JPH0127023B2 - - Google Patents
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- Publication number
- JPH0127023B2 JPH0127023B2 JP59190128A JP19012884A JPH0127023B2 JP H0127023 B2 JPH0127023 B2 JP H0127023B2 JP 59190128 A JP59190128 A JP 59190128A JP 19012884 A JP19012884 A JP 19012884A JP H0127023 B2 JPH0127023 B2 JP H0127023B2
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- Prior art keywords
- ceramics
- sialon
- bonding
- sintered body
- diffusion
- Prior art date
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Description
【発明の詳細な説明】
(イ) 技術分野
本発明は、Si3N4系セラミツクスとAl2O3系セ
ラミツクスを高い接合強度で固相接合する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to a method for solid-phase bonding Si 3 N 4 ceramics and Al 2 O 3 ceramics with high bonding strength.
(ロ) 従来技術の問題点
従来技術Si3N4を主成分とするセラミツクスと
Al2O3を主成分とするセラミツクスを接合する際
には、被接合物の界面を接触させた後、非酸化性
の雰囲気中、加圧下で1700℃前後の温度に保持し
て、固相拡散接合する方法がとられてきた。しか
しながら、1500℃付近ではAl2O3がSi3N4系セラ
ミツクスに固溶するため、Si3N4系セラミツクス
とAl2O3系セラミツクスを直接接触させて固相接
合すると、Al2O3系セラミツクスからSi3N4系セ
ラミツクス中へAlとOの一方的な拡散が起こつ
た。このためAl2O3系セラミツクス内部の接合界
面近傍に、このカーケンドール効果によつて粗大
な空孔が生じ、接合体の強度が減少した。(b) Problems with conventional technology Conventional technology Ceramics whose main component is Si 3 N 4 and
When joining ceramics containing Al 2 O 3 as the main component, after bringing the interfaces of the objects into contact, the solid state is maintained at a temperature of around 1700°C under pressure in a non-oxidizing atmosphere. A method of diffusion bonding has been used. However, since Al 2 O 3 forms a solid solution in Si 3 N 4 ceramics at around 1500°C, when Si 3 N 4 ceramics and Al 2 O 3 ceramics are brought into direct contact and solid phase bonded, Al 2 O 3 Unilateral diffusion of Al and O from the Si 3 N 4 ceramics occurred. For this reason, coarse pores were formed near the bonding interface inside the Al 2 O 3 based ceramics due to the Kirkendall effect, reducing the strength of the bonded body.
第1図に上記の従来の接合方法によつて作製し
たSi3N4系セラミツクスとAl2O3系セラミツクス
の接合体のAl2O3セラミツクス内部の接合界面近
傍の組織写真を示す。写真からも明らかなよう
に、Al2O3セラミツクス内部の接合界面付近に粗
大な空孔が発生している。この空孔は固相拡散接
合時にAlとOがSi3N4系セラミツクス中に一方拡
散して固溶し、このカーケンドール効果によつて
生じたものである。この時Si3N4系セラミツクス
の側からAl2O3系セラミツクスへはほとんど拡散
は起こらない。 FIG. 1 shows a photograph of the structure near the bonding interface inside the Al 2 O 3 ceramics of a bonded body of Si 3 N 4 ceramics and Al 2 O 3 ceramics produced by the conventional bonding method described above. As is clear from the photo, coarse pores are generated near the bonding interface inside the Al 2 O 3 ceramics. These pores are generated by the Kirkendall effect when Al and O diffuse into the Si 3 N 4 ceramics during solid phase diffusion bonding and form a solid solution. At this time, almost no diffusion occurs from the Si 3 N 4 ceramic to the Al 2 O 3 ceramic.
以上述べたように、Si3N4系セラミツクスと
Al2O3系セラミツクスを接合する際に、従来の
Si3N4系セラミツクスとAl2O3系セラミツクスを
直接接触させて固相拡散接合する方法では、カー
ケンドール効果によつてAl2O3系セラミツクス中
に粗大な空孔が発生するという問題があり、接合
強度の高いSi3N4−Al2O3接合体を得ることは不
可能であつた。本発明者らは、この点に鑑み、カ
ーケンドール効果を抑えて空孔の発生を抑止し、
接合強度の高いSi3N4−Al2O3接合体を得ること
を目的として、現象の追求、接合方法の改良に努
力した結果、本発明に到つたものである。 As mentioned above, Si 3 N 4 ceramics and
When joining Al 2 O 3 ceramics, conventional
The method of solid-phase diffusion bonding by bringing Si 3 N 4 ceramics and Al 2 O 3 ceramics into direct contact has the problem that coarse pores are generated in the Al 2 O 3 ceramics due to the Kirkendall effect. Therefore, it was impossible to obtain a Si 3 N 4 -Al 2 O 3 bonded body with high bonding strength. In view of this point, the present inventors suppressed the Kirkendall effect to suppress the generation of pores,
With the aim of obtaining a Si 3 N 4 -Al 2 O 3 bonded body with high bonding strength, the present invention was achieved as a result of efforts to pursue phenomena and improve bonding methods.
(ハ) 発明の開示
本発明で言うSi3N4系セラミツクスとは、焼結
体中に50重量%以上のSi3N4を含み、残部が
Al2O3及び/又はMgO及び/又は希土類酸化物な
ど焼結の際に助剤として添加した酸化物のガラス
相及び結晶相を含むセラミツクス、並びにサイア
ロンを指す。また、本発明のAl2O3系セラミツク
スとは焼結体中に50重量%以上のAl2O3を含み、
残部がSiO2及び/又はZrO2などの酸化物より成
るセラミツクスを指す。(c) Disclosure of the invention The Si 3 N 4 ceramics referred to in the present invention are those containing 50% by weight or more of Si 3 N 4 in a sintered body, with the remainder being
Refers to ceramics containing glass and crystalline phases of oxides added as auxiliaries during sintering, such as Al 2 O 3 and/or MgO and/or rare earth oxides, and sialon. In addition, the Al 2 O 3 ceramics of the present invention include 50% by weight or more of Al 2 O 3 in the sintered body,
Refers to ceramics in which the remainder consists of oxides such as SiO 2 and/or ZrO 2 .
上記のSi3N4系セラミツクスとAl2O3系セラミ
ツクスを直接接触させて固相拡散接合すると、
Al2O3系セラミツクスからSi3N4系セラミツクス
中へAlとOの一方拡散が起こり、Al2O3系セラミ
ツクス内部の接合界面近傍に粗大な空孔が生じる
ことは、従来技術の問題点の項で述べた通りであ
る。本発明者らはこの現象をEPMA(Electron
Probe Micro Analysis)やX線回折などの分析
手法を用いてさらに詳細に解析した結果、Si3N4
系セラミツクス内部の接合界面と隣接した部分に
サイアロン層が生成していることが判明した。こ
のサイアロンは、Al2O3系セラミツクスより
Si3N4系セラミツクス中に拡散してきたAl及びO
とSi3N4が反応して生成したものと考えられる。 When the above Si 3 N 4 ceramics and Al 2 O 3 ceramics are brought into direct contact and solid-phase diffusion bonded,
One-sided diffusion of Al and O from Al 2 O 3 ceramics into Si 3 N 4 ceramics causes large pores near the bonding interface inside the Al 2 O 3 ceramics, which is a problem with the conventional technology. As stated in the section. The present inventors investigated this phenomenon using EPMA (Electron
As a result of further detailed analysis using analysis methods such as Probe Micro Analysis and X-ray diffraction, it was found that Si 3 N 4
It was found that a sialon layer was formed in the area adjacent to the bonding interface inside the system ceramics. This Sialon is made from Al 2 O 3 ceramics.
Al and O diffused into Si 3 N 4 ceramics
It is thought that the product was formed by the reaction between Si 3 N 4 and Si 3 N 4 .
この結果をもとにして、Si3N4系セラミツクス
とAl2O3系セラミツクスの間にサイアロン焼結体
を介在させて、非酸化性雰囲気中、加圧下で1800
℃に保持して固相拡散接合を行つたところ、
Al2O3系セラミツクスの内部に粗大な空孔を生じ
ることなく、良好なSi3N4−Al2O3接合体が得ら
れた。このことからSi3N4系セラミツクスと
Al2O3系セラミツクスの間にサイアロン焼結体を
挟むことにより、Al2O3系セラミツクスから
Si3N4系セラミツクスへのAlとOの一方拡散を抑
え得ることが分かつた。この理由について現在詳
細に検討中であるが、AlとOの拡散速度が、サ
イアロン焼結体中ではSi3N4系セラミツクス中に
比べて小さいことによる可能性が大きいと考えら
れる。 Based on this result, we interposed a Sialon sintered body between Si 3 N 4 ceramics and Al 2 O 3 ceramics, and heated them for 1800 min under pressure in a non-oxidizing atmosphere.
When solid-phase diffusion bonding was performed while holding at ℃,
A good Si 3 N 4 -Al 2 O 3 bonded body was obtained without generating large pores inside the Al 2 O 3 based ceramics. From this, Si 3 N 4 ceramics and
By sandwiching the Sialon sintered body between Al 2 O 3 ceramics, it can be made from Al 2 O 3 ceramics.
It has been found that one-sided diffusion of Al and O into Si 3 N 4 ceramics can be suppressed. Although the reason for this is currently being investigated in detail, it is thought that it is highly likely that the diffusion rate of Al and O is lower in the Sialon sintered body than in Si 3 N 4 ceramics.
本発明で言うサイアロンは、Si3N4構造のSi位
置にAl、N位置にOが置換型固溶したものであ
り、被接合材であるSi3N4系セラミツクスと類似
の結晶構造を持つているのにあわせて、Al2O3系
セラミツクスとのAlとOの拡散を生ずるため、
Si3N4系セラミツクスとAl2O3系セラミツクスを
接合する際の介在層に適している。上述のように
Si3N4構造Si位置にAl、N位置にOが置換型固溶
したものを総称してサイアロンと呼んでいるが、
サイアロンにも数種類あり、それぞれ組成、構造
が異なつている。特に本発明の介在層として好ま
しいのは、β−サイアロンと呼ばれている種類の
サイアロンである。β−サイアロンは一般式
Si6-zAlzOzN8-z(ここでz=0〜4.2)で示され、
置換するAl、Oが同数であり、Si+Al/O+N
が常に3/4のモル比になつている。Si3N4系セラ
ミツクスの焼結体中に含まれるSi3N4粒子は、一
般にβ型の結晶構造を持つており、結晶構造の類
似性の面から考えると介在層としてはβ−サイア
ロンが最も適している。β−サイアロン中のOの
拡散係数が小さいことは一般に知られており、本
発明においてサイアロンを被接合物間に介在させ
ることによつて、Al2O3系セラミツクスからのAl
とOの一方拡散を抑えることができたこととよい
一致を示している。 Sialon as referred to in the present invention is a Si 3 N 4 structure in which Al is substituted in the Si position and O is substituted in the N position, and has a crystal structure similar to the Si 3 N 4 ceramics that are the materials to be joined. At the same time, it causes diffusion of Al and O with Al 2 O 3 ceramics.
Suitable as an intervening layer when bonding Si 3 N 4 ceramics and Al 2 O 3 ceramics. as mentioned above
The Si 3 N 4 structure in which Al is substituted in the Si position and O is substituted in the N position is collectively called sialon.
There are several types of Sialon, each with a different composition and structure. Particularly preferred as the intervening layer of the present invention is a type of sialon called β-sialon. β-Sialon is a general formula
denoted by Si 6- zAlzOzN 8- z (where z = 0 to 4.2),
The number of Al and O to be replaced is the same, and Si+Al/O+N
are always in a molar ratio of 3/4. Si 3 N 4 particles contained in a sintered body of Si 3 N 4 ceramics generally have a β-type crystal structure, and considering the similarity of the crystal structures, β-sialon is likely to be the intervening layer. most suitable. It is generally known that the diffusion coefficient of O in β-sialon is small, and in the present invention, by interposing sialon between the objects to be bonded, Al 2 O 3 ceramics can be
This shows good agreement with the fact that the unilateral diffusion of O was suppressed.
しかしながら、介在層はβ−サイアロンに限ら
れるものではなく、Mx(Si、Al)12(O、N)16(M
は金属でLi、Mg、Ca、Yなどx≦2)の組成を
もつα−サイアロンを用いても、Al2O3系セラミ
ツクスからSi3N4系セラミツクスへAlとOが一方
拡散するのを抑え、空孔を生じない良好な接合体
を得ることができる。 However, the intervening layer is not limited to β-SiAlON, but Mx (Si, Al) 12 (O, N) 16 (M
Even if α-Sialon is a metal with a composition such as Li, Mg, Ca, Y, etc. x≦2), it is difficult to prevent Al and O from unilaterally diffusing from Al 2 O 3 ceramics to Si 3 N 4 ceramics. It is possible to obtain a good bonded body without forming voids.
以下、実施例によつて本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例 1
焼結助剤として5重量%のMgOを添加して焼
結した密度99.2%のSi3N4焼結体と純度99.5%の
α−Al2O3を焼結した密度99.7%のAl2O3焼結体
をそれぞれ直径5mm、高さ3mmの円柱状に加工
し、この間に組成Si5AlON7、密度98.9%のβ−
サイアロン焼結体を直径5mm、厚さ1mmに加工し
た円板を挟んで、30000Kg/mm2の加圧下、1800℃
に30分間保持し、固相拡散接合した。Example 1 A Si 3 N 4 sintered body with a density of 99.2%, which was sintered by adding 5% by weight of MgO as a sintering aid, and a sintered body with a density of 99.7%, which was obtained by sintering α-Al 2 O 3 with a purity of 99.5%. Each Al 2 O 3 sintered body was processed into a cylindrical shape with a diameter of 5 mm and a height of 3 mm.
A disc made of Sialon sintered body processed into a diameter of 5 mm and a thickness of 1 mm was sandwiched between the two and heated at 1800°C under a pressure of 30000 kg/mm 2.
It was held for 30 minutes and solid-phase diffusion bonding was performed.
この接合体のAl2O3相の接合界面近傍の組織を
第2図に示す。 FIG. 2 shows the structure of the Al 2 O 3 phase near the bonding interface of this bonded body.
第1図はサイアロンを介在層として用いず、
Si3N4焼結体とAl2O3焼結体を直接接合した時の
Al2O3相の接合界面近傍の組織である。 Figure 1 shows the structure without using Sialon as an intervening layer.
When Si 3 N 4 sintered body and Al 2 O 3 sintered body are directly joined
This is the structure near the bonding interface of the Al 2 O 3 phase.
第1図と第2図を比較すると、サイアロンを介
在層に用いることにより、接合時にAl2O3焼結体
中に粗大な空孔が発生するのを抑え得ることが良
く分かる。この接合体の接合強度は引張強度は16
Kg/mm2であつた。 Comparing FIG. 1 and FIG. 2, it is clearly seen that by using SiAlON as the intervening layer, it is possible to suppress the generation of large pores in the Al 2 O 3 sintered body during bonding. The tensile strength of this joint is 16
It was Kg/ mm2 .
実施例 2
焼結助剤として10重量%のAl2O3を添加して焼
結した密度98.7%のSi3N4焼結体と、SiO2を8重
量%添加して焼結密度99.3%のAl2O3焼結体をそ
れぞれ直径10mm、高さ10mmの円柱状に加工し、こ
の間に組成Y0.6(Si9.3Al2.7)(O0.9N15.1)、密度98.
7
%のα−サイアロン焼結体を直径10mm、厚さ1mm
に加工した円板を挟んで、200Kg/cm2の加圧下、
1700℃に30分間保持し、固相拡散接合した。Example 2 A Si 3 N 4 sintered body with a density of 98.7% was sintered by adding 10% by weight of Al 2 O 3 as a sintering aid, and a sintered body with a density of 99.3% by adding 8% by weight of SiO 2 Each of the Al 2 O 3 sintered bodies was processed into a cylindrical shape with a diameter of 10 mm and a height of 10 mm .
7
% α-sialon sintered body with a diameter of 10 mm and a thickness of 1 mm.
Under a pressure of 200Kg/cm 2 ,
It was held at 1700°C for 30 minutes and solid-phase diffusion bonding was performed.
この時Al2O3焼結体中には粗大な空孔は発生せ
ず、良好な接合体が得られた。この接合体の接合
強度は引張強度で14Kg/mm2であつた。 At this time, no coarse pores were generated in the Al 2 O 3 sintered body, and a good joined body was obtained. The joint strength of this joined body was 14 Kg/mm 2 in terms of tensile strength.
第1図は従来のSi3N4とAl2O3を直接接合した
場合のAl2O3の接合界面近傍の組織を示す倍率
900倍の顕微鏡写真であり、第2図は本発明の接
合方法による接合体のAl2O3の接合界面近傍の組
織の顕微鏡写真(倍率360倍)である。
Figure 1 shows the magnification of the structure near the bonding interface of Al 2 O 3 when Si 3 N 4 and Al 2 O 3 are directly bonded using conventional methods.
FIG. 2 is a micrograph (magnification: 360 times) of the structure near the Al 2 O 3 bonding interface of the bonded body made by the bonding method of the present invention.
Claims (1)
を主成分とするセラミツクスを接合する際に、両
者間にサイアロンを介在させて固相接合すること
を特徴とするセラミツクスの接合方法。 2 介在させるサイアロンがSi6-zAlzOzN8-z(z
=0.1〜4.2)の組成をもつβサイアロンであるこ
とを特徴とする特許請求の範囲第1項記載のセラ
ミツクスの接合方法。 3 介在させるサイアロンがMx(Si、Al)12(O、
N)16(Mは金属でLi、Mg、Ca、Yなどでx≦
2)の組成をもつα−サイアロンであることを特
徴とする特許請求の範囲第1項記載のセラミツク
スの接合方法。[Claims] 1 Ceramics containing Si 3 N 4 as a main component and Al 2 O 3
1. A method for joining ceramics, which is characterized in that when joining ceramics containing as a main component, solid phase joining is performed with Sialon interposed between the two. 2 The intervening sialon is Si 6- zAlzOzN 8- z (z
2. The method for joining ceramics according to claim 1, wherein the ceramic is β-sialon having a composition of 0.1 to 4.2). 3 The intervening sialon is Mx (Si, Al) 12 (O,
N) 16 (M is a metal such as Li, Mg, Ca, Y, etc. x≦
2) The method for joining ceramics according to claim 1, wherein the ceramic is α-sialon having the composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19012884A JPS6168375A (en) | 1984-09-10 | 1984-09-10 | Ceramic bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19012884A JPS6168375A (en) | 1984-09-10 | 1984-09-10 | Ceramic bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6168375A JPS6168375A (en) | 1986-04-08 |
| JPH0127023B2 true JPH0127023B2 (en) | 1989-05-26 |
Family
ID=16252857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19012884A Granted JPS6168375A (en) | 1984-09-10 | 1984-09-10 | Ceramic bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6168375A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124778A (en) * | 1988-11-04 | 1990-05-14 | Hitachi Metals Ltd | Joined body of two pieces of aln ceramics and heat radiating device using same |
| EP2167445A1 (en) * | 2007-07-13 | 2010-03-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Diffusion-joined ceramic component and method for the production thereof |
-
1984
- 1984-09-10 JP JP19012884A patent/JPS6168375A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6168375A (en) | 1986-04-08 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |