JPH01295481A - Lead connecting method - Google Patents

Abstract

PURPOSE:To improve workability and reliability of lead connection, by bending the connection part of an externally leading-out terminal subjected to insert molding in a resin case toward the upper part of a substrate, stacking the externally leading-out terminal and a lead, and pinching and welding them by a welding electrode. CONSTITUTION:The connection part of an externally leading-out terminal 7' is bent upward to an angle of, e.g., 90 deg.. A lead is formed so as to be bent one time. Thus the terminal 7' and the lead 6 are stacked back to back. As to welding mechanism, right and left opening-closing motion of an electrode 8' is added to up and down motion of the electrode 8'. The lead 6 and the terminal 7' are pinched by the electrode 8', and connected by resistance welding. Thereby, the lead forming on a substrate single body, and the terminal forming of a case single body are enabled, so that workability is improved; current flows surely through the connection part, so that the reliability of welding is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a lead connection method for connecting leads taken out from a hybrid IC board to external lead-out terminals.

(Prior Art) In general, a method for connecting inner leads of a hybrid IC is shown in FIGS. 2 and 3.

Figure 2 is a perspective view of the main parts of the hybrid IC, and Figure 3 is a diagram showing the lead connection method.
C board (thick film board), 2 is resin case, 3 is base, 4
5 is solder, 5 is a welding pad, 6 is a welding lead (linear or plate-shaped inner lead), 7 is a plate-shaped input/output terminal (external lead-out terminal), and 8 is a resistance welding electrode.

That is, conventionally, when the leads 6 are taken out from the hybrid IC board 1 bonded to the base 3 and connected to the terminals 7 insert-molded in the resin case 2, the terminals 7 are soldered or the leads 6 are connected to the terminals 7 as shown in FIG. As shown in the cross-sectional view, a common method is to form a lead 6, place it on a flat terminal 7, and weld it.

(Problems to be Solved by the Invention) However, in the case of the method of soldering the terminal 7, there is a problem in the reliability of soldering, and the strength of the connection part decreases due to deterioration of the solder in a high temperature storage test or the like. Moreover, soldering takes time and workability is poor.

In addition, in the case of the welding method shown in Fig. 3, since the lead 6 is placed on the terminal 7, the lead 6 must be bent and formed so as to overlap the terminal 7 inside the narrow resin case 2, which makes automation difficult. Have difficulty.

In addition, since the terminal 7 is welded while being pressed from above, the terminal 7 is easily bent.

Furthermore, since both electrodes 8 are welded on top of the leads 6 and do not touch the terminals 7, not all of the current flows through the connections, which raises questions about the reliability of the welding.

Regarding welding, there is a method in which one side of the electrode 8 is placed on the beam 6 and the remaining electrode is placed on the terminal 7, but there remains a problem in workability.

Further, an automatic assembly machine may be considered to improve the workability, but this has the problem of being extremely complicated and costly.

SUMMARY OF THE INVENTION An object of the present invention is to provide a lead connection method that improves the workability during connection within a casing, which has been a problem in the prior art, and further increases the reliability of the connection.

[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention provides a method for connecting internal leads and external lead-out terminals of a hybrid IC module that includes a thick film substrate and a resin case having external lead-out terminals. The external lead-out terminal is provided above the board inside the resin case, the tip portion of the terminal inside the resin case is bent in a direction away from the board, and the lead is taken out from the board side and connected to the outside. This lead connection method is characterized in that the lead terminal is overlapped with the tip end portion of the lead terminal, and the overlapped parts are sandwiched between welding electrodes and welded.

That is, in the present invention, the connection portion of the external lead-out terminal insert-molded in the resin case is bent, for example, 90 inches above the board, the external lead-out terminal and the lead are overlapped, and the leads are welded by sandwiching them between welding electrodes. This improves performance and reliability.

(Example) An example of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of the main parts of the hybrid IC showing the same embodiment, but since this is an example corresponding to Fig. 3,
The same reference numerals will be used for the same parts, and the explanation will be omitted, and the features and parts will be explained.

The feature of this embodiment is, as shown in FIG.
The terminal 7' and the lead 6' are bent back to back, and the lead 6' is bent one more time than the conventional example.

In addition to the vertical movement of the electrodes 8', 8' in the conventional example, the welding mechanism adds horizontal opening and closing movements of the electrodes 8', 8'.

With these, the lead 6' and the terminal 7' are connected to the electrode 8',
8' will be gripped and connected by resistance welding.

According to this embodiment, the terminal 7' is not placed on the lead 6, but the terminal 7' and the flexible lead 6' are stacked between the electrodes 8', - Enables deforming and terminal forming on the case alone.

As a result, lead forming, base 3, substrate 1
, it becomes possible to automate the assembly of the resin case 2, and work efficiency is greatly improved. Further, since only a force in the left and right direction is applied to the terminal 7', deformation such as bending of the terminal 7' is eliminated. Further, since the welding method is such that the electrode 8' on one side is connected to the lead 6' and the electrode 8' on the other side is connected to the terminal 7', the current flows reliably through the connection, increasing the reliability of welding.

[Effects of the Invention] As described above, according to the present invention, it is possible to solve the problems of workability and reliability of lead connection, which are problems in the prior art.

[Brief Description of the Drawings] Fig. 1 is a sectional view of the main parts for explaining an embodiment of the present invention, Fig. 2 is a perspective view of the main parts of the IC module, and Fig. 3 is for explaining the conventional method. FIG. 1...Hybrid IC board, 2...Resin case,
3...Base, 4...Solder, 5...Welding pad,
6'... Welding lead (wire or plate shape), 7'... Plate terminal, 8'... Welding electrode. Applicant's agent Patent attorney Takehiko Suzue Figure 1

Claims (1)

[Claims] In a method for connecting internal leads and the external lead terminals of a hybrid IC module having a thick film substrate and a resin case having external lead terminals, the external lead terminals are provided above the board inside the resin case, and the four terminals are connected to each other. The tip inside the resin case is bent in a direction away from the board,
A lead connection method characterized in that the lead is taken out from the substrate side and overlapped with the tip of the external lead-out terminal, and the overlapped parts are sandwiched between welding electrodes and welded.