JPH0129982Y2 - - Google Patents

Description

[Detailed explanation of the invention] Technical field of the invention As means for downsizing in-vehicle electronic equipment, 1) internal circuits are integrated into ICs (microcontrollers), 2) electronic components (chip components) are mounted in high density, and 3) sensors are used. , integration of external devices such as actuators and electronic devices, etc. can be considered. The present invention relates to a structure for connecting in-vehicle electronic equipment and external equipment, which takes measures 2) and 3) above.

Prior Art and Problems In order to integrate an electronic device with high-density mounted electronic components and an external device, the terminals of the external device must be connected to the terminals on the board on which the electronic components are mounted. However, since the substrate used for high-density mounting is a ceramic substrate with good thermal conductivity, soldering external device terminals directly to the ceramic substrate causes heat to spread and the solder to be difficult to melt. It is difficult because of this. Another possible method is to preheat the entire board and solder it, but this method has the disadvantage that the solder portions of pre-soldered components may melt, causing displacement of these components.

Purpose of the invention The present invention was developed in view of the above circumstances, and its purpose is to connect external equipment to electronic equipment in which electronic components are densely mounted, without causing any misalignment of the mounted components. The purpose is to connect terminals and enable the integration of electronic equipment and external equipment.

The present invention is based on the idea that it is extremely difficult to solder external device terminals on a board with good thermal conductivity, and the two are connected by contact using a spring instead of soldering.

Embodiment of the invention FIG. 1 is a plan view of a connecting terminal used in the invention, and FIG. 2 is a side view thereof. This connection terminal has holes 1 and 2 on both sides, and a plurality of elastic locking pieces 3 are disposed around the circumference of the holes 1 and 2. Also,
In order to give spring properties to the connection terminals and to absorb changes in connection length due to temperature changes,
A bent portion is provided approximately at the center of the connection terminal. This connection terminal can be manufactured by cutting out a conductive flat plate such as a copper plate or an iron plate. In addition, in order to ensure the springiness, it is desirable that the thickness of the connecting terminal be set to such an extent that the connecting terminal is somewhat bent.

FIG. 3 is a structural explanatory diagram of an embodiment of the present invention.

In the figure, 10 is a ceramic substrate;
Pattern wiring etc. are applied to the surface. Electronic components 12 are mounted on this ceramic substrate 10 via a solder layer 11, and conductive pillars 13 are soldered with silver at predetermined positions on the ceramic substrate 10 (18 indicates a silver soldered portion). ). Pillar 1
3 has its lower part processed into a pedestal, and is bonded to the ceramic substrate 10 at this pedestal portion. Note that the pillars 13 can be attached to the ceramic substrate 1 by other bonding methods, such as soldering.
It is also possible to adhere to 0.

In addition, 14 indicates a part of the housing, and this housing 1
External devices 15 such as sensors and actuators are attached to 4, and terminals 16 on the rod such as signal terminals and power terminals are placed near the ceramic substrate 10 or passed through holes made in the ceramic substrate 10. protruding from the surface.

The member 17 connecting the terminal 16 of the external device 15 and the support column 13 is the connection terminal shown in FIGS. Connection terminal 17 and terminal 16 with piece 3,
The support column 13 is locked and electrically connected. At this time, if the tip of the elastic locking piece 3 is processed into a sharp shape, the electrical connection can be made more reliable.

Effects of the Invention As explained above, according to the present invention, in a structure in which a terminal of an external device is connected to an in-vehicle electronic device in which electronic components are mounted at high density on a substrate with good thermal conductivity, A conductive support post erected at a predetermined position, a terminal of an external device provided near the board, and an elastic locking piece on the circumference that engages with the terminal of the external device and the conductive support post. It consists of a spring connecting terminal with two holes arranged in plurality and a bent part provided between the two holes, and since soldering is not required, it is easy to attach the mounted parts. It is possible to integrate an electronic device and an external device without causing positional displacement. Furthermore, since thermal conduction does not adversely affect electronic components such as ICs, reliability can be improved, and there is also the advantage that connection work is extremely simple. Furthermore, after connection, the spring properties of the connection terminals reduce shocks caused by vibrations of the vehicle, thereby ensuring a reliable connection between the electronic device and the external device.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a connecting terminal used in the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a structural explanatory diagram of an embodiment of the present invention. 1 and 2 are holes, 3 is an elastic locking piece, 10 is a ceramic substrate, 11 is a solder layer, 12 is an electronic component, 13 is a column, 14 is a housing, 15 is an external device, 16 is a terminal, and 17 is a connection terminal , 18 is a silver soldering part.

Claims (1)

[Scope of utility model registration request] In a structure in which a terminal of an external device is connected to an in-vehicle electronic device in which electronic components are mounted at a high density on a substrate with good thermal conductivity, a conductive pillar erected at a predetermined position on the substrate and the substrate a terminal of an external device provided nearby, two holes in which a plurality of elastic locking pieces are disposed on the circumference and are engaged with the terminal of the external device and the conductive support; and the two holes. 1. A connection structure between an in-vehicle electronic device and an external device, comprising a spring-like connection terminal having a bent portion provided between the connection terminal and the bent portion.