, and since it was fitted mechanically, there was a risk that the gemstone agglomerates would fall off.
そこで、最近では大きい宝石の粒塊を用いるのではなく
、比較的小さめの宝石粒を金属製装飾品の表面に付着さ
せることにより、上記の如き従来の課題の解決を図るこ
とが考えられているが、今までに有効な手段が提案され
ずにいた。Therefore, recently it has been considered to solve the above conventional problems by attaching relatively small gemstone particles to the surface of metal ornaments, rather than using large gemstone agglomerates. However, until now no effective means have been proposed.
〈課題を解決するための手段〉
この発明に係る宝石粒付き金属製装飾品の製造方法は、
上記の如き従来の課題を解決すべく提案されたものであ
り、所定形状に成形した金属基材をメッキ液中に浸し、
該メッキ液中における金属基材の表面に対して全石粒を
施し、次いで該金属基材の電解メッキ処理を行って形成
した第1メッキ層により全石粒を金属基材の表面に固定
し、そして、前記第1メッキ層にて固定されなかった全
石粒を除去した後、金属基材を更に別のメッキ液に浸し
て電解メッキ又は無電解メッキ処理を行うことにより、
金属基材の表面に第2メッキ層を1層又は2層以上形成
するものである。<Means for Solving the Problems> A method for manufacturing a metal ornament with gem grains according to the present invention includes:
This method was proposed to solve the above-mentioned conventional problems, and involves immersing a metal base material formed into a predetermined shape in a plating solution.
The whole stone grains are applied to the surface of the metal base material in the plating solution, and then the whole stone grains are fixed to the surface of the metal base material with a first plating layer formed by electroplating the metal base material. Then, after removing all the stone grains that were not fixed in the first plating layer, the metal base material is further immersed in another plating solution to perform electrolytic plating or electroless plating treatment,
One or more second plating layers are formed on the surface of a metal base material.
〈作 用〉
すなわち、この発明に係る全石粒は、金属基材の表面で
第1メッキ層及び第2メッキ層より物理的に包含された
状態で固定されるので脱落するおそれがない。つまり、
金属基材の表面に施された全石粒は、メッキ処理上にお
いては「絶縁物」となるので、第1及び第2メッキ層は
この全石粒を避けた状態で、全石粒の隙間を埋めながら
確実に成長し、全石粒の金属基材側半分を包み込むよう
に形成され、全石粒の確実で強固な固定状態を得ること
ができる。<Function> That is, the whole stone grains according to the present invention are fixed on the surface of the metal base material in a state where they are physically included in the first plating layer and the second plating layer, so there is no risk of them falling off. In other words,
The whole stone grains applied to the surface of the metal base material serve as "insulators" during the plating process, so the first and second plating layers are applied to the gaps between the whole stone grains while avoiding these whole stone grains. It grows reliably while filling the stone grains, and is formed to wrap around the half of the whole stone grain on the metal base material side, making it possible to securely and firmly fix the whole stone grain.
また換言すれば、第1メッキ層を形成した時点で、固定
されなかった全石粒をいったん除去するので、全石粒は
必ず第1メッキ層と第2メッキ層の両方にて固定される
こととなり、不安定な状態(例えば、第2メッキ層だけ
でかろうじて固定されているような状態)で固定される
全石粒がなく、固定後における全石粒の脱落を招くこと
がない。In other words, all stone grains that are not fixed are removed once the first plating layer is formed, so all stone grains are sure to be fixed in both the first plating layer and the second plating layer. Therefore, no whole stone grains are fixed in an unstable state (for example, in a state where they are barely fixed only by the second plating layer), and no whole stone grains are caused to fall off after fixing.
更に、メッキ処理を利用して全石粒を固定するので、量
産に好適であると共に、金属基材を適宜マスキング材料
にて覆うことにより、所望部分だけに全石粒を付着する
ことも自由にできる。Furthermore, since the entire stone grain is fixed using plating, it is suitable for mass production, and by covering the metal base material with an appropriate masking material, the whole stone grain can be attached only to the desired area. can.
く実 施 例〉
以下、この発明の好適な一実施例を第1図及び第2図に
基づいて説明する。Embodiment A preferred embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
1は金属基材で、金属製装飾品としてのメガネフレーム
形状をしている。そして、この金属基材1の表面にはメ
ッキ対象部としての上縁部2を残してビニールテープ3
にてマスキングされている。Reference numeral 1 is a metal base material, which has the shape of an eyeglass frame as a metal ornament. Then, on the surface of this metal base material 1, a vinyl tape 3 is applied, leaving the upper edge 2 as the part to be plated.
is masked.
そして、この金属基材1は絶縁製のホルダー4に10個
並べて取付けられ、各々の金属基材1には陰極の導線5
が接続されてカソード化されている。Ten metal base materials 1 are attached to an insulating holder 4 in parallel, and each metal base material 1 has a cathode conductor 5.
is connected and cathodized.
6は第1メッキ槽で、内部には液温か40°Cで、pH
が4.5のスルファミン酸ニッケルメッキ液(以下、単
に第1メッキ液)7が、陽極8によりアノード化された
状態で満たされている。また、この第1メッキ槽5内に
は架台9が備えてあり、この架台9上には更に受皿10
が配置されている。6 is the first plating tank, inside which the liquid temperature is 40°C and the pH is
A nickel sulfamate plating solution (hereinafter simply referred to as a first plating solution) 7 having a plating temperature of 4.5 is filled with an anode formed by an anode 8 . Further, a pedestal 9 is provided in the first plating tank 5, and a saucer 10 is further disposed on this pedestal 9.
is located.
そして、前記金属基材1を並べて取付けたホルダー4を
、第1メッキ槽6内に入れて受皿10の底部に置く。次
いで、粒度#270/#325の人造ダイヤモンドであ
る「全石粒」としてのダイヤモンド砥粒11を、ホルダ
ー4に取付けられた金属基材1がこのダイヤモンド砥粒
11にて完全に隠れるまで(金属基材1がダイヤモンド
砥粒11に埋もれるまで)、第1メッキ槽6の上から金
属基材1めがけてふりかける。Then, the holder 4 to which the metal base materials 1 are arranged and attached is placed in the first plating tank 6 and placed on the bottom of the saucer 10. Next, diamond abrasive grains 11 as "whole stone grains" which are artificial diamonds with particle size #270/#325 are applied until the metal base material 1 attached to the holder 4 is completely hidden by the diamond abrasive grains 11 (metallic (until the base material 1 is buried in the diamond abrasive grains 11), sprinkle it onto the metal base material 1 from above the first plating bath 6.
そして、この状態においてIA/dm”の電流密度で、
10分間のニッケルメッキ処理を行った。In this state, at a current density of IA/dm,
Nickel plating treatment was performed for 10 minutes.
すると、金属基材1の表面にほぼ接触しているダイヤモ
ンド砥粒11だけが、ニッケルメッキ処理により形成さ
れた第1メッキ層12により、恰も「仮止め」された如
く固定される。金属基材1の表面に施されたダイヤモン
ド砥粒11は、メッキ処理上においては「絶縁物」とな
るので、第1メッキ層12はこのダイヤモンド砥粒11
を避けた状態で、ダイヤモンド砥粒11の隙間を埋めな
がら確実に成長していた。そして、ニッケルメッキ処理
後、金属基材1をホルダー4ごと第1メッキ槽6から取
り出して洗浄し、第1メッキN6にて固定されなかった
ダイヤモンド砥粒11を除去する。尚、除去されたダイ
ヤモンド砥粒11は再利用できるので、無駄のないよう
に回収する。Then, only the diamond abrasive grains 11 that are almost in contact with the surface of the metal base material 1 are fixed as if "temporarily fixed" by the first plating layer 12 formed by nickel plating. The diamond abrasive grains 11 applied to the surface of the metal base material 1 become an "insulator" during the plating process, so the first plating layer 12 consists of the diamond abrasive grains 11.
The diamond abrasive grains 11 were grown steadily while avoiding the above-mentioned conditions, filling the gaps between the diamond abrasive grains 11. After the nickel plating treatment, the metal base material 1 along with the holder 4 is taken out from the first plating tank 6 and washed, and the diamond abrasive grains 11 that are not fixed by the first plating N6 are removed. Incidentally, since the removed diamond abrasive grains 11 can be reused, they are collected without waste.
次に、洗浄した金属基材1を、図示せぬ別の第2メッキ
槽に移す。この第2メッキ槽には、液温が85°Cで、
アルニックT−Fである無電解ニッケルメッキ液(以下
、単に第2メッキ液)が満たされている。そして、この
第2メッキ液にて無電解ニッケルメッキ処理を4時間行
い、第1メッキN12の上に第2メッキ層13を更に形
成した。Next, the cleaned metal base material 1 is transferred to another second plating bath (not shown). In this second plating tank, the liquid temperature was 85°C.
It is filled with an electroless nickel plating solution (hereinafter simply referred to as the second plating solution) which is Alnic T-F. Then, electroless nickel plating treatment was performed using this second plating solution for 4 hours to further form a second plating layer 13 on the first plating N12.
第1メッキ層12と第2メッキ層13との合計の厚さは
、ダイヤモンド砥粒11の粒径の約2に相当した。第2
メッキJW13形成後、マスキング用のビニールテープ
3を取り外し、最後の仕上げであるニッケル電解メッキ
を行い、水洗・乾燥して最終製品としてのメガネフレー
ム(金属製装飾品)を得た。The total thickness of the first plating layer 12 and the second plating layer 13 corresponded to about 2 times the particle size of the diamond abrasive grains 11. Second
After forming the plating JW 13, the masking vinyl tape 3 was removed, and nickel electrolytic plating was applied as a final finish, followed by washing and drying to obtain a glasses frame (metal ornament) as a final product.
得られた金属製装飾品は、ダイヤモンド砥粒11の下側
半分が第1及び第2メッキ層12.13にて包み込まれ
るように固定されるので、ダイヤモンド砥粒11が脱落
するおそれはない。つまり、第1メッキ層12を形成し
た時点で、固定されなかったダイヤモンド砥粒11をい
ったん除去するので、ダイヤモンド砥粒11は必ず第1
メッキ層12と第2メッキ7W130両方にて固定され
ることとなり、不安定な状態(例えば、第2メッキ層1
3だけでかろうじて固定されているような状態)で固定
されるダイヤモンド砥粒11がない。The obtained metal ornament is fixed so that the lower half of the diamond abrasive grains 11 is wrapped in the first and second plating layers 12.13, so there is no fear that the diamond abrasive grains 11 will fall off. In other words, since the unfixed diamond abrasive grains 11 are removed once the first plating layer 12 is formed, the diamond abrasive grains 11 are always removed from the first plating layer 12.
It will be fixed by both the plating layer 12 and the second plating 7W130, resulting in an unstable state (for example, the second plating layer 1
There is no diamond abrasive grain 11 that is fixed in a state where it is barely fixed with only 3.
そして、得られた金属製装飾品は、ダイヤモンド砥粒1
1を付着した上縁部2が、太陽光線の当たる角度により
キラキラ輝き、装飾効果が著しく増した。更に、この金
属製装飾品を、スクラッチテスターにより5 kgの力
でひっかいても、付着したダイヤモンド砥粒11は脱落
しなかった。The obtained metal ornament is made of diamond abrasive grains of 1
The upper edge 2 to which 1 was attached sparkled depending on the angle at which the sun's rays hit it, and the decorative effect was significantly increased. Further, even when this metal ornament was scratched with a force of 5 kg using a scratch tester, the attached diamond abrasive grains 11 did not fall off.
尚、以上の説明において、「全石粒」としてダイヤモン
ド砥粒1工を例にしたが、サフヤイヤ、ルビーその他の
全石粒であっても良い。また、メッキ処理もニッケルメ
ッキに限定されない。更に、第2メッキ層はINに限定
されず2層以上の複数層形成してもよい。In the above description, a single diamond abrasive grain is used as an example of "whole stone grain", but whole stone grains such as sapphire, ruby, etc. may also be used. Furthermore, the plating treatment is not limited to nickel plating. Furthermore, the second plating layer is not limited to IN, and may be formed of two or more layers.
く効 果〉
この発明に係る宝石粒付き金属製装飾品の製造方法は、
以上説明してきた如き内容のものであって、全石粒が金
属基材の表面で第1メッキ層及び第2メッキ層より物理
的に包含された状態で固定されるので脱落するおそれが
ない。つまり、第1メッキ層を形成した時点で、固定さ
れなかった全石粒をいったん除去するので、全石粒は必
ず第1メッキ層と第2メッキ層の両方にて固定されるこ
ととなり、不安定な状態で固定される全石粒がなく、固
定後における全石粒の脱落がない。Effect> The method for manufacturing a metal ornament with gem grains according to the present invention includes the following steps:
As explained above, all the stone grains are fixed on the surface of the metal base material in a state where they are physically included in the first plating layer and the second plating layer, so there is no risk of them falling off. In other words, all stone grains that are not fixed are removed once the first plating layer is formed, so all stone grains are always fixed in both the first plating layer and the second plating layer, and any unfixed stone grains are removed. No whole stone grains are fixed in a stable state, and no whole stone grains fall off after fixation.
また、メッキ処理を利用して全石粒を固定するので、量
産に好適であると共に、金属基材を適宜マスキング材料
にて覆うことにより、所望部分だけに全石粒を付着する
ことも自由にできる。In addition, since the entire stone grain is fixed using plating, it is suitable for mass production, and by covering the metal base material with an appropriate masking material, the whole stone grain can be attached only to the desired area. can.
第1図はこの発明の一実施例に係る金属基材を示す平面
図、
第2図はメッキ槽を示す概略断面図、そして第3図は全
石粒の付着状態を示す金属基材表面の拡大図である。
1 ・−・ 金属基材
7− 第1メッキ液
11− ダイヤモンド砥粒(全石粒)
12 ・−第1メッキ層
13 ・−第2メッキ層FIG. 1 is a plan view showing a metal base material according to an embodiment of the present invention, FIG. 2 is a schematic sectional view showing a plating bath, and FIG. 3 is a surface view of the metal base material showing the state of adhesion of all stone grains. It is an enlarged view. 1 - Metal base material 7 - First plating solution 11 - Diamond abrasive grains (whole stone grains) 12 - First plating layer 13 - Second plating layer
Claims (1)
ッキ液中における金属基材の表面に対して宝石粒を施し
、次いで該金属基材の電解メッキ処理を行って形成した
第1メッキ層により宝石粒を金属基材の表面に固定し、 そして、前記第1メッキ層にて固定されなかった宝石粒
を除去した後、金属基材を更に別のメッキ液に浸して電
解メッキ又は無電解メッキ処理を行うことにより、金属
基材の表面に第2メッキ層を1層又は2層以上形成した
ことを特徴とする宝石粒付き金属製装飾品の製造方法。[Claims] A metal base material formed into a predetermined shape is immersed in a plating solution, gem grains are applied to the surface of the metal base material in the plating solution, and then the metal base material is electrolytically plated. The gem grains are fixed on the surface of the metal base material by the first plating layer formed by the above-mentioned method, and after removing the jewel grains that were not fixed by the first plating layer, the metal base material is further coated with another plating solution. A method for manufacturing a metal ornament with gem grains, characterized in that one or more second plating layers are formed on the surface of a metal base material by immersion and electrolytic plating or electroless plating treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63091661A JPH01263100A (en) | 1988-04-15 | 1988-04-15 | Production of metallic ornament with gem particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63091661A JPH01263100A (en) | 1988-04-15 | 1988-04-15 | Production of metallic ornament with gem particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01263100A true JPH01263100A (en) | 1989-10-19 |
| JPH0479840B2 JPH0479840B2 (en) | 1992-12-17 |
Family
ID=14032675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63091661A Granted JPH01263100A (en) | 1988-04-15 | 1988-04-15 | Production of metallic ornament with gem particles |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01263100A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010148919A (en) * | 2010-02-22 | 2010-07-08 | Aida Kagaku Kogyo Kk | Decoration measure of silver sintered compact |
| JP2018042966A (en) * | 2016-09-13 | 2018-03-22 | 恵美子 新居 | Decorative Product Plating Process and Decorative Product |
| KR20210095919A (en) * | 2018-11-30 | 2021-08-03 | 유니버셜 시티 스튜디오스 엘엘씨 | Alternating cross-aligned object detection |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9011974B2 (en) | 2003-12-09 | 2015-04-21 | The Foundation for the Promotion of Supplementary Occupations and Related Techniques of her Majesty Queen Sirikit | Process of producing decorated metal |
-
1988
- 1988-04-15 JP JP63091661A patent/JPH01263100A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010148919A (en) * | 2010-02-22 | 2010-07-08 | Aida Kagaku Kogyo Kk | Decoration measure of silver sintered compact |
| JP2018042966A (en) * | 2016-09-13 | 2018-03-22 | 恵美子 新居 | Decorative Product Plating Process and Decorative Product |
| KR20210095919A (en) * | 2018-11-30 | 2021-08-03 | 유니버셜 시티 스튜디오스 엘엘씨 | Alternating cross-aligned object detection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479840B2 (en) | 1992-12-17 |
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