JPH01295762A - Grinding wheel condition supervisory device and its utilizing method for nc grinding machine - Google Patents

Grinding wheel condition supervisory device and its utilizing method for nc grinding machine

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Publication number
JPH01295762A
JPH01295762A JP12508488A JP12508488A JPH01295762A JP H01295762 A JPH01295762 A JP H01295762A JP 12508488 A JP12508488 A JP 12508488A JP 12508488 A JP12508488 A JP 12508488A JP H01295762 A JPH01295762 A JP H01295762A
Authority
JP
Japan
Prior art keywords
grindstone
grinding wheel
displacement
grinding
detected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12508488A
Other languages
Japanese (ja)
Inventor
Toshiya Takakuwa
俊也 高桑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amada Wasino Co Ltd
Original Assignee
Amada Wasino Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amada Wasino Co Ltd filed Critical Amada Wasino Co Ltd
Priority to JP12508488A priority Critical patent/JPH01295762A/en
Publication of JPH01295762A publication Critical patent/JPH01295762A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To enhance grinding accuracy of an NC grinding machine by providing a displacement arithmetic circuit for calculating an error for the reference point of an NC unit of a grinding wheel by comparing its displacement, detected by a sensor while rotating the grinding wheel, with a reference level of the NC unit. CONSTITUTION:Contactless displacement sensors S1 to S3 are provided corresponding to a grinding surface of a rotary grinding wheel 1. A displacement amount, detected by these sensors S1 to S3, of the grinding surface of the grinding wheel 1 is compared with the reference level of an NC unit, and an error for a reference point of the NC unit of the grinding wheel is calculated by a displacement amount arithmetic circuit 13. The calculated error is given to an NC part 17 of the NC unit as a correction amount, and controlling a work table 3 to be driven in accordance with a wearing amount of the grinding wheel 1, a workpiece is high accurately ground.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明はNC研削盤の砥石状態監視装置及びその利用方
法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a grindstone condition monitoring device for an NC grinding machine and a method of using the same.

(従来の技術) 近年、研削盤においてもNC化が進められているが、研
削盤特有の事情により完全な自動化が為されるまでには
至っていない。即ち、研削盤では、砥石が加工につれて
どんどん摩耗し、又目詰りするので、補正なしでは加工
精度が悪化するか゛らである。又、砥石主軸側の熱変形
により、砥石と被加工物との間で位置ずれが生じること
もある。
(Prior Art) In recent years, the use of NC in grinding machines has been progressing, but complete automation has not been achieved due to the unique circumstances of grinding machines. That is, in a grinding machine, the grinding wheel gradually wears out and becomes clogged as the grinding process progresses, so the machining accuracy will deteriorate if no correction is made. Furthermore, thermal deformation on the grindstone main shaft side may cause a positional shift between the grindstone and the workpiece.

そこで、従来、上記摩耗ないし熱変形を無祝し、加工を
行うことがある。又適宜手動により補正を行い加工を行
う例がある。或いは、より高精麿の加工を行うことを目
的として光倣い研削盤を用いることもある。
Therefore, conventionally, processing is sometimes performed without considering the above-mentioned wear or thermal deformation. There is also an example in which processing is performed by manually correcting as appropriate. Alternatively, an optical tracing grinder may be used for the purpose of performing higher precision machining.

(発明が解決しようとする課題) しかしながら、砥石摩耗量は相当大きな量であり、多く
の場合これを無視する場合にはどうしても加工精度に問
題が生ずる。又、手動の補正では、相当多くの手間を要
することになる。更に光倣い研削ではNC装置を有効利
用できないという問題点がある。更に、従来、砥石のド
レッシングを目視検査で行っていたが、これもN G 
?ill rlJ盤の完全自動化を阻んでいる。
(Problem to be Solved by the Invention) However, the amount of wear on the grindstone is quite large, and if this is ignored in many cases, problems will inevitably arise in processing accuracy. Moreover, manual correction requires a considerable amount of effort. Furthermore, optical tracing grinding has the problem that the NC device cannot be used effectively. Furthermore, conventionally, dressing of the grinding wheel was done by visual inspection, but this also failed.
? It is preventing full automation of ill RLJ board.

そこで、本発明は、砥石の摩耗などに基づくNC装置の
t単点に対する誤差を自動的に検出することにより、及
び又は砥石の砥粒状態を自動的に検出することによりN
C装置を有効に活用し得るNC研削盤の砥石状態監視装
置及びその利用方法を提供することを目的とする。
Therefore, the present invention provides N
An object of the present invention is to provide a grindstone condition monitoring device for an NC grinding machine that can effectively utilize a C device, and a method for using the same.

[発明の構成] (課題を解決するための手段) 上記課題を解決するため本発明は、回転砥石の加工面に
対応して非接触変位センサを設け、特許請求の範囲(1
)〜(6)の通りの構成とした。
[Structure of the Invention] (Means for Solving the Problems) In order to solve the above problems, the present invention provides a non-contact displacement sensor corresponding to the machining surface of a rotary grindstone.
) to (6).

(作用) 特許請求の範囲(1)に記載の発明では、非接触変位セ
ンサが検出した変位置に基いて砥石のNC装置の基準点
に対する誤差を自動的に検出し、検出した誤差間をNC
I置に補正量として与える。
(Operation) In the invention described in claim (1), the error of the grinding wheel with respect to the reference point of the NC device is automatically detected based on the displacement position detected by the non-contact displacement sensor, and the detected error is separated by NC.
It is given as a correction amount to the I position.

特許請求の範囲(2)に記載の発明では、非接触変位セ
ンサが検出した変位置に基いて砥粒状態を自動的に検出
し、必要に応じて自動的にドレッシングを行う。
In the invention described in claim (2), the state of the abrasive grains is automatically detected based on the displacement position detected by the non-contact displacement sensor, and dressing is automatically performed as necessary.

特許請求の範囲(3)に記載の発明では、砥石のNC装
置の基準点に対する誤差及び砥粒状態を共に検出きるの
で、NC装置に所定の補正量を与えることができると共
に、必要に応じてドレッシングゝを行うことができる。
In the invention described in claim (3), since it is possible to detect both the error of the grindstone with respect to the reference point of the NC device and the state of the abrasive grains, it is possible to give a predetermined correction amount to the NC device, and to adjust the amount of correction as necessary. Dressing can be done.

特許請求の範囲(4)に記載の発明では、非接触変位セ
ンサを砥石側に設けたので、当該センサが加工作業の邪
魔にならず、機械装置をコンパクトに構成できる。この
場合検出された砥石のNC装置のli!準点単点する誤
差は砥石摩耗量に相当する。
In the invention described in claim (4), since the non-contact displacement sensor is provided on the grindstone side, the sensor does not interfere with the machining operation, and the mechanical device can be configured compactly. In this case, the li! of the NC device of the detected grindstone! The error caused by a single quasi-point corresponds to the amount of wear on the grinding wheel.

特許請求の範囲(5)に記載の発明では、非接触変位セ
ンサを被加工物側に設けたので、砥石摩耗量の検出の他
、砥石と被加工物との間の熱的歪等をも検出でき、より
高度の補正が可能となる。
In the invention described in claim (5), since the non-contact displacement sensor is provided on the workpiece side, it is possible to detect thermal strain between the grindstone and the workpiece in addition to detecting the amount of wear on the grindstone. detection, and more advanced correction becomes possible.

特許請求の範囲(6)に記載の発明では、測定サイクル
を加工サイクル中に介在させたので、比較的大きな加工
物であっても加工開始前後又はその途中で砥石のNC装
置の基準点に対する誤差又は及びドレッシングの必要性
を検出でき、より高度の自動化B行える。
In the invention described in claim (6), since the measurement cycle is interposed in the machining cycle, even if the workpiece is relatively large, the error with respect to the reference point of the NC device of the grindstone can be detected before, during, or after the start of machining. Or, the need for dressing can be detected and a higher degree of automation can be performed.

(実施例) 以下、添付図面に基いて本発明の詳細な説明する。(Example) Hereinafter, the present invention will be described in detail based on the accompanying drawings.

第1図及び第2図は、非接触変位センサ(以下単にセン
サと呼ぶ)を被加工物(以下ワークと呼ぶ)側に設りた
例を示す平面説明図及び側面説明図である。
FIGS. 1 and 2 are a plan view and a side view showing an example in which a non-contact displacement sensor (hereinafter simply referred to as a sensor) is provided on a workpiece (hereinafter referred to as a work).

図示のように回転する砥石1に対し、NC装置(図示せ
ず)で駆動されるワークテーブル3には、加工ワーク5
の他、センサ装置7及びドレッサ装置9が取付けられて
いる。
As shown in the figure, a grinding wheel 1 rotates, and a workpiece 5 is mounted on a work table 3 driven by an NC device (not shown).
In addition, a sensor device 7 and a dresser device 9 are attached.

上記構成のNC研削盤において、図示しないNC装置は
、N0文を解釈して、ワークテーブル3を適宜X、Y方
向に移動させることにより、砥石1のItli点A、B
を加工ワーク5の所定点に当てつつ、所定の研削加工を
行うものである。本例では、砥石1が平砥石であること
に鑑みて、センサ装置7には3個のセンサS+ 、32
.83が各加工面に対応させて取付けである。第2図は
、ワークテーブル3を移動させ、センサ装置7を砥石1
に対応させた状態を示しである。
In the NC grinding machine having the above configuration, the NC device (not shown) interprets the N0 statement and moves the work table 3 in the X and Y directions as appropriate to move the grinding wheel 1 to Itli points A and B.
A predetermined grinding process is performed while applying the grinding machine to a predetermined point on the workpiece 5. In this example, considering that the grindstone 1 is a flat grindstone, the sensor device 7 includes three sensors S+, 32
.. Reference numeral 83 indicates attachment corresponding to each machined surface. In FIG. 2, the work table 3 is moved and the sensor device 7 is placed on the grinding wheel 1.
This figure shows the state corresponding to the following.

各センサS+ 、S2 、S3は、砥石1に対するセン
サ基準位置からの変位量に応じて所定の電圧信号を出力
する〈例えば株式会社キーエンス社のLC−2010,
PA1810)。
Each sensor S+, S2, S3 outputs a predetermined voltage signal according to the amount of displacement from the sensor reference position with respect to the grinding wheel 1 (for example, LC-2010 of Keyence Corporation,
PA1810).

第3図は、上記NC研削盤に適用される砥石状態監視装
置のブロック説明図である。
FIG. 3 is a block diagram illustrating a grindstone condition monitoring device applied to the NC grinding machine.

図示のように、本例の砥石状態監視装置装置は、前記セ
ンサS+ 、S2.33が出力する電圧信号を入力し適
宜のアナログ或いはデジタル伍を出力するアンプ部11
と、該アンプ部11に並列接続される変位演算部13及
び砥粒状態検出部15を備えて構成されている。両演算
部13.15の出力線は前記ワークテーブル3を駆動す
るNC装置のN0部17に接続されている。又、砥粒状
態検出部15はアラーム1!i置19とも接続されてい
る。
As shown in the figure, the grinding wheel condition monitoring device of this example includes an amplifier section 11 which inputs the voltage signals output from the sensors S+ and S2.33 and outputs an appropriate analog or digital signal.
, a displacement calculating section 13 and an abrasive grain state detecting section 15 connected in parallel to the amplifier section 11. The output lines of both calculation sections 13 and 15 are connected to the N0 section 17 of the NC device that drives the work table 3. Also, the abrasive grain state detection unit 15 indicates alarm 1! It is also connected to i location 19.

第4図及び第5図は、前記変位演算部13の演算方式を
示す説明図である。
FIG. 4 and FIG. 5 are explanatory diagrams showing the calculation method of the displacement calculation section 13.

変位演算部13は、第4図に示す砥石軸回転角θに対す
る変位りの入力信号を第5図に示すように平均化し、こ
れと基準レベルLOとの差を求めてN0部17へ補正量
δを出力する。基準レベルし0は砥石設定時にN0部1
7へ教示した正規の砥石基準位置である。
The displacement calculation section 13 averages the input signal of displacement with respect to the grinding wheel shaft rotation angle θ shown in FIG. 4 as shown in FIG. 5, calculates the difference between this and the reference level LO, and sends the correction amount to the N0 section 17 Output δ. Reference level 0 is N0 part 1 when setting the whetstone
This is the regular grindstone reference position taught to No. 7.

かくして1qられた補正量δは、本例ではセンサ装置7
をワークテーブルに取付けであるので、砥石摩耗量にワ
ークテーブル3と砥石1の間の熱的歪を加えたものとな
っている。因みに、センサ装置7を砥石1に対して固定
した場合には、装置がコンパクトによる反面、この熱的
歪は考慮されないものとなる。
In this example, the correction amount δ obtained by 1q is calculated by the sensor device 7.
Since the grinding wheel is attached to the work table, the amount of wear on the grinding wheel is the sum of the thermal strain between the work table 3 and the grinding wheel 1. Incidentally, when the sensor device 7 is fixed to the grindstone 1, although the device is compact, this thermal distortion is not taken into consideration.

詳細には、今、砥石1の先端とワークテーブルが熱的歪
によりセンサS+ に対しX方向にdX。
In detail, the tip of the grinding wheel 1 and the work table are now dX in the X direction with respect to the sensor S+ due to thermal strain.

Y方向にdY変位していたとする。又、研削ないしドレ
ッシングにより砥石径がdR,砥石幅がセンサS+ 、
83に対しdll+、dH3変位していたとする。
Assume that it is displaced by dY in the Y direction. Also, due to grinding or dressing, the diameter of the grinding wheel is dR, the width of the grinding wheel is sensor S+,
Suppose that dll+ and dH3 are displaced from 83.

すると、各センサS+ 、S2 、S3の基準値(通常
ゼロ)からの読取りデータL+ 、 L2 、 L3は
、 L 、 =d t−1+ +d X L2”d  R+dY し3 =d H:+ −d X となる。
Then, the read data L+, L2, L3 from the reference value (usually zero) of each sensor S+, S2, S3 is L, =d t-1+ +d becomes.

゛ そこで変位演算部13は、各加工面に対して補正量
を与える場合には、面記数値L+ 、 L2 、 L3
を出力するが、実際には、第1図に示した点A。
゛Therefore, when giving a correction amount to each machined surface, the displacement calculation unit 13 uses the notation values L+, L2, L3
However, in reality, point A shown in Figure 1 is output.

已について補正値を与えるので、点Aに対して(L+ 
、L2 )を、点Bに対して(13、12)を与えるこ
とになる。
Since a correction value is given for 已, for point A (L+
, L2), which gives (13, 12) for point B.

以上により、N0部17は、実際の点A、Bの座標値を
認識することができるので、砥石摩耗量及び熱的歪に関
係のない高精度の加工を続行することができる。
As described above, since the N0 section 17 can recognize the actual coordinate values of points A and B, it is possible to continue high-precision machining that is unrelated to the amount of grindstone wear and thermal strain.

第6図および第7図は、前記砥粒演算部15の演算方式
を示す説明図である。
6 and 7 are explanatory diagrams showing the calculation method of the abrasive calculation section 15. FIG.

砥粒状態検出部15は、第6図に示す砥石回転角θに対
する変位りの信号をアンプ部11から入力し、この信号
をフィルタにかけ、第7図に示すように、低周波部を除
去し、除去した後の信号の平均値で砥粒突出mを認識し
、これが経験により定めた一定Ii![以下のとき、ア
ラーム出力と共にN0部17にドレス要求信号Qを出力
する。
The abrasive grain condition detection section 15 inputs the displacement signal with respect to the grinding wheel rotation angle θ shown in FIG. 6 from the amplifier section 11, filters this signal, and removes the low frequency part as shown in FIG. , the abrasive grain protrusion m is recognized from the average value of the signal after removal, and this is a constant Ii! determined by experience. [In the following cases, the address request signal Q is output to the N0 unit 17 along with the alarm output.

以上の砥粒状態演算部15の作用により、N0部17は
ドレッサ装W9を使用して自動的に砥石1のドレッシン
グを行うことができる。
Due to the above-described operation of the abrasive grain condition calculation section 15, the N0 section 17 can automatically dress the grindstone 1 using the dresser device W9.

第8図は加工サイクルと測定サイクルの相関を示すフロ
ーチャートである。
FIG. 8 is a flowchart showing the correlation between processing cycles and measurement cycles.

ステップ801で単位加工面の加工サイクル終了後、ス
テップ802で測定サイクルを実行する。
After the machining cycle of the unit machined surface is completed in step 801, a measurement cycle is executed in step 802.

測定サイクルでは、砥石を低速回転させ、この間センサ
S+ 、82.83で砥石軸回転角θに応じた変位りを
検出する。
In the measurement cycle, the grindstone is rotated at a low speed, and during this period, the sensor S+, 82.83 detects the displacement according to the rotation angle θ of the grindstone shaft.

ステップ803で変位演算部13及び砥粒状態演算部1
5により測定を行い、ステップ804でドレス要求が出
された場合は、ステップ806でドレッシングを実行し
、この場合、再度ステップ802.803の測定サイク
ルで測定を行った後、ステップ805で補正をする。ス
テップ804を介在させたのは、ドレッシングにより砥
石状態が変化するからである。
In step 803, the displacement calculation unit 13 and the abrasive grain state calculation unit 1
5, and if a dressing request is issued in step 804, dressing is performed in step 806. In this case, measurement is performed again in the measurement cycle of steps 802 and 803, and then correction is performed in step 805. . The reason why step 804 is provided is that the condition of the grindstone changes due to dressing.

以上のように、測定サイクルは任意の加工サイクルの間
に介在させることができるので、全加工を^精度、全自
動で実行することができる。
As described above, since the measurement cycle can be interposed between any machining cycles, all machining can be performed with precision and fully automatically.

ゝ 第9図は■砥石に本発明を適用した例、第10図は
R砥石に本発明を適用した例を示す。■砥石ではその先
端点も加工面であると考え、■両端面及び先端面に3個
のセンサS+ 、82.83を対応させている。又、R
砥石では、R形状を正確に測定すべく3個のセンサS+
 、82.83を対応させている。センサS+ 、32
.33としては、いわゆる距離センサと呼ばれているも
のであっても同様である。
Fig. 9 shows an example in which the present invention is applied to a ■ grindstone, and Fig. 10 shows an example in which the present invention is applied to an R grindstone. ■ Considering that the tip of the grindstone is also the processed surface, ■ three sensors S+, 82.83 are attached to both end surfaces and the tip surface. Also, R
The grindstone uses three sensors S+ to accurately measure the R shape.
, 82.83. Sensor S+, 32
.. The same applies to what is called a distance sensor as 33.

本発明は上記実施例に限定されるものではなく、適宜の
設計的変更を行うことにより、他の態様でも実施し得る
ものである。
The present invention is not limited to the above embodiments, but can be implemented in other embodiments by making appropriate design changes.

[発明の効果] 以上の通り、特許請求の範囲(1)に記載の発明では、
非接触変位センサが検出した変位置に基いて砥石のNC
装置の基準点に対する誤差を自動的に検出し、検出した
誤差をNC装置に補正量として与えることができるので
、NG研削盤の精度が向上し、自動化を進展させること
ができる。
[Effect of the invention] As mentioned above, the invention described in claim (1) has the following effects:
NC of the grinding wheel based on the displacement position detected by the non-contact displacement sensor
Since the error with respect to the reference point of the device can be automatically detected and the detected error can be given to the NC device as a correction amount, the accuracy of the NG grinder can be improved and automation can be advanced.

特許請求の範囲(2)に記載の発明では、非接触変位セ
ンサが検出した変位量に基いて砥粒状態を自動的に検出
し、必要に応じて自動的にドレッシングを行わせること
ができるので、手間の少ない自動化が達成できる。
In the invention described in claim (2), the state of the abrasive grains can be automatically detected based on the amount of displacement detected by the non-contact displacement sensor, and dressing can be performed automatically as necessary. , automation can be achieved with less effort.

特許請求の範囲(3)に記載の発明では、砥石のNC装
置の基準点に対する誤差及び砥粒状態と共に検出できる
ので、NC装置に所定の補正を与えることができると共
に、必要に応じてドレッシングを行うことができるので
より完全な自動化を達成することができる。
In the invention described in claim (3), since it is possible to detect the error of the grindstone with respect to the reference point of the NC device as well as the abrasive grain condition, it is possible to give a predetermined correction to the NC device and to perform dressing as necessary. This allows more complete automation to be achieved.

特許請求の範囲(4)に記載の発明では、非接触変位セ
ンサを砥石側に設けたので、当該センサを加工作業の邪
魔にならない態様で設置でき、機械装置をコンパクトに
構成できる。
In the invention described in claim (4), since the non-contact displacement sensor is provided on the grindstone side, the sensor can be installed in a manner that does not interfere with the processing operation, and the mechanical device can be configured compactly.

特許請求の範囲(5)に記載の発明では、非接触変位セ
ンサを被加工物側に設けたので、砥石摩耗量の検出の地
被加工物との間の熱的歪等をも検出でき、より高度の補
正が可能であり、加工精度をより向上させることができ
る。
In the invention described in claim (5), since the non-contact displacement sensor is provided on the workpiece side, it is also possible to detect thermal strain between the grindstone and the workpiece to detect the amount of wear on the grindstone. More advanced correction is possible, and processing accuracy can be further improved.

特許請求の範囲(6)に記載の発明では、測定サイクル
を加工サイクルに介在させたので、比較的大きな被加工
物であっても、加工開始前後又はその途中で砥石のNC
装置の基準点に対する誤差又は及びドレッシングの必要
性を検出できるので、より高爪の自動化が行える。
In the invention described in claim (6), since the measurement cycle is interposed in the machining cycle, even when processing a relatively large workpiece, the NC of the grindstone is adjusted before, during, or before the start of machining.
Errors relative to the reference point of the device or the need for dressing can be detected, allowing for higher automation.

【図面の簡単な説明】[Brief explanation of the drawing]

図面はいずれも本発明の実施例を示し、第1図及び第2
図はセンサの取付状態を示す平面説明図及び側面図、第
3図は砥石状態監視装置のブロック説明図、第4図及び
第5図は変位演算部の信号処理方式を示す説明図、第6
図及び第7図は砥石状i演算部の信号処理方式を示す説
明図、第8図は測定サイクルの位置づけを示すフローチ
ャート、第9図は■砥石への適用例を示す平面説明図、
第10図はR砥石への適用例を示す平面説明図である。 1.21.23・・・砥石  3・・・ワークテーブル
5・・・加工ワーク     9・・・ドレッサ装置1
3・・・変位演算部    15・・・砥粒状態演算部
S+ 、82 、S3・・・非接触変位センサ代理人 
弁理士  三 好 保 男 第3図 1.21.23・・砥石  3・・・ワークチー:5・
・加工ワーク     9・・・ドレッサ装置13・変
位l1lI算部    15・・・砥粒状!IεS+ 
、Ss 、S3・・・非接触変位センサrル ♂ 町胃部 【 第1図 第2図 第8図 第9図        第10図 手続ネ甫正書(自発) 昭和63年8月9θ日
The drawings all show embodiments of the present invention, and FIG. 1 and FIG.
The figures are an explanatory plan view and a side view showing the mounting state of the sensor, Fig. 3 is an explanatory block diagram of the grinding wheel condition monitoring device, Figs. 4 and 5 are explanatory views showing the signal processing method of the displacement calculation section, and Fig.
7 and 7 are explanatory diagrams showing the signal processing method of the grindstone-like i calculation unit, FIG. 8 is a flowchart showing the positioning of the measurement cycle, and FIG. 9 is a plan explanatory diagram showing an example of application to a grindstone.
FIG. 10 is an explanatory plan view showing an example of application to an R grindstone. 1.21.23... Grindstone 3... Work table 5... Machining work 9... Dresser device 1
3... Displacement calculation section 15... Abrasive grain state calculation section S+, 82, S3... Non-contact displacement sensor agent
Patent Attorney Yasuo Miyoshi Figure 3 1.21.23...Whetstone 3...Work Q:5.
・Workpiece 9... Dresser device 13 ・Displacement l1lI calculating section 15... Abrasive grain shape! IεS+
, Ss, S3...Non-contact displacement sensor ruru ♂ Town stomach part

Claims (6)

【特許請求の範囲】[Claims] (1)回転砥石の加工面に対応して非接触変位センサを
設け、前記砥石を回転させつつ得られた前記非接触変位
センサの検出変位をNC装置の基準レベルと比較するこ
とにより前記砥石のNC装置の基準点に対する誤差を算
出する変位演算回路を設けたことを特徴とするNC研削
盤の砥石状態監視装置。
(1) A non-contact displacement sensor is provided corresponding to the machining surface of the rotary grindstone, and the displacement detected by the non-contact displacement sensor obtained while rotating the grindstone is compared with the reference level of the NC device. A grindstone condition monitoring device for an NC grinding machine, characterized in that it is provided with a displacement calculation circuit that calculates an error with respect to a reference point of an NC device.
(2)回転砥石の加工面に対応して非接触変位センサを
設け、前記砥石を回転させつつ得られた前記非接触セン
サの検出変位の微小変化に基いて前記砥石の砥粒状態を
検出する砥粒状態演算回路を設けたことを特徴とするN
C研削盤の砥石状態監視装置。
(2) A non-contact displacement sensor is provided corresponding to the machining surface of the rotary whetstone, and the state of the abrasive grains of the whetstone is detected based on minute changes in the displacement detected by the non-contact sensor obtained while rotating the whetstone. N characterized by being provided with an abrasive grain state calculation circuit.
Grinding wheel condition monitoring device for C grinding machine.
(3)回転砥石の加工面に対応して非接触変位センサを
設け、前記砥石を回転させつつ得られた前記非接触変位
センサの検出変位をNC装置の基準レベルと比較するこ
とにより前記砥石のNC装置の基準点に対する誤差を算
出する変位演算回路を設け、前記検出変位置の微小変化
に基いて前記砥石の砥粒状態を検出する砥粒状態演算回
路を設けたことを特徴とするNC研削盤の砥石状態監視
装置。
(3) A non-contact displacement sensor is provided corresponding to the machining surface of the rotary whetstone, and the detected displacement of the non-contact displacement sensor obtained while rotating the whetstone is compared with the reference level of the NC device. NC grinding characterized in that a displacement calculation circuit is provided for calculating an error with respect to a reference point of the NC device, and an abrasive grain state calculation circuit is provided for detecting the abrasive grain state of the grindstone based on a minute change in the detected displacement position. Grinding wheel condition monitoring device.
(4)回転砥石の加工面に対応して非接触変位センサを
設け、前記砥石を回転させつつ得られた前記非接触変位
センサの検出変位に基いて前記砥石のNC装置の基準点
に対する誤差又は及び砥粒状態を検出するNC研削盤の
砥石状態監視装置において、前記非接触センサを適宜の
進退自在手段を介して砥石側に設けたことを特徴とする
NC研削盤の砥石状態監視装置。
(4) A non-contact displacement sensor is provided corresponding to the processing surface of the rotary grindstone, and based on the detected displacement of the non-contact displacement sensor obtained while rotating the grindstone, the error of the grindstone relative to the reference point of the NC device or and a grinding wheel condition monitoring device for an NC grinding machine that detects the condition of abrasive grains, characterized in that the non-contact sensor is provided on the grinding wheel side via an appropriate movable means.
(5)回転砥石の加工面に対応して非接触変位センサを
設け、前記砥石を回転させつつ得られた前記非接触変位
センサの検出変位に基いて前記砥石のNC装置の基準点
に対する誤差又は及び砥粒状態を検出するNC研削盤の
砥石状態監視装置において、前記非接触センサを被加工
物側に設けたことを特徴とするNC研削盤の砥石状態監
視装置。
(5) A non-contact displacement sensor is provided corresponding to the processing surface of the rotary grindstone, and based on the detected displacement of the non-contact displacement sensor obtained while rotating the grindstone, the error of the grindstone relative to the reference point of the NC device or and a grindstone condition monitoring device for an NC grinder that detects the condition of abrasive grains, characterized in that the non-contact sensor is provided on a workpiece side.
(6)回転砥石の加工面に対応して非接触変位センサを
設け、前記砥石を回転させつつ得られた前記非接触変位
センサの検出変位に基いて前記砥石のNC装置の基準点
に対する誤差又は及び砥粒状態を検出するNC研削盤の
砥石状態監視装置の利用方法において、前記砥石のNC
装置の基準点に対する誤差又は及び砥粒状態を検出する
測定サイクルを前記NC研削盤の加工サイクル中に少な
くとも1回介在させたことを特徴とするNC研削盤の砥
石状態監視装置の利用方法。
(6) A non-contact displacement sensor is provided corresponding to the processing surface of the rotary grindstone, and based on the detected displacement of the non-contact displacement sensor obtained while rotating the grindstone, the error of the grindstone relative to the reference point of the NC device or and a method of using a grinding wheel condition monitoring device for an NC grinding machine that detects an abrasive grain condition,
A method of using a grinding wheel condition monitoring device for an NC grinder, characterized in that a measurement cycle for detecting an error with respect to a reference point of the device or the condition of the abrasive grain is interposed at least once during a processing cycle of the NC grinder.
JP12508488A 1988-05-24 1988-05-24 Grinding wheel condition supervisory device and its utilizing method for nc grinding machine Pending JPH01295762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12508488A JPH01295762A (en) 1988-05-24 1988-05-24 Grinding wheel condition supervisory device and its utilizing method for nc grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12508488A JPH01295762A (en) 1988-05-24 1988-05-24 Grinding wheel condition supervisory device and its utilizing method for nc grinding machine

Publications (1)

Publication Number Publication Date
JPH01295762A true JPH01295762A (en) 1989-11-29

Family

ID=14901436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12508488A Pending JPH01295762A (en) 1988-05-24 1988-05-24 Grinding wheel condition supervisory device and its utilizing method for nc grinding machine

Country Status (1)

Country Link
JP (1) JPH01295762A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463678A (en) * 1990-06-29 1992-02-28 Okuma Mach Works Ltd Automatic size measuring device for grindstone
JPH05200653A (en) * 1992-01-24 1993-08-10 Agency Of Ind Science & Technol Working error measuring method and instrument for working by means of milling tool
JPH1055985A (en) * 1996-08-07 1998-02-24 Seiko Seiki Co Ltd Dicing device
CN116635186A (en) * 2020-12-04 2023-08-22 美德龙有限公司 Automatic Grinding System

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187461A (en) * 1983-03-30 1984-10-24 Mazda Motor Corp Correcting device for grinder whetstone
JPS6179550A (en) * 1984-09-28 1986-04-23 Nippon Sheet Glass Co Ltd Machine tool
JPS61100373A (en) * 1984-10-18 1986-05-19 Inoue Japax Res Inc Wheel dressing device
JPS63114877A (en) * 1986-10-30 1988-05-19 Niigata Eng Co Ltd Grindstone processing device in numerically controlled grinder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187461A (en) * 1983-03-30 1984-10-24 Mazda Motor Corp Correcting device for grinder whetstone
JPS6179550A (en) * 1984-09-28 1986-04-23 Nippon Sheet Glass Co Ltd Machine tool
JPS61100373A (en) * 1984-10-18 1986-05-19 Inoue Japax Res Inc Wheel dressing device
JPS63114877A (en) * 1986-10-30 1988-05-19 Niigata Eng Co Ltd Grindstone processing device in numerically controlled grinder

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463678A (en) * 1990-06-29 1992-02-28 Okuma Mach Works Ltd Automatic size measuring device for grindstone
JPH05200653A (en) * 1992-01-24 1993-08-10 Agency Of Ind Science & Technol Working error measuring method and instrument for working by means of milling tool
JPH1055985A (en) * 1996-08-07 1998-02-24 Seiko Seiki Co Ltd Dicing device
CN116635186A (en) * 2020-12-04 2023-08-22 美德龙有限公司 Automatic Grinding System
EP4252964A4 (en) * 2020-12-04 2024-10-16 Metrol Co., Ltd. AUTOMATED GRINDING SYSTEM

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