JPH01267979A - Element for connection between electronic parts - Google Patents

Element for connection between electronic parts

Info

Publication number
JPH01267979A
JPH01267979A JP9627488A JP9627488A JPH01267979A JP H01267979 A JPH01267979 A JP H01267979A JP 9627488 A JP9627488 A JP 9627488A JP 9627488 A JP9627488 A JP 9627488A JP H01267979 A JPH01267979 A JP H01267979A
Authority
JP
Japan
Prior art keywords
package
packages
pins
connection
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9627488A
Other languages
Japanese (ja)
Inventor
Hirobumi Yamamoto
博文 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9627488A priority Critical patent/JPH01267979A/en
Publication of JPH01267979A publication Critical patent/JPH01267979A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

  • Connecting Device With Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To provide compact connectability for a plurality of IC packages and facilitate alteration of wirings on a circuit board by fixing a lead to a pin receptacle for receiving a pin of any piece of electronic parts with an insulative substance. CONSTITUTION:Each connecting element 1 between pins 7-10 of IC packages 5, 6 has a plurality of IC package pin receptacle 2 and is equipped with a lead 3 to make electrical connection between these IC package pin receptacles 2, 2, and they are fixed with an insulative substance 4. Thereby the connecting element 1 can connect IC packages 5, 6 compactly, and the IC package pin receptacle 2 installed inside facilitates inter-pin connection and disconnection for the IC packages 5, 6.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ＩＣを含む電子部品の組み立てにおいて、
複数の電子部品のピン間を接続する部品に関するもので
ある。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to the assembly of electronic components including ICs.
It relates to a component that connects pins of multiple electronic components.

〔従来の技術〕[Conventional technology]

電子部品としてはＩＣ，抵抗素子、容量素子、コイル等
種々存在するが、以下簡略化のためＩＣ間の接続を例に
取り述る。There are various electronic components such as ICs, resistive elements, capacitive elements, and coils, but for the sake of simplicity, connections between ICs will be described below as an example.

第５図（ａ）　（ｂ）は従来のＩＣパッケージピン間に
ついての接続方法を示したものである。（ａ）はプリン
ト配線による接続例、（６）はジャンパー配線による接
続例である。FIGS. 5(a) and 5(b) show a conventional method of connecting pins of an IC package. (a) is an example of connection using printed wiring, and (6) is an example of connection using jumper wiring.

第５図（ａ）において、　（５）　Ｉ　（６）はＩＣパ
’７ケージ、（至）はＩＣパッケージ（５）　ｅ　（６
）を固定するプリント基板、（２）はＩＣパッケージ（
５）　ｅ　（６）を結線するためにプリント基板（至）
の裏面に導体の薄板を利用して配線されたプリント配線
、αυはＩＣパッケージピン（７）　＃　（８）とプリ
ント配線（２）を接続するはんだ接着である。In Fig. 5(a), (5) I (6) is the IC package (7), and (to) is the IC package (5) e (6).
), (2) is the printed circuit board that fixes the IC package (
5) Connect the printed circuit board (to) to connect e (6).
The printed wiring is wired using a thin conductor plate on the back side of the board, and αυ is the solder bond that connects the IC package pins (7) # (8) and the printed wiring (2).

第５図（ロ）においては、（５）　ｅ　（ａ）はａと同
様ＩＣパッケージ、α→はこれらＩＣパッケージ（５）
　ｅ　（６）を固定する基板、（３）はＩＣパッケージ
（５）　＃　（６）を結線する導線、αυははんだ接着
である。In Figure 5 (b), (5) e (a) is an IC package similar to a, and α→ is these IC packages (5)
e A board to which (6) is fixed, (3) is a conductive wire that connects the IC package (5) # (6), and αυ is solder bonding.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のＩＣパッケージのピン間の接続は以上のように構
成されているので、ＩＣパッケージをコンパクトに接続
するにはＩＣパッケージのピン間をできる限り近づけな
ければならず、配線ショートの原因となりかねない。ま
た、基板上の配線変更の際、ＩＣパッケージのピン間の
接続及び切断に手間がかかる。プリント配線においては
、基板を作り直さなければならないなどの問題があり、
その対策が課題であった。The connections between the pins of conventional IC packages are configured as described above, so in order to connect IC packages compactly, the pins of the IC package must be placed as close as possible, which may cause wiring shorts. . Furthermore, when changing the wiring on the board, it takes time and effort to connect and disconnect pins of the IC package. There are problems with printed wiring, such as the need to recreate the board.
The challenge was how to deal with this.

この発明は上記のような課題を解決するためになされた
もので、複数のＩＣパッケージをコンパクトに接続でき
るとともに、基板上の配線変更が容易にできるＩＣパッ
ケージのピン間の接続素子を得ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide a connecting element between pins of IC packages that can connect multiple IC packages compactly and that can easily change the wiring on the board. purpose.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係るＩＣパッケージのピン間の接続素子は、
複数のＩＣパッケージピン受けを有し、ＩＣパッケージ
ピン受け間を電気的に接続する導線を備え、これらを絶
縁性物質で固定したものである。The connection element between the pins of the IC package according to the present invention is
It has a plurality of IC package pin receivers, a conductive wire that electrically connects the IC package pin receivers, and these are fixed with an insulating material.

〔作用〕[Effect]

この発明におけるＩＣパッケージのピン間の接続素子は
、複数のＩＣパッケージをコンパクトに接続でき、また
、内部に設けたＩＣパッケージピン受けにより、複数の
ＩＣパッケージのピン間接続及び切断を容易にする。The connecting element between the pins of the IC package according to the present invention allows a plurality of IC packages to be connected compactly, and the IC package pin receiver provided inside facilitates connection and disconnection between the pins of the plurality of IC packages.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第１
図にこの発明によるＩＣパッケージのピン間の接続素子
の外観斜視図を示す。第２図に第１図の８面で切断した
断面斜視図を示した。図において、（１）は接続素子、
（２）はＩＣパッケージのピン間の接続及び切断ができ
るようにピンソケット構造となっているＩＣパッケージ
ピン受け、（３）はａｍのＩＣパッケージピン受け（２
）を電気的に接続する導線、（４）は絶縁性物質で作ら
れた接続素子本体である。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure shows an external perspective view of a connecting element between pins of an IC package according to the present invention. FIG. 2 shows a cross-sectional perspective view taken along the 8th plane in FIG. 1. In the figure, (1) is a connecting element,
(2) is an IC package pin receiver with a pin socket structure that allows connection and disconnection between pins of the IC package, and (3) is an am IC package pin receiver (2).
), and (4) is a connecting element body made of an insulating material.

第３図にこの発明によるＩＣパッケージのピン間の接続
素子の使用例を示す。図において、複数のＩＣパッケー
ジ（５）　Ｉ　（６）を基板ａ＜上に立て、接続素子（
１）を使用して、それぞれのＩＣパッケージピンＣ７＞
　＊　（ａ）を接続する方法である。また、基板α少裏
面での接続にも、接続素子（１）を使用してＩＣパッケ
ージピン叫を接続することができ、従来の接続方法（プ
リント配線、ジャンパー配線）と併用して利用すること
ができる。FIG. 3 shows an example of the use of a connecting element between pins of an IC package according to the present invention. In the figure, a plurality of IC packages (5) I (6) are placed on a substrate a<, and connecting elements (
1) using each IC package pin C7>
*This is a method of connecting (a). In addition, the connection element (1) can be used to connect the IC package pins for connection on the back side of the board, and can be used in conjunction with conventional connection methods (printed wiring, jumper wiring). I can do it.

第４図（ａ）　、　（ｂ）にこの発明による接続素子（
１）内部の導線（３）接続の例を示す。図において、接
婢素子（１）内部に設けたＩＣパッケージピン受け（２
）と導線（３）の接続及び切断ができるようになってい
る。また、ＩＣパッケージピン受け（２）と導線（３）
の組み合せを変える（例、図４（ａ）を図４の）に変え
る）ことで、いろいろなタイプの接続素子を作ることが
可能である。FIGS. 4(a) and 4(b) show a connection element according to the present invention (
1) An example of internal conductor (3) connection is shown. In the figure, the IC package pin receiver (2) provided inside the contact element (1)
) and the conductor (3) can be connected and disconnected. In addition, the IC package pin receiver (2) and conductor wire (3)
By changing the combination of (for example, changing FIG. 4(a) to that in FIG. 4), it is possible to create various types of connecting elements.

なお、上記実施例では接続素子内部に設けたＩＣパッケ
ージピン受け（２）がピンソケットになっているものを
示したが、ＩＣパッケージピン受ケ（２）の表面にはん
だを蒸着したものでよい。この場合はＩＣパッケージピ
ン受げにＩＣパッケージピンを入れた状態の後に、リフ
ロー処理することによりはんだ接続させることができ、
量産処理に向いている。In addition, in the above embodiment, the IC package pin receiver (2) provided inside the connecting element is shown as a pin socket, but solder may be vapor-deposited on the surface of the IC package pin receiver (2). . In this case, after inserting the IC package pin into the IC package pin holder, solder connection can be made by performing reflow treatment.
Suitable for mass production processing.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば複数のＩＣパッケージ
のピン間の接続に接続素子を使用したので、ボードの集
積度を上げることができ、また、配線変更も容易にでき
るという効果がある。As described above, according to the present invention, since a connecting element is used to connect the pins of a plurality of IC packages, it is possible to increase the degree of integration of the board, and the wiring can be easily changed.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第４図はこの発明の一実施例に関するもの
で、第１図は電子部品量接続素子を示す外観斜視図、第
２図は第１図に示す８面における断面斜視図、第３図は
電子部品量接続素子による使用例の側面図、第４図は電
子部品量接続素子内部の配線接続の一例の平面図、第５
図は従来の技術による複数のＩＣパッケージのピン間の
接続例を示す側面図である。図において、（１）は接続
素子、（２）はＩＣパッケージピン受け、（３）は導線
、（４）は接続素子本体、（５）（６）ハＩＣハッケー
シ、（７）　〜（１０はＩＣパッケージピン、αυはは
んだ接着、ａ→は基板である。 なお、図中、同一符号は同一、又は相当部分を示す。1 to 4 relate to an embodiment of the present invention, in which FIG. 1 is an external perspective view showing an electronic component quantity connecting element, FIG. Figure 3 is a side view of an example of use with an electronic component connection element, Figure 4 is a plan view of an example of wiring connections inside the electronic component connection element, and Figure 5 is a side view of an example of use with an electronic component connection element.
The figure is a side view showing an example of connections between pins of a plurality of IC packages according to the prior art. In the figure, (1) is a connecting element, (2) is an IC package pin receiver, (3) is a conductor, (4) is a connecting element body, (5) (6) is an IC hackseat, (7) to (10 are IC package pins, αυ are solder bonds, and a→ are substrates. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 複数の電子部品のピンを受けるための複数の導電性ピン
受けと、これらピン受け間を電気的に接続する導線とを
備え、絶縁性物質でこれらピン、受けと導線を固定した
ことを特徴とする電子部品間接続素子。It is characterized by comprising a plurality of conductive pin receivers for receiving pins of a plurality of electronic components, and conductive wires for electrically connecting these pin receivers, and these pins, receivers, and conductor wires are fixed with an insulating material. Connection element between electronic components.
JP9627488A 1988-04-18 1988-04-18 Element for connection between electronic parts Pending JPH01267979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9627488A JPH01267979A (en) 1988-04-18 1988-04-18 Element for connection between electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9627488A JPH01267979A (en) 1988-04-18 1988-04-18 Element for connection between electronic parts

Publications (1)

Publication Number Publication Date
JPH01267979A true JPH01267979A (en) 1989-10-25

Family

ID=14160562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9627488A Pending JPH01267979A (en) 1988-04-18 1988-04-18 Element for connection between electronic parts

Country Status (1)

Country Link
JP (1) JPH01267979A (en)

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