JPH0126537B2 - - Google Patents

Info

Publication number
JPH0126537B2
JPH0126537B2 JP56203685A JP20368581A JPH0126537B2 JP H0126537 B2 JPH0126537 B2 JP H0126537B2 JP 56203685 A JP56203685 A JP 56203685A JP 20368581 A JP20368581 A JP 20368581A JP H0126537 B2 JPH0126537 B2 JP H0126537B2
Authority
JP
Japan
Prior art keywords
hybrid integrated
integrated circuit
connector
board
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56203685A
Other languages
Japanese (ja)
Other versions
JPS58105549A (en
Inventor
Takeshi Urushibara
Yoshikazu Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56203685A priority Critical patent/JPS58105549A/en
Publication of JPS58105549A publication Critical patent/JPS58105549A/en
Publication of JPH0126537B2 publication Critical patent/JPH0126537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0478Simultaneously mounting of different components
    • H05K13/0482Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Connecting Device With Holders (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

【発明の詳細な説明】 本発明は、混成集積回路を調整装置や検査装置
に自動的に送り込めるようにした搬送治具に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a transport jig that can automatically feed a hybrid integrated circuit to an adjustment device or an inspection device.

混成集積回路は、セラミツク基板上に所要の電
子部品を塔載したのち、基板の一辺もしくは2辺
に、他の回路基板と接続するためのリード端子が
取付けられる。そして、リード端子が取付けられ
た混成集積回路は、専用の運搬箱に収容され、調
整工程、あるいは検査工程に搬送されたのち、調
整装置あるいは検査装置に接続されたコネクタに
1個づつ、着脱して調整あるいは検査される。
In a hybrid integrated circuit, necessary electronic components are mounted on a ceramic substrate, and then lead terminals for connection to other circuit boards are attached to one or two sides of the substrate. The hybrid integrated circuits with lead terminals attached are then stored in a special transport box and transported to the adjustment or inspection process, where they are connected and disconnected one by one to the connector connected to the adjustment or inspection device. adjusted or inspected.

混成集積回路のリード端子をコネクタに着脱す
る場合、セラミツク基板とリード端子の機械的な
接合強度が弱いことと、リード端子が細く軟弱で
あることなどのために、前記着脱の自動化が困難
であり、1個ずつ人手によつて着脱していた。
When attaching and detaching lead terminals of hybrid integrated circuits to connectors, it is difficult to automate the attachment and detachment because the mechanical bonding strength between the ceramic substrate and the lead terminals is weak, and the lead terminals are thin and weak. , they had to be attached and detached one by one by hand.

このため、調整装置や検査装置には常時作業者
が付いて、混成集積回路の着脱を行なつている。
For this reason, a worker is always present at the adjustment device or inspection device to attach or detach the hybrid integrated circuit.

ここで、たとへば、混成集積回路の着脱に要す
る時間が1個当り5〜6秒、調整もしくは検査に
要する時間が1個当り5〜6秒とすると、作業者
の作業時間のうち半分は待ち時間となる。さら
に、調整、検査等の時間が長くなると、待ち時間
が増大し、作業効率が低下する。
For example, if the time required to attach and detach hybrid integrated circuits is 5 to 6 seconds per piece, and the time required for adjustment or inspection to be 5 to 6 seconds per piece, half of the worker's work time will be spent waiting. becomes. Furthermore, as the time for adjustments, inspections, etc. becomes longer, waiting time increases and work efficiency decreases.

また、前述のように、混成集積回路のリード端
子が軟弱であるため、その取扱いには十分な注意
が必要であり、調整装置あるいは検査装置への自
動供給が困難であつた。
Furthermore, as described above, the lead terminals of the hybrid integrated circuit are soft and weak, so sufficient care must be taken in handling them, making it difficult to automatically supply them to an adjustment device or a testing device.

本発明の目的は、上記した従来技術の欠点をな
くし、混成集積回路の着脱を効率よく行なうと共
に、調整装置あるいは検査装置への供給を自動化
し得るようにした搬送治具を提供するにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a transport jig that eliminates the above-mentioned drawbacks of the prior art, efficiently attaches and detaches hybrid integrated circuits, and automates the supply to an adjustment device or inspection device.

上記目的を達成するため、本発明においては、
基板上にコネクタを配置して搬送治具とし、この
コネクタに混成集積回路を挿着すると共に、基板
の下面より、コネクタのコンタクトピンを介して
混成集積回路と調整装置もしくは検査装置との電
気的な接続を行なわせるようにしたことを特徴と
する。
In order to achieve the above object, in the present invention,
A connector is placed on the board as a transport jig, and the hybrid integrated circuit is inserted into this connector, and the electrical connection between the hybrid integrated circuit and the adjustment device or inspection device is made from the bottom of the board via the contact pins of the connector. The feature is that the connection is made as follows.

以下、本発明の一実施例を図面にしたがつて説
明する。
An embodiment of the present invention will be described below with reference to the drawings.

第1図および第2図は、本発明による搬送治具
の一実施を示すもので、同図において、搬送治具
1は、基板2と、この基板2に固定されたコネク
タ7によつて構成されている。前記基板2には、
位置決め用の穴3と、コネクタ7を収容する穴
4、および穴4の底面から基板2を貫通する貫通
穴5が形成され、その下部は、下方に向けて拡開
するテーパ穴6になつている。前記コネクタ7に
は、コンタクトピン8が所定の間隔で植設されて
いる。このコンタクトピン8は、下端が前記テー
パ穴6内に突出するように前記貫通穴5に嵌合し
ている。
FIGS. 1 and 2 show an embodiment of the transport jig according to the present invention. In the figures, the transport jig 1 is composed of a board 2 and a connector 7 fixed to the board 2. has been done. The substrate 2 includes:
A hole 3 for positioning, a hole 4 for accommodating a connector 7, and a through hole 5 penetrating the board 2 from the bottom of the hole 4 are formed, the lower part of which becomes a tapered hole 6 that widens downward. There is. Contact pins 8 are implanted in the connector 7 at predetermined intervals. The contact pin 8 is fitted into the through hole 5 such that its lower end projects into the tapered hole 6.

このような搬送治具1を用いた場合の検査装置
の一例を第3図および第4図に示す。
An example of an inspection apparatus using such a transport jig 1 is shown in FIGS. 3 and 4.

同図において、検査装置10にはケーブル11
によつて検査基板12が接続されている。この検
査基板12には、検査に必要な電子部品13と、
支柱14を介してブレード15が取付けられてい
る。前記検査基板12とブレード15の間には、
ガイドピン16が立設されている。このガイドピ
ン16には、プローブピン17が摺動自在に支持
され、ばね18で上方に向けて突出するように付
勢されている。なお、ガイドピン16とプローブ
ピン17は、前記搬送治具1の貫通穴5と同じ配
列で形成されている。前記搬送治具1の搬送路を
形成するレール19を含む搬送手段は、搬送治具
1を検査位置に位置決めするため、搬送治具1の
穴3に嵌合するストツパ(図示せず)を備えてい
る。混成集積回路20はリード端子21が取付け
られている。
In the figure, the inspection device 10 includes a cable 11
The test board 12 is connected by. This test board 12 includes electronic components 13 necessary for testing,
A blade 15 is attached via a strut 14. Between the inspection board 12 and the blade 15,
A guide pin 16 is provided upright. A probe pin 17 is slidably supported by the guide pin 16 and is urged by a spring 18 so as to protrude upward. Note that the guide pins 16 and probe pins 17 are formed in the same arrangement as the through holes 5 of the transport jig 1. The conveyance means including the rails 19 forming the conveyance path of the conveyance jig 1 includes a stopper (not shown) that fits into the hole 3 of the conveyance jig 1 in order to position the conveyance jig 1 at the inspection position. ing. Lead terminals 21 are attached to the hybrid integrated circuit 20 .

上記構成において、混成集積回路20は、組立
工程と検査工程の間で一括して、搬送治具1のコ
ネクタ7に挿着される。したがつて、調整、検査
等の時間に関係なく、連続して挿着を行なうこと
ができるので、待時間をなくし、作業効率を向上
させることができる。
In the above configuration, the hybrid integrated circuit 20 is inserted into the connector 7 of the transport jig 1 all at once between the assembly process and the inspection process. Therefore, the insertion and attachment can be performed continuously regardless of the time required for adjustment, inspection, etc., thereby eliminating waiting time and improving work efficiency.

混成集積回路20を収容した搬送治具1は、搬
送手段のマガジンに収容し、搬送手段に供給す
る。搬送手段では、マガジンから搬送治具を取出
し、レール19に沿つて検査装置へ送り込む。そ
して、搬送治具1が検査基板12の上方に到達す
ると、ストツパが作動し、穴3に嵌合して搬送治
具1を位置決め停止させる。すると、検査基板1
2が図示しない昇降手段によつて上昇させられ、
プローブピン17が搬送治具1のテーパ穴6に挿
入される。すると、テーパ穴6内に突出するコネ
クタ7のコンタクトピン8にプローブピン17が
当接し、電気的な接続が達成される。この状態で
検査装置10が作動し、混成集積回路20の検査
を行なう。検査が終つて、検査基板12が下降
し、プローブピン17が搬送治具1から離脱する
と、ストツパが穴3から離脱して、搬送治具1が
搬送される。
The transport jig 1 containing the hybrid integrated circuit 20 is stored in a magazine of a transport means and supplied to the transport means. The transport means takes out the transport jig from the magazine and sends it along the rail 19 to the inspection device. When the transport jig 1 reaches above the test substrate 12, the stopper is activated and fits into the hole 3 to position and stop the transport jig 1. Then, the test board 1
2 is raised by a lifting means (not shown),
The probe pin 17 is inserted into the tapered hole 6 of the transport jig 1. Then, the probe pin 17 comes into contact with the contact pin 8 of the connector 7 protruding into the tapered hole 6, and an electrical connection is established. In this state, the testing device 10 operates and tests the hybrid integrated circuit 20. When the inspection is finished, the test board 12 is lowered and the probe pins 17 are removed from the transport jig 1, the stoppers are removed from the holes 3 and the transport jig 1 is transported.

このようにして、検査装置等に対する混成集積
回路の自動供給を可能にすることができ、調整、
検査作業の自動化を可能にすることができる。
In this way, automatic feeding of hybrid integrated circuits to inspection equipment etc. can be made possible, adjustment,
It is possible to automate inspection work.

以上述べた如く、本発明によれば、基板にコネ
クタを塔載固定し、コネクタのコンタクトピンを
基板に形成されたテーパ穴内に突出させた搬送治
具に混成集積回路を着脱するようにしたので、組
立終了後の混成集積回路の着脱を1度にまとめて
実施することができ、待ち時間等の発生を防止し
作業効率を向上させることができる。また、搬送
治具へ挿着したのちは、混成集積回路のリード端
子の機械的な強度に関係なくハンドリングできる
ので、自動化が容易になるなどの効果がある。
As described above, according to the present invention, the connector is mounted and fixed on the substrate, and the hybrid integrated circuit is attached to and detached from the transfer jig in which the contact pins of the connector protrude into the tapered holes formed in the substrate. After assembly, the hybrid integrated circuit can be attached and detached all at once, which prevents waiting time and improves work efficiency. Furthermore, after the hybrid integrated circuit is inserted into the transport jig, it can be handled regardless of the mechanical strength of the lead terminals of the hybrid integrated circuit, which facilitates automation.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明による搬送治具の一例を示す平
面図、第2図は第1図における基板の側面断面
図、第3図は検査装置の一例を示す側面図、第4
図は第3図におけるプローブピンの拡大図であ
る。 1……搬送治具、2……基板、3,4……穴、
5……貫通穴、6……テーパ穴、7……コネク
タ、8……コンタクトピン。
FIG. 1 is a plan view showing an example of a transfer jig according to the present invention, FIG. 2 is a side sectional view of the substrate in FIG. 1, FIG. 3 is a side view showing an example of an inspection device, and FIG.
The figure is an enlarged view of the probe pin in FIG. 3. 1... Transfer jig, 2... Board, 3, 4... Hole,
5...Through hole, 6...Tapered hole, 7...Connector, 8...Contact pin.

Claims (1)

【特許請求の範囲】[Claims] 1 上面にコネクタを収納する収納部と下面に下
方に向けて拡開するテーパ穴と前記収納部と前記
テーパ穴とを連通する貫通穴を所定の配列で形成
した基板と、混成集積回路のリード端子を挿着
し、かつ、前記基板を貫通し、下端が前記テーパ
穴内に突出するように前記貫通穴に嵌合するコン
タクトピンを前記混成集積回路のリード端子の挿
入方向に前記貫通穴の配列と同じ配列で配設した
コネクタにより構成され、混成集積回路のリード
端子を挿着した前記コネクタを前記基板の収納部
に収納することで、前記コンタクトピンを介し前
記基板の下面から前記混成集積回路の電気的接続
を可能にしたことを特徴とする混成集積回路の搬
送治具。
1. A board having a housing portion for housing a connector on an upper surface, a tapered hole expanding downward on a lower surface, and through-holes communicating with the housing portion and the tapered hole in a predetermined arrangement, and a lead for a hybrid integrated circuit. The through holes are arranged in the insertion direction of the lead terminals of the hybrid integrated circuit, into which terminals are inserted, and contact pins that penetrate the substrate and fit into the through holes so that their lower ends protrude into the tapered holes. By storing the connector into which the lead terminals of the hybrid integrated circuit are inserted in the housing part of the board, the hybrid integrated circuit can be inserted from the bottom surface of the board via the contact pins. A transport jig for a hybrid integrated circuit, characterized in that it enables electrical connection of the hybrid integrated circuit.
JP56203685A 1981-12-18 1981-12-18 Conveying jig for hybrid integrated circuit Granted JPS58105549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56203685A JPS58105549A (en) 1981-12-18 1981-12-18 Conveying jig for hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56203685A JPS58105549A (en) 1981-12-18 1981-12-18 Conveying jig for hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS58105549A JPS58105549A (en) 1983-06-23
JPH0126537B2 true JPH0126537B2 (en) 1989-05-24

Family

ID=16478139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56203685A Granted JPS58105549A (en) 1981-12-18 1981-12-18 Conveying jig for hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS58105549A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2609014B2 (en) * 1990-07-17 1997-05-14 三菱電機株式会社 Semiconductor device manufacturing method and manufacturing apparatus
JPH06281698A (en) * 1993-11-26 1994-10-07 Toshiba Corp IC auto handler method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508308A (en) * 1973-05-26 1975-01-28
JPS5113251U (en) * 1974-07-17 1976-01-30

Also Published As

Publication number Publication date
JPS58105549A (en) 1983-06-23

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