JPH0129208B2 - - Google Patents
Info
- Publication number
- JPH0129208B2 JPH0129208B2 JP2327282A JP2327282A JPH0129208B2 JP H0129208 B2 JPH0129208 B2 JP H0129208B2 JP 2327282 A JP2327282 A JP 2327282A JP 2327282 A JP2327282 A JP 2327282A JP H0129208 B2 JPH0129208 B2 JP H0129208B2
- Authority
- JP
- Japan
- Prior art keywords
- dicyclopentadiene
- capacitor
- film
- parts
- unsaturated polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 19
- 229920006305 unsaturated polyester Polymers 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- -1 dicyclopentadiene carboxylic acid Chemical class 0.000 claims description 13
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 13
- 239000011342 resin composition Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims description 8
- 238000006482 condensation reaction Methods 0.000 claims description 7
- 150000005846 sugar alcohols Polymers 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 5
- 239000011976 maleic acid Substances 0.000 claims description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 5
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 36
- 239000000203 mixture Substances 0.000 description 16
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical group C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- MVWPVABZQQJTPL-UHFFFAOYSA-N 2,3-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1C1=CC=CC=C1 MVWPVABZQQJTPL-UHFFFAOYSA-N 0.000 description 1
- JFZBUNLOTDDXNY-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)OCC(C)OC(=O)C(C)=C JFZBUNLOTDDXNY-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical group ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- SWHLOXLFJPTYTL-UHFFFAOYSA-N [2-methyl-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(COC(=O)C(C)=C)COC(=O)C(C)=C SWHLOXLFJPTYTL-UHFFFAOYSA-N 0.000 description 1
- NBICYCZLCAMSBG-UHFFFAOYSA-L [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Co+2].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O NBICYCZLCAMSBG-UHFFFAOYSA-L 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- FJDJVBXSSLDNJB-LNTINUHCSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FJDJVBXSSLDNJB-LNTINUHCSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Polyesters Or Polycarbonates (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、熱硬化性樹脂組成物に関するもので
あり、その目的はその硬化物が電気特性、皮膜硬
度、機械強度、寸法精度等にすぐれたフイルムコ
ンデンサ用等に用いられる熱硬化性樹脂組成物を
提供するにある。
フイルムコンデンサは、ポリエステルフイル
ム、ポリプロピレンフイルム、スチロールフイル
ムなどで電極をはさみ、巻き重ねた素子に防湿、
絶縁保護を目的として熱硬化性樹脂組成物などで
保護皮膜を形成し、その電気特性の安定性、防
湿、機械特性強度向上が図られている。然るに近
年の電子、電気機器の性能および信頼性向上の動
きに対応して、例えば音響機器、通信機器、テレ
ビ、ビデオテープレコーダーなどの分野では使用
するフイルムコンデンサの誘電正接および静電容
量の温度依存性ができるだけ少ないことが要求さ
れている。
また同時に生産性の向上の動きに対応してフイ
ルムコンデンサ等の部品の基板への自動装着が行
なわれており、これらに用いられるフイルムコン
デンサは寸法精度にすぐれていること、リード線
の引張り強度にすぐれていることなどを要求され
る。
従来フイルムコンデンサの含浸剤およびコーテ
イング剤として使用されてきたエポキシ樹脂組成
物は、使用する雰囲気の温度により誘電正接およ
び静電容量が大きく変化し、特に高温における誘
電正接の変化が大きい欠点があり、又揺変性を有
する高い粘度のエポキシ樹脂組成物で被覆したフ
イルムコンデンサは皮膜厚さがバラツキ・寸法精
度が劣る。さらにポリブタジエン樹脂は温度依存
性およびフイルムコンデンサの寸法精度にすぐれ
ているが、皮膜が軟らかいため皮膜が傷つきやす
く、コンデンサの自動挿入時のリード線の引張り
強度が弱い欠点がある。
本発明者らは、有機過酸化物の添加により容易
に硬化し、その硬化物は誘電正接および比誘電率
が小さく機械強度に優れた特性を示す熱硬化性樹
脂組成物を見出した。
本発明になる樹脂組成物で処理されたフイルム
コンデンサは、コンデンサの引張り強度および寸
法精度にすぐれたフイルムコンデンサとなる。
本発明は、末端アクリル変性1,2−ポリブタ
ジエン樹脂又は、末端メタクリル変性1,2−ポ
リブタジエン樹脂()、(1)ジシクロペンタジエ
ン及びマレイン酸、(2)ジシクロペンタジエン、無
水マレイン酸及び水または(3)ヒドロキシル化ジシ
クロペンタジエン及び無水マレイン酸を150℃以
下で反応させて得られた部分エステル化ジシクロ
ペンタジエンカルボン酸と多価アルコールとを縮
合反応させて得られる不飽和ポリエステル()
およびスチレン系化合物又は多官能性メタクリル
酸エステル()を含有してなる熱硬化性樹脂組
成物に関する。
本発明においては、末端メタクリル変性1,2
−ポリブタジエン樹脂、例えば日本曹達株式会社
製NISSO−PB(商品名)TE−2000又は末端アク
リル変性1,2−ポリブタジエン樹脂が使用され
る。これらはポリマー鎖に1,2−結合を主結
合、例えば90%以上とする樹脂である。
本発明において用いられる不飽和ポリエステル
は、部分エステル化ジシクロペンタジエンカルボ
ン酸と多価アルコールとを付価縮合させて得られ
るが、部分エステル化ジシクロペンタジエンカル
ボン酸は(1)ジシクロペンタジエン及びマレイン
酸、(2)ジシクロペンタジエン、無水マレイン酸及
び水または(3)ヒドロキシル化ジシクロペンタジエ
ン及び無水マレイン酸を反応させて得られる。
この反応においては、マレイン酸の第一カルボ
ン酸の強い解離性によつて150℃以下でジシクロ
ペンタジエン又はヒドロキシル化ジシクロペンタ
ジエンとマレイン酸又は無水マレイン酸の第一カ
ルボキシル基との付加反応が起こり、部分エステ
ル化ジシクロペンタジエンカルボン酸が得られ
る。
ジシクロペンタジエンとマレイン酸の配合割合
は等モルが好ましく、150℃以下好ましくは120〜
140℃の温度で反応させ、ジシクロペンタジエン、
無水マレイン酸および水の配合割合もこれらを等
モルとすることが好ましく、150℃以下好ましく
は120〜140℃の温度で反応させ、同様にヒドロキ
シル化ジシクロペンタジエンと無水マレイン酸の
配合割合も等モルが好ましく、150℃以下、好ま
しくは100〜120℃の温度で反応させて部分エステ
ル化ジシクロペンタジエンが得られる。150℃を
越えるとジシクロペンタジエンは、シクロペンタ
ジエンに分解するために、反応温度は150℃以下
とされる。部分エステル化ジシクロペンタジエン
カルボン酸は1価のカルボン酸と同様にポリエス
テルの原料として取扱うことができ、エチレング
リコール、プロピレングリコール、ジエチレング
リコール、ジプロピレングリコール、1,3−ブ
チレングリコール、ネオペンチルグリコール、
1,6−ヘキサンジオールなどの多価アルコール
と縮合反応させて不飽和ポリエステルとすること
ができる。
部分エステル化ジシクロペンタジエンと多価ア
ルコールの配合割合は、通常アルコール過剰率0
〜30%とされるが部分エステル化ジシクロペンタ
ジエンカルボン酸2モルに対して多価アルコール
1モルが好ましい。反応温度は好ましくは150〜
210℃とされる。
不飽和ポリエステルの製造においては、通常採
用される条件が採用され、特に制限はない。
本発明におけるスチレン系化合物としては、ス
チレン、α−メチルスチレン、o−メチルスチレ
ン、m−メチルスチレン、p−メチルスチレン、
ジメチルスチレン、エチルスチレン、p−ターシ
ヤリブスチレン、クロルスチレン、ジビニルベン
ゼン等がある。
また多官能性メタクリル酸エステルとしては、
エチレングリコールジメタクリレート、ジエチレ
ングリコールジメタクリレート、トリエチレング
リコールジメタクリレート、ネオペンチルグリコ
ールジメタクリレート、1,3−ブタンジオール
ジメタクリレート、ジプロピレングリコールジメ
タクリレート、ポリプロピレングリコールジメタ
クリレート、トリメチロールエタントリメタクリ
レート、トリメチロールプロパントリメタクリレ
ート、テトラメチロールメタンテトラメタクリレ
ート等が用いられる。スチレン系化合物と多官能
性メタクリル酸エステルとは併用してもよい。
本発明による熱硬化性樹脂組成物をフイルムコ
ンデンサの含浸剤、コーテイング剤として用いる
場合には、上記のポリブタジエン樹脂を10〜60重
量部、上記の不飽和ポリエステルを90〜40重量部
の範囲内で総量が100重量部となるように用い、
これにスチレン系化合物又は多官能性メタクリル
酸エステルを40〜110重量部の範囲で用いること
が好ましい。
本発明になる熱硬化性樹脂組成物には必要に応
じて硬化剤、硬化促進剤、重合禁止剤を加えて硬
化性、ポツトライフの調整を行なうことができ
る。
硬化剤としては、不飽和ポリエステル樹脂の硬
化剤をいずれも使用することができ、例えばメチ
ルエチルケトンパーオキサイド、ベンゾイルパー
オキサイド、シクロヘキサノンパーオキサイド、
t・ブチルパーベンゾエート、1,1−ビス(t
−ブチルパーオキシ)3,3,5−トリメチルシ
クロヘキサン、クメンハイドロパーオキサイドな
どが用いられる。
硬化促進剤としては、ナフテン酸コバルト、オ
クテン酸コバルト、ナフテン酸マンガン、コバル
トアセチルアセトネート、ジメチルアニリンなど
が用いられる。
重合禁止剤としては、ハイドロキノン、パラベ
ンゾキノン、カテコール、ジフエニルキノンなど
が用いられる。
本発明になる熱硬化性樹脂組成物においては必
要に応じて、顔料、染料、揺変剤等を用いてもよ
い。
末端アクリル変性1,2−ポリブタジエン樹脂
又は、末端メタクリレート変性1,2−ポリブタ
ジエン樹脂及び架橋剤としてスチレン系化合物又
は多官能性メタクリル酸エステルを使用した場合
には、硬化樹脂が軟らかく、機械強度が劣るた
め、例えばこれによつて処理されたフイルムコン
デンサは皮膜に傷がつきやすく、コンデンサの自
動挿入時のリード線の引張り強度が弱い欠点があ
る。
本発明においては、上記の不飽和ポリエステル
をさらに用いることにより、皮膜硬度がかたくこ
れによつてフイルムコンデンサを処理する場合に
は、処理されたフイルムコンデンサのリード線の
引張り強度も向上される。
本発明の実施例を説明する。部とあるのは重量
部である。
不飽和ポリエステル(A)〜(D)の製造
ジシクロペンタジエン264部、無水マレイン酸
196部及び水36部を窒素ガス気流中で140℃で2時
間反応させ、部分エステル化ジシクロペンタジエ
ンカルボン酸を合成し、これにプロピレングリコ
ール83.6部を添加し、120℃で10時間脱水縮合反
応を行ない、酸価10の不飽和ポリエステル(A)を得
た。
ヒドロキシル化ジシクロペンタジエン300部及
び無水マレイン酸196部を窒素ガス気流中で120℃
で2時間反応させ、部分エステル化ジシクロペン
タジエンカルボン酸を合成し、これにプロピレン
グリコール83.6部を添加し、210℃で10時間脱水
縮合反応を行ない、酸価10の不飽和ポリエステル
(B)を得た。
ジシクロペンタジエン264部、無水マレイン酸
196部及び水36部を窒素気流中で140℃で2時間反
応させ、部分エステル化ジシクロペンタジエンカ
ルボン酸を合成し、これに1,6−ヘキサンジオ
ール118.0部を添加し、210℃で10時間脱水縮合反
応を行ない、酸価10の不飽和ポリエステル(C)を得
た。
無水マレイン酸98部及び無水フタル酸196部に
プロピレングコール167.2部を添加し、窒素気流
中にて210℃で10時間脱水縮合反応を行ない酸価
15の不飽和ポリエステルDを得た。
実施例 1〜4
第1表に示す組成物を常温で均一に混合し、そ
の相溶性を調べ、硬化時の硬度、鉛筆硬さ、曲げ
強さを測定し、その結果を第1表に示す。この組
成物でフイルムコンデンサを処理し、コンデンサ
特性、コンデンサの引張り強度を測定した。その
結果を第1表に示す。硬度、鉛筆硬さ、曲げ強さ
は不飽和ポリエステル(A)を添加することにより向
上し、コンデンサの引張り強度も高くなる。コン
デンサの温度特性も、不飽和ポリエステル(A)を添
加しても変化が小さく優れている。
実施例 5
第1表に示す組成物により実施例1〜4と同様
の試験を行ない、その結果を第1表に示す。硬
度、鉛筆硬さ、曲げ強さは不飽和ポリエステル(B)
を添加したことにより向上し、コンデンサの引張
り強度も高くなつている。コンデンサの温度特性
も不飽和ポリエステル(B)を添加しても変化が小さ
く優れている。
実施例 6
第1表に示す組成物により実施例1〜4と同様
の試験を行ないその結果を第1表に示す。硬度、
鉛筆硬さ、曲げ強さは、トリメチロールプロパン
トリメタクリレートを添加したことにより向上
し、コンデンサの引張り強度も高くなつている。
コンデンサの温度特性も、トリメチロールプロパ
ントリメタクリレートを添加することにより高温
特性が優れている。
実施例 7〜10
第1表に示す組成物により実施例1〜4と同様
の試験を行ないその結果を第1表に示す。硬度、
鉛筆硬さ、曲げ強さはトリメチロールプロパント
リメタクリレートを添加することにより向上し、
コンデンサの引張り強度も高くなつている。コン
デンサの温度特性もトリメチロールプロパントリ
メタクリレートを添加することにより高温特性が
優れている。
比較例 1
第1表に示す組成物により実施例1〜4と同様
の試験を行ないその結果を第1表に示す。硬度、
鉛筆硬さ、曲げ強さは実施例に比較し劣つており
コンデンサの引張り強度も低い。
比較例 2
第1表に示す組成物を常温で均一に混合したと
ころ時間の経過とともに末端メタクリル変性1,
2−ポリブタジエン樹脂と不飽和ポリエステル(D)
が相分離し、フイルムコンデンサ用組成物とする
ことはできなかつた。
The present invention relates to a thermosetting resin composition, and its purpose is to provide a thermosetting resin composition whose cured product has excellent electrical properties, film hardness, mechanical strength, dimensional accuracy, etc. for use in film capacitors, etc. is to provide. Film capacitors are made by sandwiching electrodes with polyester film, polypropylene film, styrene film, etc., and winding them together to prevent moisture.
For the purpose of insulation protection, a protective film is formed using a thermosetting resin composition, etc., in order to improve the stability of electrical properties, moisture resistance, and strength of mechanical properties. However, in response to the recent movement to improve the performance and reliability of electronic and electrical equipment, for example, in fields such as audio equipment, communication equipment, televisions, and video tape recorders, the temperature dependence of the dielectric loss tangent and capacitance of film capacitors used has increased. It is required that there be as little sex as possible. At the same time, in response to the trend toward improved productivity, parts such as film capacitors are being automatically attached to circuit boards. They are required to be excellent. Epoxy resin compositions conventionally used as impregnating agents and coating agents for film capacitors have the disadvantage that the dielectric loss tangent and capacitance change greatly depending on the temperature of the atmosphere in which they are used, and that the dielectric loss tangent changes significantly at high temperatures. Furthermore, film capacitors coated with a high viscosity epoxy resin composition having thixotropy have uneven coating thickness and poor dimensional accuracy. Furthermore, although polybutadiene resin has excellent temperature dependence and dimensional accuracy for film capacitors, it has the disadvantage that the film is soft and easily damaged, and the tensile strength of the lead wire during automatic insertion of the capacitor is weak. The present inventors have discovered a thermosetting resin composition that is easily cured by the addition of an organic peroxide, and the cured product exhibits characteristics of low dielectric loss tangent and dielectric constant, and excellent mechanical strength. A film capacitor treated with the resin composition of the present invention has excellent tensile strength and dimensional accuracy. The present invention comprises a terminal acrylic-modified 1,2-polybutadiene resin or a terminal methacrylic-modified 1,2-polybutadiene resin (1) dicyclopentadiene and maleic acid, (2) dicyclopentadiene, maleic anhydride and water or (3) Unsaturated polyester obtained by condensation reaction of partially esterified dicyclopentadiene carboxylic acid obtained by reacting hydroxylated dicyclopentadiene and maleic anhydride at 150°C or lower with a polyhydric alcohol ()
The present invention also relates to a thermosetting resin composition containing a styrene compound or a polyfunctional methacrylic acid ester. In the present invention, terminal methacrylic modified 1,2
- A polybutadiene resin such as NISSO-PB (trade name) TE-2000 manufactured by Nippon Soda Co., Ltd. or a terminally acrylic-modified 1,2-polybutadiene resin is used. These are resins in which the main bonds in the polymer chain are 1,2-bonds, for example, 90% or more. The unsaturated polyester used in the present invention is obtained by valence condensation of partially esterified dicyclopentadiene carboxylic acid and polyhydric alcohol. It is obtained by reacting an acid, (2) dicyclopentadiene, maleic anhydride and water or (3) hydroxylated dicyclopentadiene and maleic anhydride. In this reaction, an addition reaction between dicyclopentadiene or hydroxylated dicyclopentadiene and the primary carboxyl group of maleic acid or maleic anhydride occurs at temperatures below 150°C due to the strong dissociative nature of the primary carboxylic acid of maleic acid. , a partially esterified dicyclopentadiene carboxylic acid is obtained. The mixing ratio of dicyclopentadiene and maleic acid is preferably equimolar, preferably 150°C or less, preferably 120°C or less.
Reacted at a temperature of 140 °C, dicyclopentadiene,
It is preferable that the mixing proportions of maleic anhydride and water are equimolar, and the reaction is carried out at a temperature of 150°C or lower, preferably 120 to 140°C. Similarly, the mixing ratio of hydroxylated dicyclopentadiene and maleic anhydride is also equal. Molar is preferred and the reaction is carried out at a temperature below 150°C, preferably from 100 to 120°C to obtain partially esterified dicyclopentadiene. If the temperature exceeds 150°C, dicyclopentadiene will decompose into cyclopentadiene, so the reaction temperature should be kept below 150°C. Partially esterified dicyclopentadiene carboxylic acid can be treated as a raw material for polyester like monovalent carboxylic acid, and can be used as a raw material for polyester, such as ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 1,3-butylene glycol, neopentyl glycol,
An unsaturated polyester can be obtained by a condensation reaction with a polyhydric alcohol such as 1,6-hexanediol. The blending ratio of partially esterified dicyclopentadiene and polyhydric alcohol is usually at an alcohol excess of 0.
The amount is preferably 1 mol of polyhydric alcohol to 2 mol of partially esterified dicyclopentadiene carboxylic acid. The reaction temperature is preferably 150~
It is said to be 210℃. In the production of unsaturated polyester, normally employed conditions are employed, and there are no particular limitations. Examples of the styrenic compound in the present invention include styrene, α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene,
Examples include dimethylstyrene, ethylstyrene, p-tertiary styrene, chlorostyrene, and divinylbenzene. In addition, as a polyfunctional methacrylic ester,
Ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,3-butanediol dimethacrylate, dipropylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylolethane trimethacrylate, trimethylolpropane Trimethacrylate, tetramethylolmethanetetramethacrylate, etc. are used. The styrene compound and the polyfunctional methacrylic ester may be used together. When the thermosetting resin composition of the present invention is used as an impregnating agent or coating agent for a film capacitor, the above polybutadiene resin should be used in an amount of 10 to 60 parts by weight, and the above unsaturated polyester should be in an amount of 90 to 40 parts by weight. Use so that the total amount is 100 parts by weight,
It is preferable to use a styrene compound or a polyfunctional methacrylic acid ester in an amount of 40 to 110 parts by weight. Curing properties and pot life can be adjusted by adding a curing agent, a curing accelerator, and a polymerization inhibitor to the thermosetting resin composition of the present invention, if necessary. As the curing agent, any curing agent for unsaturated polyester resins can be used, such as methyl ethyl ketone peroxide, benzoyl peroxide, cyclohexanone peroxide,
t-butyl perbenzoate, 1,1-bis(t
-butylperoxy) 3,3,5-trimethylcyclohexane, cumene hydroperoxide, etc. are used. As the curing accelerator, cobalt naphthenate, cobalt octenoate, manganese naphthenate, cobalt acetylacetonate, dimethylaniline, etc. are used. As the polymerization inhibitor, hydroquinone, parabenzoquinone, catechol, diphenylquinone, etc. are used. In the thermosetting resin composition of the present invention, pigments, dyes, thixotropic agents, etc. may be used as necessary. When a terminal acrylic-modified 1,2-polybutadiene resin or a terminal methacrylate-modified 1,2-polybutadiene resin and a styrene compound or polyfunctional methacrylic acid ester are used as a crosslinking agent, the cured resin is soft and has poor mechanical strength. Therefore, for example, a film capacitor treated with this method has the disadvantage that the film is easily damaged and the tensile strength of the lead wire is weak when automatically inserting the capacitor. In the present invention, by further using the above-mentioned unsaturated polyester, the film hardness is hard, and when a film capacitor is treated with this, the tensile strength of the lead wire of the treated film capacitor is also improved. Examples of the present invention will be described. Parts are by weight. Production of unsaturated polyesters (A) to (D) 264 parts of dicyclopentadiene, maleic anhydride
196 parts and 36 parts of water were reacted at 140°C for 2 hours in a nitrogen gas stream to synthesize partially esterified dicyclopentadiene carboxylic acid, to which 83.6 parts of propylene glycol was added and a dehydration condensation reaction was carried out at 120°C for 10 hours. An unsaturated polyester (A) having an acid value of 10 was obtained. 300 parts of hydroxylated dicyclopentadiene and 196 parts of maleic anhydride were heated at 120°C in a nitrogen gas stream.
to synthesize partially esterified dicyclopentadiene carboxylic acid, to which 83.6 parts of propylene glycol was added, and a dehydration condensation reaction was carried out at 210°C for 10 hours to form an unsaturated polyester with an acid value of 10.
I got (B). 264 parts of dicyclopentadiene, maleic anhydride
196 parts and 36 parts of water were reacted at 140°C for 2 hours in a nitrogen stream to synthesize partially esterified dicyclopentadienecarboxylic acid, to which 118.0 parts of 1,6-hexanediol was added, and the mixture was reacted at 210°C for 10 hours. A dehydration condensation reaction was performed to obtain an unsaturated polyester (C) with an acid value of 10. 167.2 parts of propylene glycol was added to 98 parts of maleic anhydride and 196 parts of phthalic anhydride, and a dehydration condensation reaction was carried out at 210°C for 10 hours in a nitrogen stream to determine the acid value.
15 unsaturated polyester D was obtained. Examples 1 to 4 The compositions shown in Table 1 were mixed uniformly at room temperature, their compatibility was examined, and the hardness upon curing, pencil hardness, and bending strength were measured, and the results are shown in Table 1. . A film capacitor was treated with this composition, and the capacitor properties and tensile strength of the capacitor were measured. The results are shown in Table 1. Hardness, pencil hardness, and bending strength are improved by adding unsaturated polyester (A), and the tensile strength of the capacitor is also increased. The temperature characteristics of the capacitor are also excellent, with little change even when unsaturated polyester (A) is added. Example 5 The same tests as in Examples 1 to 4 were conducted using the compositions shown in Table 1, and the results are shown in Table 1. Hardness, pencil hardness, and bending strength are unsaturated polyester (B)
The tensile strength of the capacitor has also increased. The temperature characteristics of the capacitor are also excellent, with little change even when unsaturated polyester (B) is added. Example 6 The same tests as in Examples 1 to 4 were conducted using the compositions shown in Table 1, and the results are shown in Table 1. hardness,
Pencil hardness and bending strength are improved by adding trimethylolpropane trimethacrylate, and the tensile strength of the capacitor is also increased.
The temperature characteristics of the capacitor are also excellent due to the addition of trimethylolpropane trimethacrylate. Examples 7 to 10 The same tests as in Examples 1 to 4 were conducted using the compositions shown in Table 1, and the results are shown in Table 1. hardness,
Pencil hardness and bending strength are improved by adding trimethylolpropane trimethacrylate.
The tensile strength of capacitors is also increasing. The temperature characteristics of the capacitor are also excellent due to the addition of trimethylolpropane trimethacrylate. Comparative Example 1 The same tests as in Examples 1 to 4 were conducted using the compositions shown in Table 1, and the results are shown in Table 1. hardness,
The pencil hardness and bending strength are inferior to those of the examples, and the tensile strength of the capacitor is also low. Comparative Example 2 When the compositions shown in Table 1 were mixed uniformly at room temperature, the terminal methacrylic modification 1,
2-Polybutadiene resin and unsaturated polyester (D)
Phase separation occurred, and a composition for film capacitors could not be obtained.
【表】【table】
【表】【table】
【表】【table】
【表】
硬度の測定は、組成物を直径60mmの金属シヤー
レ中に10g注入硬化し1時間硬化後25℃でシヨア
ーD硬度計で測定した。
鉛筆硬さの測定は組成物をブリキ板に流し塗り
し、垂直に懸垂し1時間硬化後25℃でBから9H
までの鉛筆により皮膜をこすりき裂が生じる時の
硬さを測定した。
曲げ強さは組成物を127×12×5mmの溝付きの
金属金型中に注入硬化し、1時間硬化後、金型か
ら試験片を取り出し、十分に研磨し、島津製オー
トグラフ(型式IM−100)により25℃で曲げ強さ
を測定した。
コンデンサ特性は、0.001μFのマイラーコンデ
ンサを組成物に浸漬し、20〜10mmHgの減圧下で
3分間含浸した後常圧で引き上げ、120℃で1時
間硬化炉中で加熱硬化を行ないユニバーサルブリ
ツジ(横河電機製4260A)により誘電正接及び静
電正接及び静電容量(C)を求め各温度における静電
容量変化率を次式により求めた。
静電容量変化率(ΔC/C)(%)=(Ct℃−C25
℃)×100/C25℃コンデンサの引張り強度は、
0.001μFのコンデンサを組成物に浸漬し、20〜10
mmHgの減圧下で3分間含浸した後常圧で引き上
げ120℃、1時間加熱硬化を行ない、シヨツパー
試験器でリード線とコンデンサ間の引張り強さを
測定した。
本発明になる熱硬化性樹脂組成物は、容易に硬
化し、その硬化物は、誘電正接および比誘電率が
小さく、機械強度に優れた特性を示すものであ
る。
本発明になる熱硬化性樹脂組成物を用いてフイ
ルムコンデンサを処理する場合にはフイルムコン
デンサの樹脂皮膜が硬く他の素子と接触しても傷
がつかず、また皮膜の機械強度が向上されたため
コンデンサの引張り強度が大幅に向上し、コンデ
ンサの自動挿入時の折曲げ、破損不良が改良でき
る等の利点を有する。[Table] Hardness was measured by pouring 10 g of the composition into a metal shear dish with a diameter of 60 mm, curing it for 1 hour, and then measuring it at 25° C. using a Shor D hardness meter. To measure pencil hardness, pour the composition onto a tin plate, suspend it vertically, cure for 1 hour, and then apply it from B to 9H at 25℃.
The hardness of the film was measured when a crack occurred by rubbing the film with a pencil. The bending strength was determined by injecting and hardening the composition into a grooved metal mold of 127 x 12 x 5 mm. After curing for 1 hour, the test piece was taken out from the mold, thoroughly polished, and a Shimadzu Autograph (model IM) was used. -100), the bending strength was measured at 25°C. The capacitor characteristics were determined by immersing a 0.001 μF Mylar capacitor in the composition, soaking it for 3 minutes under a reduced pressure of 20 to 10 mmHg, then pulling it up at normal pressure, and heating and curing it in a curing oven at 120°C for 1 hour. The dielectric loss tangent, electrostatic loss tangent, and capacitance (C) were determined using Yokogawa Electric Corporation's 4260A), and the capacitance change rate at each temperature was determined using the following formula. Capacitance change rate (ΔC/C) (%) = (Ct℃−C25
℃) × 100/C 25 ℃ The tensile strength of the capacitor is
A 0.001 μF capacitor is immersed in the composition and 20-10
After being impregnated for 3 minutes under a reduced pressure of mmHg, the sample was pulled up to normal pressure and cured by heating at 120°C for 1 hour, and the tensile strength between the lead wire and the capacitor was measured using a Schopper tester. The thermosetting resin composition of the present invention is easily cured, and the cured product thereof has a small dielectric loss tangent and a small dielectric constant, and exhibits excellent mechanical strength. When a film capacitor is treated using the thermosetting resin composition of the present invention, the resin film of the film capacitor is hard and will not be damaged even if it comes into contact with other elements, and the mechanical strength of the film is improved. It has the advantage that the tensile strength of the capacitor is greatly improved, and the problems of bending and damage during automatic insertion of the capacitor can be improved.
Claims (1)
脂又は、末端メタクリル変性1,2−ポリブタジ
エン樹脂()、(1)ジシクロペンタジエン及びマ
レイン酸、(2)ジシクロペンタジエン、無水マレイ
ン酸及び水または(3)ヒドロキシル化ジシクロペン
タジエン及び無水マレイン酸を150℃以下で反応
させて得られた部分エステル化ジシクロペンタジ
エンカルボン酸と多価アルコールとを縮合反応さ
せて得られる不飽和ポリエステル()およびス
チレン系化合物又は多官能性メタクリル酸エステ
ル()を含有してなる熱硬化性樹脂組成物。1 Terminal acrylic-modified 1,2-polybutadiene resin or methacrylic-terminated 1,2-polybutadiene resin (), (1) dicyclopentadiene and maleic acid, (2) dicyclopentadiene, maleic anhydride, and water, or (3) Unsaturated polyester () and styrenic compound obtained by condensation reaction of partially esterified dicyclopentadiene carboxylic acid obtained by reacting hydroxylated dicyclopentadiene and maleic anhydride at 150°C or less and a polyhydric alcohol, or A thermosetting resin composition containing a polyfunctional methacrylic acid ester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2327282A JPS58160308A (en) | 1982-02-15 | 1982-02-15 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2327282A JPS58160308A (en) | 1982-02-15 | 1982-02-15 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58160308A JPS58160308A (en) | 1983-09-22 |
| JPH0129208B2 true JPH0129208B2 (en) | 1989-06-08 |
Family
ID=12105961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2327282A Granted JPS58160308A (en) | 1982-02-15 | 1982-02-15 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160308A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD715995S1 (en) | 2013-09-26 | 2014-10-21 | Dyson Technology Limited | Hair dryer |
| USD715996S1 (en) | 2013-09-26 | 2014-10-21 | Dyson Technology Limited | Hair dryer |
| USD716492S1 (en) | 2013-09-26 | 2014-10-28 | Dyson Technology Limited | Hair dryer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231316A (en) * | 1984-04-27 | 1985-11-16 | 松下電器産業株式会社 | Capacitor |
-
1982
- 1982-02-15 JP JP2327282A patent/JPS58160308A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD715995S1 (en) | 2013-09-26 | 2014-10-21 | Dyson Technology Limited | Hair dryer |
| USD715996S1 (en) | 2013-09-26 | 2014-10-21 | Dyson Technology Limited | Hair dryer |
| USD716492S1 (en) | 2013-09-26 | 2014-10-28 | Dyson Technology Limited | Hair dryer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58160308A (en) | 1983-09-22 |
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