JPH01264236A - Wafer-breaking apparatus - Google Patents

Abstract

PURPOSE:To shorten the breaking treatment time by constituting a shape of a roller used to apply a load to the rear of a tape in such a way that its diameter is large in the center and becomes smaller toward both ends. CONSTITUTION:This apparatus is equipped with a roller 8 having a swelling, in the central part, constituted in such a way that the center has a maximum radius R and that both end parts have a radius (r) which is smaller than that. At an operation, a position of the roller is decided by setting a dicing line and a roller shaft is parallel; then, a table 4 where a frame ring 3 supporting an adhesive sheet 2 used to fix a wafer 1 and the roller 8 are shifted relatively; the roller 8 is moved to a right end. At this operation, the roller 22 is turned in the direction in which a contact resistance with the adhesive sheet 2 is large by a roller shaft 9; the dicing line is broken and shifted to the curvature of the roller 8; after a breaking operation of a first stroke has been completed, the table 4 is turned by 90 deg.; a similar operation is executed; the breaking operation is finished at a second stroke. Accordingly, the breaking treatment time can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a wafer breaking device that separates semiconductor devices in a wafer state into device units.

[Conventional technology]

FIG. 6 is a block diagram of an example of a conventional wafer cutting apparatus.

In the figure, (1) is a semi-full cut wafer, (
2) is an adhesive sheet that fixes the wafer in (1), (3) is a frame ring that supports this adhesive sheet (2), and (4) is an adhesive sheet that fixes the wafer in (1).
) is a table to which this frame ring (3) can be fixed detachably, (5) is a break blade (6) is a rotating shaft that allows this break blade (5) to rotate, and (7) is a break blade. (5) A fixing jig for fixing the rotating shaft (61).

Next, the operation will be explained. In the conventional wafer breaking apparatus configured as described above, the position of the break blade (5) is determined by aligning the line to be broken with the advancing direction of the break blade (5) and the break position.

At this time, the break blade (5) is set to a height that slightly pushes up the adhesive sheet (2). Next is the frame ring (3) that supports the adhesive sheet (2) that fixes the wafer (1).
The break blade (5) is moved relative to the table (4) on which it is attached, and the break blade (6) is moved to the position shown in Figure 8. During this movement, the break blade (5) causes the sheet (2
), the semi-full cut lower part of the wafer (1) is pushed up, and the line in this part is broken.

In the state shown in Fig. 8, move the break blade (5) to a new line where you want to break and repeat the above operation.

After breaking all horizontal lines, frame ring (3
) is fixed, the table (4) is rotated 90'' to break all the lines in the advancing direction of the break blade (5) again, and the breaking operation is completed.

[Problem to be solved by the invention]

The problem with conventional wafer breaking equipment is that it is necessary to break the dicing lines one by one using a break blade (5), which increases the breaking processing time.

This invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to obtain a wafer breaking device that can break with two strokes regardless of the number of dicing lines, and can shorten the breaking processing time. With the goal.

[Means to solve the problem]

The wafer breaking device according to the present invention adheres a diced wafer stuck on an adhesive sheet attached to a frame ring to the wafer from the back side of the tape without contacting the wafer surface pattern. The break is performed using the force, the adhesive strength between the frame ring and the tape, and the rigidity of the tape when a load of H4 orders of magnitude is applied from the back side to the tape adhered to the 71/- frame ring. The shape of the roller for applying the load is configured to have a large diameter at the center and a smaller diameter towards both ends.I7, the roller movement is made so that it does not interfere with the frame ring, and the diameter at the center and the diameter at both ends are broken. The selection is made based on the chip size.

[Effect]

In the wafer break device fl of this invention, the adhesive sheet is adhered around the outer periphery by a frame ring, so when a load is applied from the back side of the tape, the deformation of the tape is similar to the boundary condition of the de-S inner plate with peripheral support. To perform the displacement,
Different stresses are generated in the tape plane from position ζ, and it is not possible to obtain a curvature capable of pulling L/- with a simple loading form. For this reason, the diameters of the center and both ends are changed so that the center is large and both ends are broken by rollers with small diameters.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

In Fig. 1, (8) is a roller with a bulge in the center, with a maximum radius R at the center and a smaller radius r at both ends, and (9) is a roller that can rotate. It is the axis of rotation that allows In Figure 4 (1)
is the diced wafer (2) is the adhesive sheet (3) is the wafer ring (4) is the wafer ring and tightens it.
(8) is a fixing table configured to be fixed; (8) is a roller α4 according to the present invention; (10 is a bearing for allowing this roller to rotate; (9) is a shaft and a row (8);
) is a vertical movement mechanism installed to move the bearing stand αd up and down, and 02 is a moving shaft 03 for the roller movement mechanism to move the roller along the break line.
shows a part of the guide mechanism for supporting the moving mechanism. Figure 2 shows the relationship between the roller (8), the wafer (1), the adhesive sheet (2), and the frame ring (3) when the roller (8) starts breaking. Roller when moving and completing a break (
8) and wafer (i)? The relationship between the knee adhesive tape (2), the frame ring (3), and the fixing table (4) is shown.

Effects of the above wafer breaking device il'JI
Explain the work.

In FIG. 2, the position of the roller is determined by aligning the dicing line and the roller rotation axis in parallel.

At this time, the roller slightly pushes up the sheet (2) and adjusts it to a predetermined height ζ using the vertical movement mechanism shown in FIG. 4 αB.

Next, attach the adhesive sheet (2) that fixes the wafer (1) to the support A-
Table (4) to which the frame ring (3) is attached
and the roller (8) are moved relative to each other and the roller (8) is moved to the position shown in FIG. At this time, the direction in which the roller (8) rotates is determined by the roller rotation shaft (9).
(Roller (8) facing toward the side with greater contact resistance with 2+
The dicing line is broken due to the curvature of , and the roller moves to the position shown in Figure 3.
After completing the rotation, the table (4), which fixes the frame ring (3), is rotated by 90° and the above series of operations is performed, and the break operation is completed at the break of the second stroke. The radius of curvature that can be broken is determined by the adhesive force P of the adhesive tape, the vertical dimension a of the chip size, the horizontal dimension A, and the uncut portion from dicing L tl The elastic modulus of the tow bar E, determines the maximum diameter of the roller. The displacement of the adhesive tape is determined by the outer diameter of the sheet, that is, the inner circumference of the frame ring, the tape thickness, t2, and the tape's elastic modulus E2, so find the difference in displacement between the center of the tape and the 9+ circumference, and use that difference to determine the center of the roller. Design so that the difference between the diameter of the part and the diameter of both ends is large.

In addition, in the embodiment shown in FIG. 1, a roller with a length l larger than the wafer diameter is shown, which is formed by a straight line between the maximum diameter R at the center and the minimum diameter r at both ends. Displacement is determined by changing the boundary conditions depending on the shape of the inner circumference of the frame ring and the support method of the table that supports the inner circumference of the frame ring. Therefore, by changing the shape of the frame ring or the method of supporting the frame ring, various adhesive tapes can be applied. In that case, the same effect can be obtained by changing the difference between R and r.If the adhesive tape is attached to a frame ring and tension is applied to the adhesive tape, and the adhesive tape is broken from the back side of the tape, It goes without saying that the same effect can be achieved whether the bond connecting the maximum diameter R and the minimum diameter r is a straight line or another curved line as shown in Fig. 4. , as shown in Figures 1 and 4, it is not necessary to match the diameter of the wafer, and even if it is shorter than the diameter of the wafer, it is possible to break in the same way.Also, as e becomes smaller, the difference between R and r decreases, and R Even if and r are the same size, as long as the chip size 4 is larger than the chip size a or b, the same effect as the present invention will be achieved. However, when e is small, the break will occur from one end of the wafer diameter to the other, so it will reciprocate. The number of rollers will increase, but it is possible to break.

〔Effect of the invention〕

As described above, according to the present invention, by using a roller with a bulge, it is possible to break the entire line with a stroke in two directions, whereas the conventional breaking device performs a breaking operation of one stroke per line. This has the effect of shortening the break processing time.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing a roller according to an embodiment of the present invention, Fig. 2.3.4 is a front view showing the working layer and operation of the present invention, and Fig. 5.6.7.8. (1) Wafer;
(2) is an adhesive sheet, (3) is a frame ring, (
4) is the table, (5) is the break blade, (6) is the break blade rotation axis, (7) is the break blade fixing jig, (8)
is the roller, (9) is the roller rotation axis, and Qd is the bearing stand 0.
1) is a vertically movable i-groove, (2) is a roller moving mechanism, 03 is a guide mechanism, and α→ is a bearing. In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] In a wafer breaking device that uses an adhesive sheet attached to a frame ring and a diced wafer fixed with the adhesive sheet from the back side of the adhesive sheet, the semiconductor devices in the wafer state are separated into individual elements using a roller. A roller with a bulge in the center with a maximum radius R and a smaller radius R at both ends, a rotation mechanism that allows the roller to rotate, and a mechanism that allows the roller to move linearly. Wafer break equipment.