JPH01298799A - Chip component installing machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a chip component mounting machine that automatically mounts chip components onto a printed wiring board.

(Prior art) As a conventionally used chip component mounting machine,
There is a device as shown in Japanese Patent No. 0-41298. As shown in Figure 3, this device includes a mounting head body (not shown).
a mounting drive shaft 1 slidably supported by a mounting drive shaft 1; a suction nozzle 2 provided at the tip of the mounting drive shaft 1 with a defined inner diameter for sucking a chip component W and mounting it on a printed wiring board B; a centering pawl 3 for positioning the chip component W suctioned by the nozzle 2 at the center of the tip of the suction nozzle 2;
A vacuum pump 4 for sucking the chip component W with the suction nozzle 2, a vibrator 5 connecting the suction nozzle 2 and the vacuum pump 4, and a vibrator 5 installed in the middle of this pipe 5 to detect the air pressure when the chip component is being sucked and held. It has an air sensor 6 and a control device 7 that controls this chip component mounting machine.

In this device, as shown in FIG. 3, when picking up a chip component W from a component supply position (not shown) at the tip of the suction nozzle 2, if the chip component W is suctioned in an abnormal state, the suction nozzle 2 rises and the centering claw 3 operates, but since the chip component W is not suctioned and held in the suction nozzle 2 in a normal state, the air pressure inside the pipe 5 is different from normal, and the air sensor 6 detects this abnormality in air pressure, causing a suction error. The signal shown is output. On the other hand, when the control device 7 receives this signal, it stops the chip component mounting machine and sends a signal to remove the chip component W.

(Problems to be Solved by the Invention) In the above-mentioned conventional technology, as shown in FIG. 5, a chip component W (a≧r, b≧r, c≧r) in Figure 4 (a), (b)
In the case of adsorption as shown in the figure, it is determined that the adsorption state is normal, and especially in the case as shown in Fig.
There were cases where the parts W were damaged when the parts were attached to the machine. Conventionally, this has been dealt with by replacing the suction nozzle 2 depending on the size of the chip component W. However, such a method requires a lot of time for changeover, and is not suitable for high-mix, medium-to-low volume production. .

In addition, since the chip component W is attached by suction by the vacuum pump 4, if deer or the like accumulates inside the suction nozzle 2 or the vibrator 5, the sensitivity of the air sensor 6 will decrease, making accurate abnormality detection impossible. Something happened.

SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and an object of the present invention is to provide a chip component mounting machine that can easily and accurately detect the component suction state when a chip component is being suctioned and held.

[Structure of the Invention] (Means for Solving the Problems) The chip component mounting machine of the present invention comprises: a suction holding means for taking out a chip component; a casing claw for casing the suction-held chip component; A comparison device having a detection means provided at a portion of the claw that contacts and clamps the chip component and detects the clamping state of the chip component, and a function of determining whether the clamping state of the chip component is good or bad based on a signal output from the detection means. and means.

(Function) According to the present invention, the suction and holding states of various types of chip components can be detected with high accuracy by the detection means provided on the casing claw.

(Example) Hereinafter, a chip component mounting machine according to an embodiment of the present invention will be described with reference to the drawings, in which the same parts as those of the conventional example are denoted by the same reference numerals.

FIGS. 1(a) and 1(b) are front views of a chip component mounting machine according to an embodiment of the present invention.

8 is a chip component mounting machine, 9.10 is two sets of casing claws configured with different mold widths, and each of these casing claws 9,
The chip component W is in contact with the chip component W of No. 10.
A detection means, for example, a pressure sensor 11, for detecting the quality of the adsorption and holding state is attached. It should be noted that the mold widths of the casing claws 9,10 may be different as shown in FIG. 1(b) or may be the same. Reference numeral 12 denotes a comparison device (comparison means), which determines in advance the type of chip component W to be caged and the set value of the output value of each pressure sensor 11 when the chip component W is normally caged;
The allowable error range for the set value of this output value is input, and the output value and the set value are compared to determine whether the caging condition is good or bad. Here, the comparison between the output value and the set value is not particularly limited, such as comparing the output values of each pressure sensor 11 individually, or comparing the sum of the output values of each pressure sensor with the set value. do not have. Further, the chip component mounting machine 8 is driven and controlled by a control means (not shown).

The operation of this embodiment configured as above will be described below.

First, the suction nozzle 2 moves to a predetermined position above a component supply means (not shown), and then descends by a predetermined amount to suction the chip component W to be taken out. Thereafter, the suction nozzle 2 moves up a predetermined distance while sucking the chip component W and returns to its original position, and the casing claws 9 and 10 simultaneously close to perform caging.

Here, when closing each of the casing claws 9 and 10, when each of the casing claws 9 and 10 contacts the chip component W, control is performed so that the chip component W does not move due to the impact, and the pressure is It is necessary to control the sensor 11 so that it does not malfunction.

Furthermore, the method of operation of each of the casing claws 9 and 10 is that the casing claws close at a predetermined speed until either of the claws comes into contact with the chip component W, and when the contact is detected, the casing claws continue to close for a predetermined time or a predetermined amount. All you have to do is close it. Therefore, as shown in FIG. 2(a), when the caging claws 9 and 10 close to cage the chip part W, the caging pressure at that time is output from each pressure sensor 11, and the output value is sent to the comparator 12. Sent. This comparison device 12 compares this output value signal with a preset value using the method described above, and if the value is within the tolerance range, the chip component W is normally suctioned and held. It is determined that the vehicle has been caged.

However, as shown in FIG. 2(b), when the chip component W is held in front of the eye in an abnormal state, when the output value from each pressure sensor 11 is compared with the set value, the result falls outside the allowable error range. In this case, the comparator 12
The comparison device 12 determines that the chip component W is suctioned and held in an abnormal state, and further outputs the determination result to a control device (not shown), and based on the output result, the control device controls the operation of the chip component mounting machine 8. A signal is sent to the chip component mounting machine 8 to stop the chip component W that is suctioned and held in this abnormal state, or to transport the chip component W that is suctioned and held in this abnormal state to a predetermined removal position. or exclude.

As described above, according to this embodiment, the suction and holding state of the chip component can be detected with high accuracy.

In the above embodiment, the suction nozzle 2 and each caging claw 9, 1
0 are provided on the same axis and are configured to move simultaneously, but they may be placed separately at different positions. Moreover, although the respective caging claws 9 and 10 are closed at the same time, this is not particularly necessary and may be closed in any combination.

Further, the shape of the component to be sucked is not limited to the angular shape shown in the figure, but may be any shape.

[Effects of the Invention] As described above, the chip component mounting machine of the present invention can accurately and easily detect the adsorption/holding state of a wide variety of chip components, greatly increasing the chip component mounting ability. Can improve and even damage the chip components,
Destruction etc. can also be prevented.

[Brief explanation of the drawing]

FIG. 1(a) is a front view of a chip component supply device which is an embodiment of the present invention, FIG. 1(b) is a view of FIG. 1(a) seen from below, and FIGS. 2(a) and (b). 3 is a front view of a conventional chip component mounting machine, FIG. 4 is a diagram showing the state of chip components being sucked by the conventional device, and FIG. FIG. 2... Nozzle (suction holding means), 8... Chip component mounting machine 9.10... Caging claw, 11... Pressure sensor (detection means), 12... Comparison device (comparison means) B ...Printed wiring boards, W...Chip parts agent Patent attorney Noriyuki Chika

Claims (1)

[Claims] In a chip component mounting machine configured to take out a chip component from a component supply means and mount the chip component at a predetermined position on a printed wiring board, a suction holding means for taking out the chip component; A casing claw for casing the chip component held by suction; a detection means for detecting the clamping state of the chip component provided at a portion of the casing claw that contacts and clamps the chip component; and a signal output from the detection means. A chip component mounting machine characterized by comprising: comparison means having a function of determining whether the chip component is in a good or bad state.