JPH01297902A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH01297902A JPH01297902A JP63128824A JP12882488A JPH01297902A JP H01297902 A JPH01297902 A JP H01297902A JP 63128824 A JP63128824 A JP 63128824A JP 12882488 A JP12882488 A JP 12882488A JP H01297902 A JPH01297902 A JP H01297902A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- frequency circuit
- substrate
- wiring
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 238000000059 patterning Methods 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 2
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
Landscapes
- Waveguides (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は回路基板に関し、特にマイクロストリブ線路を
有する回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a circuit board, and particularly to a circuit board having microstrib lines.
従来の回路基板は、第２図に示すように、誘電体基板１
の上面に設けたストリップ導体２と、誘電体基板１の下
面に設けた導体Ｍ３とを有するマイクロストリップ線路
を有し、電源配線や低周波の制御用配線を誘電体基板の
表面の一部に形成〈図示せず）していた。A conventional circuit board has a dielectric substrate 1 as shown in FIG.
It has a microstrip line with a strip conductor 2 provided on the top surface and a conductor M3 provided on the bottom surface of the dielectric substrate 1, and the power supply wiring and low frequency control wiring are provided on a part of the surface of the dielectric substrate 1. (not shown).
上述した従来の回路、基板は特性インピーダンスを考慮
したマイクロストリップ線路を有しているが、電源線や
、低周波の制御線が多くなると同一基板上に形成した配
線が複雑化し、基板面積が大きくなり電子機器へ実装す
る際の占有面積が大きくなるという問題点がある。The conventional circuits and boards mentioned above have microstrip lines that take characteristic impedance into consideration, but as the number of power lines and low-frequency control lines increases, the wiring formed on the same board becomes complicated and the board area increases. However, there is a problem in that the area occupied when mounted on an electronic device increases.
本発明の回路基板は、誘電体基板の上面に設けたストリ
ップ導体と、前記誘電体基板の下面に設けた導体層とを
有するマイクロストリップ線路と、表面にパターニング
して設けた配線を有する絶縁基板を積層して形成し、前
記導体層の下に接着して設けた多層回路基板とを含んで
構成される。The circuit board of the present invention includes a microstrip line having a strip conductor provided on the upper surface of the dielectric substrate, a conductor layer provided on the lower surface of the dielectric substrate, and an insulating substrate having wiring patterned on the surface. and a multilayer circuit board formed by laminating the conductor layers and adhesively provided under the conductor layer.
次に、本発明の実施例について説明する。 Next, examples of the present invention will be described.
第１図は本発明の一実施例を説明するための回路基板の
斜視図である。FIG. 1 is a perspective view of a circuit board for explaining one embodiment of the present invention.
第１図に示すように、誘°電体基板１の上面に設けたス
トリップ導体２と、誘電体基板１の下面に設けた導体層
３とを有してマイクロストリップ線路を構成し、誘電体
基板１の誘電率とストリップ導体２の厚さ及び幅により
、特性インピーダンスを設定する。As shown in FIG. 1, a microstrip line is constituted by a strip conductor 2 provided on the upper surface of a dielectric substrate 1 and a conductor layer 3 provided on the lower surface of the dielectric substrate 1. The characteristic impedance is set by the dielectric constant of the substrate 1 and the thickness and width of the strip conductor 2.
次に、表面にパターニングして設けた配線４を有する絶
縁基板５の複数枚を積層して形成した多層回路基板を導
体層３の下面に設けた絶縁層６を介して前記マイクロス
トリップ線路の下面に接着して設ける。Next, a multilayer circuit board formed by laminating a plurality of insulating substrates 5 having wiring lines 4 patterned on the surface is connected to the lower surface of the microstrip line via an insulating layer 6 provided on the lower surface of the conductor layer 3. It is attached and provided.
ここで、前記多層回路基板の配線４は、電源線あるいは
低周波回路の信号線等に使用する。Here, the wiring 4 of the multilayer circuit board is used as a power supply line, a signal line of a low frequency circuit, or the like.
以上説明したように本発明は、マイクロストリップ線路
の下に低周波回路用の多層回路基板を接着して設けるこ
とにより、高周波回路と低周波回路とを一体化した回路
基板で構成し、回路の高集積化と容積の縮減化を実現す
ることができ、電子機器への実装に際してもその占有面
積を縮小できるという効果を有する。As explained above, the present invention provides a circuit board that integrates a high frequency circuit and a low frequency circuit by bonding and providing a multilayer circuit board for low frequency circuits under the microstrip line. It is possible to achieve high integration and volume reduction, and has the effect of reducing the area occupied when mounted on electronic equipment.
第１図は本発明の一実施例を説明するための回路基板の
斜視図、第２図は従来の回路基板の一例を説明するため
の斜視図である。
１・・・誘電体基板、２・・・ストリップ導体、３・・
・導体層、４・・・配線、５・・・絶縁基板、６・・・
絶縁層。FIG. 1 is a perspective view of a circuit board for explaining an embodiment of the present invention, and FIG. 2 is a perspective view for explaining an example of a conventional circuit board. 1... Dielectric substrate, 2... Strip conductor, 3...
・Conductor layer, 4... Wiring, 5... Insulating substrate, 6...
Insulating layer.
Claims (1)
記誘電体基板の下面に設けた導体層とを有するマイクロ
ストリップ線路、 （Ｂ）表面にパターニングして設けた配線を有する絶縁
基板を積層して形成し、前記導体層の下に接着して設け
た多層回路基板、 とを含むことを特徴とする回路基板。[Claims] (A) A microstrip line having a strip conductor provided on the upper surface of a dielectric substrate and a conductor layer provided on the lower surface of the dielectric substrate; (B) Wiring provided by patterning on the surface. 1. A multilayer circuit board formed by laminating insulating substrates having a conductor layer and bonded under the conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63128824A JPH01297902A (en) | 1988-05-25 | 1988-05-25 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63128824A JPH01297902A (en) | 1988-05-25 | 1988-05-25 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01297902A true JPH01297902A (en) | 1989-12-01 |
Family
ID=14994320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63128824A Pending JPH01297902A (en) | 1988-05-25 | 1988-05-25 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01297902A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232153A (en) * | 2001-01-31 | 2002-08-16 | Sanyo Electric Co Ltd | Multilayer circuit board |
| WO2020130004A1 (en) * | 2018-12-18 | 2020-06-25 | 株式会社村田製作所 | Circuit board and electronic device |
-
1988
- 1988-05-25 JP JP63128824A patent/JPH01297902A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232153A (en) * | 2001-01-31 | 2002-08-16 | Sanyo Electric Co Ltd | Multilayer circuit board |
| WO2020130004A1 (en) * | 2018-12-18 | 2020-06-25 | 株式会社村田製作所 | Circuit board and electronic device |
| JPWO2020130004A1 (en) * | 2018-12-18 | 2021-09-09 | 株式会社村田製作所 | Circuit boards and electronic devices |
| US11612053B2 (en) | 2018-12-18 | 2023-03-21 | Murata Manufacturing Co., Ltd. | Circuit board and electronic device |
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