JPH01290768A - Sputtering device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention is utilized in the technical field of film forming equipment, and particularly relates to sputtering equipment.

(Prior Art) Conventionally, as a means for holding a substrate in a sputtering apparatus, for example, a flat plate rotary table is used to hold a plurality of substrates to be subjected to film formation on an appropriate pitch circle. . However, since each substrate can only pass once per rotation of the flat plate rotary table against a target set corresponding to its movement trajectory, it is difficult to sufficiently capture the target material ejected from the target. Therefore, there is a problem that the film thickness distribution becomes uneven. Therefore, in an attempt to solve this problem, a multi-axis flat planetary jig has been provided in which a substrate holder that holds a substrate rotates on its movement trajectory (revolution trajectory 'ya>).

(Problem to be Solved by the Invention) However, the above-mentioned multi-axis flat planetary jig does not allow the substrate to move while the orbital locus of the substrate relative to the substrate holder axis overlaps the target placement pitch circle, or to move the substrate on the target placement pitch circle. Even if you match the orbit of the holder,
It is not easy to form a uniform film thickness, and there are still points to be improved.

In view of the above-mentioned conventional problems, the present invention enables the substrate to pass through each target multiple times with one rotation of the substrate holder, or to stop or rotate at a position facing the target, thereby creating a substrate. An object of the present invention is to provide a sputtering apparatus that improves the film speed and makes the film thickness distribution uniform.

(Means for Solving the Problems) Means for solving the above problems of the present invention include disposing a target inside a vacuum chamber and substrate holding means for holding a substrate facing the target. , in which a thin film of a target material is formed on the surface of a substrate by sputtering, the target is provided at least at a central position of a vacuum chamber, and the substrate holding means includes a base rotating member pivotally supported at the central position; It consists of a substrate holder that can be interlocked with the base rotation member and is rotatably provided on an orbit surrounding the center position, and the substrates listed as n; j are arranged on the orbit that surrounds the rotation axis of the substrate holder. The substrate is held and the substrate is repeatedly placed in a position facing the target, and the substrate is made stationary and placed in a position facing the target,
This also includes making the substrate self-rotating so that it is rotated at a position facing the target.

(Function) The effect of the above means is that when the base rotation member of the substrate holding means is rotated by the drive means, the substrate holder, which is pivoted on an orbit surrounding the center position of the base rotation member, rotates in conjunction with the rotation of the base rotation member. Therefore, the substrate held on the orbit surrounding the rotational axis of the substrate holder further revolves on the orbit of the substrate holder with respect to the center position, thereby repeatedly bringing the substrate to a position facing the target. A thin film of target material is formed by rotating the target material, positioning it in a position facing the target, or rotating it in that position.

(Example) Hereinafter, each embodiment of the present invention will be described based on the drawings.

Example 1 This example is applied to sputtering while continuously moving the substrate, and is shown in FIGS. 1 and 2.
The present invention is characterized in that the loci of movement of the substrate drawn each time the base rotation member of the substrate holding means deeply overlaps each other.

The sputtering apparatus 1 shown in FIG. 1 includes a target 3.4 and a heater 5 disposed inside a vacuum chamber 2, and a substrate holding means 7 for holding a substrate 6 facing the target 3.4. It includes as the main part.

The target 3.4 moves to the center position of the vacuum chamber 2 at a circumferential position i1 surrounding the center position at an equal distance from each other.
B (three locations in FIG. 2), and the heater 5 is provided at the target 3 so as to face the target 3.
The substrate holder 10, which will be described later, is disposed above the substrate holder 10 with a distance C maintained therebetween to allow the substrate holder 10, which will be described later, to pass therethrough.

The substrate holding means 7 is attached to the vacuum chamber 2 above the center position A.
A base rotating member 9 is pivotally supported on the crown plate 2a of the base plate 2a, and a driving means 8 is connected to the base rotating member 9, and a revolution orbit 0. The substrate 6 is held on a revolving orbit 02 that surrounds a rotation axis 22 of the holder, which will be described later. Describe.

That is, the targets 3 and 4 are target objects Q3a and 4 each having a radius of 101.6M, for example.
A is supported by target supports 3b, 41), and the target 4 is placed at the circumferential position [B] set by the radius R of the target pitch circle from the center position (for example, 250M), and each target 3.4 have the same height and are fixed to the bottom plate 2b of the vacuum chamber 2 via packing boxes 11.12.

The heater 5 is fixed to the cap plate 2a of the vacuum chamber 2 via a cylindrical holding member 13 so as to heat the substrate 6 downward, and the upper end of the holding member 13 is attached to the cap plate 2a. is projected upwards.

The driving means 8 includes a vertical motor 14 with a reduction gear and a drive gear 15, and the motor 14 with a reduction gear is fixedly installed on the upper surface of the crown plate 2a and projects a bearing part 14a into the vacuum chamber 2. The driving gear 15 is a motor 1 with a reduction gear.
It is fixed to the output shaft 14b of No. 4.

The base rotating member 9 includes a driven gear 16 that meshes with the driving gear 15, a cylindrical boss member 17 that protrudes concentrically from the upper surface of the driven gear, and one location on the outer periphery of the driven gear 16. It consists of a holder bearing 18 provided in
The boss member 17 is pivotally supported via a base bearing 20 to a bearing box 19 protruding from the lower surface of the crown plate 2a (inside the vacuum chamber 2) at the center position A. Reference numeral 21 denotes an adhesion prevention plate, which is provided to prevent the target substances 3a and 4a from scattering upward in the vacuum chamber 2, and whose inner circumferential portion is fixed to the outer circumferential portion of the driven gear 16, so that the outer circumferential The empty space from the section to the body plate 2c of the vacuum chamber 2 is rotatably covered.

The board holder 10 includes a rotating shaft 22 pivotally supported by the holder bearing 18, a planetary gear 23 fixed to the upper end of the rotating shaft, and a planetary gear 23 meshing with the planetary gear and fixed to the lower end of the bearing box 19. The rotating plate 25 consists of a sun gear 24 and a rotary plate 25 concentrically fixed to the lower end of the rotation axis 22, and the rotation plate 25 is connected to the orbit 02 of the substrate 6 centered on the rotation axis 22.
Three substrates 6 are mounted at equidistant positions on the top.

The revolution radius R2 of the substrate is set equal to the revolution radius R3 (for example, 152+nm) of the substrate holder 10 from the center position of the vacuum chamber 2 to the center of the rotation axis 22, and therefore, the radius of the target pitch circle R1, the revolution radius R2 of the substrate, and the revolution radius R3 of the substrate holder are set to satisfy the following conditions.

R2=R3 R1(R2+R3 Next, the operation of the first embodiment will be explained.

When the drive means 8 is activated and the drive gear 15 rotates clockwise relative to the plane of FIG. The substrate holder 10 in which the planetary gear 23 rolls on the toothed part of the sun gear 24 and rotates counterclockwise rotates the substrate holder 10 so that each center pt (second
In the figure, the center P of one substrate 6) is the target 3 at the center position A by one rotation movement of the base rotation member 9.
6 times against each target of IWB 4° 4.4
While repeatedly drawing a movement trajectory L1 that passes three times, sputtering is performed while being heated by the heating means 5 provided at the center position A, and the surface of the substrate 6 is
Target substance 3a.

A thin film 4a is uniformly formed.

Note that the movement locus L1 of the substrate 6 described above is based on the drive gear 1.
5 and the driven gear 16, the ratio of the teeth between the planetary gear 23 and the sun gear 24, and the radius R of the target pitch circle, the revolution radius R2 of the board, and the revolution radius R3 of the board holder 10. By selecting the ratio, a thin film that meets desired film forming conditions can be formed with a uniform thickness distribution.

Embodiment 2 This embodiment is applied to sputtering by stopping the substrate each time it enters a position corresponding to each target, and is shown in FIGS. 3 and 4. It is characterized in that the locus of movement of the substrate drawn each time it rotates is particularly concentrated at the center position of the vacuum chamber.

The sputtering apparatus 31 shown in FIG. 3 has a radius R2 of revolution of the substrates of a rotary plate 32 that holds three substrates 6 with respect to a radius R1 of a target pitch circle, and a rotation axis 33 of the rotary plate 32 (i.e. Revolution radius R3 of substrate holder 10)
is set to R2=R3 Rt=R20R3, while the planetary gear 34 and the sun gear 35 having different gear ratios are provided, and the structure is the same as that of the first embodiment. The symbol is the rotation axis 22
, the same applies to the second embodiment except for the planetary gear 23, the sun gear 24, and the rotating plate 25.

In the above structure, each center P2 of the three substrates 6 held by the rotation plate 32 of the substrate holder 10 is moved 6 to 6 degrees with respect to the target 3 to the center position by one rotation operation of the base rotation member 9. While drawing a movement trajectory L2 that passes once for each target 4, 4.4 at the orbiting position B, the target 3
．． When the substrate 6 enters the position opposite to the drive means 8
By stopping the substrate 6, the target object [3a.

4a is selected and the process is stopped, so that the film forming process that meets the desired film forming conditions is performed.

Embodiment 3 This embodiment is another example applied to sputtering by stopping each time the substrate approaches a position corresponding to each target, and is shown in FIGS. 5 and 6. Its unique feature is that it rotates relative to each target.

The sputtering apparatus 41 shown in FIG. 5 includes targets 43 and 44 suspended inside a vacuum chamber 42, a substrate holding means 46 for holding a substrate 45 facing the target, and a substrate holding means 46 for holding a substrate 45 facing the target. The main component is a substrate rotation means 47 for linking with the holding means.

The targets 43 and 44 have target materials 43b on target supports 43a and 44a, respectively.

44b, and moves the target materials 43b and 44b to the center position of the vacuum chamber 42 and to circumferential positions rl (two positions in FIG. 5) surrounding the center position while maintaining a distance from each other. It is placed facing downward.

The substrate holding means 46 is attached to the central position IA and the upper and lower vacuum chambers 4.
a base rotating member 50 which is pivotally supported on the bottom plate 42a of 2 via a bearing 48 and is connected with a driving means 49; A substrate stage 52 is pivotally supported on a revolution orbit 02 surrounding a rotation axis 53 of the substrate holder, which will be described later. Holds 45.

The substrate holder 51 is constructed by meshing a planetary gear 54 provided at the lower end of the rotation shaft 53 with a sun gear 55 provided on a hollow shaft 59 described later and capable of rotating integrally with the base rotation member 50. The rotation axis 53 revolves around the hollow shaft 59, and the substrate stage 52 can revolve around the rotation axis. Note that the substrate 45 may be held at the center of the substrate stage 52 instead of this example.

The driving means 49 is provided with a motor 57 with a reduction gear and an interlocking clutch 58 on a suspension frame 56 installed downward from the bottom plate 42a of the vacuum tank 42, and an output shaft 57a of the motor with a reduction gear and the bearing. The vacuum chamber 42 is pivoted to 48.
A bevel gear mechanism 60 is interposed between the hollow shaft 59 facing inside the hollow shaft 59, and the base rotating shaft 61 inserted through the hollow shaft 59 has a lower end that extends the bracket 62 below the suspension frame 56. The base rotating member 50 is fixed to the upper end while being pivotally supported by a lower bearing 63 disposed through the lower bearing 63,
An input side gear mechanism 64 is interposed between the bevel gear mechanism 60 and the interlocking clutch 58, and an output side gear mechanism 65 is interposed between the interlocking clutch 58 and the base rotation shaft 61.

66 is a hollow shaft detector, 67 is a base rotating shaft detector, 6
8 is a stopper.

The substrate rotation means 47 is attached to rotate the substrate 45 or the substrate stage 52 facing the target 44 at the rotation position B, and is a speed reducer fixed to the mounting tube 69 of the bottom plate 42a of the vacuum chamber 42. with auxiliary motor 7
0 faces the inside of the vacuum chamber 42, and a rotation shaft 72a of an arm 72 holding a gear mechanism 71 is pivotally supported at the upper end of the bearing, while a drive side gear 71a is mounted in the inner cavity.
The output shaft 70b of the auxiliary motor 70 with a speed reducer fixed therethrough is rotatably inserted, and the driven gear 71b
is provided with a driving side friction wheel for rotating a driven side friction wheel 73 fixed to the human power shaft 52a of the substrate stage 52.

The revolution radius R2 of the substrate 45 (or the substrate stage 52), the revolution radius R3 of the substrate holder 51, and the radius R1 of the pitch circle of the target 44 are set to satisfy the following conditions: R2=R3 R1=R2+R3.

Next, the operation of the third embodiment will be explained.

(a) When rotating the board 45 at the center position A After connecting the interlocking clutch 58 in the state shown in FIGS. 5 and 6, and starting the motor 57 with a reduction gear, the bevel gear mechanism 6
0 through the hollow shaft 59 to the sun gear 55, and from the bevel gear mechanism 60 to the input end gear mechanism 64, the interlocking clutch 58, the output side gear mechanism 65, and the base rotation shaft 61 to the base rotation member 50. By inputting the transmitted rotational action in synchronization and in the same direction, the rotation axis 53 and the planetary gear 54 revolve around the center position A together with the sun gear 55, and the substrate 45 (or the substrate 45 if there are multiple substrates 45) The stage 52) rotates relative to the target 43.

(b) Orbital position [When rotating the board 45 at B, first fix the base rotation shaft 61 with the stopper 68 and
8 is released and the motor 57 with a reducer is started, the rotation of the sun gear 55 causes the substrate holder 57 to rotate around the rotation axis 5.
3 and the planetary gear 54 to rotate the base rotating member 5.
The legs are opened in the centrifugal direction of 0, the center of the substrate stage 52 is moved onto the pitch circle of the rotation position B, and then stopped.

Next, after releasing the stopper 68 and connecting the interlocking clutch 58, the motor 57 with a reduction gear is started, and the linear base rotation member 50 and the substrate holder 51 are integrally rotated to move relative to the target 44. and stop.

Subsequently, the auxiliary motor 70 with a reducer of the substrate rotation means 47
arm 7 while rotating the drive-side friction wheel 74.
The substrate 45 (or the substrate stage 52) rotates relative to the target 44 by rotating the drive-side friction wheel 2 and pressing the driven-side friction wheel 73 of the rotating plate 52 with the driving-side friction wheel.

(Effects of the Invention) According to the above-described configuration, the invention as claimed in claim 1 is characterized in that the substrate is sputtered while repeatedly revolving on the orbit of the substrate holder with respect to the center position. This is advantageous in making the film thickness distribution uniform and increasing the film forming speed in production film forming processing, and the invention as claimed in claim 2 also uses a target that is suitable for the film forming conditions on the orbit of the substrate holder. Since the substrate is stopped and sputtered at the opposing position, it is advantageous for film forming processing in a high-mix, low-volume production system with different film forming conditions. Since the substrate is sputtered while rotating at a position facing a target that matches the film formation conditions, it is possible to achieve uniform film thickness distribution and film formation in the second step of film formation in a high-mix, low-volume production system with different film formation conditions. This has the advantageous effect of improving speed.

[Brief explanation of the drawing]

The drawings illustrate an embodiment of the present invention, and FIG. 1 is a central longitudinal sectional view of the sputtering apparatus in Example 1, and FIG. 2 is a plan view showing the rotation locus of the substrate in a cross section taken along II-II&I in FIG. 1. , FIG. 3 is a central vertical cross-sectional view of the sputtering apparatus in Example 2, and FIG. 4 is the rV-rV1% of FIG. 3.
5 is a plan view showing the rotation locus of the substrate in a cross section, FIG. 5 is a central vertical sectional view of the sputtering apparatus in Example 3,
FIG. 6 is a plan view of the same. 1.31.41...Sputtering equipment, 2゜42...Vacuum chamber, 3,4,43.44...
・Target, 3 a, 4 a, 43 a,
44 a...Target material, 6,45...
...Substrate, 7.46...Substrate holding means, 8.4
9... Drive means, 9, 50... Base rotating member, 10.51... Substrate holder, 22°33.5
3...Rotation axis, A...Center position, 01゜0□...Revolutionary orbit. Patent applicant ShinMaywa Industries Co., Ltd.

Claims (3)

[Claims] (1) In a method for forming a thin film of a target material on the surface of a substrate by sputtering, a target and a substrate holding means for holding a substrate facing the target are disposed inside a vacuum chamber, and the target material is is provided at least at a center position of the vacuum chamber, and the substrate holding means is capable of interlocking with a base rotation member pivotally supported at the center position, and is arranged on an orbit surrounding the center position. and a substrate holder that is rotatably provided, the substrate is held on an orbit surrounding the rotation axis of the substrate holder, and the substrate is repeatedly brought to a position facing a target. Characteristic sputtering equipment. (2) Claim 1, wherein the substrate is of a stop type and is positioned at a position facing the target.
The sputtering apparatus described in . (3) The sputtering apparatus according to claim 1, wherein the substrate is rotatable so that it is rotated at a position facing the target.