JPH0127023B2 - - Google Patents

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Publication number
JPH0127023B2
JPH0127023B2 JP59190128A JP19012884A JPH0127023B2 JP H0127023 B2 JPH0127023 B2 JP H0127023B2 JP 59190128 A JP59190128 A JP 59190128A JP 19012884 A JP19012884 A JP 19012884A JP H0127023 B2 JPH0127023 B2 JP H0127023B2
Authority
JP
Japan
Prior art keywords
ceramics
sialon
bonding
sintered body
diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59190128A
Other languages
Japanese (ja)
Other versions
JPS6168375A (en
Inventor
Yoshio Myamoto
Akira Sasame
Mitsue Koizumi
Hisao Takeuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
University of Osaka NUC
Original Assignee
Osaka University NUC
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka University NUC, Sumitomo Electric Industries Ltd filed Critical Osaka University NUC
Priority to JP19012884A priority Critical patent/JPS6168375A/en
Publication of JPS6168375A publication Critical patent/JPS6168375A/en
Publication of JPH0127023B2 publication Critical patent/JPH0127023B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 (イ) 技術分野 本発明は、Si3N4系セラミツクスとAl2O3系セ
ラミツクスを高い接合強度で固相接合する方法に
関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to a method for solid-phase bonding Si 3 N 4 ceramics and Al 2 O 3 ceramics with high bonding strength.

(ロ) 従来技術の問題点 従来技術Si3N4を主成分とするセラミツクスと
Al2O3を主成分とするセラミツクスを接合する際
には、被接合物の界面を接触させた後、非酸化性
の雰囲気中、加圧下で1700℃前後の温度に保持し
て、固相拡散接合する方法がとられてきた。しか
しながら、1500℃付近ではAl2O3がSi3N4系セラ
ミツクスに固溶するため、Si3N4系セラミツクス
とAl2O3系セラミツクスを直接接触させて固相接
合すると、Al2O3系セラミツクスからSi3N4系セ
ラミツクス中へAlとOの一方的な拡散が起こつ
た。このためAl2O3系セラミツクス内部の接合界
面近傍に、このカーケンドール効果によつて粗大
な空孔が生じ、接合体の強度が減少した。
(b) Problems with conventional technology Conventional technology Ceramics whose main component is Si 3 N 4 and
When joining ceramics containing Al 2 O 3 as the main component, after bringing the interfaces of the objects into contact, the solid state is maintained at a temperature of around 1700°C under pressure in a non-oxidizing atmosphere. A method of diffusion bonding has been used. However, since Al 2 O 3 forms a solid solution in Si 3 N 4 ceramics at around 1500°C, when Si 3 N 4 ceramics and Al 2 O 3 ceramics are brought into direct contact and solid phase bonded, Al 2 O 3 Unilateral diffusion of Al and O from the Si 3 N 4 ceramics occurred. For this reason, coarse pores were formed near the bonding interface inside the Al 2 O 3 based ceramics due to the Kirkendall effect, reducing the strength of the bonded body.

第1図に上記の従来の接合方法によつて作製し
たSi3N4系セラミツクスとAl2O3系セラミツクス
の接合体のAl2O3セラミツクス内部の接合界面近
傍の組織写真を示す。写真からも明らかなよう
に、Al2O3セラミツクス内部の接合界面付近に粗
大な空孔が発生している。この空孔は固相拡散接
合時にAlとOがSi3N4系セラミツクス中に一方拡
散して固溶し、このカーケンドール効果によつて
生じたものである。この時Si3N4系セラミツクス
の側からAl2O3系セラミツクスへはほとんど拡散
は起こらない。
FIG. 1 shows a photograph of the structure near the bonding interface inside the Al 2 O 3 ceramics of a bonded body of Si 3 N 4 ceramics and Al 2 O 3 ceramics produced by the conventional bonding method described above. As is clear from the photo, coarse pores are generated near the bonding interface inside the Al 2 O 3 ceramics. These pores are generated by the Kirkendall effect when Al and O diffuse into the Si 3 N 4 ceramics during solid phase diffusion bonding and form a solid solution. At this time, almost no diffusion occurs from the Si 3 N 4 ceramic to the Al 2 O 3 ceramic.

以上述べたように、Si3N4系セラミツクスと
Al2O3系セラミツクスを接合する際に、従来の
Si3N4系セラミツクスとAl2O3系セラミツクスを
直接接触させて固相拡散接合する方法では、カー
ケンドール効果によつてAl2O3系セラミツクス中
に粗大な空孔が発生するという問題があり、接合
強度の高いSi3N4−Al2O3接合体を得ることは不
可能であつた。本発明者らは、この点に鑑み、カ
ーケンドール効果を抑えて空孔の発生を抑止し、
接合強度の高いSi3N4−Al2O3接合体を得ること
を目的として、現象の追求、接合方法の改良に努
力した結果、本発明に到つたものである。
As mentioned above, Si 3 N 4 ceramics and
When joining Al 2 O 3 ceramics, conventional
The method of solid-phase diffusion bonding by bringing Si 3 N 4 ceramics and Al 2 O 3 ceramics into direct contact has the problem that coarse pores are generated in the Al 2 O 3 ceramics due to the Kirkendall effect. Therefore, it was impossible to obtain a Si 3 N 4 -Al 2 O 3 bonded body with high bonding strength. In view of this point, the present inventors suppressed the Kirkendall effect to suppress the generation of pores,
With the aim of obtaining a Si 3 N 4 -Al 2 O 3 bonded body with high bonding strength, the present invention was achieved as a result of efforts to pursue phenomena and improve bonding methods.

(ハ) 発明の開示 本発明で言うSi3N4系セラミツクスとは、焼結
体中に50重量%以上のSi3N4を含み、残部が
Al2O3及び/又はMgO及び/又は希土類酸化物な
ど焼結の際に助剤として添加した酸化物のガラス
相及び結晶相を含むセラミツクス、並びにサイア
ロンを指す。また、本発明のAl2O3系セラミツク
スとは焼結体中に50重量%以上のAl2O3を含み、
残部がSiO2及び/又はZrO2などの酸化物より成
るセラミツクスを指す。
(c) Disclosure of the invention The Si 3 N 4 ceramics referred to in the present invention are those containing 50% by weight or more of Si 3 N 4 in a sintered body, with the remainder being
Refers to ceramics containing glass and crystalline phases of oxides added as auxiliaries during sintering, such as Al 2 O 3 and/or MgO and/or rare earth oxides, and sialon. In addition, the Al 2 O 3 ceramics of the present invention include 50% by weight or more of Al 2 O 3 in the sintered body,
Refers to ceramics in which the remainder consists of oxides such as SiO 2 and/or ZrO 2 .

上記のSi3N4系セラミツクスとAl2O3系セラミ
ツクスを直接接触させて固相拡散接合すると、
Al2O3系セラミツクスからSi3N4系セラミツクス
中へAlとOの一方拡散が起こり、Al2O3系セラミ
ツクス内部の接合界面近傍に粗大な空孔が生じる
ことは、従来技術の問題点の項で述べた通りであ
る。本発明者らはこの現象をEPMA(Electron
Probe Micro Analysis)やX線回折などの分析
手法を用いてさらに詳細に解析した結果、Si3N4
系セラミツクス内部の接合界面と隣接した部分に
サイアロン層が生成していることが判明した。こ
のサイアロンは、Al2O3系セラミツクスより
Si3N4系セラミツクス中に拡散してきたAl及びO
とSi3N4が反応して生成したものと考えられる。
When the above Si 3 N 4 ceramics and Al 2 O 3 ceramics are brought into direct contact and solid-phase diffusion bonded,
One-sided diffusion of Al and O from Al 2 O 3 ceramics into Si 3 N 4 ceramics causes large pores near the bonding interface inside the Al 2 O 3 ceramics, which is a problem with the conventional technology. As stated in the section. The present inventors investigated this phenomenon using EPMA (Electron
As a result of further detailed analysis using analysis methods such as Probe Micro Analysis and X-ray diffraction, it was found that Si 3 N 4
It was found that a sialon layer was formed in the area adjacent to the bonding interface inside the system ceramics. This Sialon is made from Al 2 O 3 ceramics.
Al and O diffused into Si 3 N 4 ceramics
It is thought that the product was formed by the reaction between Si 3 N 4 and Si 3 N 4 .

この結果をもとにして、Si3N4系セラミツクス
とAl2O3系セラミツクスの間にサイアロン焼結体
を介在させて、非酸化性雰囲気中、加圧下で1800
℃に保持して固相拡散接合を行つたところ、
Al2O3系セラミツクスの内部に粗大な空孔を生じ
ることなく、良好なSi3N4−Al2O3接合体が得ら
れた。このことからSi3N4系セラミツクスと
Al2O3系セラミツクスの間にサイアロン焼結体を
挟むことにより、Al2O3系セラミツクスから
Si3N4系セラミツクスへのAlとOの一方拡散を抑
え得ることが分かつた。この理由について現在詳
細に検討中であるが、AlとOの拡散速度が、サ
イアロン焼結体中ではSi3N4系セラミツクス中に
比べて小さいことによる可能性が大きいと考えら
れる。
Based on this result, we interposed a Sialon sintered body between Si 3 N 4 ceramics and Al 2 O 3 ceramics, and heated them for 1800 min under pressure in a non-oxidizing atmosphere.
When solid-phase diffusion bonding was performed while holding at ℃,
A good Si 3 N 4 -Al 2 O 3 bonded body was obtained without generating large pores inside the Al 2 O 3 based ceramics. From this, Si 3 N 4 ceramics and
By sandwiching the Sialon sintered body between Al 2 O 3 ceramics, it can be made from Al 2 O 3 ceramics.
It has been found that one-sided diffusion of Al and O into Si 3 N 4 ceramics can be suppressed. Although the reason for this is currently being investigated in detail, it is thought that it is highly likely that the diffusion rate of Al and O is lower in the Sialon sintered body than in Si 3 N 4 ceramics.

本発明で言うサイアロンは、Si3N4構造のSi位
置にAl、N位置にOが置換型固溶したものであ
り、被接合材であるSi3N4系セラミツクスと類似
の結晶構造を持つているのにあわせて、Al2O3
セラミツクスとのAlとOの拡散を生ずるため、
Si3N4系セラミツクスとAl2O3系セラミツクスを
接合する際の介在層に適している。上述のように
Si3N4構造Si位置にAl、N位置にOが置換型固溶
したものを総称してサイアロンと呼んでいるが、
サイアロンにも数種類あり、それぞれ組成、構造
が異なつている。特に本発明の介在層として好ま
しいのは、β−サイアロンと呼ばれている種類の
サイアロンである。β−サイアロンは一般式
Si6-zAlzOzN8-z(ここでz=0〜4.2)で示され、
置換するAl、Oが同数であり、Si+Al/O+N
が常に3/4のモル比になつている。Si3N4系セラ
ミツクスの焼結体中に含まれるSi3N4粒子は、一
般にβ型の結晶構造を持つており、結晶構造の類
似性の面から考えると介在層としてはβ−サイア
ロンが最も適している。β−サイアロン中のOの
拡散係数が小さいことは一般に知られており、本
発明においてサイアロンを被接合物間に介在させ
ることによつて、Al2O3系セラミツクスからのAl
とOの一方拡散を抑えることができたこととよい
一致を示している。
Sialon as referred to in the present invention is a Si 3 N 4 structure in which Al is substituted in the Si position and O is substituted in the N position, and has a crystal structure similar to the Si 3 N 4 ceramics that are the materials to be joined. At the same time, it causes diffusion of Al and O with Al 2 O 3 ceramics.
Suitable as an intervening layer when bonding Si 3 N 4 ceramics and Al 2 O 3 ceramics. as mentioned above
The Si 3 N 4 structure in which Al is substituted in the Si position and O is substituted in the N position is collectively called sialon.
There are several types of Sialon, each with a different composition and structure. Particularly preferred as the intervening layer of the present invention is a type of sialon called β-sialon. β-Sialon is a general formula
denoted by Si 6- zAlzOzN 8- z (where z = 0 to 4.2),
The number of Al and O to be replaced is the same, and Si+Al/O+N
are always in a molar ratio of 3/4. Si 3 N 4 particles contained in a sintered body of Si 3 N 4 ceramics generally have a β-type crystal structure, and considering the similarity of the crystal structures, β-sialon is likely to be the intervening layer. most suitable. It is generally known that the diffusion coefficient of O in β-sialon is small, and in the present invention, by interposing sialon between the objects to be bonded, Al 2 O 3 ceramics can be
This shows good agreement with the fact that the unilateral diffusion of O was suppressed.

しかしながら、介在層はβ−サイアロンに限ら
れるものではなく、Mx(Si、Al)12(O、N)16(M
は金属でLi、Mg、Ca、Yなどx≦2)の組成を
もつα−サイアロンを用いても、Al2O3系セラミ
ツクスからSi3N4系セラミツクスへAlとOが一方
拡散するのを抑え、空孔を生じない良好な接合体
を得ることができる。
However, the intervening layer is not limited to β-SiAlON, but Mx (Si, Al) 12 (O, N) 16 (M
Even if α-Sialon is a metal with a composition such as Li, Mg, Ca, Y, etc. x≦2), it is difficult to prevent Al and O from unilaterally diffusing from Al 2 O 3 ceramics to Si 3 N 4 ceramics. It is possible to obtain a good bonded body without forming voids.

以下、実施例によつて本発明を説明する。 The present invention will be explained below with reference to Examples.

実施例 1 焼結助剤として5重量%のMgOを添加して焼
結した密度99.2%のSi3N4焼結体と純度99.5%の
α−Al2O3を焼結した密度99.7%のAl2O3焼結体
をそれぞれ直径5mm、高さ3mmの円柱状に加工
し、この間に組成Si5AlON7、密度98.9%のβ−
サイアロン焼結体を直径5mm、厚さ1mmに加工し
た円板を挟んで、30000Kg/mm2の加圧下、1800℃
に30分間保持し、固相拡散接合した。
Example 1 A Si 3 N 4 sintered body with a density of 99.2%, which was sintered by adding 5% by weight of MgO as a sintering aid, and a sintered body with a density of 99.7%, which was obtained by sintering α-Al 2 O 3 with a purity of 99.5%. Each Al 2 O 3 sintered body was processed into a cylindrical shape with a diameter of 5 mm and a height of 3 mm.
A disc made of Sialon sintered body processed into a diameter of 5 mm and a thickness of 1 mm was sandwiched between the two and heated at 1800°C under a pressure of 30000 kg/mm 2.
It was held for 30 minutes and solid-phase diffusion bonding was performed.

この接合体のAl2O3相の接合界面近傍の組織を
第2図に示す。
FIG. 2 shows the structure of the Al 2 O 3 phase near the bonding interface of this bonded body.

第1図はサイアロンを介在層として用いず、
Si3N4焼結体とAl2O3焼結体を直接接合した時の
Al2O3相の接合界面近傍の組織である。
Figure 1 shows the structure without using Sialon as an intervening layer.
When Si 3 N 4 sintered body and Al 2 O 3 sintered body are directly joined
This is the structure near the bonding interface of the Al 2 O 3 phase.

第1図と第2図を比較すると、サイアロンを介
在層に用いることにより、接合時にAl2O3焼結体
中に粗大な空孔が発生するのを抑え得ることが良
く分かる。この接合体の接合強度は引張強度は16
Kg/mm2であつた。
Comparing FIG. 1 and FIG. 2, it is clearly seen that by using SiAlON as the intervening layer, it is possible to suppress the generation of large pores in the Al 2 O 3 sintered body during bonding. The tensile strength of this joint is 16
It was Kg/ mm2 .

実施例 2 焼結助剤として10重量%のAl2O3を添加して焼
結した密度98.7%のSi3N4焼結体と、SiO2を8重
量%添加して焼結密度99.3%のAl2O3焼結体をそ
れぞれ直径10mm、高さ10mmの円柱状に加工し、こ
の間に組成Y0.6(Si9.3Al2.7)(O0.9N15.1)、密度98.
7
%のα−サイアロン焼結体を直径10mm、厚さ1mm
に加工した円板を挟んで、200Kg/cm2の加圧下、
1700℃に30分間保持し、固相拡散接合した。
Example 2 A Si 3 N 4 sintered body with a density of 98.7% was sintered by adding 10% by weight of Al 2 O 3 as a sintering aid, and a sintered body with a density of 99.3% by adding 8% by weight of SiO 2 Each of the Al 2 O 3 sintered bodies was processed into a cylindrical shape with a diameter of 10 mm and a height of 10 mm .
7
% α-sialon sintered body with a diameter of 10 mm and a thickness of 1 mm.
Under a pressure of 200Kg/cm 2 ,
It was held at 1700°C for 30 minutes and solid-phase diffusion bonding was performed.

この時Al2O3焼結体中には粗大な空孔は発生せ
ず、良好な接合体が得られた。この接合体の接合
強度は引張強度で14Kg/mm2であつた。
At this time, no coarse pores were generated in the Al 2 O 3 sintered body, and a good joined body was obtained. The joint strength of this joined body was 14 Kg/mm 2 in terms of tensile strength.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のSi3N4とAl2O3を直接接合した
場合のAl2O3の接合界面近傍の組織を示す倍率
900倍の顕微鏡写真であり、第2図は本発明の接
合方法による接合体のAl2O3の接合界面近傍の組
織の顕微鏡写真(倍率360倍)である。
Figure 1 shows the magnification of the structure near the bonding interface of Al 2 O 3 when Si 3 N 4 and Al 2 O 3 are directly bonded using conventional methods.
FIG. 2 is a micrograph (magnification: 360 times) of the structure near the Al 2 O 3 bonding interface of the bonded body made by the bonding method of the present invention.

Claims (1)

【特許請求の範囲】 1 Si3N4を主成分とするセラミツクスとAl2O3
を主成分とするセラミツクスを接合する際に、両
者間にサイアロンを介在させて固相接合すること
を特徴とするセラミツクスの接合方法。 2 介在させるサイアロンがSi6-zAlzOzN8-z(z
=0.1〜4.2)の組成をもつβサイアロンであるこ
とを特徴とする特許請求の範囲第1項記載のセラ
ミツクスの接合方法。 3 介在させるサイアロンがMx(Si、Al)12(O、
N)16(Mは金属でLi、Mg、Ca、Yなどでx≦
2)の組成をもつα−サイアロンであることを特
徴とする特許請求の範囲第1項記載のセラミツク
スの接合方法。
[Claims] 1 Ceramics containing Si 3 N 4 as a main component and Al 2 O 3
1. A method for joining ceramics, which is characterized in that when joining ceramics containing as a main component, solid phase joining is performed with Sialon interposed between the two. 2 The intervening sialon is Si 6- zAlzOzN 8- z (z
2. The method for joining ceramics according to claim 1, wherein the ceramic is β-sialon having a composition of 0.1 to 4.2). 3 The intervening sialon is Mx (Si, Al) 12 (O,
N) 16 (M is a metal such as Li, Mg, Ca, Y, etc. x≦
2) The method for joining ceramics according to claim 1, wherein the ceramic is α-sialon having the composition.
JP19012884A 1984-09-10 1984-09-10 Ceramic bonding method Granted JPS6168375A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19012884A JPS6168375A (en) 1984-09-10 1984-09-10 Ceramic bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19012884A JPS6168375A (en) 1984-09-10 1984-09-10 Ceramic bonding method

Publications (2)

Publication Number Publication Date
JPS6168375A JPS6168375A (en) 1986-04-08
JPH0127023B2 true JPH0127023B2 (en) 1989-05-26

Family

ID=16252857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19012884A Granted JPS6168375A (en) 1984-09-10 1984-09-10 Ceramic bonding method

Country Status (1)

Country Link
JP (1) JPS6168375A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02124778A (en) * 1988-11-04 1990-05-14 Hitachi Metals Ltd Joined body of two pieces of aln ceramics and heat radiating device using same
EP2167445A1 (en) * 2007-07-13 2010-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Diffusion-joined ceramic component and method for the production thereof

Also Published As

Publication number Publication date
JPS6168375A (en) 1986-04-08

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