JPH01267264A - Sticking method for thin plate and adhesive tape - Google Patents

Abstract

PURPOSE:To get rid of any possible fear of damaging a thin plate top surface by moving an adhesive tape intermittently in turning its sticking surface upside, and constituting the top circumference of a thin plate so as to be attracted with a conveyor device, setting a lower circumference alone down to the attracting surface and to be stuck onto the adhesive tape. CONSTITUTION:A filmy adhesive tape 15 is intermittently moved in the longitudinal direction in turning its sticking surface upside. Then, a top circumference of a thin plate 1 being delivered piece by piece by a delivery means 5 is attracted by a vacuum suction type conveyor device 19, setting a lower circumference alone down to its suction surface (a), and it is conveyed onto the adhesive tape 15. After the conveyor device 19 is lowered and the thin plate 1 at the lower end is stuck to an adhesive tape 1, the suction is released and the conveyor device 19 is restored. Thus, the conveyor device 19 attracts the plate 1 only with the sticking surface (a) with plural numbers of suction holes 20 at the lower circumference alone so as to attract only the circumference of the thin plate 1. Consequently, no spot is contacted with the conveyor device 19 excepting a circumferential part of the thin plate 1, so that any possible fear of damaging a top surface of the thin plate 1 is made preventable.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for attaching a circular thin plate such as a silicon wafer, which serves as a substrate for forming an integrated circuit, onto an adhesive tape. Afterwards, a ring, such as a circular ring, which will become a carrier jig for the thin plate, is stuck onto a piece of adhesive tape, and the tape is cut along the ring.

[Conventional technology]

Conventionally, the above-described attachment of a film to a ring-shaped carrier jig and attachment of a silicon wafer, etc. to the film were performed manually, and the film protruding from the periphery of the ring was also manually cut.

Another method is to supply a thin plate on top of the adhesive tape with the adhesive side facing up, then sandwich the thin plate and the adhesive tape with the upper and lower rubber row arms and stick the thin plate on top of the adhesive tape. A method has also been proposed in which the thin plate is sandwiched between the adhesive tape and the protective tape by supplying the thin plate with a protective tape and sandwiching the thin plate with upper and lower rubber rollers.

[Problem to be solved by the invention]

Of the conventional methods mentioned above, the first manual method is time-consuming and requires a hot wire to apply the tape to prevent wrinkles. The method of sandwiching and pasting thin plates is advantageous in that it can be automated, but because the thin plates are sandwiched between upper and lower rollers, the surface of the thin plates reacts sensitively to even the slightest pressure and may be damaged. Ta.

In addition, the third method is superior in that the three plates are sandwiched between adhesive tape and protective tape, so damage to the surface of the thin plates can be absorbed by the protective tape, but it requires a means for supplying the protective tape. Since the protective tape is not required after the thin plate is attached to the adhesive tape, a means for winding up the protective tape is required after the thin plate is attached.

The object of the present invention is to provide a method for attaching a thin plate to an adhesive tape, which solves the problems of the conventional methods as described above.

[Means for Solving the Problems] In order to achieve the above object, the present invention moves a film-like adhesive tape intermittently in the longitudinal direction with the adhesive side facing up, and delivers it one by one using a delivery means. The outer periphery of the upper surface of the thin plate to be processed is adsorbed using a vacuum suction type conveying tool that uses only the outer periphery of the lower surface as a suction surface and conveyed onto the adhesive tape, the conveying tool is lowered, and the thin plate at the lower end is placed on the adhesive tape. The present invention provides a method for attaching a thin plate to an adhesive tape, which is characterized in that after the attachment, the adhesion is released and the conveyor is returned to its original position.

〔Example〕

Embodiments of the method of this invention will be described below based on embodiments shown in the accompanying drawings.

In the figure, numeral 1 is a thin plate such as a silicon wafer, with a portion of the disk cut out in a straight line.

Such thin plates 1 are stacked at regular intervals in a magazine 2 as shown in FIG. This magazine 2 is placed on a pedestal 3, and the pedestal 3 is a unitized screw jack type.
The sheets are intermittently lowered at a constant pitch by a lifting mechanism 4 such as a rack and pinion type or a cylinder type, and are taken out one by one by a feeding means 5 starting from the lowest one.

The feeding means 5 has an endless conveyor belt 7 which is continuously driven by a drive pulley 6 in the direction of the arrow in FIG. However, mechanisms other than those shown may be used.

Furthermore, a positioning means 8 is provided in front of the magazine 2.

For example, as shown in FIG. 3, this positioning means 8 includes a vacuum suction table 9 that can be lowered and rotated freely by a drive means consisting of an air cylinder and a pulse motor, and a linear orientation flat (hereinafter referred to as It consists of a photoelectric detector (not shown) that detects the direction of the orientation flat.

However, when handling a thin plate 1 without an orientation flat, the positioning means 8 is omitted.

Reference numeral 10 is a one-digit machine base, and a machine 'n1 is provided on the upper side of the machine base for the elevating mechanism 4, delivery means 5, etc.

Reference numeral 13 denotes a roller provided on the machine base 10, which is intermittently driven in the directions of arrows in FIGS. 1 and 3.

Further, as shown in FIG. 5, an adhesive tape 15 pulled out from a winding shaft 14 provided on a machine base 10 is guided through a guide roller 16 onto a roller 13 made of an elastic material such as rubber. This tape 15 is a film made of polyethylene or the like with an adhesive surface on one side, and is directed onto the roller 13 with the adhesive surface facing up.

Further, the machine box 1) is provided with a guide rail 12 in the left and right direction, and a reciprocating table 17 that reciprocates along this rail 12 by an appropriate driving means is provided. A transport tool 1 that can be raised and lowered and is equipped with a positioning means that has the same function as the positioning means 8 mentioned above.
9 will be provided.

As shown in FIG. 3, the transport tool IS is provided with a suction surface a having a plurality of suction holes 20 only on the outer periphery of the lower surface so as to suck only the outer periphery of one plate 1, and the lower surface other than this suction surface a is concave. A space 21 is formed by entering the space 21, and an air blowing port (not shown) is provided for blowing air into this space 21.

If there are irregularities on the surface of the thin plate 1 and the thin plate cannot be held sufficiently by vacuum suction alone, as shown in FIGS. There is also a method in which the holding claws 28 are used to hold the thin plate 1, and the claws 28 are opened as the plate 1 is moved.

The thin plate 1 sent out by the sending out means 5 is stopped when the heald 7 stops under the condition that it is located at the front end of the sending out means 5.

Next, the vacuum suction table 9 rises from between the belts 7, and its upper surface rises above the upper surface of the heald 7, whereby the thin plate 1 is transferred from above the belt 7 to the suction table 91- as shown in FIG.

In this state, the suction stand S rotates while vacuum suctioning the thin plate 1.

Since the peripheral edge of the thin plate 1 protrudes from the periphery of the suction table 9, a detector detects the peripheral edge of the thin plate 1, and when the orientation flat is in a predetermined orientation, a signal is output from the detector and the rotation of the suction table 9 is stopped.

Next, when the carrier 19 that was directly above the thin plate 1 descends and the suction surface a on the outer periphery of its lower surface comes into close contact with the outer periphery of the thin plate 1, the vacuum suction of the carrier 19 is started to suck the thin plate 1 and the suction. The vacuum suction of the table 9 is released, the conveyor 19 rises, the orientation flat is again corrected in the designated direction, and it begins to move horizontally to the right in FIGS. 1 and 3.

On the other hand, the suction table 9, which had been raised above the belt 7, is lowered below the belt 7 to a position where it does not interfere with the entry of the next thin plate 1.

In addition, the thin plate 1 sucked by the conveyor 19 as described above
The lower surface is deformed into a concave shape due to the negative pressure caused by the suction of air in the space 21 from the minute gap between the outer periphery of the thin plate 1 and the suction surface a of the conveyor 19 due to the action of vacuum suction by the suction hole 20. However, in such a case, deformation can be prevented by blowing low-pressure air into the space 21 from an air inlet (not shown).

The adhesive tape 15 is rolled over the roller 13 at a constant speed.
Since it is moving as shown by the arrow in the figure, the conveyor 19 is moved and lowered at the same speed as the tape 15, and the thin plate 1
is pasted onto the tape 15.

After the thin plate 1 is pasted onto the tape 15 in this manner, the conveyor 19 releases suction and rises to return to its original position, that is, above the positioning means 8.

In the plan view of FIG. 2, 22 is a magazine with a ring z3 like a carrier jig.Although not shown, it has almost the same structure as the thin plate magazine 2 shown in FIG. It is placed on a similar pedestal and lowers intermittently one pitch at a time, and is intermittently pushed out in the direction of the arrow from the lowest end by a pushing member 24 driven by a drive mechanism (not shown). becomes.

When the ring 23 has an orientation flat similar to that of the thin plate 1, the orientation flat is positioned by a positioning means provided at this point gb.

The positioning ring 23 is, for example, a transfer means 2 as shown in FIG.
5 onto the tape cutting means 26.

This transfer means 25 is a guide arm 2 fixed to the machine box 1).
It consists of a transfer table 29 that is retracted a along the line 7 with a feed screw or the like, and a suction device 30 that is attached to this table 2S so as to be raised and lowered by an air cylinder or the like.

This suction device 30 has a hollow ring-shaped bottom protrusion with a large number of suction holes, and a flexible tube (
(not shown) is connected to a vacuum suction device (not shown), and as shown in Figure 4, the ring 23 on the machine base 10 is sucked and raised, moved to the position indicated by the chain line, and lowered to cut the tape. The tape 15 on the means 26 and the herring 23 are lowered to release the suction and rise to perform a movement of returning to the original position.

As shown in FIG. 4, the cutting means 26 is provided at the end of an arm 34 that is raised and lowered by an air cylinder 33 attached to the machine box 1). A gear motor 35 is fixed to the lower part of the end of the arm 34, and this motor 3
A cutter arm 38 that swings about a shaft 37 is mounted on a rotating frame 36 that is rotated at 5, and a freely rotating disc-shaped canter 39 is mounted on the tip of this arm 38. Push up by 40.

Further, a disk-shaped presser plate 42 is rotatably attached to the upper end of a vertical shaft 41 fixed at the center of the rotating frame 36, and this presser plate 4
A circular ring-shaped rubber 43 is attached to the upper surface of the outer periphery of the rotating frame 3.
A plurality of legs provided around the lower part of the presser foot 6 are provided with rollers 44 that contact the lower circumferential surface of the presser slope 42.

Therefore, as the tape 15 on which the thin plate 1 is attached moves, the thin plate 1 comes onto the cutting means 26 and stops, and then the transfer means 25 operates as described above to move the ring 23 onto the tape 1.
5, the air cylinder 33 acts, the arm 34 rises, and the rubber 43 on the holding plate 42 and the suction device 30
The cutter 39 cuts into the tape 15 by sandwiching the ring 23 and the tape 15, and the shaft 41 and the rotating frame 36 are rotated by the motor 35 to cut the tape 15 on the lower surface of the ring 23. When the rotating frame 36 rotates about two times to completely cut the tape 15, the motor 35 stops, the cylinder 33 lowers the arm 34, and the suction device 30 returns to its original position.

The tape 15 after cutting is guided to a roller 45 in front of the cutting means 26 as shown in FIGS. 1 and 5, and is guided to a guide roller 46.
The film is then wound onto a winding shaft 47.

Therefore, the adhesive tape 15 to be wound up has a hole 32 cut therein as shown in FIG. .

This conveyor 49 is attached to the machine box 1) or the machine stand 10.

Reference numeral 51 in FIG. 1 is a magazine that stores the thin plate 1 and the ring 23 covered with the film 15' as described above. This magazine 51 is almost similar to each magazine 2.22 described above, and is placed on a pedestal 53 that is lifted and lowered by a suitable unitized lifting mechanism 52, and the ring 23 that has moved on the conveyor 4S is inside the magazine 51. The pedestal 53 rises by one pitch every time there is one shepherd.

〔Effect of the invention〕

As described above, this invention moves the film-like adhesive tape intermittently in the longitudinal direction with the adhesive side facing up, and positions the thin plates one by one by the feeding means to position the orientation flat as necessary. After this, the sheet is pasted onto the adhesive tape with the adhesive side facing up using a vacuum-suction conveying device, and the conveying device suctions the thin plate only with its suction surface around its lower surface. Therefore, since the portion other than the peripheral portion of the thin plate does not come into contact with the conveyor, there is no risk of damaging the top surface of the thin plate.

Furthermore, since it is not necessary to sandwich the adhesive tape and the thin plate between the upper and lower rubber rollers, there is an effect that there is no possibility that the surface of the thin plate will be damaged by the pressure bonding of the rollers.

[Brief explanation of the drawing]

Fig. 1 is a front view showing an example of the apparatus for carrying out the method of the invention; Fig. 2 is a plan view of the same as above; Fig. 3 is an enlarged vertical cross-sectional view of the conveyor and positioning means; Fig. 4 is the same as Fig. 1. FIG. 5 is a perspective view of the main part, FIG. 6 is an enlarged vertical front view showing another example of the carrier, and FIG. 7 is a plan view of the same. DESCRIPTION OF SYMBOLS 1... Thin plate, 5... Feeding means, 8... Positioning means, 13... Roller, 14... Winding shaft, 15... ...Tape, 15'...Film, 19...Carrier, 23...Ring, 26...
Tape cutting means, 30...Suction device. Patent applicant: Nitto Electric Industry Co., Ltd. Agent: Kama 1) Text - Figure 5 Figure 1 Figure 1-153 Figure 2

Claims (1)

[Claims] (1) A film-like adhesive tape is moved intermittently in the longitudinal direction with the adhesive side facing up, and the outer periphery of the upper surface of the thin plate, which is fed out one by one by the feeding means, is vacuumed using only the outer periphery of the lower surface as a suction surface. It is adsorbed with a suction-type conveyor and conveyed onto the adhesive tape, the conveyor is lowered and the thin plate at the lower end is affixed to the adhesive tape, and then the suction is released and the conveyor is returned to its original position. Features a method of attaching thin plates and adhesive tape.